CN102581410A - Soldering process for diode chip - Google Patents
Soldering process for diode chip Download PDFInfo
- Publication number
- CN102581410A CN102581410A CN2012100495062A CN201210049506A CN102581410A CN 102581410 A CN102581410 A CN 102581410A CN 2012100495062 A CN2012100495062 A CN 2012100495062A CN 201210049506 A CN201210049506 A CN 201210049506A CN 102581410 A CN102581410 A CN 102581410A
- Authority
- CN
- China
- Prior art keywords
- soldering
- welding
- chip
- filling
- scaling powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000005476 soldering Methods 0.000 title abstract 15
- 238000003466 welding Methods 0.000 claims abstract description 44
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims description 22
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 6
- 238000004140 cleaning Methods 0.000 abstract description 4
- 238000005554 pickling Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000002994 raw material Substances 0.000 abstract description 3
- 239000012535 impurity Substances 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000004907 flux Effects 0.000 abstract 2
- 238000011109 contamination Methods 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 230000005611 electricity Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 3
- 230000004807 localization Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000001131 transforming effect Effects 0.000 description 2
- CYNYIHKIEHGYOZ-UHFFFAOYSA-N 1-bromopropane Chemical compound CCCBr CYNYIHKIEHGYOZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Images
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a soldering process for a semiconductor chip, which improves components of raw materials and includes the steps: filling shot copper into a soldering jig; filling a soldering lug containing soldering flux into the soldering jig; filling the chip into the soldering jig; filling a soldering lug containing soldering flux into the soldering jig; filling shot copper into the soldering jig; and enabling the filled soldering jig to enter a furnace for soldering. By the aid of the soldering process for the diode chip, a soldering procedure is simplified, production efficiency is improved, and impurity contamination attached to side surfaces of the chip due to incomplete cleaning of a cleaning procedure can be effectively removed during pickling after welding, so that the high-temperature feature of materials is more stable, and the probability of leading electrical property to be unstable due to surface electricity leakage of the materials is decreased.
Description
Technical field
The present invention relates to a kind of welding procedure of semiconductor chip, relate in particular in the welding procedure improvement composition of raw material.
Background technology
Prior art flows through journey to the welding procedure of diode chip for backlight unit:
shot copper filling
spray scaling powder
weld tabs filling
chip filling
weld tabs filling
shot copper filling
Pen scaling powder,
advances stove be directed at the welding fixture that fills.Secondly semi-finished product be will weld and positive N-Propyl Bromide cleaning and pickling carried out.
The weld tabs composition that adopts during original the welding has Pb, Sn, Ag; Bad with the zygosity of chip behind high temperature, need with the auxiliary welding of scaling powder, treat that scaling powder just puts the welding localization tool after air-dry; Cause production efficiency low; Can remain in the chip side surface after the scaling powder welding, make cleaning thorough inadequately, cause material electrically unstable.
Summary of the invention
Technical problem to be solved by this invention provides when can enhance productivity and makes electrically stable a kind of diode chip for backlight unit welding procedure of material.
The technical scheme that the present invention solves the problems of the technologies described above is following: a kind of welding procedure of diode chip for backlight unit, and it may further comprise the steps:
The weld tabs that
will contain scaling powder is loaded in the welding fixture;
The weld tabs that
will contain scaling powder is loaded in the welding fixture;
Further, the method for making of the said weld tabs that contains scaling powder for the scaling powder brush on the solder stick surface after the mould punching press process.
Further, the parts by weight of said scaling powder are 4 parts of rosin, 1 part of isopropyl alcohol.
Further, the weight ratio of said solder stick is that lead accounts for 92.5%, and tin accounts for 5%, and silver accounts for 2.5%.
The beneficial effect that adopts such scheme is that employing the inventive method is that the diode welding sequence need not spray scaling powder, makes production technology simpler; Adopt through behind the weld tabs of transforming, after the raw material assembling, need not wait scaling powder air-dry, can directly put the welding localization tool, not only reduced welding sequence, enhance productivity; After adopting the weld tabs of transforming to weld, can effectively remove because of matting is not thorough during pickling, echo contaminating impurity, thereby make the hot properties of material more stable, reduce because material causes electrical instability because of the surface leakage TV university on the chip side surface.
Description of drawings
Fig. 1 is welding process flow figure of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing principle of the present invention and characteristic are described, institute gives an actual example and only is used to explain the present invention, is not to be used to limit scope of the present invention.
Embodiment 1
As shown in Figure 1, the present invention includes following steps:
is loaded into shot copper in the welding fixture, again chip correcting plate is fixed in welding fixture inside;
The weld tabs that
will contain scaling powder is loaded in the welding fixture;
The weld tabs that
will contain scaling powder is loaded in the welding fixture; From welding fixture, take out chip correcting plate;
is loaded into shot copper in the welding fixture;
advances the stove welding with the welding fixture that fills.
The method for making of the said weld tabs that contains scaling powder for the scaling powder brush on the solder stick surface after the mould punching press process.
The parts by weight of said scaling powder are 4 parts of rosin, 1 part of isopropyl alcohol.
The weight ratio of said solder stick is that lead accounts for 92.5%, and tin accounts for 5%, and silver accounts for 2.5%.
To weld semi-finished product again after welding is accomplished and carry out pickling.
