KR101825633B1 - Flux for solder and the manufacturing method thereof and the electric device comprising thereof - Google Patents

Abstract

The present invention provides a flux composition for a solder comprising a solvent, an activator and an additive, wherein the activator comprises a first activator comprising an acid and a second activator comprising an amine, A flux composition for a solder and an electric device using the flux composition are provided, which can simplify a process of manufacturing an electric device by using the flux composition, and also have excellent performance of an electric device to be manufactured.

Description

FIELD OF THE INVENTION [0001] The present invention relates to flux compositions for solders,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flux composition for a solder, and more particularly, to a flux composition for a solder that can simplify a mounting process using a solder ball and is excellent in workability and an electric apparatus including the flux composition.

In the field of integrated circuit technology, when a chip or the like is bonded to a printed circuit board (PCB) on which a metal layer such as a metal circuit pattern, UBM (under bump metallurgy) is formed using a solder ball, A pre-cleaning flux is applied before solder ball bonding, reflow is performed to remove the oxide film, and then the substrate is cleaned. Then, a flux for the bonding process is applied, and a solder ball is bonded Reflow will occur.

Also, in most of the reflow processes, conventional fluxes leave residues such as ion residues, which require additional processing steps to remove residues as they can lead to corrosion of the circuit and disconnection of the circuit. In the semiconductor device manufacturing process, it is very difficult to remove (i.e., clean) the remnants around the solder bumps after the reflow process, because the solder connections formed between the semiconductor chip and the PCB have a very narrow spacing. Even if the cleaning process is easy, the cleaning process causes environmental problems including the treatment of the waste generated during the cleaning operation.

As described above, since the joining process of the electric device parts using the conventional flux adds an intermediate process such as a reflow process and a residue washing process for pre-cleaning flux, the manufacturing cost and time in the process increase There is a problem.

The present invention provides a flux composition for a solder and an electric device including the flux composition capable of performing a bonding process directly without passing through a reflow process and a residue washing process using a pre-flux as an intermediate process .

However, the objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

The present invention relates to a flux composition for solder comprising a solvent, an activator and an additive, wherein the activator comprises a first activator containing at least two acids and a second activator comprising at least two amines, Wherein the first active agent is selected from the group consisting of succinic acid, adipic acid, propionic acid, malonic acid, maleic acid, formic acid glutaric acid ( wherein the second active agent comprises at least two acids selected from the group consisting of glutaric acid, pimelic acid, tetradecanoic acid and dimethylolpropionic acid, Wherein the alkylene group is selected from the group consisting of alkyl monoamine, alkyl diamine, monoethanol amine, diethanol amine, triethanol amine and ethylenediamine. Two species Based on the total weight of the flux composition.

And the activator is contained in an amount of 30 to 70 parts by weight based on 100 parts by weight of the solder flux composition.

The first activator is contained in an amount of 10 to 25 parts by weight based on 100 parts by weight of the flux composition for solder and the second active agent is contained in 20 to 50 parts by weight based on 100 parts by weight of the flux composition for solder. .

The additive also comprises a first additive, wherein the first additive is selected from the group consisting of sodium dioctyl sulfosuccinate, sodium dodecylsulfate, polyoxyethylene sorbitan monolaurate, Wherein the flux composition comprises at least one selected from the group consisting of ethoxylated fatty alcohols.

And the first additive is included in an amount of 5 to 20 parts by weight based on 100 parts by weight of the solder flux composition.

Also, the additive includes a second additive, and the second additive is selected from the group consisting of polyethylene glycol ether, polyethylene glycol, polyethylene glycol stearyl ether, polyoxyethylene resin alcohol The present invention provides a flux composition for solder comprising at least two selected from the group consisting of polyoxyethylene tallow alcohol, palmitic acid, stearic acid and lauric acid.

And the second additive is contained in an amount of 10 to 25 parts by weight based on 100 parts by weight of the solder flux composition.

And the third additive includes at least two selected from the group consisting of Maleic Resin, Petroleum Resin and Pyrrolidone, wherein the additive comprises a third additive, A flux composition for solder is provided.

And the third additive is included in an amount of 2 to 10 parts by weight based on 100 parts by weight of the solder flux composition.

The solvent may further comprise at least one compound selected from the group consisting of ethylene glycol ether, ethylene glycol, glycol acetate, and aromatic alcohol, And 15 to 30 parts by weight based on 100 parts by weight of the solder flux composition.

Also, there is provided a solder flux composition having a viscosity change ratio of 50% or less and a TI (Thixotropic Index) value of 0.55 or more after 4000 times of printing of the flux composition for solder.

