CN205566802U - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN205566802U CN205566802U CN201620133753.4U CN201620133753U CN205566802U CN 205566802 U CN205566802 U CN 205566802U CN 201620133753 U CN201620133753 U CN 201620133753U CN 205566802 U CN205566802 U CN 205566802U
- Authority
- CN
- China
- Prior art keywords
- pad
- paster
- circuit board
- paster pad
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000003466 welding Methods 0.000 claims abstract description 16
- 238000009826 distribution Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- 238000012423 maintenance Methods 0.000 abstract description 4
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a circuit board, three patch welding pads on the surface of the circuit board; the patch bonding pad comprises a first bonding pad and a second bonding pad; and a gap is formed between the first bonding pad and the second bonding pad, and solder mask oil is filled in the gap to form a solder mask bridge. Adopt the utility model discloses can install the paster component that adopts different pad standards on the circuit board, practice thrift the panel space. Simultaneously, use solder mask oil to separate between the second pad that is used for installing the first pad of first paster component and is used for installing the second paster component, avoid the emergence of bad phenomena such as component skew, tombstone and empty welding that big small pad directly superposes and causes, be favorable to reducing technology and quality risk, reduce cost of maintenance.
Description
Technical field
The utility model relates to electronic technology field, particularly relates to a kind of circuit board.
Background technology
PCB (Printed Circuit Board, printed circuit board) encapsulation refers to actual electronic devices and components, core
Various parameters (size of such as components and parts, length and width, straight cutting, paster, the size of pad, the pin of sheet etc.
Length and width, spacing etc.) graphically show, in order to can call when making pcb board.
For high pressure paster metal-oxide-semiconductor (metal oxide semiconductor), owing to different clients is to temperature
Rising and pressure requirement differs, in order to avoid there is polylith in the encapsulation specification difference of the metal-oxide-semiconductor of use
Board, therefore need on same board, to use the metal-oxide-semiconductor replaced mutually, when the weldering of different size metal-oxide-semiconductor
When existing overlapping between dish, existing solution mainly have separated (such as Fig. 1) or simple superposition (as
Fig. 2).
As it is shown in figure 1, according to separated method, the pad A and the 2nd MOS of the first metal-oxide-semiconductor
The pad B of pipe needs separated in PCB C, it is clear that can take substantial amounts of space, cause board
The waste in space, also affects electric property.
As in figure 2 it is shown, according to the method for simple superposition, the pad A and the 2nd MOS of the first metal-oxide-semiconductor
The pad B of pipe is direct superposition in PCB C, causes the pad needed for device and the reality on board
Pad does not mates, and generating element skew after being greatly increased solder reflow, sets up a monument and the bad phenomenon such as missing solder
Probability, increases maintenance cost, affects the quality of subsequent product.
Utility model content
The purpose of this utility model is, it is provided that a kind of circuit board, reduces taking of board space, reduces weldering
Generating element skew after tin backflow, set up a monument and the probability of the bad phenomenon such as missing solder.
A kind of circuit board that the utility model embodiment provides, the plate face of described circuit board is provided with three patches
Sheet pad；
Each paster pad includes the first pad and the second pad；
Having gap between described first pad and described second pad, described gap is filled with welding resistance oil, shape
Become welding resistance bridge.
Preferably, described three paster pads are respectively the first paster pad, the second paster pad and the 3rd patch
Sheet pad；
The area of described second paster pad and the area equation of described 3rd paster pad；
Described in the area ratio of described first paster pad, the area of the second paster pad is big.
Preferably, described second paster pad and described 3rd paster pad specular distribution；
Described first paster pad is centrally located at the right of described second paster pad and described 3rd paster pad
Claim on axle.
Preferably, the first pad of described first paster pad in " recessed " shape, described first paster pad
Second pad is rectangular, and the second pad of described first paster pad is arranged at the opening of described " recessed " shape
Position.
Preferably, the first pad of described second paster pad is L-shaped, the of described second paster pad
The two rounded rectangles of pad, and the second pad of described second paster pad is arranged at the opening of described " L " shape
Position.
