CN205324924U - Be used for circuit board through -hole welding set - Google Patents
Be used for circuit board through -hole welding set Download PDFInfo
- Publication number
- CN205324924U CN205324924U CN201620073421.1U CN201620073421U CN205324924U CN 205324924 U CN205324924 U CN 205324924U CN 201620073421 U CN201620073421 U CN 201620073421U CN 205324924 U CN205324924 U CN 205324924U
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- CN
- China
- Prior art keywords
- template
- welding
- wiring board
- hole
- mozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model belongs to the technical field of the welding of circuit board through -hole, one kind in particular to is used for circuit board through -hole welded devices and methods therefor, including solder paste printing machine, pressure roller bearing, location frame and welding template, the pressure roller bearing with the location frame all set up in solder paste printing machine, welding template correspondence set up in location frame top, welding template correspondence set up in the below of pressure roller bearing, the welding template include the template and inlay in the honeycomb duct of template. Above -mentioned device simple structure, convenient operation adopt its welding will reduce the welding cost by a wide margin, improve the direct rate of welding.
Description
Technical field
This utility model belongs to wiring board through hole welding technology field, particularly to a kind of device for the welding of wiring board through hole。
Background technology
At present, in electronics manufacturing, it is often necessary to substantial amounts of electronic devices and components are fixing in the circuit board by through hole welding procedure。Currently used through hole welding procedure is mainly wave soldering and human assistance welding。The advantage of these current through hole welding process flows is in that Joint Strength is big and is applicable to batch production, but its shortcoming is in that surface mount and through hole welding must be separately performed, wiring board difficulty of processing for double-sided belt surface mount elements is very big, but also there is many defects such as energy consumption is relatively big, solder oxidation is fast。
Along with the progress of technology, also developing selectivity wave soldering processes in this field, it is more compatible for being suitable for of double-sided wiring board, also alleviates power consumption to a certain extent。Specifically, in selectivity wave soldering processes, by device programming device, whole wiring board can be completed scaling powder spraying by scaling powder spraying module, after the preheating of preheated module, then is completed to weld to each solder joint pointwise by welding module。But adopting this technique, its equipment used costly, makes many enterprises hang back。
Utility model content
The purpose of this utility model is in that: for the deficiencies in the prior art, and provides a kind of for wiring board through hole welder, and this apparatus structure is simple, easy to operate, adopts its welding that welding cost will be greatly reduced, and improves welding first-pass yield。
For achieving the above object, the technical solution of the utility model is:
A kind of for wiring board through hole welder, including stencil printer, pressure roller, positioning framework and welding template, described pressure roller and described positioning framework may be contained within described stencil printer, described welding template is correspondingly arranged in above described positioning framework, described welding template is correspondingly arranged in the lower section of described pressure roller, and described welding template includes template and is embedded in the mozzle of described template。Said apparatus simple in construction, easy to operate, adopt its welding that welding cost will be greatly reduced, improve and weld first-pass yield。
As a kind of improvement for wiring board through hole welder described in the utility model, shape of through holes and the size of described mozzle and wiring board match。
As a kind of improvement for wiring board through hole welder described in the utility model, described mozzle is set to hollow circular configuration or hollow ellipse structure。
As a kind of improvement for wiring board through hole welder described in the utility model, the thickness of described template is 1 ~ 4mm。
As a kind of improvement for wiring board through hole welder described in the utility model, the thickness of described template is 3mm。
As a kind of improvement for wiring board through hole welder described in the utility model, described positioning framework is provided with the detent for placing wiring board。
As a kind of improvement for wiring board through hole welder described in the utility model, one end of described mozzle is fair with the top of described template, and the other end of described mozzle stretches out in the bottom of described template。
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model。
Detailed description of the invention
Below in conjunction with specific embodiment and Figure of description, this utility model is described in further detail, but embodiment of the present utility model is not limited to this。
As shown in Figure 1, a kind of for wiring board through hole welder, including stencil printer 1, pressure roller 2, positioning framework 3 and welding template 4, pressure roller 2 and positioning framework 3 may be contained within stencil printer 1, welding template 4 is correspondingly arranged in above positioning framework 3, welding template 4 is correspondingly arranged in the lower section of pressure roller 2, welding template 4 includes template 41 and is embedded in the mozzle 42 of template 41, the present embodiment directly can also hollow out in template 41, replace the function of mozzle 42, so can save cost。The positioning framework 3 of the supporting corresponding product size of above-mentioned welding template 4, by the pressure of pressure roller 2 by tin cream water conservancy diversion to wiring board via pad, thus realizing the purpose of welding。
