CN105397226B - A kind of electric-heat base board not metal cladding soldering nickel wire technique - Google Patents

A kind of electric-heat base board not metal cladding soldering nickel wire technique Download PDF

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Publication number
CN105397226B
CN105397226B CN201510926760.XA CN201510926760A CN105397226B CN 105397226 B CN105397226 B CN 105397226B CN 201510926760 A CN201510926760 A CN 201510926760A CN 105397226 B CN105397226 B CN 105397226B
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China
Prior art keywords
electric
base board
nickel wire
heat base
soldering
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CN201510926760.XA
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Chinese (zh)
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CN105397226A (en
Inventor
邹琦
兰海
张惠华
傅建树
张静
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FUJIAN MINHANG ELECTRONIC Co Ltd
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FUJIAN MINHANG ELECTRONIC Co Ltd
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Priority to CN201510926760.XA priority Critical patent/CN105397226B/en
Publication of CN105397226A publication Critical patent/CN105397226A/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/008Soldering within a furnace
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/19Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203Fluxing, i.e. applying flux onto surfaces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

The present invention provides a kind of electric-heat base board not metal cladding soldering nickel wire technique, and Pb is put into the Hcl that concentration is 5% and forms chlorination lead solution;Electric-heat base board one end is stained with chlorination lead solution;Nickel wire is placed on the electric-heat base board for speckling with chlorination lead solution, the electric-heat base board for being placed with nickel wire is completed to weld by soldering oven so that electric-heat base board soldering nickel wire technique more simplifies, and is Reducing Cost in Enterprises, improves productivity effect.

Description

A kind of electric-heat base board not metal cladding soldering nickel wire technique
Technical field
The present invention relates to a kind of electric-heat base board not metal cladding soldering nickel wire technique.
Background technology
In the prior art, need to plate layer of metal layer (wherein on electric-heat base board in soldering nickel wire on electric-heat base board Metal is tungsten), nickel wire could be placed on the metal level afterwards, soldering is carried out by soldering oven afterwards;If not in electric heating base Layer of metal layer is plated on plate, then nickel wire can not be brazed on electric-heat base board;Also there is another kind need not be in electric-heat base board now Upper metal cladding can soldering nickel wire method, i.e., temperature is increased to more than 1100 °, by high temperature with reach welding, still Being increased to so high temperature then needs corresponding equipment, and such equipment price is very high, substantially increases entreprise cost, unfavorable In competition among enterprises.
The content of the invention
The technical problem to be solved in the present invention, it is to provide a kind of electric-heat base board not metal cladding soldering nickel wire technique, drops Low entreprise cost.
What the present invention was realized in:A kind of electric-heat base board not metal cladding soldering nickel wire technique, comprises the following steps:
Step 1, Pb is put into formation chlorination lead solution in the Hcl that concentration is 5%;
Step 2, electric-heat base board one end is stained with chlorination lead solution;
Step 3, nickel wire is placed on the electric-heat base board for speckling with chlorination lead solution, the electric-heat base board for being placed with nickel wire is passed through Soldering oven completes welding.
Further, in the step 1, the quality that Pb is placed in 1L Hcl solution is 0.1~5g.
Further, the step 2 is specially further:Electric-heat base board one end is stained with chlorination lead solution, and need to The one end of the nickel wire of soldering is wanted to be stained with chlorination lead solution.
Further, the step 3 is specially further:The nickel wire one end for speckling with chlorination lead solution is positioned over and speckled with The one end of the electric-heat base board of chlorination lead solution, the other end of nickel wire do not contact with electric-heat base board, will be placed with nickel wire afterwards Electric-heat base board is completed to weld by soldering oven.
The invention has the advantages that:A kind of electric-heat base board of the present invention not metal cladding soldering nickel wire technique, work of the present invention Skill causes for the process simplification of electric-heat base board soldering nickel wire, and also reduces cost for enterprise.
Brief description of the drawings
The present invention is further illustrated in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is a kind of execution flow chart of electric-heat base board of the present invention not metal cladding soldering nickel wire technique.
Embodiment
As shown in figure 1, electric-heat base board of the present invention not metal cladding soldering nickel wire technique, comprises the following steps:
Step 1, Pb is put into formation chlorination lead solution in the Hcl that concentration is 5%, Pb matter is placed in 1L Hcl solution Measure as 0.1~5g;
Step 2, electric-heat base board one end is stained with to chlorination lead solution, and the one end for the nickel wire for needing soldering is stained with chlorine Change lead solution;
Step 3, the nickel wire one end for speckling with chlorination lead solution is positioned over the one of the electric-heat base board for speckling with chlorination lead solution End, the other end of nickel wire do not contact with electric-heat base board, complete to weld by soldering oven by the electric-heat base board for being placed with nickel wire afterwards Connect.
Although the foregoing describing the embodiment of the present invention, those familiar with the art should manage Solution, the specific embodiment described by us are merely exemplary, rather than for the restriction to the scope of the present invention, are familiar with this The equivalent modification and change that the technical staff in field is made in the spirit according to the present invention, should all cover the present invention's In scope of the claimed protection.

