CN114068338A - Chip ball mounting tool based on computer whole machine manufacturing process and method thereof - Google Patents
Chip ball mounting tool based on computer whole machine manufacturing process and method thereof Download PDFInfo
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- CN114068338A CN114068338A CN202111355166.1A CN202111355166A CN114068338A CN 114068338 A CN114068338 A CN 114068338A CN 202111355166 A CN202111355166 A CN 202111355166A CN 114068338 A CN114068338 A CN 114068338A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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Abstract
The invention discloses a chip ball mounting tool based on a computer complete machine manufacturing process and a method thereof, and relates to the technical field of chip ball mounting. Including chip positioning jig for the chip of treating the ball planting is fixed a position, chip positioning jig includes the locating rack, the slide opening has all been seted up to the both sides of locating rack, the inside of locating rack is provided with the brace table that is used for placing the chip, the inside activity of locating rack is provided with the slide bar that quantity is two at least, and movable groove, activity chamber and activity hole have been seted up in proper order to the inside of slide bar. Through setting up chip positioning jig, altitude mixture control piece and chip ball planting tool, chip positioning jig accomplishes the centre gripping location to the chip, adjusts through the altitude mixture control piece according to the thickness of chip, plants the ball tool through the chip at last and assists the operation of carrying out tin cream coating and planting the ball to the chip, and the operation mode is simple swift, and the in-process can not cause the fish tail to the chip, and tin cream coating is even quick, has wide application prospect.
Description
Technical Field
The invention relates to the technical field of chip ball mounting, in particular to a chip ball mounting tool and a method based on a computer complete machine manufacturing process.
Background
The computer complete machine manufacturing industry produces various industries of computer systems, peripheral equipment, terminal equipment and other related devices, and the industries and the computer service industry form the computer industry together, and generally, the computer complete machine accessories are assembled after being manufactured separately.
Some DIY fan can purchase the constitution accessory of computer complete machine and return oneself and assemble, user's hands-on ability is very examined to this kind of computer complete machine assembly mode, especially, BGA chip on the computer motherboard, all need dismantle the BGA chip when mistake or later stage circuit board trouble appear in the welding, lead to the tin ball on the BGA chip to lose easily, need plant the ball again, owing to lack special chip and plant the ball instrument, the process is slow complicated when leading to the manual ball of planting of user, and cause chip fish tail and collision easily, lead to the chip to scrap, influence the regularity and the welding strength in later stage after planting the ball simultaneously, puzzlement has been brought for the user.
Disclosure of Invention
In order to achieve the purpose, the invention provides the following technical scheme: a chip ball-planting tool and method based on computer complete machine manufacturing process includes:
the chip positioning jig is used for positioning the chip to be planted with the ball, and comprises a positioning frame, both sides of the positioning frame are provided with sliding holes, a supporting platform for placing a chip is arranged inside the positioning frame, at least two slide bars are movably arranged in the positioning frame, a movable groove, a movable cavity and a movable hole are sequentially arranged in the slide bars, a slide block is arranged inside the movable hole, an adjusting rod is arranged inside the slide block, one end of the adjusting rod is provided with a conical rod, the two ends of the positioning frame are respectively provided with a convex block extending into the two sliding holes, the interior of the movable cavity is provided with a driving rod the exterior of which is in contact with the surface of the conical rod and the number of which is not less than one, two ends of the driving rod respectively extend to the insides of the two convex blocks, and a pressing rod with one end extending to the inside of the sliding hole is arranged outside the driving rod;
the height adjusting block is used for clamping a chip, a sliding seat is mounted on one side of the height adjusting block, the interior of the sliding seat is connected with the interior of a movable groove in a sliding mode, a supporting block is movably arranged in the height adjusting block, a movable rod used for adjusting the height of the supporting block is arranged in the height adjusting block, an adjusting cavity is formed in the supporting block, two groups of clamping plates are hinged to the interior of the adjusting cavity, and one end, away from the adjusting cavity, of each clamping plate penetrates through the interior of the positioning hole and is provided with a clamping block;
the chip ball-planting jig is used for assisting a chip in carrying out solder paste coating and ball-planting operations, and comprises a counterpoint plate arranged at the top of a supporting block and a chip counterpoint assembly arranged on the counterpoint plate, wherein the chip counterpoint assembly comprises a positioning hole formed in the counterpoint plate and a positioning frame arranged on the positioning hole, the counterpoint plate is internally provided with a ball-planting hole positioned in the positioning frame, the ball-planting hole is opposite to a welding spot on the chip, two groups of baffle plates which are symmetrically arranged are hinged at two ends of the positioning frame, one side of each baffle plate is provided with a control plate, one side of each control plate is provided with a tooth socket, the counterpoint plate is provided with a control block positioned on one side of each baffle plate, the top of the control block is provided with a screw rod, one end of the screw rod extends to the inside of the control block and is provided with a movable ball, the control block is internally provided with a connecting frame, one end of the connecting frame extends to the inside of the tooth socket and is provided with a roller wheel, the other end of the connecting frame is provided with a spring for applying pressure to the roller, a stabilizing block with one side abutting against the spring is arranged in the control block, and the other side of the stabilizing block is connected with the surface of the movable ball in a sliding manner.
As a preferred technical scheme of the invention, the bottom of the positioning frame is provided with a supporting leg, the top and the bottom of the inner wall of the sliding hole are both provided with a limiting groove, the top and the bottom of the projection are respectively provided with a pressing block extending to the inside of the two limiting grooves, and one end of the pressing rod, which is far away from the driving rod, penetrates through the pressing block and extends to the inside of the limiting groove.
As a preferred technical scheme of the invention, the outside of the driving rod is provided with a tension spring, one end of the tension spring, which is far away from the driving rod, is fixedly connected with the inner wall of the movable cavity, one end of the pressure lever and one side of the inner wall of the limiting groove are respectively provided with mutually staggered bulges, and two ends of the movable cavity are both provided with openings.