The present invention also provides a method for preparing a polymer electrolyte membrane, comprising: a first dissolving step in which a first activator and a second additive are added to a solvent while the temperature of the reactor is maintained at 90 to 120 ° C, followed by stirring to dissolve the first charge; A second dissolving step of setting the temperature of the reactor at 120 to 150 ° C, adding a second activator and raising the temperature to dissolve the second charge; A third dissolving step in which the third additive is added and stirred while the temperature of the reactor is maintained at 120 to 150 ° C to dissolve the third charge; A fourth dissolving step in which the temperature of the reactor is maintained at 100 to 120 DEG C, and then the first additive and the second additive are added and stirred to dissolve the fourth charge; And a cooling step of putting the solution having been subjected to the fourth dissolution step in a cooling vessel and cooling the solution at a set temperature of 5 to 10 DEG C for 4 hours or more and physically dispersing it and stabilizing the solution at 5 to 25 DEG C for 60 hours or more, The present invention also provides a method for producing a flux composition for use in the present invention.

The present invention also provides a method of bonding a solder ball to a printed circuit board (PCB) using flux, the method comprising: printing the flux composition for solder on a metal layer formed on the printed circuit board (PCB) Mounting a solder ball on the composition and reflowing the solder ball; and providing a solder ball bonding method using the flux composition for solder.

The present invention also relates to a printed circuit board (PCB) including a metal pad and an under bump metallurgy (UBM) formed on the metal pad; And a solder ball bonded using the flux composition for soldering according to any one of claims 1 to 10 on the UBM.

The solder flux composition according to the present invention can excellently remove oxides formed in the process of electrical connection of circuits and does not affect the performance degradation of the device after the reflow, It is not necessary to carry out the residue washing process, so that the process can be simplified and an effect of workability is provided. It also has the advantage that it does not contain halogen components and does not cause environmental problems.

1 and 2 show SEM and EDS results of a printed circuit board according to an embodiment of the present invention.

Before describing the present invention in detail, it is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention, which is defined solely by the appended claims. shall. All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art unless otherwise stated.

Throughout this specification and claims, the word "comprise", "comprises", "comprising" means including a stated article, step or group of articles, and steps, , Step, or group of objects, or a group of steps.

On the contrary, the various embodiments of the present invention can be combined with any other embodiments as long as there is no clear counterpoint. Any feature that is specifically or advantageously indicated as being advantageous may be combined with any other feature or feature that is indicated as being preferred or advantageous. Hereinafter, embodiments of the present invention and effects thereof will be described with reference to the accompanying drawings.

<Flux composition for solder>

The flux composition for solder according to an embodiment of the present invention includes a solvent, an activator and an additive, wherein the activator includes a first activator and a second activator, and the solder ball melts when reflowed, Has the effect of fluxing the surface so as to be electrically connected with excellent.

(1) Solvent

The solvent according to an embodiment of the present invention may include one or more solvents selected from the group consisting of ethylene glycol ether, ethylene glycol, glycol acetate, and aromatic alcohol. &Lt; / RTI &gt; (EDGBE, Butyl cabitol), Diethylene glycol monobutyl ether acetate (EDGBEA, Butyl cabitol acetate), Ethylene glycol ethyl ether (EGEE), Ethylene glycol ethyl ether acetate (EGEEA; ethoxyethanol acetate, diethylene glycol monohexyl ether (DEGHE), tetraethylene glycol, triethylene glycol, and alpha terpineol. Particularly, it is preferable to use a solvent such as Butyl carbitol or Hexyl carbitol having high solubility without being inhibited by the activity.

The solvent is contained in an amount of 15 to 30 parts by weight based on 100 parts by weight of the solder flux. If the amount of the solvent is less than 15 parts by weight, there is a problem that the reliability and merchantability of the solder flux to be produced is lowered due to the lowered solubility. When the solder flux is used in an amount exceeding 30 parts by weight, Lt; / RTI &gt;

Preferably, a low boiling point solvent having a boiling point of 180 ° C or lower and a high boiling point solvent having a boiling point of 200 ° C or higher are mixed at a weight ratio of 0.8 to 1.2 per 1 mole of the above-mentioned mixture.

(2) Activator

The active agent according to an embodiment of the present invention includes a first active agent containing at least two acids and a second active agent containing at least two amines. (For example, a copper oxide film of a metal layer of a printed circuit board (PCB), a tin oxide film of a solder ball surface) formed on the surface of a solder ball, which is generated when a component of the electric device according to the present invention is bonded, So that the solder balls are smoothly joined to each other to provide excellent electrical connection.

In the present invention, the first activator which has no environmental problems and has excellent activity, and a second activator which removes the organic matter remaining on the substrate surface while reflowing while reinforcing the active power of the first activator, and remains as a residue after reflow, A second active agent that does not cause performance degradation can be used together to improve the active power while minimizing performance problems.

