CN104384752A - Soldering flux applied to sensor - Google Patents
Soldering flux applied to sensor Download PDFInfo
- Publication number
- CN104384752A CN104384752A CN201410491399.8A CN201410491399A CN104384752A CN 104384752 A CN104384752 A CN 104384752A CN 201410491399 A CN201410491399 A CN 201410491399A CN 104384752 A CN104384752 A CN 104384752A
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- China
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- parts
- acid
- present
- sensor
- scaling powder
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses soldering flux applied to a sensor. The soldering flux is characterized by comprising the following raw materials in parts by weight: 1 to 2 parts of succinic acid, 0.5 to 1.5 parts of adipic acid, 0.1 to 0.3 part of dibromosuccinic acid, 0.25 to 0.4 part of OP-10, 0.03 to 0.07 part of FSN-100 and 80 to 120 parts of ethanol. The soldering flux is free of lead and cleaning, high in solderability and performance and low in solid content, few residues remain after soldering, the shortcomings of conventional soldering flux can be overcome, and environmental protection requirements are better met.
Description
Technical field
The present invention relates to wiring board welding field, be specifically related to a kind of scaling powder being applied to sensor.
Background technology
Scaling powder can remove oxide in the process of welding, reduces soldered material surface tension, is widely used in the welding of horological instruments, precise part, medicine equipment, mobile communication, digital product and all kinds of pcb board and BGA tin ball.
Scaling powder appears at the surface mounting technology (SurfaceMountAssembly of 20 century 70s, be called for short SMT), refer to printing on printed circuit board pad, the agent of coating scolding tin, and Surface Mount Component is placed with accurately scribble scolding tin agent pad on, according to specific reflux temperature curve heater circuit plate, allow scolding tin agent melt, between components and parts with printed circuit board, form solder joint after its alloying component cooled and solidified and realize the metallurgical technology be connected.Scolding tin agent is a kind of Novel welding material arisen at the historic moment along with SMT.Scolding tin agent is a complicated system, is to be mixed by solder powder, scaling powder and other additive, the creaminess mixture of formation.Scolding tin agent has certain vigorous degree at normal temperatures, can be bonded at commitment positions by the beginning of electronic devices and components, under welding temperature, along with the volatilization of solvent and portions additive, welded components and parts is formed permanent connection together with printed circuit pad solder.Existing scaling powder also has plumbous grade for heavy metal mostly, and inadequate environmental protection, easily pollutes.Now study a kind of scaling powder being applied to sensor, environment-friendly high-efficiency, improve the fastness of welding.
Summary of the invention
For the problems referred to above, the invention provides a kind of scaling powder being applied to sensor, environment friendly and pollution-free, improve the fastness of welding.
In order to solve the problem, technical scheme provided by the invention is:
Be applied to a scaling powder for sensor, it is characterized in that: comprise following raw material: succinic acid 1-2 part, adipic acid 0.5-1.5 part, dibromosuccinic acid 0.1-0.3 part, OP-100.25-0.45 part, FSN-1000.03-0.07 part, ethanol 80-120 part.
Preferably, described each raw material is: succinic acid 1.2-1.8 part, adipic acid 0.75-1.25 part, dibromosuccinic acid 0.15-0.25 part, OP-100.30-0.40 part, FSN-1000.04-0.06 part, ethanol 90-110 part.
Preferably, described each raw material is: succinic acid 1.5 parts, adipic acid 1 part, dibromosuccinic acid 0.2 part, OP-100.35 part, FSN-1000.05 part, ethanol 100 parts.
Beneficial effect of the present invention is: the present invention is not leaded, and solderability is good, and solids content is low, and postwelding residue is few, need not clean.Function admirable of the present invention, and the shortcoming that can overcome existing scaling powder, it uses the requirement also more meeting environmental protection.
Detailed description of the invention
The present invention will be further described below:
Embodiment one:
Be applied to a scaling powder for sensor, it is characterized in that: comprise following raw material: succinic acid 1 part, adipic acid 0.5 part, dibromosuccinic acid 0.1 part, OP-100.25 part, FSN-1000.03 part, ethanol 80 parts.
Beneficial effect of the present invention is: the present invention is not leaded, and solderability is good, and solids content is low, and postwelding residue is few, need not clean.Function admirable of the present invention, and the shortcoming that can overcome existing scaling powder, it uses the requirement also more meeting environmental protection.
Embodiment two:
Be applied to a scaling powder for sensor, it is characterized in that: comprise following raw material: succinic acid 2 parts, adipic acid 1.5 parts, dibromosuccinic acid 0.3 part, OP-100.45 part, FSN-1000.07 part, ethanol 120 parts.
Beneficial effect of the present invention is: the present invention is not leaded, and solderability is good, and solids content is low, and postwelding residue is few, need not clean.Function admirable of the present invention, and the shortcoming that can overcome existing scaling powder, it uses the requirement also more meeting environmental protection.
Embodiment three:
Be applied to a scaling powder for sensor, it is characterized in that: comprise following raw material: succinic acid 1.5 parts, adipic acid 1 part, dibromosuccinic acid 0.2 part, OP-100.35 part, FSN-1000.05 part, ethanol 100 parts.
Beneficial effect of the present invention is: the present invention is not leaded, and solderability is good, and solids content is low, and postwelding residue is few, need not clean.Function admirable of the present invention, and the shortcoming that can overcome existing scaling powder, it uses the requirement also more meeting environmental protection.