As a preferred technical scheme of the present invention, a chip placing plate is disposed on the top of the supporting table and used for placing chips, the number of the sliding blocks in the movable hole is not less than one, the surface of the adjusting rod is provided with threads, the sliding blocks are provided with internal threads engaged with the surface of the adjusting rod, and the sliding blocks are arranged in an i-shape.
As a preferred technical scheme of the invention, two ends of the positioning frame are respectively provided with a connecting plate, the positioning frame is hinged with the baffle plate through the connecting plates, the inside of the connecting plates is movably sleeved with the outside of the control plate, one side of the positioning frame is provided with a collecting frame for collecting solder balls, a connecting port is arranged at the connecting part of the positioning frame and the collecting frame, and the area of the top of the aligning plate, which is positioned in the collecting frame, is concave.
As a preferable technical scheme of the invention, the top of the inner wall of the control block is provided with a containing groove, the surface of the screw is in threaded connection with the inside of the containing groove, the top end of the screw is provided with a control rod, the bottom end of the screw is provided with a connecting ball, the outside of the connecting ball is movably sleeved with the inside of the movable ball, and the inside of the positioning hole and the top and the bottom of the alignment plate are both coated with non-stick coatings.
As a preferable technical scheme of the invention, a movable frame is arranged on one side of the connecting frame, the spring is positioned in the movable frame, one side of the stabilizing block extends into the movable frame and is provided with a contact rod, one end of the contact rod extends into the spring, and at least one pulley is movably arranged at the bottom of the stabilizing block.
As a preferred technical scheme of the present invention, the surface of the movable rod is provided with a thread, the inside of the support block is provided with an internal thread engaged with the surface of the movable rod, the surface of the movable rod is provided with a limit ring for limiting the displacement of the movable rod, and the outside of the support block is provided with a length mark.
As a preferable technical scheme of the invention, one side of each clamping plate is provided with a pressure spring of which one end extends into the adjusting cavity, a pull rod positioned between the two clamping plates is arranged in the adjusting cavity, the surface of the pull rod is provided with a rubber block, and the bottom end of the pull rod extends to the bottom of the height adjusting block.
A chip ball-planting method based on a computer complete machine manufacturing process uses a chip ball-planting tool based on the computer complete machine manufacturing process, and comprises the following steps:
s1, positioning a chip, placing the chip on a chip placing plate, firstly moving one of the slide bars to drive a height adjusting block to be close to one corner of the chip, clamping one corner of the chip, moving the slide block to slide in the movable hole through an adjusting bar, enabling the conical rod to be opposite to the slide seat, rotating the adjusting bar to drive the conical rod to abut against the drive bar, enabling the drive bar to drive the bulge on the press bar to abut against the bulge in the limiting groove, enabling the bulge and the slide bar to be incapable of moving, meanwhile, enabling the slide seat and the height adjusting block to be incapable of moving, and after one corner of the chip is positioned, moving the other slide bar and the height adjusting block to position one corner of the chip opposite to the positioning angle;
s2, adjusting a supporting block, after positioning of the chip is completed, firstly cleaning redundant tin on a welding spot of the chip by using an electric soldering iron, when the temperature of the electric soldering iron is about 350 ℃, cleaning the chip by using a cleaning agent, and after cleaning is completed, rotating a movable rod which cannot move up and down due to the limit of a limiting ring, so that the movable rod drives the supporting block to move up and down when rotating, and the top of the supporting block is adjusted to be horizontal to the top of the chip;
s3, locking the alignment plate, selecting the alignment plate matched with the chip, pulling the pull rod to drive the rubber block to be separated from the interference with the clamping plates, rebounding the pressure spring to drive the two clamping plates in the adjusting cavity to be mutually interfered, pressing the positioning hole and the adjusting cavity relatively to ensure that the clamping blocks penetrate through the positioning holes, pushing the pull rod to drive the rubber block to be interfered with the clamping plates again, enabling the two clamping plates to move back and forth and be clamped with the positioning holes, and completing the locking of the alignment plate;
s4, coating solder paste, stirring the baffle to turn for ninety degrees, driving a tooth groove in the control plate to continuously abut against a roller when the baffle turns, enabling the roller to drive a compression spring of the connecting frame, after the baffle turns, keeping the baffle in a positioning state due to the fact that the tooth groove is abutted by the roller, taking a proper amount of solder paste to place in the positioning frame, scraping the solder paste into the positioning hole by using a solder paste scraper, enabling the solder paste to be attached to a welding spot of a chip, and scraping and collecting the residual solder paste through the aligning plate after the solder paste coating is finished;
s5, in ball mounting operation, after the solder paste is coated, the movable rod is rotated to drive the supporting block to ascend again, so that the supporting block drives the alignment plate to be separated from the attachment of the chip and ascend to the height of a positioning hole, the baffle is shifted to reset, the positioning frame is shielded, a proper amount of solder balls are poured into the positioning frame, the solder balls are shifted to enter the positioning hole and adhere to the solder paste, and the rest solder balls are pushed into the collecting frame to be temporarily stored;
s6, plant under the ball operation, stimulate the pull rod once more and drive the block rubber and break away from the conflict to the cardboard, make the cardboard receive the conflict of pressure spring drive the fixture block break away from with the joint of locating hole, can with counterpoint board perpendicular rebound take off can, use the air heater, adopt low wind high fever mode to solidify the tin cream, can accomplish the ball of planting to the chip, the chip plants the ball and accomplishes the back, the reversal regulation pole drives the altitude mixture control piece and breaks away from the centre gripping to the chip, can take off the chip.
