CN113471087A - Process method for welding chips of laminated product in one step - Google Patents
Process method for welding chips of laminated product in one step Download PDFInfo
- Publication number
- CN113471087A CN113471087A CN202110707168.6A CN202110707168A CN113471087A CN 113471087 A CN113471087 A CN 113471087A CN 202110707168 A CN202110707168 A CN 202110707168A CN 113471087 A CN113471087 A CN 113471087A
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- Prior art keywords
- welding
- boat
- wire
- chip
- chips
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- 238000003466 welding Methods 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 238000005245 sintering Methods 0.000 claims abstract description 8
- 238000009713 electroplating Methods 0.000 claims abstract description 5
- 238000012360 testing method Methods 0.000 claims abstract description 5
- 238000007599 discharging Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910002804 graphite Inorganic materials 0.000 claims description 9
- 239000010439 graphite Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 241000587161 Gomphocarpus Species 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 5
- 230000001590 oxidative effect Effects 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 238000005476 soldering Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85136—Aligning involving guiding structures, e.g. spacers or supporting members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/858—Bonding techniques
- H01L2224/8584—Sintering
Abstract
The invention relates to a process method for welding chips of a laminated product in one step, which comprises the following steps: 1) inserting the lead into the welding boat hole to finish the lead arranging operation on the welding boat; 2) placing a platform jig at the lower end of the wire, and supporting the wire by the platform jig to ensure that the reserved depth of the welding boat hole is 3 +/-1 mm; 3) directly implanting a chip into the welding boat behind the wire row; 4) sending the welding boat with the arranged chips into a sintering furnace for welding operation; 5) and packaging, electroplating, testing, packaging and finally discharging the welded chip in sequence. The process method changes the traditional method of adopting prewelding in the welding process of the laminated chip product, omits a prewelding boat, does not need to stack two chips before formal welding, reduces the procedure of entering a sintering furnace once, avoids the risk of oxidizing the upper surface and the lower surface of the laminated chip, avoids the risk of material breakage, saves the procedure and improves the production efficiency.
Description
Technical Field
The invention relates to a process method for welding chips of a laminated product in one step, belonging to the technical field of chip packaging.
Background
In the packaging process of electronic products, if a chip is directly implanted into a welding boat hole of a laminated product, the upper chip and the lower chip are not concentric due to the inclination of the chip caused by the depth of the hole, so that the chip pre-welding operation is required to be performed firstly.
For example, chinese patent document CN111739812A discloses a production process of a high-power axial bidirectional diode, which includes the following steps: pre-welding copper particles: welding the square copper particles and the copper particles through a soldering lug to prepare pre-welded copper particles; pre-welding a chip: welding the copper particles and the square chip through a soldering lug to prepare a pre-welded chip; filling a lower die: firstly filling a lower lead in a lower die, and then filling a square chip, a pre-welded chip and pre-welded copper particles in sequence according to a positive sequence or a reverse sequence, and spacing by using a soldering lug; filling an upper die: an upper lead is filled in the upper die, and soldering lugs are arranged between the upper lead and the square chip or the pre-soldered copper particles in the lower die at intervals; die assembly welding: and closing the upper die and the lower die, pressing tightly, and feeding into a welding furnace for welding.
Chinese patent document CN201979244U discloses an SMA one-time welding graphite boat, which includes a graphite plate, wherein a limit block is arranged on the long edge of the graphite plate, a limit groove matched with a chip is arranged between adjacent limit blocks, and the limit groove and the limit block form a saw-tooth shape. And a counter bore is arranged on the graphite plate. The utility model only needs to weld the chip once, which reduces the production cost and improves the working efficiency; the chip does not deviate during welding, the chip does not deviate after welding, the welding state is good, and the product quality is ensured. The utility model discloses electronic equipment of mainly used semiconductor power device encapsulation.
The traditional method is to implant two or more chips into a pre-welding boat in advance, send the chips and the pre-welding boat to a welding furnace for pre-welding the chips, and aims to ensure that two chips stacked up and down are concentric up and down, then assemble the pre-welded chip products, send the assembled products to the welding furnace for welding, and then sequentially carry out packaging, electroplating, testing, packaging and shipment after welding. Because the traditional method needs to perform the prewelding of the chips by a welding furnace once more before formal welding, because the upper surface of the upper chip and the lower surface of the lower chip are exposed when the two chips are stacked, the metal layers on the upper surface and the lower surface are inevitably oxidized after passing through a high-temperature region of a sintering furnace when entering the welding furnace for prewelding, the oxidation layer directly influences the product assembly and then the welding quality is performed again, and meanwhile, the risk of material breakage is uncontrollable and the production efficiency is low.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the process method for welding the chips of the laminated product in one step, the process method does not need to perform pre-welding of two or more chips, the problem that metal layers on the upper surface and the lower surface of the pre-welded chips are oxidized is avoided, the risk of material breakage is avoided, the process steps are saved, and the production efficiency is improved.