The first active agent is an acid-containing active agent. Specific examples thereof include succinic acid, adipic acid, propionic acid, malonic acid, maleic acid, Formic acid Two or more acids selected from the group consisting of glutaric acid, pimelic acid, tetradecanoic acid and dimethylolpropionic acid, .

Preferably at least two acids selected from the group consisting of succinic acid, adipic acid, maleic acid, propionic acid and tetradecanoic acid, It is good.

The first activator is included in an amount of 10 to 25 parts by weight based on 100 parts by weight of the solder flux. More preferably 20 to 25 parts by weight. If the amount of the solder flux is less than 10 parts by weight, it is not possible to provide a sufficient fluxing effect, and there is a problem that the soldering and the shrinkage are generated. When the solder flux is contained in an amount exceeding 25 parts by weight, ) May remain, and there is a problem of deterioration of the performance of the device due to corrosion.

It is preferable to use a first activator containing three or more acids having different active points in order to supply sufficient activation energy to the solder.

The second active agent is an amine-containing active agent, and specifically includes an organic amine and an ethanol amine. More specifically, the present invention relates to a method for producing a polyurethane resin composition comprising an alkyl monoamine, an alkyl diamine, a monoethanol amine, a diethanol amine, a triethanol amine and an ethylenediamine And at least two amines selected from the group consisting of

The second activator is included in an amount of 20 to 50 parts by weight based on 100 parts by weight of the solder flux. More preferably 20 to 35 parts by weight. If it is contained in an amount of less than 20 parts by weight, residues such as organic substances remain on the surface of the substrate after reflow or washing. If the amount exceeds 50 parts by weight, viscous organic gas may occur beyond the commercial range.

The content ratio of the first active agent and the second active agent can be appropriately determined in consideration of both the environmental aspect and the active power aspect within the above content range.

The active agent is mainly composed of acid and amine, and is included in 30 to 70 parts by weight based on 100 parts by weight of the solder flux. If the amount of the activator is less than 30 parts by weight, the fluxing effect is lowered, resulting in problems such as coldness, surface shrinkage, bump failure and solder ball missing rate. When the amount exceeds 70 parts by weight, So that the performance of the device due to corrosion may be deteriorated. Preferably 45 to 60 parts by weight.

(3) Additives

The flux composition for solder according to an embodiment of the present invention includes a surfactant, a shaving agent, a defoaming agent, and an emulsifying agent. The additive is included in the solder flux composition and is not limited to one role, but performs the functions of surfactant, vesicle, rumen and emulsification organically.

The first additive is included in the flux composition so as to have an easy washing effect, and includes components that do not cause environmental problems. For example, sodium dioctyl sulfosuccinate, sodium dodecylsulfate, polyoxyethylene sorbitan monolaurate, and ethoxylated fatty alcohol may be used. Can be used.

The first additive is included in an amount of 20 to 40 parts by weight based on 100 parts by weight of the additive. The content ratio of the first additive can be suitably determined in consideration of the environmental problem and the washing property within the above content range.

The first additive is included in an amount of 5 to 20 parts by weight based on 100 parts by weight of the solder flux. If it is contained in an amount of less than 5 parts by weight, residues may be generated in the cleaning process after the use of the solder flux. If it exceeds 20 parts by weight, the active ingredient may be decomposed to inhibit the fluxing effect, Air bubbles may be generated. Preferably 8 to 16 parts by weight.

The second additive is added in order to improve the process capability of the flux, thereby maintaining the shape after the flux printing and suppressing the generation of bubbles in the flux during printing. Examples of the second additive include polyethylene glycol ether, polyethylene glycol, polyethylene glycol stearyl ether, polyoxyethylene tallow alcohol, palmitic acid ), Stearic acid, and lauric acid, may be used. However, it should be understood that the present invention is not limited thereto and various materials may be used.

The second additive is included in an amount of 10 to 25 parts by weight based on 100 parts by weight of the solder flux. If it is contained in an amount of less than 10 parts by weight, the roughening is lowered and bubbles are produced in the flux, and if it is contained in an amount exceeding 25 parts by weight, the flowability is deteriorated. Preferably 12 to 22 parts by weight.

The third additive includes maleic resin, petroleum resin, and pyrrolidone so as to maintain the viscosity of the solder flux composition according to the present invention and to complement the action of the active agent .

And at least one resin selected from the group consisting of a third additive may be used. As the third additive, for example, Piccopale l00, Neville Lx-685, Dutrex, Fortified rosin (250), Dispropotionated rosin (800H) methyl pyrrolidone, polyvinyl pyrrolidone and 2-pyrrolidone- .