Compared with the prior art, the invention provides a chip ball mounting tool based on a computer complete machine manufacturing process and a method thereof, and the chip ball mounting tool has the following beneficial effects:
1. according to the chip ball-planting tool and the method based on the computer whole machine manufacturing process, the chip positioning jig, the height adjusting block and the chip ball-planting jig are arranged, the chip positioning jig is used for clamping and positioning the chip, the height adjusting block is used for adjusting according to the thickness of the chip, and finally the chip ball-planting jig is used for assisting in coating the solder paste and planting balls on the chip.
2. According to the chip ball-planting tool based on the computer whole machine manufacturing process and the chip ball-planting method, the chip positioning jig is arranged, the slide rod capable of moving back and forth is matched with the height adjusting block capable of moving left and right, chips with different lengths and widths can be clamped and positioned, the adjusting rod is rotated to lock the height adjusting block and the position of the slide rod at the same time, the chip positioning time is further shortened, and the working efficiency is guaranteed.
3. According to the chip ball-planting tool based on the computer whole machine manufacturing process and the method thereof, the height adjusting block is arranged, the movable rod is rotated to drive the supporting block to ascend, chips with different thicknesses can be processed, meanwhile, the aligning plate can be directly ascended after the solder paste coating is finished, the ball-planting operation is directly carried out, the connection among all working procedures is compact, and the universality is high.
4. According to the chip ball-planting tool and the method based on the computer complete machine manufacturing process, the chip ball-planting jig is arranged, the coating area of the solder paste is limited through the positioning frame, the solder paste is saved, the later cleaning difficulty is reduced, the solder ball can be conveniently scraped by the movable baffle, the solder ball can be blocked, and the condition that the solder ball falls off is avoided.
Drawings
FIG. 1 is a schematic structural diagram of a chip ball-mounting tool and a method thereof based on a computer complete machine manufacturing process according to the present invention;
FIG. 2 is a schematic structural diagram of a height adjusting block of a chip ball-mounting tool and a method thereof based on a computer complete machine manufacturing process according to the present invention;
FIG. 3 is an enlarged view of the structure at A in FIG. 2;
FIG. 4 is an enlarged view of the structure at B in FIG. 2;
FIG. 5 is a cross-sectional view of a slide bar structure of a chip ball-mounting tool and a method thereof based on a computer complete machine manufacturing process according to the present invention;
FIG. 6 is a cross-sectional view of a bump structure of a chip ball-mounting tool and a method thereof according to the present invention;
FIG. 7 is a schematic structural diagram of a chip ball-mounting jig of the chip ball-mounting tool and method thereof based on a computer complete machine manufacturing process according to the present invention;
FIG. 8 is an enlarged view of the structure at A in FIG. 7;
FIG. 9 is a cross-sectional view of a control board structure of a chip ball-mounting tool and a method thereof based on a computer complete machine manufacturing process according to the present invention;
FIG. 10 is a cross-sectional view of a control block structure of a chip ball mounting tool and method thereof based on a computer complete machine manufacturing process according to the present invention;
FIG. 11 is a sectional view of a height adjustment block structure of a chip ball-mounting tool and a method thereof according to the present invention;
FIG. 12 is a structural diagram of a configuration of a positioning plate of a chip ball-mounting tool and a method thereof based on a computer complete machine manufacturing process according to the present invention;
FIG. 13 is a structural diagram of a second configuration of a positioning plate of a chip ball-mounting tool and a method thereof based on a computer complete machine manufacturing process according to the present invention;
fig. 14 is a flow chart of a chip ball-mounting tool and a method thereof based on a computer complete machine manufacturing process according to the present invention.
In the figure: 1. a chip positioning jig; 11. a positioning frame; 111. a support leg; 12. a slide hole; 121. a limiting groove; 13. a support table; 131. a chip placement board; 14. a slide bar; 141. a movable groove; 142. a movable cavity; 143. a movable hole; 15. a slider; 16. adjusting a rod; 161. a tapered rod; 17. a bump; 171. briquetting; 18. a drive rod; 181. a pressure lever; 182. a tension spring; 2. a height adjusting block; 21. a slide base; 22. a support block; 23. a movable rod; 24. a limiting ring; 25. an adjustment chamber; 26. clamping a plate; 27. a clamping block; 28. a pull rod; 281. a rubber block; 29. a pressure spring; 3. a chip ball mounting jig; 31. a positioning plate; 32. a chip alignment assembly; 321. positioning holes; 33. a positioning frame; 331. planting ball holes; 332. a connecting plate; 333. a collection frame; 334. a connecting port; 34. a baffle plate; 35. a control panel; 351. a tooth socket; 36. a control block; 361. a screw; 362. a receiving groove; 363. a connecting ball; 364. a movable ball; 365. a control lever; 37. a connecting frame; 371. a roller; 38. a movable frame; 381. a spring; 39. a stabilizing block; 391. a touch bar; 392. a pulley.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-14, a chip ball-mounting tool and method thereof based on a computer complete machine manufacturing process includes:
the chip positioning jig 1 is used for positioning a chip to be subjected to ball planting, the chip positioning jig 1 comprises a positioning frame 11, slide holes 12 are formed in two sides of the positioning frame 11, a supporting table 13 for placing the chip is arranged in the positioning frame 11, at least two slide bars 14 are movably arranged in the positioning frame 11, a movable groove 141, a movable cavity 142 and a movable hole 143 are sequentially formed in each slide bar 14, a slide block 15 is arranged in each movable hole 143, an adjusting rod 16 is arranged in each slide block 15, a tapered rod 161 is arranged at one end of each adjusting rod 16, lugs 17 extending into the two slide holes 12 are respectively arranged at two ends of the positioning frame 11, a driving rod 18 with the outer part abutting against the surface of the tapered rod 161 and the number of the driving rod 18 being not less than one is arranged in each movable hole 142, and two ends of the driving rod 18 extend into the two lugs 17 respectively, the outside of actuating lever 18 is provided with the depression bar 181 that one end extends to the inside of slide opening 12, through setting up chip positioning jig 1, through the slide bar 14 that can the back-and-forth movement cooperation can control the altitude mixture control piece 2 that removes, can carry out the centre gripping location to the chip that different length can be wide, rotates adjusting lever 16 and can lock the position of altitude mixture control piece 2 and slide bar 14 simultaneously, has further reduced chip positioning time, has guaranteed work efficiency.
