CN205609476U - A plant ball instrument for BGA chip - Google Patents
A plant ball instrument for BGA chip Download PDFInfo
- Publication number
- CN205609476U CN205609476U CN201620423523.1U CN201620423523U CN205609476U CN 205609476 U CN205609476 U CN 205609476U CN 201620423523 U CN201620423523 U CN 201620423523U CN 205609476 U CN205609476 U CN 205609476U
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- China
- Prior art keywords
- chip
- plate
- steel net
- frame
- net template
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a plant ball instrument for BGA chip, including frame, chip hoisting device and steel mesh template clip utensil, vacant chamber has been offered to frame inside, the inside fixed plate that transversely is provided with of frame, chip hoisting device sets up at the frame middle position, chip hoisting device's first threaded rod upper portion spiro union has the chip to place the unit, the lower part spiro union has on the center transmission piece, steel mesh template clip utensil is including support, punch holder and lower plate, the quad slit has been seted up at punch holder and lower plate middle part, having placed that the punch holder is detachable hides the orifice plate. The utility model discloses a chip promotes the unit and can require to make chip and steel mesh template keep certain interval according to different chips, hides the orifice plate and has effectively shielded some out of use holes in the steel mesh template fast, is favorable to the follow -up quick effectual solder ball of placing, can make locking simultaneously or loosen the operating time of steel mesh template shorter, operates more portably, and production efficiency is higher.
Description
Technical field:
What this utility model related to chip plants ball instrument, in particular to one for BGA
Chip plant ball instrument.
Background technology:
Along with the progress of technology, chip integration improves constantly, and I/O pin number sharply increases,
Power consumption increases the most therewith, and the requirement to integrated antenna package is the strictest.In order to meet development
Needs, BGA package starts to be applied to produce, BGA (English Ball Grid Array
Package) i.e. BGA Package technology, the I/O terminal of BGA package is with circular or column weldering
Pressing array format, to be distributed in encapsulation following, and is arranged in a pattern being similar to grid, should
Although technology has the advantage that I/O number of pins increases, but the distance between pin is big, carries
High yield rate；Although the power consumption of BGA increases, but owing to using control collapsed chip
Method is welded, such that it is able to improve electric heating property；Signal transmission delay is little, adapts to frequency and significantly carries
High；Assembling available coplanar welding, reliability is greatly improved.Therefore BGA is CPU, mainboard
High density, high-performance, the optimum selections of many pin package such as south, north bridge chips, a lot of chips
Device producer is used, and the chip of BGA package is more and more universal.
Owing to BGA pin mostly is stanniferous material, in carrying out circuit board group process of assembling, device
Part can melt because of the scolding tin in high-temperature soldering, device, and with the line scan pickup coil side welding on circuit board
Together, if BGA device needs to reprocess when disassembling from circuit board, due to pin
Material at high temperature melts deformation, and after device disassembles, the pin of BGA reforms in a jumble
The shape that can't bear, bga chip at this moment cannot use, and therefore chip needs again to plant
Enter new solder ball.
Existing BGA plants ball technique and generally uses steel net template to carry out, such as China's utility model
BGA disclosed in patent CN102881599A plants ball technique, steel mesh is installed to printer enterprising
Row para-position is fixed, and tin cream is coated onto on steel mesh；Several BGA are contained on carrier, and
Carrier is installed on printer, makes steel mesh overlap with carrier and carry out paste solder printing；It is completed for printing
After, check whether the tin cream on each BGA pad prints uniformly, after confirming printing OK,
It is put into Reflow Soldering baking, completes to plant ball.Above-mentioned technique having the disadvantage in that, (1) needs steel
Net stencil and the array way of chip, the size of soldered ball and spacing one_to_one corresponding, poor universality；
(2) steel net template surrounding needs with cushion block frame high so that it is with printed scaling powder or the BGA of soldering paste
Device keeps accurate distance, complex operation, needs operator to have the operation skill of consummation；
(3) due to the thickness of different chips and not of uniform size, also needing to of having is grasped on Rework station
Making, therefore, above-mentioned technique is not suitable for the unified maintenance of various chip.
As can be seen here, existing BGA plants ball technique poor universality, complex operation, inapplicable
Unified maintenance in various chips.
For solving above-mentioned technical problem, the utility model of Application No. CN201420481106.3
Disclosing the ball instrument of planting of a kind of bga chip, chip mounting table includes workbench and is located at work
The cushion block of station upper surface, cushion block is used for fixing bga chip；Plant ball template and include upper and lower
Clamping plate and the steel net template being folded between upper and lower clamping plate, the center of upper and lower clamping plate is provided with
The through hole of up/down perforation, upper and lower clamping plate are provided with, around through hole, the screwed hole that many groups are through, its
In be screwed with regulation bolt in one group of screwed hole.Above-mentioned utility model utilizes regulation bolt to regulate
The distance of steel net template and bga chip to be processed, and steel net template is provided with different size,
Mesh array number can cover the number of arrays of major part chip, therefore can be used for the dimension of major part chip
Repair, do not limited by number of pins and the thickness of chip, be simple to manufacture, with low cost, highly versatile.