The third additive is included in an amount of 2 to 10 parts by weight based on 100 parts by weight of the solder flux. If it is contained in an amount of less than 2 parts by weight, the solder ball may be detached from the UBM due to its low viscosity, or organic matters may remain on the surface of the substrate. If the amount is more than 10 parts by weight, have. Preferably 4 to 8 parts by weight.

The flux composition for soldering according to the present invention can remove oxides and other organic residues formed in the process of electrical connection of a circuit with excellent ease of cleaning due to the absence of remaining components after reflow, It is possible to perform the printing, dotting and solder ball attaching work of the present flux without the need to go through the entire substrate pretreatment process including the cleaning process, thereby simplifying the process and reducing the facility / management cost, The effect is excellent. It also has the advantage that it does not contain halogen components and does not cause environmental problems.

&Lt; Preparation of flux composition for solder >

The flux composition for solder of the present invention is prepared by mixing a solvent, an activator and an additive. The order of mixing them is not limited to a certain order as long as all materials can be appropriately synthesized.

However, for example, the synthesis may be carried out by adding a first charge to a solvent to synthesize the mixture, adding a second charge and a third charge to synthesize the mixture, and finally adding a fourth charge. This will be described in more detail. The method for manufacturing a flux composition for solder according to an embodiment of the present invention is manufactured in a state where the temperature of the reactor is controlled and maintained at 100 to 150 ° C.

First, the solvent, the first activator and the second additive, which are the first charge, are added in the state where the temperature of the reactor is maintained at 90 to 120 ° C, and the mixture is stirred for 60 to 180 minutes at a stirring speed of 100 to 200 rpm to obtain a first charge Synthesized. After the completion of the synthesis of the first charge, the temperature of the reactor was set at 120 to 150 ° C., and the second activator, the second activator, was added. The mixture was heated at a stirring speed of 150 to 250 rpm while being stirred for 30 to 60 minutes, Synthesized.

After the solids completely reacted through the first and second synthesis, the third additive, which is a third input, is added while the reactor temperature is maintained at 120 to 150 ° C, and the mixture is stirred at a stirring rate of 150 to 190 rpm for 5 to 20 minutes .

After the third charge is completely synthesized, the temperature of the reactor is adjusted to 100-120 ° C, and then the first additive and the second additive, which are the fourth inputs, are added and stirred at a stirring rate of 150-190 rpm for 5-20 minutes .

The high temperature solder flux prepared by fully synthesizing the input materials is put into a cooling container and cooled to a set temperature of 5 to 10 캜 and stirring for 4 hours or more at a stirring speed of 5 to 10 rpm. The cooled solder flux is dispersed 2 to 5 times using a roll mill and then stabilized at 5 to 25 DEG C for 60 hours or more to prepare a solder flux composition.

<Solder Ball Bonding Method Using Flux Composition for Solder>

A method of bonding a solder ball to a metal layer of a printed circuit board (PCB) using the flux composition for soldering according to an embodiment of the present invention will be described as follows.

 The flux composition for a solder according to an embodiment of the present invention is printed or dotted on a metal layer formed on a printed circuit board (PCB), and solder ball attachment is performed on the solder flux composition for reflow after solder ball attachment Reflow) to bond the solder balls.

More specifically, on a printed circuit board (PCB) on which a UBM (Under Bump Metallurgy), which is a multilayer metal layer for easy adhesion on a metal pad or a metal pad and prevents diffusion of solder into chips, is formed, The flux composition for soldering according to the embodiment is applied by a method such as metal mask printing, pin dotting, stencil printing, or the like. The flux composition for solder can be applied over the entire surface of the substrate including the metal layer and on the metal layer that is part of the surface of the substrate.

The solder ball is placed on the coated flux composition for solder at a position where electrical connection is required and then heated and reflowed to activate the solder flux to melt the solder ball surface and the metal oxide film on the surface of the metal layer and melt the solder ball It is bonded to a printed circuit board (PCB).

&Lt; Production example of flux composition for solder >

(1) Production of flux composition for solder of Example 1

To the reactor maintained at 100 ℃, 7 g of propionic acid, 8 g of succinic acid and 4 g of parmidic acid were added to 18 g of diethylene glycol monobutyl ether, and the mixture was stirred at a stirring speed of 150 rpm for 70 minutes to synthesize a primary input to the solvent.

After the first charge was synthesized, the temperature of the reactor was set to 130 ° C., 16 g of triethanol amine and 14 g of diethanol amine were added, and the reaction solution was reacted with the reaction solution while raising the temperature to the set temperature for 40 minutes with stirring at 160 rpm.

6 g of methyl pyrrolidone and 2 g of Dispropotionated rosin (800H) were added to the reaction solution while maintaining the reactor temperature at 130 ° C., and the mixture was stirred for 50 minutes at a stirring rate of 180 rpm to synthesize a tertiary input .