A height adjusting block 2 for clamping the chip, a slide seat 21 is arranged on one side of the height adjusting block 2, the interior of the sliding seat 21 is connected with the interior of the movable groove 141 in a sliding way, the interior of the height adjusting block 2 is movably provided with a supporting block 22, the height adjusting block 2 is internally provided with a movable rod 23 for adjusting the height of the supporting block 22, an adjusting cavity 25 is formed in the supporting block 22, two groups of clamping plates 26 are hinged in the adjusting cavity 25, one end of the clamping plate 26 far away from the adjusting cavity 25 penetrates through the inner part of the positioning hole 321 and is provided with a clamping block 27, by arranging the height adjusting block 2 and rotating the movable rod 23 to drive the supporting block 22 to ascend, not only can the chips with different thicknesses be processed, meanwhile, the alignment plate 31 can be directly lifted after the solder paste is coated, the ball planting operation is directly carried out, the connection among all the working procedures is compact, and the universality is high.
The chip ball-planting jig 3 is used for assisting a chip in performing solder paste coating and ball-planting operations, the chip ball-planting jig 3 comprises a positioning plate 31 arranged at the top of a supporting block 22 and a chip positioning component 32 arranged on the positioning plate 31, the chip positioning component 32 comprises a positioning hole 321 arranged inside the positioning plate 31 and a positioning frame 33 arranged on the positioning hole 321, a ball-planting hole 331 arranged in the positioning frame 33 is formed inside the positioning plate 31, the ball-planting hole 331 is opposite to a welding point on the chip, two ends of the positioning frame 33 are hinged with two groups of baffle plates 34 which are symmetrically arranged, one side of each baffle plate 34 is provided with a control plate 35, one side of each control plate 35 is provided with a tooth socket 351, the positioning plate 31 is provided with a control block 36 arranged at one side of each baffle plate 34, the top of each control block 36 is provided with a screw 361, one end of each screw 361 extends into the control block 36 and is provided with a movable ball 364, the inside of control block 36 is provided with link 37 that one end extends to inside and install gyro wheel 371 of tooth's socket 351, the other end of link 37 is provided with spring 381, be used for right gyro wheel 371 is exerted pressure, the inside of control block 36 is provided with one side and the inconsistent stable piece 39 of spring 381, the opposite side of stable piece 39 and the surperficial sliding connection of activity ball 364, plant ball tool 3 through setting up the chip, restrict the coating region of tin cream through locating frame 33, when saving the tin cream, reduced the clearance degree of difficulty in later stage, movable baffle 34 has not only made things convenient for and has struck off the tin cream, can block the tin ball simultaneously, has avoided the condition that the tin ball dropped to appear.
Fig. 12 and 13 are schematic diagrams of another two forms of the alignment plate 31, and according to the use requirement, a plurality of chip alignment assemblies 32 with different specifications can be installed on one alignment plate 31, so that the later use is facilitated.
As a specific technical scheme of this embodiment, the bottom of locating rack 11 is provided with landing leg 111, limiting groove 121 has all been seted up to the top and the bottom of slide opening 12 inner wall, the top and the bottom of lug 17 set up respectively and extend to the inside briquetting 171 of two limiting groove 121, the one end that actuating lever 18 was kept away from to depression bar 181 runs through briquetting 171 and extends to the inside of limiting groove 121, and landing leg 111 heightens locating rack 11, has made things convenient for user operation pull rod 28 and movable rod 23, and limiting groove 121's setting cooperates briquetting 171 to use for slide bar 14 is more steady when removing, the condition of skew can not appear.
As a specific solution of this embodiment, a tension spring 182 is disposed outside the driving rod 18, the end of the tension spring 182 far away from the driving rod 18 is fixedly connected with the inner wall of the movable cavity 142, one end of the pressure lever 181 and one side of the inner wall of the limit groove 121 are respectively provided with mutually staggered bulges, both ends of the movable cavity 142 are open, referring to fig. 6, two driving rods 18 are installed inside the movable cavity 142, the locking effect of the sliding rod 14 can be further ensured, the openings at the two ends of the movable cavity 142 facilitate the replacement and the disassembly of the tension spring 182, the two ends of the tension spring 182 can be fixed in a welding mode, the arrangement of the bulges effectively increases the friction force when the pressure rod 181 is abutted against the inner wall of the limiting groove 121, so that the pressing rod 181, the pressing block 171, the protrusion and the sliding rod 14 can not move, and the subsequent ball mounting operation is prevented from being influenced.
As a specific technical solution of this embodiment, a chip placing plate 131 is disposed on the top of the supporting table 13 and used for placing chips, the number of the sliders 15 inside the movable hole 143 is not less than one, the surface of the adjusting rod 16 is provided with threads, the interior of the slider 15 is provided with internal threads engaged with the surface of the adjusting rod 16, the slider 15 is disposed in an i-shape, the chip placing plate 131 is in a circular truncated cone shape and can place chips of different specifications, referring to fig. 2 and 4, two sliders 15 are disposed inside the movable hole 143, when one slider 15 is used for positioning blocks of the height adjusting block 2 and the slide rod 14, the other slider 15 can be moved to the side of the positioning frame 11, and the adjusting rod 16 inside the other slider can be rotated to drive the pressing rod 181 to abut against the limiting groove 121, so as to further lock the slide rod 14, and multiple usage schemes are adopted, so as to ensure the stability of the slide rod 14, the use is more convenient.