The technical scheme of the invention is as follows:
a one-step in-place die bonding process for a laminated product, comprising the steps of:
1) inserting the lead into the welding boat hole to finish the lead arranging operation on the welding boat;
2) placing a platform jig at the lower end of the wire, and supporting the wire by the platform jig to ensure that the reserved depth of the welding boat hole is 3 +/-1 mm;
3) directly implanting a chip into the welding boat behind the wire row;
4) sending the welding boat with the arranged chips into a sintering furnace for welding operation;
5) and packaging, electroplating, testing, packaging and finally discharging the welded chip in sequence.
Preferably, in the step 1), the lead is an oxygen-free copper wire specially matched with the lamination, and the wire diameter is 0.60 mm.
Preferably, in step 1), the insertion of the wire into the welding boat hole requires: the wire has one end with the nail head on the top and one end without the nail head on the bottom.
Preferably, in the step 1), the welding boat is made of graphite, and the welding boat with a positioning function is selected.
Preferably, in the step 2), the platform jig is a flat plate with the length of 205mm, the width of 97mm and the height of 28mm, the platform jig is placed between the support legs at the two ends of the welding boat, and the wire is supported by the platform jig.
Preferably, in the step 3), the chip is implanted into the welding boat by using the sucking disc in the environment with the temperature and humidity of 25 +/-5 ℃ and the humidity of less than or equal to 60%.
The invention has the technical characteristics and beneficial effects that:
1. the process method changes the traditional method of adopting prewelding in the welding process of the laminated chip product, omits a prewelding boat, does not need to stack and preweld two chips before formal welding, reduces the procedure of entering a sintering furnace once, avoids the risk of oxidizing the upper surface and the lower surface of the laminated chip, avoids the risk of material breakage, saves the procedure and improves the production efficiency.
2. According to the process method, the lower end of the wire is supported by the platform jig in a mode that the welding boat and the platform jig are matched for operation, so that the welding boat hole is kept at a reasonable depth, and the upper and lower non-concentricity of the two laminated chips during stacking is avoided. By adopting the process method, the working procedures can be saved, the production efficiency can be improved, the yield of chip welding can be improved, the effect is obvious, and the effect is obvious.
Drawings
FIG. 1 is a process flow diagram of a conventional process;
FIG. 2 is a process flow diagram of the one-step die bonding method of the present invention;
FIG. 3 is a schematic view of a welding boat used in the present invention;
FIG. 4 is a schematic view of a platform fixture used in the present invention;
FIG. 5 is a schematic view of the platform fixture and the welding boat in cooperation with each other;
in the figure: 1-graphite body, 2-welding boat hole, 3-positioning hole, 4-positioning pin, 5-support leg, 6-platform jig and 7-lead.
Detailed Description
The present invention will be further described by way of examples, but not limited thereto, with reference to the accompanying drawings.
Example 1:
as shown in fig. 2, the present embodiment provides a one-step die bonding process for a laminated product, which specifically includes the following steps:
1) inserting the lead into the welding boat hole 2 to finish the lead arranging operation on the welding boat;
the lead 7 is an oxygen-free copper wire specially matched with the lamination, the wire diameter is 0.60mm, and the lead arranging operation is completed by utilizing a special lead arranging machine. The wire is inserted into the welding boat hole and the requirements are as follows: the wire has one end with the nail head on the top and one end without the nail head on the bottom.
The welding boat is the graphite material, chooses for use the welding boat of taking locate function, as shown in fig. 3, including graphite body 1 and both sides stabilizer blade 5, the bilateral symmetry of graphite body 1 is provided with four locating holes 3, and locating pin 4 is installed to the locating hole on the diagonal wherein.
2) Placing a platform jig 6 at the lower end of the wire, and supporting the wire by the platform jig 6 to ensure that the reserved depth of the welding boat hole 2 is 3 +/-1 mm;
and placing the platform jigs 6 with different heights according to the depth of the reserved boat hole 2. In this embodiment, the platform jig 6 is a flat plate with a length of 205mm, a width of 97mm and a height of 28mm, and the platform jig 6 is placed between the support legs 5 at the two ends of the welding boat, and the lead 7 is supported by the platform jig 6.