After reacting the third charge, the reactor temperature was set to 105 ° C., 14 g of sodium dioctyl sulfosuccinate and 11 g of polyoxyethylene tallow alcohol were added, and the mixture was stirred at a stirring speed of 190 rpm for 15 minutes. The temperature of the condenser was set at 5 ° C., Lt; / RTI &gt; for 210 minutes.

The cooled flux was dispersed three times using a roll mill and stabilized at a storage temperature of 15 캜 for 72 hours to prepare a flux composition for a solder.

(2) Preparation of flux compositions for solder of Examples 2 to 7

Examples 2 to 7 were prepared in the same manner as in Example 1 except that the solvent, the activator, the resin and the additive were prepared as shown in Tables 1 and 2.

The solvent Primary inputs (excluding solvents) Kinds Content (g) Kinds Content (g) Example 1 Diethylene glycol monobutyl ether 18 propionic acid
+ succinic acid
+ parmitic acid 19
(7 + 8 + 4) Example 2 Diethylene glycol monobutyl ether
+ Triethylene glycol 20
(10 + 10) Propionic acid
+ maleic acid
+ stearic acid 20
(10 + 5 + 5) Example 3 Diethylene glycol monohexyl ether 19 Succinic acid
+ tetradecanoic acid
+ Lauric acid 22
(9 + 5 + 8) Example 4 Diethylene glycol monohexyl ether 19 Succinic acid
+ Maleic acid
+ Adipic acid 19
(10 + 6 + 3) Example 5 Triethylene glycol 20 Propionic acid
+ succinic acid
+ Lauric acid 20
(10 + 5 + 5) Example 6 Triethylene glycol
+ Alpha terpineol 20
(13 + 7) Propionic acid
+ succinic acid
+ stearic acid 22
(12 + 6 + 4) Example 7 Alpha terpineol 25 Propionic acid
+ Maleic acid
+ stearic acid 16
(7 + 5 + 3)

Secondary inputs Third Input 4th input Kinds Content (g) Kinds Content (g) Kinds Content (g) Example 1 Triethanol amine
+ Diethanol amine 30
(16 + 14) Methyl pyrrolidone
+ Dispropotionated rosin 8
(6 + 2) Sodium dioctyl sulfosuccinate
+ Polyoxyethylene tallow Alcoho 25
(14 + 11) Example 2 Triethanol amine
+ Diethanol amine 30
(16 + 14) Poly vinyl Pyrrolidone
+ Fortified resin (DX-250) 7
(2 + 5) Sodium dioctyl sulfosuccinate
+ Polyoxyethylene tallow Alcoho 23
(13 + 10) Example 3 Ethylenediamine
+ Triethanol amine 30
(15 + 15) Poly vinyl Pyrrolidone
+ Fortified resin (DX-250) 7
(2 + 5) Sodium dioctyl sulfosuccinate
+ Polyethylene glycol stearyl ether 22
(15 + 7) Example 4 Ethylenediamine
+ Monoethanol amine 32
(22 + 10) 2-pyrrolidone-5-carboxylic acid
+ Dispropotionated rosin 6
(4 + 2) Sodium dioctyl sulfosuccinate
+ Polyethylene glycol stearyl ether 24
(13 + 11) Example 5 Ethylenediamine
+ Triethanol amine 30
(10 + 20) 2-pyrrolidone-5-carboxylic acid
+ Dispropotionated rosin 6
(4 + 2) Ethoxylated fatty alcohol
+ Polyethylene glycol 24
(13 + 11) Example 6 Ethylenediamine
+ Triethanol amine 32
(15 + 17) Methyl pyrrolidone
+ Dispropotionated rosin 10
(3 + 7) Sodium dioctyl sulfosuccinate
+ Polyethylene glycol ether 16
(8 + 8) Example 7 Diethanol amine
+ Monoethanol amine 25
(15 + 10) Methyl pyrrolidone
+ Fortified resin (DX-250) 8
(3 + 5) Sodium dodecylsulfate
+ Polyethylene glycol stearyl ether 26
(13 + 13)

(3) Production of flux compositions for solder of Comparative Examples 1 to 3

Comparative Examples 1 to 7 were prepared as Comparative Examples 3 and 4 as comparative flux compositions for comparison with the Examples. The solvent was prepared by adding the first activator and the second activator in order, and adding the resin and the additive.

solvent The first activator The second activator Kinds Content (g) Kinds Content (g) Kinds Content (g) Comparative Example 1 HeDG 20 Organic acid 10 Organic amine 50 Comparative Example 2 Aromatic alcohol 30 Organic acid 20 Organic amine + TEA 10 + 5 Comparative Example 3 Polyglycol ether 40 Organic acid 6 Organic amine 44 Comparative Example 4 Triethylene glycol 20 succinic acid
+ glycolic acid 7 + 8 ethanol amine 35 Comparative Example 5 Alpha terpineol 20 succinic acid 8 프로 옥시 알 아민 45

Suzy Additive 1 Additive 2 Kinds Content (g) Kinds Content (g) Kinds Content (g) Comparative Example 1 Thixotopic 5 Polyoxyethylene ether 15 - - Comparative Example 2 Polyethylene glycol stearyl ether 10 surfactant 25 - - Comparative Example 3 Thixotopic 5 surfactant 5 - - Comparative Example 4 Fortified resin (DX-250) 25 Envirogem AD01 5 - - Comparative Example 5 Dispropotionated rosin 20 Envirogem AD01 2 Methyl pyrrolidone 5

&Lt; Electrical bonding using flux composition for solder >

The flux compositions for solder produced according to Examples 1 to 7 and Comparative Examples 1 to 3 described above were printed on a metal pad treated with Cu OSP or NiAu to a thickness of 0.3 to 0.5 mu m on a printed circuit board, The flux was applied by pin dotting and the solder balls (SAC composition) of 100 to 300 袖 m were placed on the substrate. The substrate was then reflowed using a reflow apparatus at a peak temperature of 240 to 255 캜, Dwell time) The solder balls are melted under the condition of 50 to 120 sec to make a bump-shaped electrically bonded printed circuit board. After the reflow process is completed, the DI water is heated to 40 to 50 ° C within 3 hours. (DI water) at room temperature (25 ° C) for 2 minutes or more by spraying method, followed by drying to complete the electrical connection A printed circuit board was prepared in the same manner as in Examples 8 to 14 and Comparative Examples 6 to 10.

&Lt; Evaluation of flux composition for solder and electrical connection >

(1) Evaluation of Fluidity characteristic

Viscosity and Thixopropic Index (TI) measurements

Viscosity and TI (Thixopropic Index) at the following test conditions were measured using a Malcom Viscometer (PCU-205) to evaluate the flow characteristics of the solder flux compositions of Examples 1 to 7 and Comparative Examples 1 to 5, And the results are shown in Table 5. &lt; tb &gt; &lt; TABLE &gt;

- Printer: 50mm / sec, 1.5kgf

- Printing cycle - 4000 times (about 8hr)

- Rheometer: Temp. - 25 ± 0.1 ° C

Before printing After 1000 After 2000 After 3000 After 4000 Rate of change
(%) Example 1 Viscosity
(Pa.S) 25 18 15 14 13 48 T.I. 0.55 0.62 0.66 0.67 0.67 21.8 Example 2 Viscosity
(Pa.S) 28 20 19 16 14 50 T.I. 0.60 0.62 0.66 0.71 0.74 23.3 Example 3 Viscosity
(Pa.S) 15 14 12 11 11 26.7 T.I. 0.65 0.66 0.68 0.68 0.70 7.7 Example 4 Viscosity
(Pa.S) 20 18 14 12 12 40 T.I. 0.58 0.59 0.61 0.62 0.63 8.6 Example 5 Viscosity
(Pa.S) 26 22 19 17 13 50 T.I. 0.67 0.69 0.70 0.71 0.74 10.4 Example 6 Viscosity
(Pa.S) 34 33 30 27 26 23.5 T.I. 0.60 0.60 0.65 0.68 0.69 15.0 Example 7 Viscosity
(Pa.S) 48 42 38 34 31 35.4 T.I. 0.74 0.76 0.77 0.77 0.80 8.1 Comparative Example 1 Viscosity
(Pa.S) 21 15 11 11 10 52.4 T.I. 0.46 0.49 0.51 0.52 0.53 15.2 Comparative Example 2 Viscosity
(Pa.S) 47 40 36 29 23 51.1 T.I. 0.54 0.58 0.61 0.64 0.65 20.4 Comparative Example 3 Viscosity
(Pa.S) 60 35 29 25 23 61.7 T.I. 0.78 0.45 0.43 0.43 0.40 -48.7 Comparative Example 4 Viscosity
(Pa.S) 71 59 50 33 29 59.2 T.I. 0.42 0.43 0.45 0.46 0.52 19.2 Comparative Example 5 Viscosity
(Pa.S) 67 60 55 53 51 23.9 T.I. 0.37 0.37 0.41 0.44 0.44 15.9

As shown in Table 5, the viscosity change rate of the flux composition for soldering according to the comparative example was more than 50% after printing 4000 times, while the rate of change in viscosity after printing 4,000 times of the flux composition for soldering according to the embodiment of the present invention was 50% , And the flux composition for solder according to the embodiment of the present invention has a TI value of 0.55 or more.