As a specific technical solution of this embodiment, the two ends of the positioning frame 33 are both provided with a connecting plate 332, the positioning frame 33 is hinged to the baffle 34 through the connecting plate 332, the inside of the connecting plate 332 is movably sleeved with the outside of the control board 35, one side of the positioning frame 33 is provided with a collecting frame 333 for collecting solder balls, a connecting port 334 is provided at the connecting position of the positioning frame 33 and the collecting frame 333, the region of the top of the aligning plate 31 located in the collecting frame 333 is concave, referring to fig. 7 and 8, the arrangement of the connecting plate 332 increases the opening of the positioning frame 33, prevents solder paste from adhering to the control board 35, reduces the difficulty in cleaning in the later period, and the arrangement of the collecting frame 333 can temporarily store the remaining solder balls after the solder balls enter the positioning holes 321, thereby preventing the remaining solder balls from falling through the positioning holes 321 when the aligning plate 31 is taken down, the area in the collection frame 333 is concave, so that the solder balls are not easy to shake after entering the interior of the collection frame 333, and after the alignment plate 31 is taken down by a user, the solder balls in the collection frame 333 are poured out and collected.
As a specific technical solution of this embodiment, the top of the inner wall of the control block 36 is provided with a receiving groove 362, the surface of the screw 361 is in threaded connection with the inside of the receiving groove 362, the top end of the screw 361 is provided with a control rod 365, the bottom end of the screw 361 is provided with a connecting ball 363, the outside of which is movably sleeved with the inside of the movable ball 364, the inside of the positioning hole 321 and the top and bottom of the positioning plate 31 are coated with non-stick coatings, which are not coated with the coatings, so as to prevent solder paste from adhering to the inner wall of the positioning hole 321 of the cover, reduce the difficulty of cleaning in the later period, when the elasticity of the spring 381 is insufficient, to ensure the stability of the baffle 34, the control rod 365 is first rotated to drive the screw 361 to descend, so that the movable ball 364 abuts against the stabilizing block 39, so that the stabilizing block 39 further presses the spring 381, thereby ensuring the stability of the baffle 34, when the spring 381 needs to be replaced, the control rod 365 is rotated to drive the screw 361 to ascend, so that the movable ball 364 is accommodated in the accommodating groove 362, the stabilizing block 39 is taken out to replace the spring 381, after replacement, the stabilizing block 39 is abutted against the spring 381 again, and the screw 361 is rotated to descend to drive the movable ball 364 to abut against the stabilizing block 39 again.
As a specific technical solution of this embodiment, one side of the connecting frame 37 is provided with the movable frame 38, the spring 381 is located inside the movable frame 38, one side of the stabilizing block 39 extends to inside of the movable frame 38 and is provided with the abutting rod 391 with one end extending to inside of the spring 381, the bottom of the stabilizing block 39 is movably provided with at least one pulley 392, the pulley 392 is arranged, friction between the stabilizing block 39 and the inner wall of the control block 36 is reduced, so that the stabilizing block 39 moves more smoothly, the stability of the connecting frame 37 is ensured by the arrangement of the movable frame 38, the arrangement of the roller 371 reduces friction of the tooth socket 351, and the arrangement of the abutting rod 391 ensures the stability of the spring 381.
As a specific technical scheme of this embodiment, a thread is formed on the surface of the movable rod 23, an internal thread meshed with the surface of the movable rod 23 is formed inside the supporting block 22, a limiting ring 24 for limiting the displacement of the movable rod 23 is arranged on the surface of the movable rod 23, a length mark is formed outside the supporting block 22, the movable rod 23 cannot move up and down due to the limitation of the limiting ring 24, and the supporting block 22 cannot rotate due to the limitation of the height adjusting block 2, so that the movable rod 23 drives the supporting block 22 to move up and down when rotating, the length mark is arranged, the ascending distance of the supporting block 22 can be accurately judged, the top of the supporting block 22 is adjusted to be level with the top of the chip, the movable rod 23 can be adapted to chips with different thicknesses, and the applicability of the device is ensured.
As a specific solution of this embodiment, one side of the clamping plate 26 is provided with a compression spring 29 with one end extending to the inside of the adjusting cavity 25, the interior of the adjusting cavity 25 is provided with a pull rod 28 positioned between two clamping plates 26, the surface of the pull rod 28 is provided with a rubber block 281, the bottom end of the pull rod 28 extends to the bottom of the height adjusting block 2, the pull rod 28 is pulled to drive the rubber block 281 to be separated from the interference with the clamping plates 26, the pressure spring 29 rebounds to drive the two clamping plates 26 in the adjusting cavity 25 to be mutually interfered, the positioning hole 321 and the adjusting cavity 25 are pressed after being opposite, so that the fixture block 27 passes through the positioning hole 321, the pull rod 28 is pushed to drive the rubber block 281 to abut against the two clamping plates 26 again, so that the two clamping plates 26 move back and forth and are clamped with the positioning hole 321, namely, the locking of the aligning plate 31 is completed, and the friction force of the snap-gauge 26 is increased by the arrangement of the rubber block 281, so that the pressure is always applied to the snap-gauge 26.