3) Directly implanting a chip into the welding boat behind the wire row; in the implantation process, the chip is implanted into the welding boat by means of the sucker, the sucker for daily production is used, and the chip is implanted into the welding boat by the sucker in the environment with the temperature and humidity of 25 +/-5 ℃ and the humidity of less than or equal to 60 percent.
4) Sending the welding boat with the arranged chips into a sintering furnace for welding operation;
5) and packaging, electroplating, testing, packaging and finally discharging the welded chip in sequence.
Compared with the traditional process, the whole operation process of the process does not need to stack and preweld two chips before formal welding, the process of entering a sintering furnace once is reduced, the risk of oxidizing the upper surface and the lower surface of the laminated chip is avoided, meanwhile, the risk of material breakage is avoided, the process is saved, and the production efficiency is improved.
The above description is only for the specific embodiments of the present invention, and the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the protection scope of the present invention.
Claims (6)
1. A chip welding one-step in-place process method of a laminated product is characterized by comprising the following steps:
1) inserting the lead into the welding boat hole to finish the lead arranging operation on the welding boat;
2) placing a platform jig at the lower end of the wire, and supporting the wire by the platform jig to ensure that the reserved depth of the welding boat hole is 3 +/-1 mm;
3) directly implanting a chip into the welding boat behind the wire row;
4) sending the welding boat with the arranged chips into a sintering furnace for welding operation;
5) and packaging, electroplating, testing, packaging and finally discharging the welded chip in sequence.
2. The process of die bonding a laminate product in one step as claimed in claim 1, wherein in step 1), the wire is an oxygen-free copper wire having a wire diameter of 0.60mm, which is specially used for the laminate.
3. The process of die bonding a laminated product in one step as claimed in claim 1, wherein in step 1), the insertion of the wire into the bonding boat hole requires: the wire has one end with the nail head on the top and one end without the nail head on the bottom.
4. The process of one-step die bonding of a laminated product according to claim 1, wherein in step 1), the bonding boat is made of graphite and has a positioning function.
5. The process of claim 1, wherein in step 2), the platform fixture is a flat plate with a length of 205mm, a width of 97mm and a height of 28mm, the platform fixture is placed between the support legs at the two ends of the welding boat, and the wire is lifted by the platform fixture.
6. The process of die bonding a laminated product according to claim 1, wherein in step 3), the die is implanted into the bonding boat by using the suction cup under an environment of a temperature and humidity of 25 ± 5 ℃ and a humidity of less than or equal to 60%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110707168.6A CN113471087A (en) | 2021-06-25 | 2021-06-25 | Process method for welding chips of laminated product in one step |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110707168.6A CN113471087A (en) | 2021-06-25 | 2021-06-25 | Process method for welding chips of laminated product in one step |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113471087A true CN113471087A (en) | 2021-10-01 |
Family
ID=77872758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110707168.6A Pending CN113471087A (en) | 2021-06-25 | 2021-06-25 | Process method for welding chips of laminated product in one step |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113471087A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107342222A (en) * | 2017-07-28 | 2017-11-10 | 阳信金鑫电子有限公司 | A kind of method that hyperfrequency high-voltage diode is manufactured with GPP chip |
| CN111739812A (en) * | 2020-06-30 | 2020-10-02 | 安徽安美半导体有限公司 | Production process of high-power axial bidirectional diode |
| CN111730161A (en) * | 2020-06-30 | 2020-10-02 | 安徽安美半导体有限公司 | Copper particle double-side pre-welding device and welding method |
| CN211966235U (en) * | 2020-01-07 | 2020-11-20 | 福建闽航电子有限公司 | Graphite square boat for brazing ceramic shell |
-
2021
- 2021-06-25 CN CN202110707168.6A patent/CN113471087A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107342222A (en) * | 2017-07-28 | 2017-11-10 | 阳信金鑫电子有限公司 | A kind of method that hyperfrequency high-voltage diode is manufactured with GPP chip |
| CN211966235U (en) * | 2020-01-07 | 2020-11-20 | 福建闽航电子有限公司 | Graphite square boat for brazing ceramic shell |
| CN111739812A (en) * | 2020-06-30 | 2020-10-02 | 安徽安美半导体有限公司 | Production process of high-power axial bidirectional diode |
| CN111730161A (en) * | 2020-06-30 | 2020-10-02 | 安徽安美半导体有限公司 | Copper particle double-side pre-welding device and welding method |
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