Preferably, described welding resistance oil is green oil.
Preferably, the second pad of the first pad of described first paster pad and described first paster pad it
Between gap length be 0.5 millimeter.
Preferably, the second pad of the first pad of described second paster pad and described second paster pad it
Between gap length be 0.15 millimeter.
The circuit board that the utility model embodiment provides, arranges three paster pads on pcb board face, each
The first pad and the second pad using different size it is respectively provided with again on paster pad, can be at described circuit board
The upper surface mount elements using different pad standards of installing, saving sheet material space.Meanwhile, for installing the first patch
Welding resistance oil is used to separate between first pad and second pad being used for installation the second surface mount elements of piece element,
Avoid Component Displacement that the direct superposition of size pad causes, set up a monument and the generation of the bad phenomenon such as missing solder, favorably
In reducing technique and quality risk, reduce maintenance cost.
Accompanying drawing explanation
Fig. 1 is the structural representation using separated method that prior art provides；
Fig. 2 is the structural representation of the employing simple superposition method that prior art provides；
Fig. 3 is the structural representation of an embodiment of the circuit board that the utility model provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the utility model embodiment, to the technical side in the utility model embodiment
Case is clearly and completely described.
See Fig. 3, be the structural representation of an embodiment of the circuit board that the utility model provides.
It is provided with three paster pads 1,2 and 3 on the plate face P1 of described circuit board.
Each paster pad include the first pad (1_1,2_1 or 3_1) and the second pad (1_2,2_2 or
3_2)。
Having gap 4 between described first pad and described second pad, described gap 4 is filled with welding resistance oil,
Form welding resistance bridge.
Described three paster pads are respectively the first paster pad the 1, second paster pad 2 and the 3rd paster pad
3。
In figure, dotted line is the housing silk-screen of surface mount elements.
The area of described second paster pad 2 and the area equation of described 3rd paster pad 3.
Described in the area ratio of described first paster pad 1, the area of the second paster pad 2 is big.
Preferably, for ensureing surface mount elements left-right balance in welding process, described second paster pad 2 with
Described 3rd paster pad 3 specular distribution.
Described first paster pad 1 is centrally located at described second paster pad 2 and described 3rd paster pad 3
Mirror axis on.
First pad 1_1 of described first paster pad 1 in " recessed " shape, described first paster pad 1
Second pad 1_2 is rectangular, and the second pad 1_2 of described first paster pad 1 is arranged at described " recessed "
The aperture position of shape.
First pad 2_1 of described second paster pad 2 is L-shaped, the of described second paster pad 2
The two rounded rectangles of pad 2_2, and the second pad 2_2 of described second paster pad 2 is arranged at described " L "
The aperture position of shape.
Described welding resistance oil is preferably green oil, the first pad 1_1 and described first of described first paster pad 1
Gap length between second pad 1_2 of paster pad 1 is preferably 0.5 millimeter.Described second paster pad
Gap length between the first pad 2_1 and the second pad 2_2 of described second paster pad 2 of 2 is preferably
0.15 millimeter.Described 3rd paster pad 3 and described second paster pad 2 specular, the most described
Between between the first pad 3_1 and the second pad 3_2 of described 3rd paster pad 3 of three paster pads 3
Gap size is preferably also 0.15 millimeter.
Three paster pads on described circuit board are for installing the surface mount elements of three pins, described surface mount elements
Being preferably small one and large one two paster metal-oxide-semiconductors, described first paster pad 1 is for welding metal-oxide-semiconductor
Drain electrode, described second paster pad 2 is for welding the grid of metal-oxide-semiconductor, and described 3rd paster pad 3 is used for
Connect the source electrode of metal-oxide-semiconductor.In the middle of being embodied as, can be the most first by the weldering of big paster metal-oxide-semiconductor
Dish is worked it out, then the part that big paster metal-oxide-semiconductor need to weld with little paster metal-oxide-semiconductor body is respectively made independence
Paste layer and Solder layer design on aforementioned pad, centre green oil separates, to prevent when the little patch of use
During sheet metal-oxide-semiconductor, component's feet is adsorbed on the surface of PCB by solder reflow, because of compatible pad too big with
Little surface mount elements does not mates, and causes Component Displacement, and pulling of effect of expanding with heat and contract with cold causes element to be raised,
Device is caused to set up a monument.