Utility model content:
This utility model is solved the technical problem that: a kind of bga chip described in prior art
Plant ball instrument, operator need to external tool action threaded fastener with fixing train wheel bridge and
Lower plate, and then clamping steel net template, so, complex operation, it is unfavorable for carrying of work efficiency
High；
For reaching above-mentioned purpose, this utility model provides a kind of plants ball for bga chip
Instrument, carries including chip, steel net template, screening orifice plate, frame, steel net template fixture and chip
Rise device；Frame includes that inside offers the frame body in vacant chamber；Machine frame inside horizontally set
There is fixed plate；Some guide rods are vertically fixed in frame upper surface；
Chip lifting device includes the first worm screw, center transmission block and the first threaded rod；Fixed plate
Upper surface is vertically fixed a pair support seat；First worm screw is longitudinally articulated in support by central shaft
On seat；Transmission block top, center be cylinder, bottom be worm gear；Center transmission formation of lots have from
Upper and under the screwed hole that runs through；Center transmission block top by bearing hinge joint frame upper side wall,
Bottom and the first worm engaging；First threaded rod is vertically screwed onto the screwed hole of center transmission block
In；First threaded rod lower end passes fixed plate；First threaded rod upper end is bolted with chip and places single
Unit；Chip placement unit includes chip container and base；Described chip container is fixed on the end
Seat upper end；Base is connected is formed by cylinder ring body and the lower circular plate of top；Described circular slab
Center is screwed onto on the first threaded rod, circumferential edges is plugged on guide rod；
Steel net template fixture includes bearing, train wheel bridge and lower plate；Bearing is made up of some pillars；
Lower plate is fixed on bearing；Train wheel bridge and lower plate are equivalently-sized square plate；Train wheel bridge
Center offers square opening；Center, lower plate upper surface offers steel net template
Groove, center, lower surface offer lower square opening；Lower square opening and steel net template groove communicate；
Upper square opening with under square hole dimension identical；Steel net template groove size be more than under square hole dimension；
Lower plate is fixed with four cylinders on four angles straight up；Described train wheel bridge is fixed on four gas
On the piston rod of cylinder；
Chip container is the cuboid offering rectangular channel；
Steel net template is placed in the steel net template groove of lower plate；
Screening plate size is equivalently-sized with upper square opening.
Preferred as technique scheme, the length and width size of the rectangular channel of chip container and core
The length and width of sheet are equivalently-sized.
Preferred as technique scheme, the groove depth of the rectangular channel of chip container is less than chip
Thickness.
Preferred as technique scheme, the groove depth of steel net template groove and the thickness of steel net template
Identical.
Preferred as technique scheme, hides orifice plate and matches with chip kind, hides orifice plate and offers
The first hole corresponding with chip welding spot, the first hole and steel net template offer part the second hole phase
Corresponding.
The beneficial effects of the utility model are: chip lift unit can be wanted according to different chips
Seek the spacing making chip certain with steel net template holding, hide orifice plate and be the most effectively blinded by steel mesh mould
The hole that on plate, some are useless, follow-up soldered ball of placing fast and effectively, locking can be made simultaneously
Or operating time of unclamping steel net template is shorter, operates easier, production efficiency is higher.
Accompanying drawing illustrates:
Fig. 1 is the cross-sectional view faced of the present utility model；
Fig. 2 is the structural representation of vertical view of the present utility model；
Fig. 3 is the structural representation of the vertical view of steel net template 40 of the present utility model；
Fig. 4 is the structural representation of screening orifice plate 50 of the present utility model；
In figure, 10, frame；11, frame body；12, fixed plate；13, guide rod；20、
Steel net template fixture；21, bearing；22, lower plate；221, piston；223, steel net template
Groove；224, lower square opening；23, train wheel bridge；231, upper square opening；30, chip promotes dress
Put；31, seat is supported；32, central shaft；33, the first worm screw；34, center transmission block；35、
First threaded rod；36, chip placement unit；361, chip container；40, steel net template；
41, the second hole；50, orifice plate is hidden；51, the first hole.