A chip ball-planting method based on a computer complete machine manufacturing process uses a chip ball-planting tool based on the computer complete machine manufacturing process, and comprises the following steps:
s1, positioning a chip, placing the chip on the chip placing plate 131, firstly moving one of the slide bars 14 to drive the height adjusting block 2 to approach one corner of the chip, clamping one corner of the chip, moving the slide block 15 to slide in the movable hole 143 through the adjusting rod 16, so that the tapered rod 161 is opposite to the slide base 21, rotating the adjusting rod 16 to drive the tapered rod 161 to abut against the driving rod 18, so that the driving rod 18 drives the protrusion on the press bar 181 to abut against the protrusion in the limiting groove 121, so that the protrusion and the slide bar 14 cannot move, and simultaneously the tapered rod 161 abuts against the slide base 21, so that the slide base 21 and the height adjusting block 2 cannot move, after one corner of the chip is positioned, moving the other slide bar 14 and the height adjusting block 2 to position one corner of the chip opposite to the positioning angle;
s2, adjusting the supporting block 22, after positioning of the chip is completed, firstly cleaning redundant tin on a welding spot of the chip by using an electric soldering iron, when the temperature of the electric soldering iron is about 350 ℃, cleaning the chip by using a cleaning agent, and after cleaning is completed, rotating the movable rod 23, wherein the movable rod 23 cannot move up and down due to the fact that the movable rod 23 is limited by the limiting ring 24, so that the movable rod 23 drives the supporting block 22 to move up and down when rotating, and the top of the supporting block 22 is adjusted to be horizontal to the top of the chip;
s3, locking the aligning plate 31, selecting the aligning plate 31 matched with the chip, pulling the pull rod 28 to drive the rubber block 281 to be separated from the interference with the clamping plates 26, rebounding the pressure spring 29 to drive the two clamping plates 26 in the adjusting cavity 25 to be mutually interfered, pressing the positioning hole 321 and the adjusting cavity 25 relatively, enabling the fixture block 27 to penetrate through the positioning hole 321, pushing the pull rod 28 to drive the rubber block 281 to be interfered with the clamping plates 26 again, enabling the two clamping plates 26 to move back and forth to be clamped with the positioning hole 321, and completing the locking of the aligning plate 31;
s4, coating solder paste, stirring the baffle 34 to turn for ninety degrees, driving the tooth groove 351 in the control plate 35 to continuously abut against the roller 371 when the baffle 34 turns, so that the roller 371 drives the compression spring 381 which the connecting frame 37 does not stop, after the baffle 34 turns over, because the tooth groove 351 is abutted by the roller 371, the baffle 34 keeps positioning, taking a proper amount of solder paste to place in the positioning frame 33, scraping the solder paste into the positioning hole 321 by using a solder paste scraper, attaching the solder paste to a welding spot of a chip, and after the solder paste coating is finished, scraping and collecting the rest solder paste by the aligning plate 31;
s5, in the ball mounting operation, after the solder paste is coated, the movable rod 23 is rotated to drive the supporting block 22 to ascend again, so that the supporting block 22 drives the alignment plate 31 to be separated from the joint with the chip and ascend to the height of one positioning hole 321, the baffle plate 34 is shifted to reset, the positioning frame 33 is shielded, a proper amount of solder balls are taken and poured into the positioning frame 33, the solder balls are shifted to enter the positioning holes 321 and adhere to the solder paste, and the rest solder balls are pushed into the collecting frame 333 to be temporarily stored;
s6, plant under the ball operation, stimulate pull rod 28 once more and drive rubber block 281 and break away from the conflict to cardboard 26, make cardboard 26 receive the conflict of pressure spring 29 drive fixture block 27 break away from with the joint of locating hole 321, can take off counterpoint board 31 perpendicular rebound can, use the air heater, adopt low wind high fever mode to solidify the tin cream, can accomplish the ball of planting to the chip, the chip plants the ball completion back, reverse regulation pole 16 drives height control piece 2 and breaks away from the centre gripping to the chip, can take off the chip.
To sum up, according to the chip ball-planting tool and the method based on the computer whole machine manufacturing process, the chip positioning jig 1, the height adjusting block 2 and the chip ball-planting jig 3 are arranged, the chip positioning jig 1 finishes clamping and positioning of the chip, the height adjusting block 2 adjusts the chip according to the thickness of the chip, and finally the chip ball-planting jig 3 assists in tin paste coating and ball-planting operation of the chip.
It should be noted that, in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A chip ball-planting tool based on a computer complete machine manufacturing process is characterized by comprising:
chip positioning jig (1) for treating the chip of planting the ball and fixing a position, chip positioning jig (1) includes locating rack (11), draw-off hole (12) have all been seted up to the both sides of locating rack (11), the inside of locating rack (11) is provided with brace table (13) that are used for placing the chip, the inside activity of locating rack (11) is provided with quantity slide bar (14) that are two at least, movable groove (141), activity chamber (142) and activity hole (143) have been seted up in proper order to the inside of slide bar (14), the inside of activity hole (143) is provided with slider (15), the inside of slider (15) is provided with adjusts pole (16), the one end of adjusting pole (16) is provided with taper rod (161), the both ends of locating rack (11) are provided with respectively and extend to inside lug (17) of two draw-off holes (12), the inside in activity chamber (142) is provided with outside and taper rod (161) surface inconsistent and quantity is not few Two ends of one driving rod (18) extend to the insides of the two lugs (17), and a pressing rod (181) with one end extending to the inside of the sliding hole (12) is arranged outside the driving rod (18);
the height adjusting device comprises a height adjusting block (2) used for clamping a chip, wherein a sliding seat (21) is installed on one side of the height adjusting block (2), the inside of the sliding seat (21) is connected with the inside of a movable groove (141) in a sliding mode, a supporting block (22) is movably arranged inside the height adjusting block (2), a movable rod (23) used for adjusting the height of the supporting block (22) is arranged inside the height adjusting block (2), an adjusting cavity (25) is formed inside the supporting block (22), two groups of clamping plates (26) are hinged inside the adjusting cavity (25), and one end, far away from the adjusting cavity (25), of each clamping plate (26) penetrates through the inside of a positioning hole (321) and is provided with a clamping block (27);
the chip ball-planting jig (3) is used for assisting a chip in coating solder paste and planting balls, the chip ball-planting jig (3) comprises a counterpoint plate (31) arranged at the top of a supporting block (22) and a chip counterpoint assembly (32) arranged on the counterpoint plate (31), the chip counterpoint assembly (32) comprises a positioning hole (321) arranged inside the counterpoint plate (31) and a positioning frame (33) arranged on the positioning hole (321), a ball-planting hole (331) positioned in the positioning frame (33) is formed inside the counterpoint plate (31), the ball-planting hole (331) is opposite to a welding spot on the chip, two groups of symmetrically arranged baffles (34) are hinged to two ends of the positioning frame (33), a control plate (35) is arranged on one side of each baffle (34), a tooth socket (351) is formed on one side of each control plate (35), and a control block (36) positioned on one side of each baffle (34) is arranged on the counterpoint plate (31), the top of control block (36) is provided with screw rod (361), the one end of screw rod (361) extends to the inside of control block (36) and installs activity ball (364), the inside of control block (36) is provided with link (37) that one end extends to inside of tooth's socket (351) and installs gyro wheel (371), the other end of link (37) is provided with spring (381), is used for exerting pressure to gyro wheel (371), the inside of control block (36) is provided with one side and the inconsistent steady block (39) of spring (381), the opposite side of steady block (39) and the surperficial sliding connection of activity ball (364).