Embodiment four:
Be applied to a scaling powder for sensor, it is characterized in that: comprise following raw material: succinic acid 1.2 parts, adipic acid 0.75 part, dibromosuccinic acid 0.15 part, OP-100.30 part, FSN-1000.04 part, ethanol 90 parts.
Beneficial effect of the present invention is: the present invention is not leaded, and solderability is good, and solids content is low, and postwelding residue is few, need not clean.Function admirable of the present invention, and the shortcoming that can overcome existing scaling powder, it uses the requirement also more meeting environmental protection.
Embodiment five:
Be applied to a scaling powder for sensor, it is characterized in that: comprise following raw material: succinic acid 1.8 parts, adipic acid 1.25 parts, dibromosuccinic acid 0.25 part, OP-100.40 part, FSN-1000.06 part, ethanol 110 parts.
Beneficial effect of the present invention is: the present invention is not leaded, and solderability is good, and solids content is low, and postwelding residue is few, need not clean.Function admirable of the present invention, and the shortcoming that can overcome existing scaling powder, it uses the requirement also more meeting environmental protection.
More than show and describe general principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (3)
1. be applied to a scaling powder for sensor, it is characterized in that: comprise following raw material: succinic acid 1-2 part, adipic acid 0.5-1.5 part, dibromosuccinic acid 0.1-0.3 part, OP-100.25-0.45 part, FSN-1000.03-0.07 part, ethanol 80-120 part.
2. the scaling powder being applied to sensor according to claim 1, it is characterized in that: described each raw material is: succinic acid 1.2-1.8 part, adipic acid 0.75-1.25 part, dibromosuccinic acid 0.15-0.25 part, OP-100.30-0.40 part, FSN-1000.04-0.06 part, ethanol 90-110 part.
3. the scaling powder being applied to sensor according to claim 1 and 2, is characterized in that: described each raw material is: succinic acid 1.5 parts, adipic acid 1 part, dibromosuccinic acid 0.2 part, OP-100.35 part, FSN-1000.05 part, ethanol 100 parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410491399.8A CN104384752B (en) | 2014-09-23 | 2014-09-23 | A kind of soldering flux being applied to sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410491399.8A CN104384752B (en) | 2014-09-23 | 2014-09-23 | A kind of soldering flux being applied to sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104384752A true CN104384752A (en) | 2015-03-04 |
| CN104384752B CN104384752B (en) | 2016-06-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410491399.8A Active CN104384752B (en) | 2014-09-23 | 2014-09-23 | A kind of soldering flux being applied to sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104384752B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109489872A (en) * | 2018-10-19 | 2019-03-19 | 深圳市朋辉科技术有限公司 | A kind of flexible sensor modular structure and its manufacture craft |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2160712A (en) * | 1984-06-21 | 1985-12-24 | Stc Plc | Forming conductive tracks on circuit boards |
| US5004509A (en) * | 1990-05-04 | 1991-04-02 | Delco Electronics Corporation | Low residue soldering flux |
| CN1209374A (en) * | 1997-08-22 | 1999-03-03 | 李圣波 | Low solid-material content cleaning-free scaling powder |
| CN101085495A (en) * | 2007-07-17 | 2007-12-12 | 西安理工大学 | Non-rosin cleaning-free scaling powder for tin-lead soldering paste and preparation method thereof |
| CN101690997A (en) * | 2009-10-12 | 2010-04-07 | 宁波喜汉锡焊料有限公司 | Non-halogen cleaning-free soldering flux |
| CN101972906A (en) * | 2010-09-17 | 2011-02-16 | 丹凤县荣毅电子有限公司 | Lead-free environmentally friendly soldering flux and preparation method thereof |
| CN102029488A (en) * | 2010-12-17 | 2011-04-27 | 广州瀚源电子科技有限公司 | Washing-free high temperature dip soldering flux |
| CN103862198A (en) * | 2014-03-24 | 2014-06-18 | 吉安谊盛电子材料有限公司 | Scaling powder special for automatic solar welding |
-
2014
- 2014-09-23 CN CN201410491399.8A patent/CN104384752B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2160712A (en) * | 1984-06-21 | 1985-12-24 | Stc Plc | Forming conductive tracks on circuit boards |
| US5004509A (en) * | 1990-05-04 | 1991-04-02 | Delco Electronics Corporation | Low residue soldering flux |
| CN1209374A (en) * | 1997-08-22 | 1999-03-03 | 李圣波 | Low solid-material content cleaning-free scaling powder |
| CN101085495A (en) * | 2007-07-17 | 2007-12-12 | 西安理工大学 | Non-rosin cleaning-free scaling powder for tin-lead soldering paste and preparation method thereof |
| CN101690997A (en) * | 2009-10-12 | 2010-04-07 | 宁波喜汉锡焊料有限公司 | Non-halogen cleaning-free soldering flux |
| CN101972906A (en) * | 2010-09-17 | 2011-02-16 | 丹凤县荣毅电子有限公司 | Lead-free environmentally friendly soldering flux and preparation method thereof |
| CN102029488A (en) * | 2010-12-17 | 2011-04-27 | 广州瀚源电子科技有限公司 | Washing-free high temperature dip soldering flux |
| CN103862198A (en) * | 2014-03-24 | 2014-06-18 | 吉安谊盛电子材料有限公司 | Scaling powder special for automatic solar welding |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109489872A (en) * | 2018-10-19 | 2019-03-19 | 深圳市朋辉科技术有限公司 | A kind of flexible sensor modular structure and its manufacture craft |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104384752B (en) | 2016-06-08 |
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