CN202603054U - BGA-PCB relative-position adjustment system in BGA repair work station - Google Patents
BGA-PCB relative-position adjustment system in BGA repair work station Download PDFInfo
- Publication number
- CN202603054U CN202603054U CN 201120450882 CN201120450882U CN202603054U CN 202603054 U CN202603054 U CN 202603054U CN 201120450882 CN201120450882 CN 201120450882 CN 201120450882 U CN201120450882 U CN 201120450882U CN 202603054 U CN202603054 U CN 202603054U
- Authority
- CN
- China
- Prior art keywords
- bga
- pcb
- adjustment system
- position adjustment
- work station
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a BGA repair work station, and specifically relates to a BGA-PCB relative-position adjustment system in the repair work station. The BGA-PCB relative-position adjustment system comprises an imager, a BGA horizontal-angle adjustment system and a PCB horizontal-position adjustment system. According to the utility model, a PCB pad and BGA solder joints are simultaneously imaged on a display by means of a spectral vision system, and the horizontal position of the PCB is adjusted by a base while the horizontal angle of the BGA is adjusted by a vacuum suction nozzle so as to enable the superposition of the PCB pad and the BGA solder joints, thereby allowing the BGA solder joints to fit the PCB pad if the BGA is attached to the PCB pad.
Description
Technical field
The utility model relates to BGA-PCB relative position Adjustment System in a kind of BGA reclamation work station.
Background technology
The technology of reprocessing of BGA is how BGA device not damaged is disassembled from PCB, newer device is mounted up exactly and carries out high quality welding.Those skilled in the art can mount BGA by hand by rule of thumb, but do not advocate in this way.The method of reclamation work station use at present is to adopt BGA to reprocess platform completion BGA contraposition subsides to put.Contraposition: BGA reprocesses platform beam split vision system and can make things convenient for and contraposition accurately.This contraposition mode adopts be point-to-point formula to method for position, promptly BGA tin ball point and PCB pad point are corresponding one by one.So then eliminated fully owing to the inaccurate failure welding that causes of contraposition.After contraposition was accomplished, BGA reprocessed platform and will exactly the BGA subsides be placed on the PCB as chip mounter.The few cases contraposition has slight off normal after accurately pasting and putting, as long as generally be no more than 50%, then in the process that refluxes, has the pulling force of kupper solder can chip just be drawn automatically.Because the lead-free solder surface tension is lower, and is just relatively poor from the centering ability.
Summary of the invention
In order to overcome the deficiency of above-mentioned prior art, the purpose of the utility model is to provide BGA-PCB relative position Adjustment System in a kind of BGA reclamation work station, and PCB pad and BGA solder joint are overlapped, and has advantage easy to use simple in structure.
To achieve these goals, the technical scheme of the utility model employing is:
BGA reprocesses station BGA-PCB relative position Adjustment System; Comprise imager; BGA level angle adjustment Adjustment System, PCB horizontal position adjustment system is characterized in that: BGA level angle adjustment Adjustment System and PCB horizontal position adjustment system all are connected on the imager.
The monitor of imager is positioned at PCB pad and BGA solder joint top, and pcb board is fixedly clamped by BGA reclamation work station base.
There is vacuum slot position over against the BGA element on the BGA level angle adjustment Adjustment System.
The utility model can make PCB pad and BGA solder joint overlap, and has advantage easy to use simple in structure.
Description of drawings
Accompanying drawing is the utility model device work sketch map.
Embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is explained further details.
As shown in the figure; BGA reprocesses station BGA-PCB relative position Adjustment System, comprises imager, BGA level angle adjustment Adjustment System; PCB horizontal position adjustment system is characterized in that: BGA level angle adjustment Adjustment System and PCB horizontal position adjustment system all are connected on the imager.The monitor of imager is positioned at PCB pad and BGA solder joint top, and then PCB pad and BGA solder joint are imaged on the display through monitor simultaneously, and pcb board is fixedly clamped by BGA reclamation work station base, and pcb board x, y horizontal level can be regulated in the chassis; There is vacuum slot position over against the BGA element on the BGA level angle adjustment Adjustment System, and vacuum slot can horizontally rotate the level angle of regulating BGA; Both common actions overlap PCB pad and BGA solder joint.
During use; Use the beam split vision system to be imaged on PCB pad and BGA solder joint on the display simultaneously; The horizontal level that horizontally rotates adjusting and PCB of BGA is regulated all semi-automatic control, controls adjustment through display touch screen, makes PCB pad and BGA solder joint correspondence on the display.
The course of work of BGA-PCB relative position Adjustment System is by the fixing BGA element of vacuum slot in the utility model BGA reclamation work station; By the fixing pcb board of base; Be imaged on PCB pad and BGA solder joint simultaneously on the display through the beam split vision system, carry out two adjustment through display touch screen, the one, the position all around of base horizontal adjustment PCB; The 2nd, vacuum slot horizontally rotates the BGA angle; PCB pad and BGA solder joint are overlapped, after BGA is attached on the PCB pad like this, the BGA solder joint with regard to and PCB pad correspondence on.
The preferred embodiment of more than introducing that only is based on the utility model can not limit the scope of the utility model with this.Any the utility model is done replacement, combination, the separation of parts well know in the art, and the utility model implementation step is done that well know in the art being equal to changes or replacement does not all exceed the protection range of the utility model.
Claims (3)
1.BGA BGA-PCB relative position Adjustment System in the reclamation work station; Comprise imager; BGA level angle adjustment Adjustment System, PCB horizontal position adjustment system is characterized in that: BGA level angle Adjustment System and PCB horizontal position adjustment system all are connected on the imager.
2. BGA-PCB relative position Adjustment System in the BGA reclamation work according to claim 1 station is characterized in that: the monitor of imager is positioned at PCB pad and BGA solder joint top, and pcb board is fixedly clamped by BGA reclamation work station base.
3. BGA-PCB relative position Adjustment System in the BGA reclamation work according to claim 1 station is characterized in that: there is vacuum slot the position over against the BGA element on the BGA level angle adjustment Adjustment System.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120450882 CN202603054U (en) | 2011-11-15 | 2011-11-15 | BGA-PCB relative-position adjustment system in BGA repair work station |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120450882 CN202603054U (en) | 2011-11-15 | 2011-11-15 | BGA-PCB relative-position adjustment system in BGA repair work station |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202603054U true CN202603054U (en) | 2012-12-12 |
Family
ID=47320557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120450882 Expired - Fee Related CN202603054U (en) | 2011-11-15 | 2011-11-15 | BGA-PCB relative-position adjustment system in BGA repair work station |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202603054U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103874343A (en) * | 2014-04-04 | 2014-06-18 | 深圳市卓茂科技有限公司 | High-precision full-automatic BGA repair workbench |
| CN112369135A (en) * | 2018-07-12 | 2021-02-12 | 株式会社富士 | Image processing method and component mounting machine |
-
2011
- 2011-11-15 CN CN 201120450882 patent/CN202603054U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103874343A (en) * | 2014-04-04 | 2014-06-18 | 深圳市卓茂科技有限公司 | High-precision full-automatic BGA repair workbench |
| CN103874343B (en) * | 2014-04-04 | 2017-02-15 | 深圳市卓茂科技有限公司 | High-precision full-automatic BGA repair workbench |
| CN112369135A (en) * | 2018-07-12 | 2021-02-12 | 株式会社富士 | Image processing method and component mounting machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121212 Termination date: 20141115 |
|
| EXPY | Termination of patent right or utility model |