CN101585120A - A kind of tin-zinc-based leadless solder alloy - Google Patents
A kind of tin-zinc-based leadless solder alloy Download PDFInfo
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- CN101585120A CN101585120A CNA2009101171779A CN200910117177A CN101585120A CN 101585120 A CN101585120 A CN 101585120A CN A2009101171779 A CNA2009101171779 A CN A2009101171779A CN 200910117177 A CN200910117177 A CN 200910117177A CN 101585120 A CN101585120 A CN 101585120A
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- zinc
- tin
- solder alloy
- based leadless
- leadless solder
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Abstract
The invention discloses a kind of tin-zinc-based leadless solder alloy, it is characterized in that: the weight part ratio of each chemical composition is: tin 84-86, zinc 14-16, phosphorus 0.005-0.008, cerium 0.05-0.15, copper 0.4-0.6, antimony 0.8-1.0, lanthanum 0.05-0.25.The present invention has good wetability, fatigue behaviour, and has effectively stoped the oxidation of zinc and improved the various mechanical properties and the creep-resistant property of solder.
Description
Technical field
The present invention relates to the lead-free solder alloy of electronics assembling usefulness, specifically is a kind of tin-zinc-based leadless solder alloy.
Background technology
Lead is a kind of metallic element with toxicity, contacts with leaded material for a long time, will work the mischief to health.Along with the day by day enhancing of the mankind to environmental consciousness, ban use of the cry of leaded material more and more higher, at present, no matter the leadless soft soldering technology is to soldering manufacturer, still to electronic product manufacturing firm, all is a challenge, also is an opportunity.The lead-free brazing definition of generally acknowledging in the world now is: with tin is matrix, has added silver, copper, indium, bismuth and other alloying element, and plumbous mass fraction is at the soft solder alloy that is mainly used in the electronics assembling below 0.1%.
At present, the patented product of lead-free brazing has a lot, but really is widely used and widely accepted product and few, and its main cause is that cost is too high, or aspect of performance does not reach the level of traditional solder containing lead.From the lead-free brazing series of products that pure technical standpoint has been developed, tin-silver-copper, Xi-Yin-bismuth, these a few class lead-free brazings of tin-indium are considered to the optimal selection scheme, but the resource storage capacity of silver, indium, bismuth is limited and cost an arm and a leg, so restricted the application development of these solders.
Summary of the invention
The invention provides a kind of tin-zinc-based leadless solder alloy, it has good wetability, fatigue behaviour, and has effectively stoped the oxidation of zinc and improved the various mechanical properties and the creep-resistant property of solder.
Technical scheme of the present invention is:
A kind of tin-zinc-based leadless solder alloy is characterized in that: the weight part ratio of each chemical composition is: tin 84-86, zinc 14-16, phosphorus 0.005-0.008, cerium 0.05-0.15, copper 0.4-0.6, antimony 0.8-1.0, lanthanum 0.05-0.25.
Described a kind of tin-zinc-based leadless solder alloy is characterized in that: contain other metal impurities in the described alloy, bismuth 0.07-0.09, indium 0.05-0.15, plumbous 0.005-0.015, arsenic 0.02-0.04, cadmium 0.001-0.003, iron 0.01-0.03.
The present invention has taked to add phosphorus and the LREE cerium and the lanthanum of trace in tin-zinc alloy.Added phosphorus in alloy, phosphorus can form one deck protective film at the alloy surface of fusion when soldering, thereby has stoped the oxidation of zinc effectively.And can thinning microstructure than the adding of rare-earth element cerium and lanthanum, suppress the growth of intermetallic compound, improved the mechanical property and the creep-resistant property of solder significantly, its wetability also is improved.
The specific embodiment
A kind of tin-zinc-based leadless solder alloy is characterized in that: the weight part ratio of each chemical composition is: tin 84-86, zinc 14-16, phosphorus 0.005-0.008, cerium 0.05-0.15, copper 0.4-0.6, antimony 0.8-1.0, lanthanum 0.05-0.25.Contain other metal impurities, bismuth 0.07-0.09, indium 0.05-0.15, plumbous 0.005-0.015, arsenic 0.02-0.04, cadmium 0.001-0.003, iron 0.01-0.03.
Raw material after the said ratio is put into the vacuum for industrial use induction furnace smelt, vacuum is 10
-3Pa then under normal pressure, carried out after the mechanical agitation insulation 20-30 minute under 500 ℃ of-560 ℃ of temperature, be cast into zink rod or zinc bar with mold again, through being squeezed into the base silk, again by rolling, draw dial into different size thread, be finished product behind the drum.