Detailed description of the invention:
As shown in Figure 1 and Figure 2, this utility model provides a kind of planting for bga chip
Ball instrument, including chip, steel net template 40, hides orifice plate 50, frame 10, steel net template folder
Tool 20 and chip lifting device 30；Frame 10 includes that inside offers the frame in vacant chamber originally
Body 11；Frame 10 inner transverse is provided with fixed plate 12；Frame 10 upper surface is vertically fixed
Some guide rods 13；
As shown in Figure 1 and Figure 2, chip lifting device 30 includes that the first worm screw 33, center pass
Pass block 34 and the first threaded rod 35；Fixed plate 12 upper surface is vertically fixed a pair support seat
31；First worm screw 33 is longitudinally articulated on support seat 31 by central shaft 32；Center is transmitted
Block 34 top be cylinder, bottom be worm gear；Center transmission block 34 forms and passes through from top to down
The screwed hole worn；Center transmission block 34 top by bearing hinge joint frame 10 upper side wall, under
Portion engages with the first worm screw 33；First threaded rod 35 is vertically screwed onto center transmission block 34
In screwed hole；First threaded rod 35 lower end passes fixed plate 12；First threaded rod 35 upper end
It is bolted with chip placement unit 36；Chip placement unit 36 includes chip container 361 and the end
Seat；Described chip container 361 is fixed on base upper end；Base by the cylinder ring body of top and
Lower circular plate is connected and forms；Described circular slab center is screwed onto on the first threaded rod 35, circle
Circumferential edges is plugged on guide rod 13；
As shown in Figure 1 and Figure 2, steel net template fixture 20 includes bearing 21, train wheel bridge 23 and
Lower plate 22；Bearing 21 is made up of some pillars；Lower plate 22 is fixed on bearing 21；
Train wheel bridge 23 and lower plate 22 are equivalently-sized square plate；Train wheel bridge 23 center is opened
It is provided with square opening 231；Center, lower plate 22 upper surface offer steel net template groove 223,
Center, lower surface offers lower square opening 224；Lower square opening 224 and steel net template groove 223
Communicate；Upper square opening 231 and lower square opening 224 are equivalently-sized；Steel net template groove 223 size
More than lower square opening 224 size；Lower plate is fixed with four gas on 22 4 angles straight up
Cylinder；Described train wheel bridge 23 is fixed on the piston rod 221 of four cylinders；
As shown in Figure 1 and Figure 2, chip container 361 is the cuboid offering rectangular channel；
As shown in Figure 1 and Figure 2, steel net template 40 is placed on the steel net template groove of lower plate 22
In 223；
As shown in Figure 1 and Figure 2, the equivalently-sized of orifice plate 50 size and upper square opening 231 is hidden.
As shown in Figure 1 and Figure 2, the length and width size of the rectangular channel of chip container 361 and chip
Length and width equivalently-sized.
As shown in Figure 1 and Figure 2, the groove depth of the rectangular channel of chip container 361 is less than chip
Thickness.
As shown in Figure 1 and Figure 2, the groove depth of steel net template groove 223 and the thickness of steel net template 40
Spend identical.
As shown in Figure 3, Figure 4, hide orifice plate 50 and match with chip kind, hide orifice plate 50 and offer
The first hole 51 corresponding with chip welding spot, the first hole 51 and steel net template 40 offer portion
Divide the second hole 41 corresponding.
During concrete operations, the work planting ball instrument for bga chip described in the utility model
Flow process is as follows:
The first step, is positioned over bga chip to be processed in chip container 361；
Second step, pin size and spacing according to bga chip to be processed select properly
Steel net template 40, the mesh of steel net template needs slightly larger than Diameter of Solder Ball；
3rd step, starts cylinder simultaneously and drives train wheel bridge 23 to move downward by piston rod 221,
Steel net template 40 is clamped together with lower plate 22；
4th step, motor or manual drive central shaft 32, central shaft 32 drives the first worm screw
33, the first worm screw 33 drives center transmission block 34 to rotate, and center transmission block 34 drives first
Threaded rod 35 rotates, and the first threaded rod 35 makes chip placement unit 36 upwards transport along guide rod 13
Dynamic, i.e. bga chip moves upward；Bga chip rises to distance steel net stencil 40 about
The distance of individual Diameter of Solder Ball, is preferred with 0.8～1.2 times of Diameter of Solder Ball；
5th step, because containing more mesh array, by BGA to be processed on steel net template 40
After the mesh array alignment that chip is corresponding, put in square opening 231 hiding orifice plate 50,
Then soldered ball is poured in screening orifice plate 50 first hole 51, makes soldered ball fall into BGA to be processed
Solder joint on chip, so can avoid soldered ball to enter in the hole of inaccurate butt welding point, it is to avoid soldered ball
Waste and pollution；
6th step, puts into reflow ovens by the whole ball instrument of planting for bga chip or is reprocessing
Welding of heating is carried out above platform；
7th step, after having welded, motor or manual drive central shaft 32 counter-rotating,
Chip placement unit 36 is promoted to decline, by bga chip to be processed from chip container 361
In take off.
Above content is only better embodiment of the present utility model, for the common skill of this area
Art personnel, according to thought of the present utility model, the most all can
Change part, and this specification content should not be construed as restriction of the present utility model.