(2) Evaluation of Coverage

With respect to the solder flux compositions of Examples 1 to 7 and Comparative Examples 1 to 5, the variation of the flux with time was measured using the 3D Micro Scope under the following test conditions, and the results are shown in Table 6.

- Scope: 3D Micro Scope

- Test Temp. : 24.5 ± 0.2 ° C

- Mask: Diameter (0.2 mm), Thickness (0.2 mm)

Mask Open Printing 8hr. passed 16hr. passed 24hr. passed Rate of change
(%) Example 1 2000 2260 2266 2273 2274 0.62 Example 2 2000 2334 2339 2348 2351 0.72 Example 3 2000 2271 2297 2304 2321 2.15 Example 4 2000 2321 2328 2333 2340 0.81 Example 5 2000 2190 2196 2197 2197 0.32 Example 6 2000 2356 2359 2366 2369 0.55 Example 7 2000 2651 2654 2658 2667 0.60 Comparative Example 1 2000 2445 2453 2462 2468 0.93 Comparative Example 2 2000 2452 2464 2486 2499 1.88 Comparative Example 3 2000 2412 2423 2474 2484 2.90 Comparative Example 4 2000 2260 2268 2276 2282 0.96 Comparative Example 5 2000 2334 2355 2360 2365 1.31

As shown in Table 6, the spreadability of the flux composition for solder according to the comparative example after 24 hours is as high as 0.93 or more, while the spreadability after 24 hours of the flux composition for soldering according to one embodiment of the present invention is similar to that of Example 3 It is 0.81 or less.

(3) Evaluation of the Miassing rate according to the degree of substrate oxidation

In order to measure the degree of influence of the soldering bumps formed on the printed circuit boards manufactured according to Examples 8 to 14 and Comparative Examples 6 to 10 on the missing rate, (Ppm), and the results of the experiment are shown in Table 7.

- Solder Ball: Sn1.2Ag0.5Cu / 250um

- Pad finish: Cu OSP

Reflow: Peak Temp. (240 ° C), Dwell time (50 sec)

Air Cleaning 1st Reflow 5th Reflow 10th Reflow Increase in sewing rate (%) Example 8 107 35 53 61 72 35.8 Example 9 161 144 179 197 212 62.3 Example 10 99 43 58 69 77 35.8 Example 11 112 42 45 78 92 88.7 Example 12 181 150 171 179 192 39.6 Example 13 157 139 148 167 181 62.3 Example 14 193 153 244 298 302 109.4 Comparative Example 6 510 322 359 501 699 641.5 Comparative Example 7 197 161 251 322 376 235.8 Comparative Example 8 201 170 188 225 304 218.9 Comparative Example 9 231 192 208 236 299 171.7 Comparative Example 10 262 212 234 261 302 128.3

As shown in Table 7, it can be seen that the sewing rate of the printed circuit board according to the embodiment of the present invention is much lower than the sewing rate of the printed circuit board according to the comparative example. Also, as shown in the results of the one-time reflow soldering rate and the ten-time reflow soldering rate increase rate (%), the increase rate of the unsuccess rate of the printed circuit board according to the embodiment of the present invention was 109.4% It can be seen that the effect is more remarkable as the number of reflows is increased.

(4) Evaluation of washability

An image obtained by a scanning electron microscope (SEM) and an energy dispersive X-ray spectroscopy (EDS) were measured for an electrically bonded junction region having undergone the cleaning process according to Example 8 The results of the elemental analysis are shown in FIGS. 1 and 2. FIG. FIG. 1 shows the SEM and EDS results of the printed circuit board. FIG. 2 shows the result of SEM after cleaning the flux with ST-100 after washing the flux with water after reflow of Example 8 according to one embodiment of the present invention. And EDS results.

The features, structures, effects, and the like illustrated in the above-described embodiments can be combined and modified in other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

Claims (15)