The above is merely preferred embodiment of the present invention, and is in order to restriction the present invention, not all within spirit of the present invention and principle, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (4)
1. the welding procedure of a diode chip for backlight unit is characterized in that, it may further comprise the steps:
The weld tabs that
will contain scaling powder is loaded in the welding fixture;
The weld tabs that
will contain scaling powder is loaded in the welding fixture;
2. a kind of diode chip for backlight unit welding procedure according to claim 1 is characterized in that: the method for making of the said weld tabs that contains scaling powder for the scaling powder brush on the solder stick surface after the mould punching press process.
3. a kind of diode chip for backlight unit welding procedure according to claim 2 is characterized in that: the parts by weight of said scaling powder are 4 parts of rosin, 1 part of isopropyl alcohol.
4. a kind of diode chip for backlight unit welding procedure according to claim 2 is characterized in that: the weight ratio of said solder stick is that lead accounts for 92.5%, and tin accounts for 5%, and silver accounts for 2.5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210049506.2A CN102581410B (en) | 2012-02-29 | 2012-02-29 | A kind of welding procedure of diode chip for backlight unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210049506.2A CN102581410B (en) | 2012-02-29 | 2012-02-29 | A kind of welding procedure of diode chip for backlight unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102581410A true CN102581410A (en) | 2012-07-18 |
| CN102581410B CN102581410B (en) | 2016-04-27 |
Family
ID=46470947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210049506.2A Active CN102581410B (en) | 2012-02-29 | 2012-02-29 | A kind of welding procedure of diode chip for backlight unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102581410B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112750766A (en) * | 2020-12-14 | 2021-05-04 | 山东融创电子科技有限公司 | Preparation process of long-life diode |
| CN111730161B (en) * | 2020-06-30 | 2021-06-22 | 安徽安美半导体有限公司 | Copper particle double-side pre-welding device and welding method |
| CN113471087A (en) * | 2021-06-25 | 2021-10-01 | 日照鲁光电子科技有限公司 | Process method for welding chips of laminated product in one step |
| CN113751821A (en) * | 2021-09-17 | 2021-12-07 | 扬州虹扬科技发展有限公司 | Welding jig and welding method of crystal grains |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3584265A (en) * | 1967-09-12 | 1971-06-08 | Bosch Gmbh Robert | Semiconductor having soft soldered connections thereto |
| JPH05315734A (en) * | 1992-05-01 | 1993-11-26 | Mitsubishi Electric Corp | Installation board and installation method of electronic parts |
| CN1851887A (en) * | 2006-03-22 | 2006-10-25 | 常州久和电子有限公司 | Method for processing patch diode |
| CN201360006Y (en) * | 2009-02-12 | 2009-12-09 | 常州银河电器有限公司 | Commutation diode |
| CN101740409A (en) * | 2008-11-06 | 2010-06-16 | 贵州雅光电子科技股份有限公司 | Method for welding lead of diode and diode |
| CN102059471A (en) * | 2010-12-29 | 2011-05-18 | 厦门大学 | Soldering paste of Sn-Bi-Cu self-packed composite powder and preparation method thereof |
| CN102332832A (en) * | 2010-07-12 | 2012-01-25 | 昆山巩诚电器有限公司 | Automobile rectification regulator and production process thereof |
-
2012
- 2012-02-29 CN CN201210049506.2A patent/CN102581410B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3584265A (en) * | 1967-09-12 | 1971-06-08 | Bosch Gmbh Robert | Semiconductor having soft soldered connections thereto |
| JPH05315734A (en) * | 1992-05-01 | 1993-11-26 | Mitsubishi Electric Corp | Installation board and installation method of electronic parts |
| CN1851887A (en) * | 2006-03-22 | 2006-10-25 | 常州久和电子有限公司 | Method for processing patch diode |
| CN101740409A (en) * | 2008-11-06 | 2010-06-16 | 贵州雅光电子科技股份有限公司 | Method for welding lead of diode and diode |
| CN201360006Y (en) * | 2009-02-12 | 2009-12-09 | 常州银河电器有限公司 | Commutation diode |
| CN102332832A (en) * | 2010-07-12 | 2012-01-25 | 昆山巩诚电器有限公司 | Automobile rectification regulator and production process thereof |
| CN102059471A (en) * | 2010-12-29 | 2011-05-18 | 厦门大学 | Soldering paste of Sn-Bi-Cu self-packed composite powder and preparation method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111730161B (en) * | 2020-06-30 | 2021-06-22 | 安徽安美半导体有限公司 | Copper particle double-side pre-welding device and welding method |
| CN112750766A (en) * | 2020-12-14 | 2021-05-04 | 山东融创电子科技有限公司 | Preparation process of long-life diode |
| CN112750766B (en) * | 2020-12-14 | 2022-12-27 | 山东融创电子科技有限公司 | Preparation process of long-life diode |
| CN113471087A (en) * | 2021-06-25 | 2021-10-01 | 日照鲁光电子科技有限公司 | Process method for welding chips of laminated product in one step |
| CN113751821A (en) * | 2021-09-17 | 2021-12-07 | 扬州虹扬科技发展有限公司 | Welding jig and welding method of crystal grains |
| CN113751821B (en) * | 2021-09-17 | 2023-02-03 | 扬州虹扬科技发展有限公司 | Welding jig and welding method of crystal grains |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102581410B (en) | 2016-04-27 |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20231023 Address after: No. 58 Xinganquan East Road, Huaishi Town, Hangjiang District, Yangzhou City, Jiangsu Province, 225000 Patentee after: Jiangsu Yingdafu Electronic Technology Co.,Ltd. Address before: No. 45, Hongyang East Road, Huaisi Town, Yangzhou City, Jiangsu Province, 225116 Patentee before: YANGZHOU HY TECHNOLOGY DEVELOPMENT Co.,Ltd. |