2. The chip ball mounting tool based on the computer whole machine manufacturing process according to claim 1, characterized in that: the bottom of locating rack (11) is provided with landing leg (111), spacing groove (121) have all been seted up to the top and the bottom of slide opening (12) inner wall, the top and the bottom of lug (17) set up respectively and extend to inside briquetting (171) of two spacing grooves (121), the one end that actuating lever (18) were kept away from in depression bar (181) runs through briquetting (171) and extends to the inside of spacing groove (121).
3. The chip ball mounting tool based on the computer whole machine manufacturing process according to claim 1, characterized in that: the outside of actuating lever (18) is provided with extension spring (182), the one end that actuating lever (18) were kept away from in extension spring (182) and the inner wall fixed connection in activity chamber (142), the one end of depression bar (181) is provided with the arch that is mutual staggering respectively with one side of spacing groove (121) inner wall, the both ends in activity chamber (142) all are the opening setting.
4. The chip ball mounting tool based on the computer whole machine manufacturing process according to claim 1, characterized in that: the chip placing plate (131) is arranged at the top of the supporting table (13) and used for placing chips, at least one sliding block (15) in the movable hole (143) is arranged, the surface of the adjusting rod (16) is provided with threads, internal threads meshed with the surface of the adjusting rod (16) are arranged in the sliding block (15), and the sliding block (15) is arranged in an I shape.
5. The chip ball mounting tool based on the computer whole machine manufacturing process according to claim 1, characterized in that: the both ends of locating frame (33) all are provided with connecting plate (332), locating frame (33) are articulated through connecting plate (332) and baffle (34), the inside of connecting plate (332) cup joints with the outside activity of control panel (35), one side of locating frame (33) is provided with collects frame (333) for collect the tin ball, connector (334) have been seted up with the junction of collecting frame (333) in locating frame (33), the region that the top of counterpoint board (31) is located and collects frame (333) is the setting of recessed form.
6. The chip ball mounting tool based on the computer whole machine manufacturing process according to claim 1, characterized in that: the top of control block (36) inner wall has been seted up and has been accomodate groove (362), the surface of screw rod (361) and the inside threaded connection who accomodates groove (362), the top of screw rod (361) is provided with control lever (365), the bottom of screw rod (361) is provided with outside and activity ball (364) inside activity connected ball (363) that cup joints, the inside of locating hole (321) and the top and the bottom of counterpoint board (31) all coat and have and not be stained with the coating.
7. The chip ball mounting tool based on the computer whole machine manufacturing process according to claim 1, characterized in that: one side of link (37) is provided with adjustable shelf (38), spring (381) are located the inside of adjustable shelf (38), one side of steady piece (39) extends to the inside of adjustable shelf (38) and is provided with one end and extends to the inside conflict pole (391) of spring (381), the bottom activity of steady piece (39) is provided with the pulley (392) that the quantity is no less than one.
8. The chip ball mounting tool based on the computer whole machine manufacturing process according to claim 1, characterized in that: the surface of the movable rod (23) is provided with threads, internal threads meshed with the surface of the movable rod (23) are formed in the supporting block (22), a limiting ring (24) used for limiting the displacement of the movable rod (23) is arranged on the surface of the movable rod (23), and length marks are formed in the outer portion of the supporting block (22).
9. The chip ball mounting tool based on the computer whole machine manufacturing process according to claim 1, characterized in that: one side of the clamping plates (26) is provided with a pressure spring (29) with one end extending into the adjusting cavity (25), a pull rod (28) located between the two clamping plates (26) is arranged in the adjusting cavity (25), a rubber block (281) is arranged on the surface of the pull rod (28), and the bottom end of the pull rod (28) extends to the bottom of the height adjusting block (2).