Claims (3)

  1. A kind of 1. electric-heat base board not metal cladding soldering nickel wire technique, it is characterised in that:Comprise the following steps:
    Step 1, Pb is put into formation chlorination lead solution in the Hcl that concentration is 5%, the quality that Pb is placed in 1L Hcl solution is 0.1~5g;
    Step 2, electric-heat base board one end is stained with chlorination lead solution;
    Step 3, nickel wire is placed on the electric-heat base board for speckling with chlorination lead solution, the electric-heat base board for being placed with nickel wire is passed through into soldering Stove completes welding.
  2. A kind of 2. electric-heat base board according to claim 1 not metal cladding soldering nickel wire technique, it is characterised in that:The step Rapid 2 are specially further:Electric-heat base board one end is stained with chlorination lead solution, and the one end for the nickel wire for needing soldering is stained with Chlorination lead solution.
  3. A kind of 3. electric-heat base board according to claim 2 not metal cladding soldering nickel wire technique, it is characterised in that:The step Rapid 3 are specially further:The nickel wire one end for speckling with chlorination lead solution is positioned over to the electric-heat base board that speckles with chlorination lead solution One end, the other end of nickel wire do not contact with electric-heat base board, afterwards complete the electric-heat base board for being placed with nickel wire by soldering oven Welding.
CN201510926760.XA 2015-12-14 2015-12-14 A kind of electric-heat base board not metal cladding soldering nickel wire technique Active CN105397226B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510926760.XA CN105397226B (en) 2015-12-14 2015-12-14 A kind of electric-heat base board not metal cladding soldering nickel wire technique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510926760.XA CN105397226B (en) 2015-12-14 2015-12-14 A kind of electric-heat base board not metal cladding soldering nickel wire technique

Publications (2)

Publication Number Publication Date
CN105397226A CN105397226A (en) 2016-03-16
CN105397226B true CN105397226B (en) 2018-01-26

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107598316B (en) * 2017-10-19 2019-12-27 福建闽航电子有限公司 Nickel wire brazing method for heating sheet
CN109158723A (en) * 2018-10-15 2019-01-08 宜兴市美盛电器有限公司 The soldering processes of electric-heat base board

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN85105468B (en) * 1985-07-18 1988-11-30 交通部公路科学研究所 Brush plating solution for pretreating hard-to-braze metal
US5052612A (en) * 1989-08-24 1991-10-01 E. I. Du Pont De Nemours And Company Process for soldering allowing low ionic contamination without cleaning operation
US5178965A (en) * 1992-02-14 1993-01-12 Rockwell International Corporation Uniform solder coating on roughened substrate
EP1209245A1 (en) * 2000-11-23 2002-05-29 Galvapower Group N.V. Flux and its use in hot dip galvanization process
JP4345487B2 (en) * 2004-01-14 2009-10-14 セイコーエプソン株式会社 Solder paste
AT10735U1 (en) * 2008-05-21 2009-09-15 Austria Tech & System Tech METHOD FOR PRODUCING A PCB, AND USE AND PCB
KR101180366B1 (en) * 2011-02-25 2012-09-10 주식회사 심텍 Printed circuit board and method for manufacturing the same
CN102797001A (en) * 2012-07-11 2012-11-28 常州大学 Choline-chloride-based chemical tinning solution and application method thereof
CN105018981A (en) * 2014-04-18 2015-11-04 苏州市汉宜化学有限公司 Weldable gun color electroplating solution and electroplating method thereof

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Inventor after: Zou Qi

Inventor after: Lan Hai

Inventor after: Zhang Huihua

Inventor after: Fu Jianshu

Inventor after: Zhang Jing

Inventor before: Cheng Wenping

Inventor before: Zou Qi

Inventor before: Wu Hongying

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