Preferably, shape of through holes and the size of mozzle 42 and wiring board match, because the through-hole structure of the wiring board of different size is different, so to meet welding procedure, it is necessary for allowing the shape of through holes of mozzle 42 and wiring board and size match, thus realizing effective note stannum and welding。Mozzle 42 is set to hollow circular configuration or hollow ellipse structure, is conducive to improving the mobility of tin cream so that tin cream can quickly be covered with through hole。
Preferably, template 41 is made of copper, and the thickness of template 41 is 1 ~ 4mm, and the thickness of the template 41 of the present embodiment is 3mm, meets general welding process requirement。One end of mozzle 42 is fair with the top of template 41 so that the top of template 41 is a plane, is conducive to pressure roller 2 to carry out rolling printing；The other end of mozzle 42 stretches out in the bottom of template 41, and exceed the length of mozzle 1/42nd 2, the reason so arranged is in that: having components and parts after carrying out paster technique, mozzle 42 stretches out in the bottom of template 41, is conducive to reserving space and avoids components and parts height。
Preferably, positioning framework 3 is provided with the detent 31 for placing wiring board, can also be equiped with positioning fixture, for fixing circuit board in detent 31。
Use said apparatus for wiring board through hole welding method, comprise the following steps:
A, make corresponding welding template 4 according to wiring board, then wiring board is placed on positioning framework 3 and positions, adjust welding template 4 and make itself and wiring board para-position；
Passing through stencil printer 1 note stannum after B, the tin cream detection that will match to welding template 4, then tin cream flows on the corresponding through hole of wiring board again through the mozzle 42 welding template 4；
C, solder is released in corresponding through hole welding position by mozzle 42, then inserts components and parts at lead to the hole site；
D, finally by Reflow Soldering/infrared ray, through hole and components and parts are welded。
In said method use tin cream need according to printing stencil adjust viscosity, batch use time viscosity is detected, it is ensured that tin cream meets technological requirement。Directly encourage tin cream by above-mentioned through hole welding method and be released on through hole welding position, then weld again through the hot blast noncontact of Reflow Soldering, therefore can obtain the welding quality of SMD welding procedure, fraction defective is greatly decreased, improve utilization rate of equipment and installations and cost puts into。
The announcement of book and instruction according to the above description, above-mentioned embodiment can also be modified and revise by this utility model those skilled in the art。Therefore, this utility model is not limited to above-mentioned detailed description of the invention, and any conspicuously improved, replacement or modification that every those skilled in the art are done on basis of the present utility model belong to protection domain of the present utility model。Although additionally, employ some specific terms in this specification, but these terms are intended merely to convenient explanation, this utility model are not constituted any restriction。
Claims (7)
1. one kind is used for wiring board through hole welder, it is characterized in that: include stencil printer, pressure roller, positioning framework and welding template, described pressure roller and described positioning framework may be contained within described stencil printer, described welding template is correspondingly arranged in above described positioning framework, described welding template is correspondingly arranged in the lower section of described pressure roller, and described welding template includes template and is embedded in the mozzle of described template。
2. according to claim 1 for wiring board through hole welder, it is characterised in that: shape of through holes and the size of described mozzle and wiring board match。
3. according to claim 1 for wiring board through hole welder, it is characterised in that: described mozzle is set to hollow circular configuration or hollow ellipse structure。
4. according to claim 1 for wiring board through hole welder, it is characterised in that: the thickness of described template is 1 ~ 4mm。
5. according to claim 4 for wiring board through hole welder, it is characterised in that: the thickness of described template is 3mm。
6. according to claim 1 for wiring board through hole welder, it is characterised in that: described positioning framework is provided with the detent for placing wiring board。
7. according to claim 1 for wiring board through hole welder, it is characterised in that: one end of described mozzle is fair with the top of described template, and the other end of described mozzle stretches out in the bottom of described template。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620073421.1U CN205324924U (en) | 2016-01-26 | 2016-01-26 | Be used for circuit board through -hole welding set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620073421.1U CN205324924U (en) | 2016-01-26 | 2016-01-26 | Be used for circuit board through -hole welding set |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205324924U true CN205324924U (en) | 2016-06-22 |
Family
ID=56319428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620073421.1U Expired - Fee Related CN205324924U (en) | 2016-01-26 | 2016-01-26 | Be used for circuit board through -hole welding set |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205324924U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105562866A (en) * | 2016-01-26 | 2016-05-11 | 东莞市先飞电子材料有限公司 | Through-hole welding device and method for circuit board |
-
2016
- 2016-01-26 CN CN201620073421.1U patent/CN205324924U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105562866A (en) * | 2016-01-26 | 2016-05-11 | 东莞市先飞电子材料有限公司 | Through-hole welding device and method for circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160622 Termination date: 20200126 |