WO2023179805A1 - Flux for no-clean gold-tin soldering paste, preparation method therefor, and application thereof - Google Patents

Flux for no-clean gold-tin soldering paste, preparation method therefor, and application thereof Download PDF

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Publication number
WO2023179805A1
WO2023179805A1 PCT/CN2023/095438 CN2023095438W WO2023179805A1 WO 2023179805 A1 WO2023179805 A1 WO 2023179805A1 CN 2023095438 W CN2023095438 W CN 2023095438W WO 2023179805 A1 WO2023179805 A1 WO 2023179805A1
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Prior art keywords
flux
solder paste
polyurethane
gold
tin solder
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PCT/CN2023/095438
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French (fr)
Chinese (zh)
Inventor
陈卫民
杨青松
黄洁菲
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广州先艺电子科技有限公司
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Publication of WO2023179805A1 publication Critical patent/WO2023179805A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to the technical field of solders, and more specifically, to a flux for no-clean gold-tin solder paste and its preparation method and application.
  • solder paste has been widely used in high-tech products in my country's computers, program-controlled switches, precision instruments, solar energy, military industry, aerospace, railways, navigation and other fields.
  • Gold-tin solder paste is a high-temperature solder paste with excellent electrical conductivity, thermal conductivity, corrosion resistance and mechanical properties. It is currently widely used. However, due to the required reflow temperature (310 ⁇ 350°C) in the soldering process of gold-tin solder paste, °C) is more than 70 degrees higher than the traditional lead-free solder paste, exceeding the process temperature of the conventional additive system. There is a lot of residue after soldering, which makes it difficult to clean the circuit board and the appearance of the solder joints is poor. In addition, gold-tin solder paste usually needs to be covered with flux to form a film. Flux generally includes ingredients such as rosin and film-forming agents. The mass content of flux in gold-tin solder paste is usually 5% to 15%.
  • the solder paste contains components such as film-forming agent, solvent, thixotropic agent and flux.
  • This Flux used for gold-tin solder paste still has the problem of leaving a lot of residue after soldering and being difficult to clean. Therefore, there is an urgent need to develop a no-clean flux for gold-tin solder paste. In addition to ensuring the soldering effect under high temperature conditions, there is little residue after soldering and no cleaning is required.
  • the technical problem to be solved by the present invention is to overcome the defects and shortcomings of existing fluxes for gold-tin solder pastes that have a lot of residue and are difficult to clean, and provide a no-clean flux for gold-tin solder pastes with low rosin content (total weight of the flux). 2wt% ⁇ 5wt%), less residue after welding, no need to clean, non-corrosive, good high temperature resistance, and can prevent the flux from coking.
  • Another object of the present invention is to provide a method for preparing flux for no-clean gold-tin solder paste.
  • Another object of the present invention is to provide an application of flux for no-clean gold-tin solder paste.
  • Another object of the present invention is to provide a no-clean gold-tin solder paste.
  • Another object of the present invention is to provide a preparation method for no-clean gold-tin solder paste.
  • Another object of the present invention is to provide the application of no-clean gold-tin solder paste.
  • a flux for no-clean gold-tin solder paste including the following components in weight percentage:
  • Polyurethane film-forming agent 2% to 6%
  • Active agent 1% to 5%
  • the balance is solvent
  • the softening point of the rosin polyurethane is 131-160°C; the isocyanate group content in the rosin polyurethane is 7%-20%;
  • the solvent is a compound of high, medium and low boiling point solvents, wherein the boiling point of the high boiling point solvent is 250 ⁇ 350°C, the boiling point of the medium boiling point solvent is 150 ⁇ 250°C, and the boiling point of the low boiling point solvent is 70 ⁇ 150°C.
  • the weight ratio of medium and low boiling point solvents is 1:2 to 4:1.
  • the present invention uses rosin polyurethane with good high temperature resistance, which can prevent the flux from coking during the reflow process at 310 to 350°C.
  • a polyurethane film-forming agent is selected.
  • the polyurethane film-forming agent is not active at room temperature and will not be active during the welding process. Zhongneng can form a protective film through cross-linking reaction to prevent solder oxidation.
  • the polyurethane film-forming agent and -NCO in rosin polyurethane undergo a self-polymerization cross-linking reaction to form a denser protective film to better prevent Secondary oxidation of solder under high temperature conditions, so a good film-forming effect can be achieved with a low dosage of rosin polyurethane (2wt% ⁇ 5wt%) to reduce post-soldering residue; the activator can effectively remove solder pads, The oxides in the solder powder form bright solder joints, and at the same time can fully volatilize at high temperatures with little residue; and are compounded with high, medium and low boiling point solvents to ensure the solubility of other flux components, and the solvent is Gradually volatilizes during the welding process to prevent splashing during the entire welding process.
  • the solvent After passing the reflow temperature, the solvent will all volatilize or decompose, leaving no residue.
  • the use of a single high-boiling point solvent will lead to high viscosity, and the use of a single low-boiling point solvent will easily volatilize, affecting the auxiliary properties. Flux room temperature stability and application performance.
  • the balance is solvent.
  • the softening point of the rosin polyurethane is 135-150°C.
  • the rosin polyurethane used in the present invention has good high temperature resistance and can prevent the flux from coking during the reflow process at 310 to 350°C.
  • the isocyanate group (-NCO) content in the rosin polyurethane is 10% to 15%.
  • the cross-linking reaction between the isocyanate group in rosin polyurethane and the polyurethane film-forming agent is used to form a protective film to achieve a better film-forming effect, while reducing the dosage of rosin polyurethane and reducing post-weld residue.
  • the polyurethane film-forming agent is polyurethane-modified epoxy resin and/or polyurethane-modified acrylic resin.
  • the thixotropic agent is a compound of polyurethane thixotropic agent and modified hydrogenated castor oil, and the weight ratio of the compound is 1:2-3. Since the density of gold-tin solder powder is higher than that of conventional lead-free tin powder, the thixotropic agent performance is crucial to the storage and collapse properties of gold-tin solder paste. By compounding the thixotropic agent, it can provide excellent thixotropy while reducing post-soldering residue. .
  • the active agent is a medium and/or short chain fatty acid.
  • the use of neutralized/or short-chain fatty acids as activators can effectively remove oxides in pads and solder powder to form bright solder joints. At the same time, it can fully volatilize at high temperatures and reduce residues.
  • the active agent is one or more of propionic acid, butyric acid, valeric acid, caprylic acid, and capric acid.
  • the low boiling point solvent is one or more of propanol, n-butanol, butyl ether, and ethylene glycol ether.
  • the medium boiling point solvent is one or more of propylene glycol, polyethylene glycol, terpineol, and diethylene glycol butyl ether.
  • the high boiling point solvent is one or more of 1-octadecene, octadecane, nonadecane, and eicosane.
  • the low boiling point solvent is ethylene glycol ether
  • the medium boiling point solvent is polyethylene glycol
  • the high boiling point solvent is 1-octadecene
  • the present invention protects the preparation method of flux for the above-mentioned no-clean gold-tin solder paste, including the following steps:
  • First mix medium and high boiling point solvents heat to 120 ⁇ 180°C, add rosin polyurethane and polyurethane film-forming agent according to the formula, melt and mix evenly, then cool to 90 ⁇ 110°C, add low boiling point solvent according to the formula and activator, mix evenly, and finally add thixotropic agent according to the formula amount, mix evenly, cool, and filter to obtain the flux for clean-free gold-tin solder paste.
  • the invention protects the application of the above flux for no-clean gold-tin solder paste in preparing no-clean gold-tin solder paste.
  • a no-clean gold-tin solder paste includes the following components calculated in parts by weight: 4 to 15 parts of flux for the no-clean gold-tin solder paste and 85 to 96 parts of gold-tin alloy powder.
  • the present invention protects the preparation method of the above-mentioned no-clean gold-tin solder paste, which includes the following steps:
  • the invention protects the application of the above-mentioned no-clean gold-tin solder paste in high-brightness or high-power LED packaging.
  • the present invention adjusts the components of the flux and uses rosin polyurethane, which has good high temperature resistance and can prevent the flux from coking.
  • the cross-linking reaction between the -NCO group of the rosin polyurethane and the polyurethane film-forming agent is used to form a dense protective film.
  • the raw material reagents used in the examples of the present invention are conventionally purchased raw material reagents.
  • Rosin polyurethane A maleic acid type polyurethane, softening point 160°C; the isocyanate group content in rosin polyurethane is 15%.
  • Rosin polyurethane B acrylic pimaric acid polyurethane, softening point 150°C; the isocyanate group content in rosin polyurethane is 15%.
  • Rosin polyurethane C Male rosin-based polyurethane, softening point 130°C; the isocyanate group content in rosin polyurethane is 15%.
  • Rosin polyurethane D male rosin-based polyurethane, softening point 135°C; the isocyanate group content in rosin polyurethane is 15%.
  • Rosin polyurethane E male rosin-based polyurethane, softening point 135°C; the isocyanate group content in rosin polyurethane is 20%.
  • Rosin polyurethane F Male rosin-based polyurethane, softening point 135°C; the isocyanate group content in rosin polyurethane is 15%.
  • Rosin polyurethane G male rosin-based polyurethane, softening point 135°C; the isocyanate group content in rosin polyurethane is 10%.
  • Rosin polyurethane H male rosin-based polyurethane, softening point 135°C; the isocyanate group content in rosin polyurethane is 7%.
  • Polyurethane film-forming agent A polyurethane modified epoxy resin.
  • Polyurethane film-forming agent B polyurethane modified acrylic resin.
  • Thixotropic agent Polyurethane thixotropic agent and modified hydrogenated castor oil are compounded, and the weight ratio of the compound is 1:2.5.
  • Active agents capric acid, valeric acid.
  • High boiling point solvent 1-octadecene, boiling point is 314°C.
  • Medium boiling point solvent polyethylene glycol, boiling point 263°C.
  • Low boiling point solvent ethylene glycol ether, boiling point 135°C.
  • Gold-tin alloy powder 3#Au80Sn2 0 alloy powder.
  • the fluxes for gold-tin solder pastes of Examples 1 to 13 and Comparative Examples 1 to 6 include components in weight percentage as shown in Table 1 below:
  • the preparation method of the above flux includes the following steps:
  • a no-clean gold-tin solder paste includes the following components calculated in parts by weight: 10 parts of flux for the no-clean gold-tin solder paste prepared in the above embodiments and comparative examples and 90 parts of 3#Au80Sn20 alloy powder.
  • the preparation method of the above-mentioned no-clean gold-tin solder paste includes the following steps:
  • Post-weld residue The residue after welding is regular in shape, colorless and transparent, and no black carbide appears after being kept at 330°C for 30 seconds. , does not affect the appearance and electrical insulation of the solder joints, it is judged to be almost no residue;
  • Expansion rate Lead-free solder grade M should be ⁇ 75%.
  • solder joints The appearance of solder joints should be bright and full, and if there are no small tin beads formed by spatter around the solder joints, it is qualified;
  • Tin ball test Use a stencil with a diameter of 6.5mm or 1.5mm to print on a non-wetting ceramic substrate. After melting at 330°C, use a microscope to observe. If the number of tin beads is ⁇ 3, it will be judged to be qualified;
  • Wettability If it should be level 1 or level 2 according to the standard, it will be judged as qualified.
  • the flux prepared in each embodiment of the present invention does not contain halogen. After testing, the results are shown in Table 2.
  • the expansion rate is ⁇ 75%, the physical stability is good, and there is almost no residue after soldering. It is used to prepare gold-tin solder paste. It has good performance in welding work and can meet the no-clean process in high-brightness or high-power LED packaging. Basically no cleaning is required.
  • the tin bead test is qualified, the wettability is good, and the appearance of the solder joints is bright and clean, indicating the high temperature resistance of the flux. It has good performance and excellent welding performance, which can ensure the reliability of electronic product packaging.
  • Comparative Example 1 ordinary rosin is used, and in Comparative Example 2, ordinary resin film-forming agent is used. In both cases, cross-linking reaction cannot occur, resulting in secondary oxidation of the solder paste during the soldering process, poor appearance of the solder joints, and tin The bead test failed, and there was a lot of residue after soldering; in Comparative Example 3, more ordinary rosin was used, and the surface of the solder joint where the solder paste was prepared was covered with a thick layer of opaque residue, requiring cleaning. Comparative examples 4-6 do not use high, medium and low The boiling point solvent is compounded, resulting in poor stability or failure in the tin bead test.

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A flux for a no-clean gold-tin soldering paste, comprising the following components by weight percentage: 2% ~ 5% of rosin polyurethane; 2% ~ 6% of a polyurethane film former; 3% ~ 8% of a thixotropic agent; 1% ~ 5% of an active agent; and the remaining are a solvent. The flux does not contain halogen, has good physical stability, has a high spread rate, matches well with gold-tin solder, is non-corrosive, has good solder joint appearance, and is excellent in soldering performance; said flux can be used in high-brightness or high-power LED packaging, and ensures the reliability of electronic product packaging. Further related is a flux for a no-clean gold-tin soldering paste, a use of the flux for a no-clean gold-tin soldering paste in preparing the no-clean gold-tin soldering paste, the no-clean gold-tin soldering paste, a preparation method for the no-clean gold-tin soldering paste, and an application of the no-clean gold-tin soldering paste.

Description

一种免清洗金锡焊膏用助焊剂及其制备方法和应用A kind of flux for no-clean gold-tin solder paste and its preparation method and application 技术领域Technical field
本发明涉及焊料技术领域，更具体地，涉及一种免清洗金锡焊膏用助焊剂及其制备方法和应用。The present invention relates to the technical field of solders, and more specifically, to a flux for no-clean gold-tin solder paste and its preparation method and application.
背景技术Background technique
随着电子工业与免清洗技术的飞速发展，目前焊膏已在我国计算机、程控交换机、精密仪器仪表、太阳能、军工、航天航空、铁路、航海等领域的高科技产品中得到了广泛的应用。With the rapid development of the electronic industry and no-clean technology, solder paste has been widely used in high-tech products in my country's computers, program-controlled switches, precision instruments, solar energy, military industry, aerospace, railways, navigation and other fields.
金锡焊膏是一种高温焊膏，具有优良的导电、导热、耐蚀性能和力学性能，目前得到了广泛的应用，但是由于金锡焊膏的焊接工艺中所需回流温度(310～350℃)比传统无铅焊膏高出七十多度，超出了常规助剂体系的工艺温度，焊后残留多，导致了电路板清洗困难，焊点外观较差。另外，金锡焊膏通常需要添加助焊剂成膜覆盖，助焊剂一般包括松香、成膜剂等成分，金锡焊膏中助焊剂质量含量通常为5％～15％，虽然比重相对较小，但对金锡焊膏的性能有着不容忽视的影响，助焊剂可以防止焊接过程中的二次氧化；但是对于免清洗金锡焊膏而言，松香含量一般很少(通常小于助焊剂总重量的15％，而常规焊膏中松香含量通常占助焊剂总重量的20％～50％)，对于成膜剂有更高要求，而增加松香含量，虽能起到较好的成膜效果，但达不到免清洗的要求。中国专利CN111390423A公开了一种金锡共晶焊膏，包含微米金锡共晶粉料和助焊膏，助焊膏包含成膜剂、溶剂、触变剂和助焊剂等组分，但是这种金锡焊膏用助焊剂仍存在焊接后残留多、难清洗的问题。因此，急需研发一种免清洗金锡焊膏用助焊剂，除了保证高温条件下的助焊效果外，焊后残留少，免清洗。Gold-tin solder paste is a high-temperature solder paste with excellent electrical conductivity, thermal conductivity, corrosion resistance and mechanical properties. It is currently widely used. However, due to the required reflow temperature (310~350°C) in the soldering process of gold-tin solder paste, ℃) is more than 70 degrees higher than the traditional lead-free solder paste, exceeding the process temperature of the conventional additive system. There is a lot of residue after soldering, which makes it difficult to clean the circuit board and the appearance of the solder joints is poor. In addition, gold-tin solder paste usually needs to be covered with flux to form a film. Flux generally includes ingredients such as rosin and film-forming agents. The mass content of flux in gold-tin solder paste is usually 5% to 15%. Although the specific gravity is relatively small, However, it has a significant impact on the performance of gold-tin solder paste that cannot be ignored. Flux can prevent secondary oxidation during the soldering process; however, for no-clean gold-tin solder paste, the rosin content is generally very small (usually less than the total weight of the flux). 15%, while the rosin content in conventional solder paste usually accounts for 20% to 50% of the total weight of the flux), which has higher requirements for film-forming agents. Although increasing the rosin content can achieve better film-forming effects, Cannot meet the requirement of no cleaning. Chinese patent CN111390423A discloses a gold-tin eutectic solder paste, which contains micron gold-tin eutectic powder and flux paste. The solder paste contains components such as film-forming agent, solvent, thixotropic agent and flux. However, this Flux used for gold-tin solder paste still has the problem of leaving a lot of residue after soldering and being difficult to clean. Therefore, there is an urgent need to develop a no-clean flux for gold-tin solder paste. In addition to ensuring the soldering effect under high temperature conditions, there is little residue after soldering and no cleaning is required.
发明内容Contents of the invention
本发明要解决的技术问题是克服现有金锡焊膏用助焊剂的残留多、难清洗的缺陷和不足，提供一种免清洗金锡焊膏用助焊剂，松香含量低(助焊剂总重量的2wt％～5wt％)，焊后残留少，免清洗，无腐蚀性，耐高温性能好，可以防止助焊剂发生焦化。The technical problem to be solved by the present invention is to overcome the defects and shortcomings of existing fluxes for gold-tin solder pastes that have a lot of residue and are difficult to clean, and provide a no-clean flux for gold-tin solder pastes with low rosin content (total weight of the flux). 2wt% ~ 5wt%), less residue after welding, no need to clean, non-corrosive, good high temperature resistance, and can prevent the flux from coking.
本发明的又一目的是提供一种免清洗金锡焊膏用助焊剂的制备方法。Another object of the present invention is to provide a method for preparing flux for no-clean gold-tin solder paste.
本发明的又一目的是提供一种免清洗金锡焊膏用助焊剂的应用。 Another object of the present invention is to provide an application of flux for no-clean gold-tin solder paste.
本发明的另一目的是提供一种免清洗金锡焊膏。Another object of the present invention is to provide a no-clean gold-tin solder paste.
本发明的另一目的是提供免清洗金锡焊膏的制备方法。Another object of the present invention is to provide a preparation method for no-clean gold-tin solder paste.
本发明的另一目的是提供免清洗金锡焊膏的应用。Another object of the present invention is to provide the application of no-clean gold-tin solder paste.
本发明上述目的通过以下技术方案实现：The above objects of the present invention are achieved through the following technical solutions:
一种免清洗金锡焊膏用助焊剂，包括如下按照重量百分比的组分：A flux for no-clean gold-tin solder paste, including the following components in weight percentage:
松香聚氨酯2％～5％；Rosin polyurethane 2% to 5%;
聚氨酯类成膜剂2％～6％；Polyurethane film-forming agent 2% to 6%;
触变剂3％～8％；Thixotropic agent 3% to 8%;
活性剂1％～5％；Active agent 1% to 5%;
余量为溶剂；The balance is solvent;
所述松香聚氨酯的软化点为131～160℃；松香聚氨酯中的异氰酸酯基含量为7％～20％；The softening point of the rosin polyurethane is 131-160°C; the isocyanate group content in the rosin polyurethane is 7%-20%;
所述溶剂为高、中、低沸点溶剂复配，其中高沸点溶剂的沸点为250～350℃，中沸点溶剂的沸点为150～250℃，低沸点溶剂的沸点为70～150℃，高、中、低沸点溶剂的重量比为1：2～4：1。The solvent is a compound of high, medium and low boiling point solvents, wherein the boiling point of the high boiling point solvent is 250~350°C, the boiling point of the medium boiling point solvent is 150~250°C, and the boiling point of the low boiling point solvent is 70~150°C. The weight ratio of medium and low boiling point solvents is 1:2 to 4:1.
本发明采用耐高温性能好的松香聚氨酯，可以防止助焊剂在310～350℃的回流过程中发生焦化，同时选用聚氨酯类成膜剂，聚氨酯类成膜剂在常温下不显活性，在焊接过程中能通过交联反应形成保护膜，防止焊料氧化，同时在焊接过程中，聚氨酯类成膜剂和松香聚氨酯中-NCO发生自聚交联反应形成一层较致密的保护膜，更好地避免高温条件下焊料的二次氧化，因此可以在松香聚氨酯用量较低(2wt％～5wt％)的情况下达到良好的成膜效果，达到减少焊后残留的目的；活性剂能够有效去除焊盘、焊锡粉中的氧化物，形成光亮焊点，同时又能在高温时充分挥发，残留少；并且采用高、中、低沸点溶剂复配，确保了对其他助焊剂组分的溶解力，溶剂在焊接过程中逐步挥发，防止整个焊接过程中发生飞溅，经过回流温度后溶剂全部挥发或分解，没有残留，而单一使用高沸点溶剂会导致黏度偏高，采用单一的低沸点溶剂容易挥发，影响助焊剂室温的稳定性和应用性能。The present invention uses rosin polyurethane with good high temperature resistance, which can prevent the flux from coking during the reflow process at 310 to 350°C. At the same time, a polyurethane film-forming agent is selected. The polyurethane film-forming agent is not active at room temperature and will not be active during the welding process. Zhongneng can form a protective film through cross-linking reaction to prevent solder oxidation. At the same time, during the welding process, the polyurethane film-forming agent and -NCO in rosin polyurethane undergo a self-polymerization cross-linking reaction to form a denser protective film to better prevent Secondary oxidation of solder under high temperature conditions, so a good film-forming effect can be achieved with a low dosage of rosin polyurethane (2wt% ~ 5wt%) to reduce post-soldering residue; the activator can effectively remove solder pads, The oxides in the solder powder form bright solder joints, and at the same time can fully volatilize at high temperatures with little residue; and are compounded with high, medium and low boiling point solvents to ensure the solubility of other flux components, and the solvent is Gradually volatilizes during the welding process to prevent splashing during the entire welding process. After passing the reflow temperature, the solvent will all volatilize or decompose, leaving no residue. The use of a single high-boiling point solvent will lead to high viscosity, and the use of a single low-boiling point solvent will easily volatilize, affecting the auxiliary properties. Flux room temperature stability and application performance.
优选地，包括如下按照重量百分比的组分：Preferably, the following components are included in weight percent:
松香聚氨酯3％～4％；Rosin polyurethane 3% to 4%;
聚氨酯类成膜剂3％～5％；Polyurethane film-forming agent 3% to 5%;
触变剂4％～6％； Thixotropic agent 4% to 6%;
活性剂3％～4％；Active agent 3% to 4%;
余量为溶剂。The balance is solvent.
优选地，所述松香聚氨酯的软化点为135～150℃。本发明采用的松香聚氨酯具有较好的耐高温性能，可防止助焊剂在310～350℃的回流过程中发生焦化。Preferably, the softening point of the rosin polyurethane is 135-150°C. The rosin polyurethane used in the present invention has good high temperature resistance and can prevent the flux from coking during the reflow process at 310 to 350°C.
优选地，所述松香聚氨酯中的异氰酸酯基(-NCO)含量为10％～15％。利用松香聚氨酯中的异氰酸酯基与聚氨酯类成膜剂的交联反应形成保护膜，来达到较好的成膜效果，同时降低松香聚氨酯的用量，减少焊后残留。Preferably, the isocyanate group (-NCO) content in the rosin polyurethane is 10% to 15%. The cross-linking reaction between the isocyanate group in rosin polyurethane and the polyurethane film-forming agent is used to form a protective film to achieve a better film-forming effect, while reducing the dosage of rosin polyurethane and reducing post-weld residue.
优选地，所述聚氨酯类成膜剂为聚氨酯改性环氧树脂和/或聚氨酯改性丙烯酸树脂。Preferably, the polyurethane film-forming agent is polyurethane-modified epoxy resin and/or polyurethane-modified acrylic resin.
优选地，所述触变剂为聚氨酯类触变剂和改性氢化蓖麻油复配，复配重量比例为1:2～3。由于金锡焊粉的密度比常规无铅锡粉大，触变剂性能对于金锡焊膏的存储性、坍塌性至关重要，通过触变剂复配，提供优良触变性同时减少焊后残留。Preferably, the thixotropic agent is a compound of polyurethane thixotropic agent and modified hydrogenated castor oil, and the weight ratio of the compound is 1:2-3. Since the density of gold-tin solder powder is higher than that of conventional lead-free tin powder, the thixotropic agent performance is crucial to the storage and collapse properties of gold-tin solder paste. By compounding the thixotropic agent, it can provide excellent thixotropy while reducing post-soldering residue. .
优选地，所述活性剂为中和/或短链脂肪酸。采用中和/或短链脂肪酸作为活性剂，能够有效去除焊盘、焊锡粉中的氧化物，形成光亮焊点，同时又能在高温时充分挥发，减少残留。Preferably, the active agent is a medium and/or short chain fatty acid. The use of neutralized/or short-chain fatty acids as activators can effectively remove oxides in pads and solder powder to form bright solder joints. At the same time, it can fully volatilize at high temperatures and reduce residues.
优选地，所述活性剂为丙酸、丁酸、戊酸、辛酸、癸酸中的一种或几种。Preferably, the active agent is one or more of propionic acid, butyric acid, valeric acid, caprylic acid, and capric acid.
优选地，所述低沸点溶剂为丙醇、正丁醇、丁醚、乙二醇乙醚中的一种或几种。Preferably, the low boiling point solvent is one or more of propanol, n-butanol, butyl ether, and ethylene glycol ether.
优选地，所述中沸点溶剂为丙二醇、聚乙二醇、松油醇、二乙二醇丁醚中的一种或几种。Preferably, the medium boiling point solvent is one or more of propylene glycol, polyethylene glycol, terpineol, and diethylene glycol butyl ether.
优选地，所述高沸点溶剂为1-十八烯、十八烷、十九烷、二十烷中的一种或几种。Preferably, the high boiling point solvent is one or more of 1-octadecene, octadecane, nonadecane, and eicosane.
优选地，所述低沸点溶剂为乙二醇乙醚，中沸点溶剂为聚乙二醇，高沸点溶剂为1-十八烯。Preferably, the low boiling point solvent is ethylene glycol ether, the medium boiling point solvent is polyethylene glycol, and the high boiling point solvent is 1-octadecene.
本发明保护上述免清洗金锡焊膏用助焊剂的制备方法，包括如下步骤：The present invention protects the preparation method of flux for the above-mentioned no-clean gold-tin solder paste, including the following steps:
先将中、高沸点溶剂混合，加热至120～180℃后，按照配方量加入松香聚氨酯、聚氨酯类成膜剂，熔化并混合均匀，然后降温至90～110℃，按照配方量加入低沸点溶剂和活性剂，混合均匀，最后按照配方量加入触变剂，混合均匀后冷却，过滤后即得免清洗金锡焊膏用助焊剂。 First mix medium and high boiling point solvents, heat to 120~180℃, add rosin polyurethane and polyurethane film-forming agent according to the formula, melt and mix evenly, then cool to 90~110℃, add low boiling point solvent according to the formula and activator, mix evenly, and finally add thixotropic agent according to the formula amount, mix evenly, cool, and filter to obtain the flux for clean-free gold-tin solder paste.
本发明保护上述免清洗金锡焊膏用助焊剂的在制备免清洗金锡焊膏中的应用。The invention protects the application of the above flux for no-clean gold-tin solder paste in preparing no-clean gold-tin solder paste.
一种免清洗金锡焊膏，包括如下按照重量份计算的组分：免清洗金锡焊膏用助焊剂4～15份和金锡合金粉85～96份。A no-clean gold-tin solder paste includes the following components calculated in parts by weight: 4 to 15 parts of flux for the no-clean gold-tin solder paste and 85 to 96 parts of gold-tin alloy powder.
本发明保护上述免清洗金锡焊膏的制备方法，包括如下步骤：The present invention protects the preparation method of the above-mentioned no-clean gold-tin solder paste, which includes the following steps:
按比例称取金锡合金粉和免清洗金锡焊膏用助焊剂，依次加入免清洗金锡焊膏用助焊剂、金锡合金粉，混合均匀；然后抽真空至-0.6～-0.8Mpa，混合15～30min后收料，最后再抽真空至-0.4～-0.6Mpa，混合10～30min后即得免清洗金锡焊膏。Weigh the gold-tin alloy powder and the flux for no-clean gold-tin solder paste in proportion, add the flux for no-clean gold-tin solder paste and gold-tin alloy powder in sequence, mix evenly; then vacuum to -0.6~-0.8Mpa, Collect the material after mixing for 15 to 30 minutes, and finally vacuum to -0.4 to -0.6Mpa. After mixing for 10 to 30 minutes, the clean-free gold-tin solder paste is obtained.
本发明保护上述免清洗金锡焊膏在高亮度或大功率LED封装中的应用。The invention protects the application of the above-mentioned no-clean gold-tin solder paste in high-brightness or high-power LED packaging.
与现有技术相比，本发明的有益效果是：Compared with the prior art, the beneficial effects of the present invention are:
本发明通过调整助焊剂的组分，采用松香聚氨酯，耐高温性能好，可防止助焊剂焦化，同时利用松香聚氨酯的-NCO基团与聚氨酯类成膜剂的交联反应，形成致密的保护膜，达到良好的成膜效果，同时减少松香聚氨酯的用量，保持助焊剂的高温助焊效果，并添加触变剂、活性剂和高、中、低沸点的溶剂复配，减少助焊剂的焊后残留，达到免清洗的目的，且本发明的助焊剂中不含卤素，物理稳定性好，扩展率高，与金锡焊料匹配效果好，无腐蚀性，焊点外观良好，焊接性能优异，可应用于高亮度或大功率LED封装中，保证电子产品封装的可靠性。The present invention adjusts the components of the flux and uses rosin polyurethane, which has good high temperature resistance and can prevent the flux from coking. At the same time, the cross-linking reaction between the -NCO group of the rosin polyurethane and the polyurethane film-forming agent is used to form a dense protective film. , to achieve a good film-forming effect, while reducing the amount of rosin polyurethane, maintaining the high-temperature soldering effect of the flux, and adding thixotropic agents, activators and solvents with high, medium and low boiling points to reduce the post-soldering effect of the flux. residue, achieving the purpose of no-cleaning, and the flux of the present invention does not contain halogen, has good physical stability, high expansion rate, good matching effect with gold-tin solder, non-corrosive, good appearance of solder joints, excellent welding performance, and can It is used in high-brightness or high-power LED packaging to ensure the reliability of electronic product packaging.
具体实施方式Detailed ways
下面结合具体实施方式对本发明作进一步的说明，但实施例并不对本发明做任何形式的限定。除非另有说明，本发明实施例采用的原料试剂为常规购买的原料试剂。The present invention will be further described below with reference to specific embodiments, but the examples do not limit the present invention in any form. Unless otherwise stated, the raw material reagents used in the examples of the present invention are conventionally purchased raw material reagents.
各实施例和对比例采用的原料如下：The raw materials used in each embodiment and comparative example are as follows:
松香聚氨酯A：马来海松酸型聚氨酯，软化点160℃；松香聚氨酯中的异氰酸酯基含量为15％。Rosin polyurethane A: maleic acid type polyurethane, softening point 160°C; the isocyanate group content in rosin polyurethane is 15%.
松香聚氨酯B：丙烯海松酸型聚氨酯，软化点150℃；松香聚氨酯中的异氰酸酯基含量为15％。Rosin polyurethane B: acrylic pimaric acid polyurethane, softening point 150°C; the isocyanate group content in rosin polyurethane is 15%.
松香聚氨酯C：马来松香基聚氨酯，软化点130℃；松香聚氨酯中的异氰酸酯基含量为15％。Rosin polyurethane C: Male rosin-based polyurethane, softening point 130°C; the isocyanate group content in rosin polyurethane is 15%.
松香聚氨酯D：马来松香基聚氨酯，软化点135℃；松香聚氨酯中的异氰酸酯基含量为15％。 Rosin polyurethane D: male rosin-based polyurethane, softening point 135°C; the isocyanate group content in rosin polyurethane is 15%.
松香聚氨酯E：马来松香基聚氨酯，软化点135℃；松香聚氨酯中的异氰酸酯基含量20％。Rosin polyurethane E: male rosin-based polyurethane, softening point 135°C; the isocyanate group content in rosin polyurethane is 20%.
松香聚氨酯F：马来松香基聚氨酯，软化点135℃；松香聚氨酯中的异氰酸酯基含量为15％。Rosin polyurethane F: Male rosin-based polyurethane, softening point 135°C; the isocyanate group content in rosin polyurethane is 15%.
松香聚氨酯G：马来松香基聚氨酯，软化点135℃；松香聚氨酯中的异氰酸酯基含量为10％。Rosin polyurethane G: male rosin-based polyurethane, softening point 135°C; the isocyanate group content in rosin polyurethane is 10%.
松香聚氨酯H：马来松香基聚氨酯，软化点135℃；松香聚氨酯中的异氰酸酯基含量为7％。Rosin polyurethane H: male rosin-based polyurethane, softening point 135°C; the isocyanate group content in rosin polyurethane is 7%.
普通松香：685松香，软化点135℃。Ordinary rosin: 685 rosin, softening point 135°C.
聚氨酯类成膜剂A：聚氨酯改性环氧树脂。Polyurethane film-forming agent A: polyurethane modified epoxy resin.
聚氨酯类成膜剂B：聚氨酯改性丙烯酸树脂。Polyurethane film-forming agent B: polyurethane modified acrylic resin.
常规树脂成膜剂：环氧树脂。Conventional resin film-forming agent: epoxy resin.
触变剂：聚氨酯类触变剂和改性氢化蓖麻油复配，复配重量比例为1:2.5。Thixotropic agent: Polyurethane thixotropic agent and modified hydrogenated castor oil are compounded, and the weight ratio of the compound is 1:2.5.
活性剂：癸酸、戊酸。Active agents: capric acid, valeric acid.
高沸点溶剂：1-十八烯，沸点为314℃。High boiling point solvent: 1-octadecene, boiling point is 314°C.
中沸点溶剂：聚乙二醇，沸点263℃。Medium boiling point solvent: polyethylene glycol, boiling point 263°C.
低沸点溶剂：乙二醇乙醚，沸点135℃。Low boiling point solvent: ethylene glycol ether, boiling point 135°C.
金锡合金粉：3#Au80Sn2 0合金粉。Gold-tin alloy powder: 3#Au80Sn2 0 alloy powder.
实施例1～13和对比例1～6Examples 1 to 13 and Comparative Examples 1 to 6
实施例1～13和对比例1～6的金锡焊膏用助焊剂，包括如下表1所示按照重量百分比的组分：The fluxes for gold-tin solder pastes of Examples 1 to 13 and Comparative Examples 1 to 6 include components in weight percentage as shown in Table 1 below:
表1各实施例和对比例的组分及其重量百分比


Table 1 Components and weight percentages of each embodiment and comparative example


上述助焊剂的制备方法，包括如下步骤：The preparation method of the above flux includes the following steps:
在反应釜内加入中、高沸点溶剂，加热至165℃后按照配方量加入的松香聚氨酯、聚氨酯类成膜剂，熔化并混合均匀，然后降温至100℃，按照配方量加入低沸点溶剂和活性剂，混合均匀，最后按照配方量加入触变剂，边搅拌边加入，充分混合均匀后冷却，过滤，即得免清洗金锡焊膏用助焊剂。 Add medium and high boiling point solvents to the reaction kettle, heat to 165°C and add rosin polyurethane and polyurethane film-forming agents according to the formula amount. Melt and mix evenly. Then cool down to 100°C and add low boiling point solvents and active ingredients according to the formula amount. Agent, mix evenly, and finally add thixotropic agent according to the formula amount, add while stirring, mix thoroughly, then cool and filter, and you will have a flux for clean-free gold-tin solder paste.
应用application
一种免清洗金锡焊膏，包括如下按照重量份计算的组分：上述各实施例和对比例制备的免清洗金锡焊膏用助焊剂分别取10份和3#Au80Sn20合金粉90份。A no-clean gold-tin solder paste includes the following components calculated in parts by weight: 10 parts of flux for the no-clean gold-tin solder paste prepared in the above embodiments and comparative examples and 90 parts of 3#Au80Sn20 alloy powder.
上述的免清洗金锡焊膏的制备方法，包括如下步骤：The preparation method of the above-mentioned no-clean gold-tin solder paste includes the following steps:
按比例称取重量份的金锡合金粉、免清洗金锡焊膏用助焊剂，依次加入免清洗金锡焊膏用助焊剂、金锡合金粉，先搅拌15min后收料，将桨叶和桶壁上的锡膏刮除干净，然后抽真空至-0.8Mpa，搅拌30min后再次收料，最后再抽真空至-0.6Mpa，搅拌15min即得免清洗金锡焊膏，然后用于大功率LED器件封装，焊接后不需要清洗即可进行下一道焊接封装工序。Weigh the gold-tin alloy powder and no-clean gold-tin solder paste flux according to the proportion. Add the no-clean gold-tin solder paste flux and gold-tin alloy powder in sequence. Stir for 15 minutes and then collect the materials. Place the paddle and Scrape off the solder paste on the wall of the barrel, then vacuum to -0.8Mpa, stir for 30 minutes and collect the material again, and finally vacuum to -0.6Mpa, stir for 15 minutes to obtain a no-clean gold-tin solder paste, and then use it for high power LED device packaging does not require cleaning after welding before proceeding to the next welding and packaging process.
性能测试Performance Testing
1、测试方法1. Test method
(1)参照GB/T 31474-2015(电子装联高质量内部互连用助焊剂)对免清洗金锡焊膏用助焊剂进行物理稳定性测试、不挥发物含量测试(焊后残留)、扩展率测试；(1) Refer to GB/T 31474-2015 (Flux for high-quality internal interconnection in electronic assembly) to conduct physical stability test and non-volatile content test (post-soldering residue) of flux for no-clean gold-tin solder paste. Expansion rate test;
物理稳定性：助焊剂保持透明，无分层或沉淀现象，则为稳定性良好；否则较差；焊后残留：焊接后残留物形状规整、无色透明，330℃保温30s未出现黑色碳化物，不影响焊点美观和电气绝缘性，则判断为几乎无残留；Physical stability: If the flux remains transparent and has no delamination or precipitation, the stability is good; otherwise, it is poor; Post-weld residue: The residue after welding is regular in shape, colorless and transparent, and no black carbide appears after being kept at 330°C for 30 seconds. , does not affect the appearance and electrical insulation of the solder joints, it is judged to be almost no residue;
扩展率：无铅焊料M级应≥75％。Expansion rate: Lead-free solder grade M should be ≥75%.
(2)参照GB/31475-2015(电子装联高质量内部互连用焊锡膏)进行焊点外观、锡珠测试和润湿性测试。(2) Refer to GB/31475-2015 (Solder paste for high-quality internal interconnection in electronic assembly) for solder joint appearance, tin bead test and wettability test.
焊点外观：焊点外观应光亮饱满，且在焊点周围未见飞溅形成的小锡珠，则为合格；Appearance of solder joints: The appearance of solder joints should be bright and full, and if there are no small tin beads formed by spatter around the solder joints, it is qualified;
锡珠测试：在不润湿的陶瓷基板上，使用直径6.5mm或1.5mm的钢网印刷，于330℃熔化后使用显微镜观察，锡珠数量≤3个判定合格；Tin ball test: Use a stencil with a diameter of 6.5mm or 1.5mm to print on a non-wetting ceramic substrate. After melting at 330°C, use a microscope to observe. If the number of tin beads is ≤ 3, it will be judged to be qualified;
润湿性：按标准应为1级或2级，则判定为合格。Wettability: If it should be level 1 or level 2 according to the standard, it will be judged as qualified.
2、测试结果2. Test results
表2各实施例和对比例的性能测试结果


Table 2 Performance test results of each embodiment and comparative example


本发明各实施例制得的助焊剂不含卤素，经检测，结果如表2所示，扩展率≥75％，物理稳定性良好，焊后几乎无残留，用于制备金锡焊膏，在焊接工作中具有较好的表现，可满足高亮度或大功率LED封装中的免清洗工艺，基本不用清洗，锡珠测试合格，润湿性好，焊点外观光亮整洁，表明助焊剂的耐高温性能好，焊接性能优异，可保证电子产品封装的可靠性。The flux prepared in each embodiment of the present invention does not contain halogen. After testing, the results are shown in Table 2. The expansion rate is ≥75%, the physical stability is good, and there is almost no residue after soldering. It is used to prepare gold-tin solder paste. It has good performance in welding work and can meet the no-clean process in high-brightness or high-power LED packaging. Basically no cleaning is required. The tin bead test is qualified, the wettability is good, and the appearance of the solder joints is bright and clean, indicating the high temperature resistance of the flux. It has good performance and excellent welding performance, which can ensure the reliability of electronic product packaging.
而对比例1中使用普通松香，对比例2中使用普通树脂成膜剂，这两种情况均无法发生交联反应，导致锡膏在焊接过程中出现二次氧化，焊点外观较差，锡珠实验不合格，焊后残留多；对比例3中使用较多普通松香，配制锡膏的焊点表面覆盖一层较厚的不透明残留，需要清洗作业。而对比例4-6不使用高、中、低 沸点溶剂复配，导致稳定性差或锡珠实验不合格。In Comparative Example 1, ordinary rosin is used, and in Comparative Example 2, ordinary resin film-forming agent is used. In both cases, cross-linking reaction cannot occur, resulting in secondary oxidation of the solder paste during the soldering process, poor appearance of the solder joints, and tin The bead test failed, and there was a lot of residue after soldering; in Comparative Example 3, more ordinary rosin was used, and the surface of the solder joint where the solder paste was prepared was covered with a thick layer of opaque residue, requiring cleaning. Comparative examples 4-6 do not use high, medium and low The boiling point solvent is compounded, resulting in poor stability or failure in the tin bead test.