A flux composition for solder comprising a solvent, an activator and an additive,
Wherein the activator comprises a first activator comprising at least two acids and a second activator comprising at least two amines,
Wherein the first active agent is selected from the group consisting of succinic acid, adipic acid, propionic acid, malonic acid, maleic acid, formic acid glutaric acid, At least two kinds of acids selected from the group consisting of pimelic acid, tetradecanoic acid and dimethylolpropionic acid,
The second activator may be composed of an alkyl monoamine, an alkyl diamine, a monoethanol amine, a diethanol amine, a triethanol amine, and an ethylenediamine. And at least two amines selected from the group consisting of:
Wherein the additive comprises a third additive comprising at least two selected from the group consisting of Maleic Resin, Petroleum Resin and Pyrrolidone,
Wherein the first activator is contained in an amount of 10 to 25 parts by weight and the second active agent is contained in an amount of 20 to 50 parts by weight based on 100 parts by weight of the solder flux composition, 10 parts by weight of a flux composition for solder.
The method according to claim 1,
Wherein the activator is contained in an amount of 30 to 70 parts by weight based on 100 parts by weight of the flux composition for solder.
delete The method according to claim 1,
Wherein the additive comprises a first additive,
The first additive may be selected from the group consisting of sodium dioctyl sulfosuccinate, sodium dodecylsulfate, polyoxyethylene sorbitan monolaurate, and ethoxylated fatty alcohol. Wherein the flux composition comprises at least one selected from the group consisting of the above-mentioned flux compositions.
5. The method of claim 4,
Wherein the first additive is included in an amount of 5 to 20 parts by weight based on 100 parts by weight of the solder flux composition.
The method according to claim 1,
Wherein the additive comprises a second additive,
The second additive may be selected from the group consisting of polyethylene glycol ether, polyethylene glycol, polyethylene glycol stearyl ether, polyoxyethylene tallow alcohol, palmitic acid ), Stearic acid, and lauric acid. &Lt; Desc / Clms Page number 13 &gt;
The method according to claim 6,
Wherein the second additive is contained in an amount of 10 to 25 parts by weight based on 100 parts by weight of the solder flux composition.
delete delete The method according to claim 6,
The solvent includes at least one compound selected from the group consisting of ethylene glycol ether, ethylene glycol, glycol acetate, and aromatic alcohol, And 15 to 30 parts by weight based on 100 parts by weight of the flux composition for solder.
The method according to any one of claims 1, 2, 4 to 7, and 10,
Wherein the flux composition for solder has a viscosity change rate of 50% or less and a TI (Thixotropic Index) value of 0.55 or more after 4,000 times of printing.
A first dissolving step in which a first activator and a second additive are added to a solvent in a state where the temperature of the reactor is maintained at 90 to 120 캜 and then stirred to dissolve the first charge;
A second dissolving step of setting the temperature of the reactor at 120 to 150 ° C, adding a second activator and raising the temperature to dissolve the second charge;
A third dissolving step in which the third additive is added and stirred while the temperature of the reactor is maintained at 120 to 150 ° C to dissolve the third charge;
A fourth dissolving step in which the temperature of the reactor is maintained at 100 to 120 DEG C, and then the first additive and the second additive are added and stirred to dissolve the fourth charge; And
And a cooling step of putting the solution through the fourth dissolution step in a cooling vessel and cooling the solution at a set temperature of 5 to 10 DEG C for 4 hours or more and physically dispersing it and then stabilizing the solution at 5 to 25 DEG C for 60 hours or more &Lt; / RTI &gt;
13. The method of claim 12,
The solvent includes at least one compound selected from the group consisting of ethylene glycol ether, ethylene glycol, glycol acetate, and aromatic alcohol,
Wherein the first active agent is selected from the group consisting of succinic acid, adipic acid, propionic acid, malonic acid, maleic acid, formic acid glutaric acid, At least two kinds of acids selected from the group consisting of pimelic acid, tetradecanoic acid and dimethylolpropionic acid,
The second activator may be composed of an alkyl monoamine, an alkyl diamine, a monoethanol amine, a diethanol amine, a triethanol amine, and an ethylenediamine. And at least two amines selected from the group consisting of
The first additive is selected from the group consisting of sodium dioctyl sulfosuccinate, sodium dodecylsulfate, polyoxyethylene sorbitan monolaurate, and ethoxylated fatty alcohol. And at least one selected from the group consisting of &lt; RTI ID = 0.0 &gt;
The second additive may be selected from the group consisting of polyethylene glycol ether, polyethylene glycol, polyethylene glycol stearyl ether, polyoxyethylene tallow alcohol, palmitic acid ), Stearic acid, and lauric acid, and at least one selected from the group consisting of stearic acid,
Wherein the third additive comprises at least two selected from the group consisting of Maleic Resin, Petroleum Resin and Pyrrolidone.
A method of bonding solder balls onto a printed circuit board (PCB) using flux,
A method of manufacturing a printed circuit board, comprising the steps of: printing a solder flux composition according to any one of claims 1, 2, 4 to 7, and 10 on a metal layer formed on a printed circuit board (PCB) Mounting a solder ball on the solder ball and reflowing the solder ball.
A printed circuit board (PCB) comprising a metal pad and an under bump metallurgy (UBM) formed on the metal pad; And
And a solder ball bonded on the UBM using the flux composition for soldering according to any one of claims 1, 2, 4 to 7, and 10.

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