Claims (5)
1. one kind for bga chip plant ball instrument, it is characterised in that: include chip, steel
Net stencil (40), screening orifice plate (50), frame (10), steel net template fixture (20) and core
Sheet lifting device (30)；Frame (10) includes that inside offers the frame body (11) in vacant chamber；
Frame (10) inner transverse is provided with fixed plate (12)；Frame (10) upper surface is vertically solid
Fixed some guide rods (13)；
Chip lifting device (30) include the first worm screw (33), center transmission block (34) and
First threaded rod (35)；Fixed plate (12) upper surface is vertically fixed a pair support seat (31)；
First worm screw (33) is longitudinally articulated in support seat (31) by central shaft (32)；Center
Transmission block (34) top be cylinder, bottom be worm gear；Center transmission block (34) forms
The screwed hole run through from top to down；Bearing hinge joint is passed through in frame in transmission block (34) top, center
(10) upper side wall, bottom are engaged with the first worm screw (33)；First threaded rod (35) is vertical
It is screwed onto in the screwed hole at center transmission block (34)；First threaded rod (35) lower end is through solid
Determine plate (12)；First threaded rod (35) upper end is bolted with chip placement unit (36)；Chip
Placement unit (36) includes chip container (361) and base；Described chip container (361)
It is fixed on base upper end；Base is connected is formed by cylinder ring body and the lower circular plate of top；Institute
State circular slab center and be screwed onto that the first threaded rod (35) is upper, circumferential edges is plugged in guide rod (13)
On；
Steel net template fixture (20) includes bearing (21), train wheel bridge (23) and lower plate (22)；
Bearing (21) is made up of some pillars；Lower plate (22) is fixed on bearing (21)；On
Clamping plate (23) and lower plate (22) are equivalently-sized square plate；Train wheel bridge (23) center
Position offers square opening (231)；Lower plate (22) center, upper surface offers steel
Net stencil groove (223), center, lower surface offer lower square opening (224)；Lower square opening
(224) communicate with steel net template groove (223)；Upper square opening (231) and lower square opening (224)
Equivalently-sized；Steel net template groove (223) size is more than lower square opening (224) size；Lower folder
Plate is fixed with four cylinders on (22) four angles straight up；Described train wheel bridge (23) is fixed
On the piston rod (221) of four cylinders；
Chip container (361) is the cuboid offering rectangular channel；
Steel net template (40) is placed in the steel net template groove (223) of lower plate (22)；
Screening orifice plate (50) size is equivalently-sized with upper square opening (231).
The most according to claim 1 a kind of planting ball instrument for bga chip, it is special
Levy and be: the length and width size of the rectangular channel of chip container (361) and the length and width size of chip
Identical.
The most according to claim 1 a kind of planting ball instrument for bga chip, it is special
Levy and be: the groove depth of the rectangular channel of chip container (361) is less than the thickness of chip.
The most according to claim 1 a kind of planting ball instrument for bga chip, it is special
Levy and be: the groove depth of steel net template groove (223) is identical with the thickness of steel net template (40).
The most according to claim 1 a kind of planting ball instrument for bga chip, it is special
Levy and be: hide orifice plate (50) and match with chip kind, hide the first hole that orifice plate (50) is offered
(51) corresponding with chip welding spot, the first hole (51) and steel net template (40) offer portion
Divide the second hole (41) corresponding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620423523.1U CN205609476U (en) | 2016-05-10 | 2016-05-10 | A plant ball instrument for BGA chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620423523.1U CN205609476U (en) | 2016-05-10 | 2016-05-10 | A plant ball instrument for BGA chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205609476U true CN205609476U (en) | 2016-09-28 |
Family
ID=56966755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620423523.1U Expired - Fee Related CN205609476U (en) | 2016-05-10 | 2016-05-10 | A plant ball instrument for BGA chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205609476U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870027A (en) * | 2016-05-10 | 2016-08-17 | 付淑珍 | Ball mounting tool for BGA chips |
-
2016
- 2016-05-10 CN CN201620423523.1U patent/CN205609476U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870027A (en) * | 2016-05-10 | 2016-08-17 | 付淑珍 | Ball mounting tool for BGA chips |
| CN105870027B (en) * | 2016-05-10 | 2018-05-11 | 海门市卓维纺织品有限公司 | A kind of plant ball instrument for bga chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Tan Haiping Inventor before: Fu Shuzhen |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170712 Address after: 528400, Zhongshan, Guangdong Province, Longjing South Road, No. 3, set up Yin pioneering creative technology building, room 902 Patentee after: Zhongshan Cheng Jun Technology Co., Ltd. Address before: 528000 Foshan, China, Guicheng, South China Sea in the summer of the East and West will be surrounded by industrial zone Zijin City business center, building 2, building Patentee before: Fu Shuzhen |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160928 Termination date: 20200510 |