显然，本发明的上述实施例仅仅是为清楚地说明本发明所作的举例，而并非是对本发明的实施方式的限定。对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明权利要求的保护范围之内。 Obviously, the above-mentioned embodiments of the present invention are only examples to clearly illustrate the present invention, and are not intended to limit the implementation of the present invention. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. An exhaustive list of all implementations is neither necessary nor possible. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the claims of the present invention.

Claims (10)

  1. 一种免清洗金锡焊膏用助焊剂，其特征在于，包括如下按照重量百分比的组分：A flux for no-clean gold-tin solder paste, which is characterized in that it includes the following components in weight percentage:
    松香聚氨酯2％～5％；Rosin polyurethane 2% to 5%;
    聚氨酯类成膜剂2％～6％；Polyurethane film-forming agent 2% to 6%;
    触变剂3％～8％；Thixotropic agent 3% to 8%;
    活性剂1％～5％；Active agent 1% to 5%;
    余量为溶剂；The balance is solvent;
    所述松香聚氨酯的软化点为130～160℃；松香聚氨酯中的异氰酸酯基含量为7％～20％；The softening point of the rosin polyurethane is 130-160°C; the isocyanate group content in the rosin polyurethane is 7%-20%;
    所述溶剂为高、中、低沸点溶剂复配，其中高沸点溶剂的沸点为250～350℃，中沸点溶剂的沸点为150～250℃，低沸点溶剂的沸点为70～150℃，高、中、低沸点溶剂的重量比为1：2～4：1。The solvent is a compound of high, medium and low boiling point solvents, wherein the boiling point of the high boiling point solvent is 250~350°C, the boiling point of the medium boiling point solvent is 150~250°C, and the boiling point of the low boiling point solvent is 70~150°C. The weight ratio of medium and low boiling point solvents is 1:2 to 4:1.
  2. 根据权利要求1所述免清洗金锡焊膏用助焊剂，其特征在于，包括如下按照重量百分比的组分：The flux for no-clean gold-tin solder paste according to claim 1 is characterized in that it includes the following components in weight percentage:
    松香聚氨酯3％～4％；Rosin polyurethane 3% to 4%;
    聚氨酯类成膜剂3％～5％；Polyurethane film-forming agent 3% to 5%;
    触变剂4％～6％；Thixotropic agent 4% to 6%;
    活性剂3％～4％；Active agent 3% to 4%;
    余量为溶剂。The balance is solvent.
  3. 根据权利要求1或2所述免清洗金锡焊膏用助焊剂，其特征在于，所述松香聚氨酯的软化点为135～150℃。The flux for no-clean gold-tin solder paste according to claim 1 or 2, characterized in that the softening point of the rosin polyurethane is 135-150°C.
  4. 根据权利要求1所述免清洗金锡焊膏用助焊剂，其特征在于，所述松香聚氨酯中的异氰酸酯基含量为10％～15％。The flux for no-clean gold-tin solder paste according to claim 1, characterized in that the isocyanate group content in the rosin polyurethane is 10% to 15%.
  5. 根据权利要求1所述免清洗金锡焊膏用助焊剂，其特征在于，所述聚氨酯类成膜剂为聚氨酯改性环氧树脂和/或聚氨酯改性丙烯酸树脂。The flux for no-clean gold-tin solder paste according to claim 1, characterized in that the polyurethane film-forming agent is polyurethane-modified epoxy resin and/or polyurethane-modified acrylic resin.
  6. 权利要求1～5任一项所述免清洗金锡焊膏用助焊剂的制备方法，其特征在于，包括如下步骤： The preparation method of flux for no-clean gold-tin solder paste according to any one of claims 1 to 5, characterized in that it includes the following steps:
    先将中、高沸点溶剂混合，加热至120～180℃后，按照配方量加入松香聚氨酯、聚氨酯类成膜剂，熔化并混合均匀，然后降温至90～110℃，按照配方量加入低沸点溶剂和活性剂，混合均匀，最后按照配方量加入触变剂，混合均匀后冷却，过滤后即得免清洗金锡焊膏用助焊剂。First mix medium and high boiling point solvents, heat to 120~180℃, add rosin polyurethane and polyurethane film-forming agent according to the formula, melt and mix evenly, then cool to 90~110℃, add low boiling point solvent according to the formula. and activator, mix evenly, and finally add thixotropic agent according to the formula amount, mix evenly, cool, and filter to obtain the flux for clean-free gold-tin solder paste.
  7. 权利要求1～5任一项所述免清洗金锡焊膏用助焊剂在制备免清洗金锡焊膏中的应用。Application of the flux for no-clean gold-tin solder paste described in any one of claims 1 to 5 in preparing no-clean gold-tin solder paste.
  8. 一种免清洗金锡焊膏，其特征在于，包括如下按照重量份计算的组分：权利要求1～5任一项所述免清洗金锡焊膏用助焊剂4～15份和金锡合金粉85～96份。A no-clean gold-tin solder paste, characterized in that it includes the following components calculated in parts by weight: 4-15 parts of flux for the no-clean gold-tin solder paste according to any one of claims 1 to 5 and a gold-tin alloy 85 to 96 servings of powder.
  9. 权利要求8所述免清洗金锡焊膏的制备方法，其特征在于，包括如下步骤：The preparation method of no-clean gold-tin solder paste according to claim 8, characterized in that it includes the following steps:
    先依次加入免清洗金锡焊膏用助焊剂、金锡合金粉，混合均匀；然后抽真空至-0.6～-0.8Mpa，混合15～30min后收料，最后再抽真空至-0.4～-0.6Mpa，混合10～30min后即得免清洗金锡焊膏。First, add flux for no-clean gold-tin solder paste and gold-tin alloy powder in sequence, and mix evenly; then vacuum to -0.6~-0.8Mpa, mix for 15~30 minutes, collect the material, and finally vacuum to -0.4~-0.6 Mpa, after mixing for 10 to 30 minutes, you can get the no-clean gold-tin solder paste.
  10. 权利要求8所述免清洗金锡焊膏在高亮度或大功率LED封装中的应用。 The application of the no-clean gold-tin solder paste described in claim 8 in high-brightness or high-power LED packaging.
PCT/CN2023/095438 2022-03-23 2023-05-22 Flux for no-clean gold-tin soldering paste, preparation method therefor, and application thereof WO2023179805A1 (en)

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