Claims (2)
1, a kind of tin-zinc-based leadless solder alloy is characterized in that: the weight part ratio of each chemical composition is: tin 84-86, zinc 14-16, phosphorus 0.005-0.008, cerium 0.05-0.15, copper 0.4-0.6, antimony 0.8-1.0, lanthanum 0.05-0.25.
2, a kind of tin-zinc-based leadless solder alloy according to claim 1, it is characterized in that: contain other metal impurities in the described alloy, bismuth 0.07-0.09, indium 0.05-0.15, plumbous 0.005-0.015, arsenic 0.02-0.04, cadmium 0.001-0.003, iron 0.01-0.03.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101171779A CN101585120B (en) | 2009-06-29 | 2009-06-29 | Tin-zinc-based leadless solder alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101171779A CN101585120B (en) | 2009-06-29 | 2009-06-29 | Tin-zinc-based leadless solder alloy |
Publications (2)
| Publication Number | Publication Date |
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| CN101585120A true CN101585120A (en) | 2009-11-25 |
| CN101585120B CN101585120B (en) | 2012-08-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009101171779A Expired - Fee Related CN101585120B (en) | 2009-06-29 | 2009-06-29 | Tin-zinc-based leadless solder alloy |
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| CN (1) | CN101585120B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102500948A (en) * | 2011-11-04 | 2012-06-20 | 浙江亚通焊材有限公司 | Lead-free high-temperature soft solder and preparation method thereof |
| CN102554491A (en) * | 2011-12-14 | 2012-07-11 | 河南科技大学 | Zn (zinc) based high-temperature lead-free soft solder and preparation method for same |
| CN110823867A (en) * | 2019-10-14 | 2020-02-21 | 重庆长安工业(集团)有限责任公司 | Analysis method for multi-element content in tin-lanthanum-cerium intermediate alloy |
| CN113814514A (en) * | 2021-09-03 | 2021-12-21 | 郑州机械研究所有限公司 | Brazing flux-free brazing method for zinc alloy |
| CN115255710A (en) * | 2022-07-15 | 2022-11-01 | 郑州轻工业大学 | High-entropy alloy soft solder containing Sn and Cu and preparation method thereof |
| CN117817183A (en) * | 2024-03-06 | 2024-04-05 | 上海锡喜材料科技有限公司 | Formula and preparation method of lead-free flux-free soft welding wire for IC power device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB671079A (en) * | 1949-11-16 | 1952-04-30 | Richard Chadwick | Improvements in or relating to solders |
| CN1175956C (en) * | 2002-05-10 | 2004-11-17 | 大连理工大学 | Leadfree SnZn-base alloy solder containing rare-earth elements |
| CN1235718C (en) * | 2003-07-25 | 2006-01-11 | 南昌大学 | Tin-zinc base plumbum-free solder alloy and its preparing technology |
| CN100462183C (en) * | 2006-04-30 | 2009-02-18 | 东莞市中实焊锡有限公司 | Lead-free anti-oxidation rare-earth-contg. type SnZn alloy welding flux, and its prepn. method |
-
2009
- 2009-06-29 CN CN2009101171779A patent/CN101585120B/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102500948A (en) * | 2011-11-04 | 2012-06-20 | 浙江亚通焊材有限公司 | Lead-free high-temperature soft solder and preparation method thereof |
| CN102554491A (en) * | 2011-12-14 | 2012-07-11 | 河南科技大学 | Zn (zinc) based high-temperature lead-free soft solder and preparation method for same |
| CN102554491B (en) * | 2011-12-14 | 2014-03-05 | 河南科技大学 | Zn (zinc) based high-temperature lead-free soft solder and preparation method for same |
| CN110823867A (en) * | 2019-10-14 | 2020-02-21 | 重庆长安工业(集团)有限责任公司 | Analysis method for multi-element content in tin-lanthanum-cerium intermediate alloy |
| CN113814514A (en) * | 2021-09-03 | 2021-12-21 | 郑州机械研究所有限公司 | Brazing flux-free brazing method for zinc alloy |
| CN113814514B (en) * | 2021-09-03 | 2022-12-13 | 郑州机械研究所有限公司 | Brazing flux-free brazing method for zinc alloy |
| CN115255710A (en) * | 2022-07-15 | 2022-11-01 | 郑州轻工业大学 | High-entropy alloy soft solder containing Sn and Cu and preparation method thereof |
| CN115255710B (en) * | 2022-07-15 | 2024-04-26 | 郑州轻工业大学 | High-entropy alloy soft solder containing Sn and Cu and preparation method thereof |
| CN117817183A (en) * | 2024-03-06 | 2024-04-05 | 上海锡喜材料科技有限公司 | Formula and preparation method of lead-free flux-free soft welding wire for IC power device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101585120B (en) | 2012-08-22 |
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