10. A chip ball mounting method based on a computer whole manufacturing process according to claims 1 to 9, which uses a chip ball mounting tool based on a computer whole manufacturing process, and is characterized by comprising the following steps:
s1, positioning the chip, placing the chip on the chip placing plate (131), firstly moving one of the slide bars (14) to drive the height adjusting block (2) to be close to one corner of the chip to clamp one corner of the chip, the sliding block (15) is moved by the adjusting rod (16) to slide in the movable hole (143), so that the conical rod (161) is opposite to the sliding seat (21), the adjusting rod (16) is rotated to drive the conical rod (161) to be abutted against the driving rod (18), so that the driving rod (18) drives the bulge on the pressure lever (181) to abut against the bulge in the limiting groove (121) to make the bulge and the sliding rod (14) unable to move, meanwhile, the conical rod (161) props against the sliding seat (21) to ensure that the sliding seat (21) and the height adjusting block (2) can not move, after one corner of the chip is positioned, moving the other sliding rod (14) and the height adjusting block (2) to position one corner of the chip opposite to the positioning angle;
s2, adjusting a supporting block (22), after the chip is positioned, firstly cleaning redundant tin on a welding spot of the chip by using an electric soldering iron, keeping the temperature of the electric soldering iron at about 350 ℃, cleaning the chip by using a cleaning agent, and after the chip is cleaned, rotating a movable rod (23), wherein the movable rod (23) cannot move up and down due to the fact that the movable rod (23) is limited by a limiting ring (24), so that the supporting block (22) is driven to move up and down when the movable rod (23) rotates, and the top of the supporting block (22) is adjusted to be horizontal to the top of the chip;
s3, locking the aligning plate (31), selecting the aligning plate (31) matched with the chip, pulling the pull rod (28) to drive the rubber block (281) to be separated from the interference with the clamping plate (26), rebounding the pressure spring (29) to drive the two clamping plates (26) in the adjusting cavity (25) to be mutually interfered, pressing the positioning hole (321) and the adjusting cavity (25) relatively, enabling the clamping block (27) to penetrate through the positioning hole (321), pushing the pull rod (28) to drive the rubber block (281) to be abutted against the clamping plate (26) again, enabling the two clamping plates (26) to move back and forth and be clamped with the positioning hole (321), and completing the locking of the aligning plate (31);
s4, solder paste is coated, the baffle (34) is stirred to turn for ninety degrees, the tooth grooves (351) in the control plate (35) are driven to continuously abut against the roller (371) when the baffle (34) turns, so that the roller (371) drives the compression spring (381) of the connecting frame (37), after the baffle (34) turns, the baffle (34) keeps positioned due to the fact that the tooth grooves (351) are abutted against the roller (371), a proper amount of solder paste is taken to be placed in the positioning frame (33), the solder paste is scraped into the positioning holes (321) by a solder paste scraper, the solder paste is attached to welding spots of the chip, and after the solder paste is coated, the rest solder paste is scraped off and collected by the aligning plate (31);
s5, in ball mounting operation, after the solder paste is coated, the movable rod (23) is rotated to drive the supporting block (22) to ascend again, so that the supporting block (22) drives the alignment plate (31) to be separated from the attachment of the chip and ascend the height of one positioning hole (321), the baffle plate (34) is shifted to reset, the positioning frame (33) is shielded, a proper amount of solder balls are taken and poured into the positioning frame (33), the solder balls are shifted to enter the positioning holes (321) and adhere to the solder paste, and the rest solder balls are pushed into the collecting frame (333) to be temporarily stored;
s6, plant under the ball operation, stimulate pull rod (28) once more and drive rubber block (281) and break away from the conflict to cardboard (26), make cardboard (26) receive the conflict of pressure spring (29) to drive fixture block (27) and break away from the joint with locating hole (321), can take off counterpoint board (31) vertical upward movement can, use the air heater, adopt low wind high fever mode to solidify the tin cream, can accomplish the ball of planting to the chip, the chip plants the ball and accomplishes the back, reversal regulation pole (16) drive altitude mixture control piece (2) break away from the centre gripping to the chip, can take off the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111355166.1A CN114068338A (en) | 2021-11-16 | 2021-11-16 | Chip ball mounting tool based on computer whole machine manufacturing process and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111355166.1A CN114068338A (en) | 2021-11-16 | 2021-11-16 | Chip ball mounting tool based on computer whole machine manufacturing process and method thereof |
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| Publication Number | Publication Date |
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| CN114068338A true CN114068338A (en) | 2022-02-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111355166.1A Withdrawn CN114068338A (en) | 2021-11-16 | 2021-11-16 | Chip ball mounting tool based on computer whole machine manufacturing process and method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114597146A (en) * | 2022-05-07 | 2022-06-07 | 深圳市立可自动化设备有限公司 | BGA ball mounting machine |
| CN115229295A (en) * | 2022-06-09 | 2022-10-25 | 上海移远通信技术股份有限公司 | Positioner and manual brush tin subassembly |
| CN115602557A (en) * | 2022-12-15 | 2023-01-13 | 深圳市立可自动化设备有限公司（Cn） | Full-automatic ball mounting machine |
| CN115971819A (en) * | 2022-11-21 | 2023-04-18 | 苏州东岱电子科技有限公司 | Laser steel mesh processing technology for improving poor continuous tin |
| CN117423649A (en) * | 2023-12-19 | 2024-01-19 | 江苏中科智芯集成科技有限公司 | Full-automatic ball planting machine for chip packaging and ball planting process thereof |
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2021
- 2021-11-16 CN CN202111355166.1A patent/CN114068338A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114597146A (en) * | 2022-05-07 | 2022-06-07 | 深圳市立可自动化设备有限公司 | BGA ball mounting machine |
| CN114597146B (en) * | 2022-05-07 | 2022-07-22 | 深圳市立可自动化设备有限公司 | BGA ball mounting machine |
| CN115229295A (en) * | 2022-06-09 | 2022-10-25 | 上海移远通信技术股份有限公司 | Positioner and manual brush tin subassembly |
| CN115971819A (en) * | 2022-11-21 | 2023-04-18 | 苏州东岱电子科技有限公司 | Laser steel mesh processing technology for improving poor continuous tin |
| CN115602557A (en) * | 2022-12-15 | 2023-01-13 | 深圳市立可自动化设备有限公司（Cn） | Full-automatic ball mounting machine |
| CN115602557B (en) * | 2022-12-15 | 2023-03-21 | 深圳市立可自动化设备有限公司 | Full-automatic ball mounting machine |
| CN117423649A (en) * | 2023-12-19 | 2024-01-19 | 江苏中科智芯集成科技有限公司 | Full-automatic ball planting machine for chip packaging and ball planting process thereof |
| CN117423649B (en) * | 2023-12-19 | 2024-02-23 | 江苏中科智芯集成科技有限公司 | Chip packaging full-automatic ball planting machine and ball planting method thereof |
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Application publication date: 20220218 |