In sum, the circuit board that the utility model provides, pcb board face arranges three paster pads,
The first pad and the second pad using different size it is respectively provided with again on each paster pad, can be at described electricity
The surface mount elements using different pad standards is installed on the plate of road, saves sheet material space.Meanwhile, for installation
First pad of one surface mount elements and use between the second pad installing the second surface mount elements welding resistance oil every
Open, it is to avoid Component Displacement that the direct superposition of size pad causes, set up a monument and the generation of the bad phenomenon such as missing solder,
Advantageously reduce technique and quality risk, reduce maintenance cost.
The above is preferred embodiment of the present utility model, it is noted that general for the art
For logical technical staff, on the premise of without departing from the utility model principle, it is also possible to make some improvement and
Retouching, these improvements and modifications are also considered as protection domain of the present utility model.
Claims (8)
1. a circuit board, it is characterised in that be provided with three paster pads on the plate face of described circuit board；
Each paster pad includes the first pad and the second pad；
Having gap between described first pad and described second pad, described gap is filled with welding resistance oil, shape
Become welding resistance bridge.
2. circuit board as claimed in claim 1, it is characterised in that described three paster pads are respectively the
One paster pad, the second paster pad and the 3rd paster pad；
The area of described second paster pad and the area equation of described 3rd paster pad；
Described in the area ratio of described first paster pad, the area of the second paster pad is big.
3. circuit board as claimed in claim 2, it is characterised in that described second paster pad and described the
Three paster pad specular distributions；
Described first paster pad is centrally located at the right of described second paster pad and described 3rd paster pad
Claim on axle.
4. circuit board as claimed in claim 3, it is characterised in that the first weldering of described first paster pad
Dish is in " recessed " shape, and the second pad of described first paster pad is rectangular, and described first paster pad
Second pad is arranged at the aperture position of described " recessed " shape.
5. circuit board as claimed in claim 4, it is characterised in that the first weldering of described second paster pad
Dish is L-shaped, the second rounded rectangle of pad of described second paster pad, and described second paster pad
The second pad be arranged at the aperture position of described " L " shape.
6. the circuit board as described in any one of Claims 1 to 5, it is characterised in that described welding resistance oil is green oil.
7. the circuit board as described in any one of claim 2～5, it is characterised in that described first paster pad
The first pad and the second pad of described first paster pad between gap length be 0.5 millimeter.
8. the circuit board as described in any one of claim 7, it is characterised in that described second paster pad
Gap length between second pad of the first pad and described second paster pad is 0.15 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620133753.4U CN205566802U (en) | 2016-02-22 | 2016-02-22 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620133753.4U CN205566802U (en) | 2016-02-22 | 2016-02-22 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205566802U true CN205566802U (en) | 2016-09-07 |
Family
ID=56818755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620133753.4U Active CN205566802U (en) | 2016-02-22 | 2016-02-22 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205566802U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106358365A (en) * | 2016-11-28 | 2017-01-25 | 深圳天珑无线科技有限公司 | Semifinished product circuit board, leaf spring circuit board and contact pin circuit board |
| CN109890146A (en) * | 2019-02-14 | 2019-06-14 | 广州京写电路板有限公司 | A kind of production method that printed circuit board is used in small component attachment |
-
2016
- 2016-02-22 CN CN201620133753.4U patent/CN205566802U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106358365A (en) * | 2016-11-28 | 2017-01-25 | 深圳天珑无线科技有限公司 | Semifinished product circuit board, leaf spring circuit board and contact pin circuit board |
| CN109890146A (en) * | 2019-02-14 | 2019-06-14 | 广州京写电路板有限公司 | A kind of production method that printed circuit board is used in small component attachment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |