CN204968232U - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN204968232U CN204968232U CN201520621396.1U CN201520621396U CN204968232U CN 204968232 U CN204968232 U CN 204968232U CN 201520621396 U CN201520621396 U CN 201520621396U CN 204968232 U CN204968232 U CN 204968232U
- Authority
- CN
- China
- Prior art keywords
- base plate
- metal layer
- circuit board
- metal
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a circuit board, it includes a line base plate, it is double -phase to the first metal layer on the surface and second metal level formed at this line base plate respectively, reach the tin cream layer and reinforcement piece of keeping away from one side of this line base plate in proper order formed at the first region of this the first metal layer, this circuit board still includes an at least mounting hole, this mounting hole runs through this reinforcement piece, the tin cream layer, the first metal layer, line base plate and second metal level, this circuit board still includes the electrically conductive hole of at least one electricity this the first metal layer of connection and second metal level, this mounting hole is including being located the first portion in this line base plate's region and being located this the first metal layer, the second portion in the region of tin cream layer and reinforcement piece, the aperture of this first portion is less than aperture and the axial lead of this first portion and the axial lead coincidence of this second portion of this second portion, should electrically conductive hole along the second area that does not form the reinforcement piece of the first metal layer, the range upon range of direction of line base plate and second metal level is seted up, and set up with this tin cream layer interval.
Description
Technical field
The utility model relates to a kind of circuit board.
Background technology
Usually offer the installing hole running through this circuit board in existing circuit board, it is for being installed on this circuit board in electronic installation by securing member (as screw etc.).The hole wall of such installing hole is formed with the coat of metal usually, in order to be electrically connected each conductive circuit layer in this circuit board.In order to the intensity of intensifier circuit plate, be usually also provided with stainless steel reinforcing chip on circuit boards, it is connected on circuit board by tin cream when welding.But, because tin cream is larger in metal surface mobility, make its weld heat up time easy overflow to installing hole in thus affect the use of installing hole, even to pass installing hole overflow and pollute this circuit board to circuit board away from the surface of stainless steel reinforcing chip, and then affect circuit board performance.
Utility model content
In view of this, be necessary to provide a kind of circuit board, can the problems referred to above be avoided.
A kind of circuit board, it comprises a circuit base plate, be formed at the first metal layer on this circuit base plate two apparent surface and the second metal level respectively, be formed at the reinforcing chip of first area away from the side of this circuit base plate of this first metal layer, and the tin paste layer be connected between this first metal layer and reinforcing chip, this circuit board also comprises at least one along this reinforcing chip, tin paste layer, the first metal layer, the installing hole that circuit base plate and the second metal level stacked direction are offered, this installing hole runs through this reinforcing chip, tin paste layer, the first metal layer, circuit base plate and the second metal level, this circuit board also comprises the conductive hole of this first metal layer of at least one electrical connection and the second metal level, this installing hole comprises the Part I in the region being positioned at this circuit base plate and is positioned at this first metal layer, the Part II in the region of tin paste layer and reinforcing chip, the aperture of this Part I is less than the aperture of this Part II and the axial line of this Part I overlaps with the axial line of this Part II, this conductive hole is along the second area not forming reinforcing chip of the first metal layer, the stacked direction of circuit base plate and the second metal level is offered, and and this tin paste layer interval arrange.
Preferably, this conductive hole comprises a through hole and is formed at the coat of metal on this through hole hole wall, and this through hole runs through the first area of this first metal layer, circuit base plate and the second metal level.
Preferably, this first metal layer offers at least one spacer region, this spacer region between this first area and conductive hole, with avoid tin paste layer weld heat up time along the first metal layer overflow in conductive hole.
Preferably, the material of this reinforcing chip is stainless steel.
A kind of circuit board, it comprises a circuit base plate, be formed at the first metal layer on this circuit base plate two apparent surface and the second metal level respectively, be formed at the reinforcing chip of first area away from the side of this circuit base plate of this first metal layer, and the tin paste layer be connected between this first metal layer and reinforcing chip, this circuit board also comprises at least one along this reinforcing chip, tin paste layer, the first metal layer, the installing hole that circuit base plate and the second metal level stacked direction are offered, this installing hole runs through this reinforcing chip, tin paste layer, the first metal layer, circuit base plate and the second metal level, this circuit board also comprises the conductive hole of this first metal layer of at least one electrical connection and the second metal level, this installing hole comprises the Part I in the region being positioned at this circuit base plate and is positioned at this first metal layer, the Part II in the region of tin paste layer and reinforcing chip, the aperture of this Part I is less than the aperture of this Part II and the axial line of this Part I overlaps with the axial line of this Part II, this conductive hole only runs through this circuit base plate and the second metal level.
Preferably, this conductive hole to be formed on circuit base plate and the second metal level and to offering first area.
Preferably, this first metal layer also comprises the second area except this first area, and this conductive hole to be formed on circuit base plate and the second metal level and to offering by second area.
Preferably, the material of this reinforcing chip is stainless steel.
Circuit board of the present utility model, the aperture of the Part I of its installing hole is less than the aperture of this Part II, thus at the junction forming station terrace of circuit base plate and the first metal layer, its be conducive to stopping tin paste layer weld heat up time overflow to this mounting hole site on the region of this circuit base plate and then overflow to the second metal level.In addition, conductive hole and this tin paste layer interval arrange or only run through this circuit base plate and the second metal level is arranged, it is while electrical connection this this first metal layer and the second metal level, avoid tin paste layer when welding intensification in overflow to conductive hole so that overflow on the first metal layer.
Accompanying drawing explanation
Fig. 1 is the side structure schematic diagram of the circuit board of the utility model first execution mode.
Fig. 2 is the side structure schematic diagram of the circuit board of the utility model second execution mode.
Main element symbol description
| Circuit board | 100 |
| Circuit base plate | 10 |
| The first metal layer | 20 |
| First area | 21 |
| Second area | 23 |
| Spacer region | 25 |
| Second metal level | 30 |
| Reinforcing chip | 40 |
| Tin paste layer | 50 |
| Installing hole | 60 |
| Part I | 601 |
| Part II | 603 |
| Part III | 605 |
| Step surface | 613 |
| Conductive hole | 70 |
| Through hole | 71 |
| The coat of metal | 73、76 |
| Blind hole | 75 |
Following embodiment will further illustrate the utility model in conjunction with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1, the utility model provides a kind of circuit board 100, and it is applied in electronic installation (not shown), and this electronic installation can be mouse, mobile phone, panel computer etc.
This circuit board 100 comprises a circuit base plate 10, be formed at the first metal layer 20 on this circuit base plate 10 liang of apparent surfaces and the second metal level 30 respectively, be formed at the first area 21 of the first metal layer 20 away from the reinforcing chip 40 on the surface of circuit base plate 10 and the tin paste layer 50 that is connected between this first metal layer 20 and reinforcing chip 40.The first metal layer 20 surface also comprised except first area 21 does not form the second area 23 of reinforcing chip 40.This circuit base plate 10 can be single sided board, double sided board or multi-panel.The material of this first metal layer 20 and the second metal level 30 all can be selected from the one in copper, gold and nickel.The material of this reinforcing chip 40 is stainless steel.Be appreciated that this reinforcing chip 40 can also change other materials into as required.This tin paste layer 50, for spread upon on this first metal layer 20 by tin cream, then solidify to form after welding.
This circuit board 100 also comprises at least one installing hole 60 offered along the stacked direction of reinforcing chip 40, tin paste layer 50, the first metal layer 20, circuit base plate 10 and the second metal level 30.This installing hole 60 runs through this reinforcing chip 40, tin paste layer 50, the first metal layer 20, circuit base plate 10 and the second metal level 30, for being installed in electronic installation by this circuit board 100 by securing member (as screw etc.).This installing hole 60 comprises the Part I 601 in the region being positioned at this circuit base plate 10 and is positioned at the Part II 603 in region of this first metal layer 20, tin paste layer 50 and reinforcing chip 40, the aperture of this Part I 601 is less than the aperture of this Part II 603 and the axial line of this Part I 601 overlaps with the axial line of this Part II 603, namely the hole wall of this Part I 601 at least protrudes compared to the hole wall of this Part II 603 towards the axial line of this installing hole 60, thus at least forms a step surface 613 in the junction of circuit base plate 10 and the first metal layer 20.In welding process, this step surface 613 is conducive to stopping that tin paste layer 50 overflow heated up is on the hole wall of this Part I 601, and then stops on tin paste layer 50 overflow to the second metal level 30.This installing hole 60 also comprises the Part III 605 being positioned at this second metal level 30.In the present embodiment, the aperture of this Part I 601 is less than the aperture of this Part II 603 and the aperture of this Part III 605, namely forms a step surface 613 respectively at circuit base plate 10 and the junction of the first metal layer 20, second metal level 30.
This circuit board 100 also comprises at least one conductive hole 70, in order to be electrically connected this first metal layer 20 and the second metal level 30.In the first embodiment, this conductive hole 70 comprises a through hole 71 offered along the stacked direction of the second area 23 of the first metal layer 20, circuit base plate 10 and the second metal level 30 and the coat of metal 73 be formed on this through hole 71 hole wall, and this conductive hole 70 and tin paste layer 50 are at a distance of certain distance, with avoid tin paste layer 50 weld heat up time by conductive hole 70 overflow to the second metal level 30 to pollute this second metal level 30.In the first embodiment, the first metal layer 20 also can offer at least one spacer region 25 between first area 21 and conductive hole 70, this spacer region 25 can be contained in welding process and heat up and the tin paste layer 50 of overflow, thus avoids tin paste layer 50 along the first metal layer 20 overflow in conductive hole 70 further.
In this second embodiment, refer to Fig. 2, comprise a blind hole 75 offered along circuit base plate 10 and the second metal level 30 stacked direction and the coat of metal 76 be formed on this blind hole 75 hole wall with the first execution mode unlike, this conductive hole 70.This blind hole 75 only runs through this circuit base plate 10 and the second metal level 30, with avoid tin paste layer 50 weld heat up time by the first metal layer 20 overflow to conductive hole 70 in so that on overflow to the second metal level 30.In the present embodiment, this conductive hole 70 is formed at the position of the first area 21 of circuit base plate 10 and the corresponding the first metal layer 20 of the second metal level 30.Be appreciated that this conductive hole 70 can also be formed at the position of the second area 23 of circuit base plate 10 and the corresponding the first metal layer 20 of the second metal level 30.
Circuit board 100 of the present utility model, the aperture of the Part I 601 of its installing hole 60 is less than the aperture of this Part II 603, thus at least at the junction forming station terrace 613 of circuit base plate 10 and the first metal layer 20, its be conducive to stopping tin paste layer 50 weld heat up time overflow to this installing hole 60 region of being positioned at this circuit base plate 10 and the second metal level 30 and the second metal level 30 on.In addition, conductive hole 70 arranges at a distance of the certain distance of tin paste layer 50 or only runs through this circuit base plate 10 and the second metal level 30 is arranged, it is while electrical connection this this first metal layer 20 and the second metal level 30, avoid tin paste layer 50 when welding intensification by conductive hole 70 overflow on the first metal layer 20.
Claims (8)
1. a circuit board, it comprises a circuit base plate, be formed at the first metal layer on this circuit base plate two apparent surface and the second metal level respectively, be formed at the reinforcing chip of first area away from the side of this circuit base plate of this first metal layer, and the tin paste layer be connected between this first metal layer and reinforcing chip, this circuit board also comprises at least one along this reinforcing chip, tin paste layer, the first metal layer, the installing hole that circuit base plate and the second metal level stacked direction are offered, this installing hole runs through this reinforcing chip, tin paste layer, the first metal layer, circuit base plate and the second metal level, this circuit board also comprises the conductive hole of this first metal layer of at least one electrical connection and the second metal level, it is characterized in that: this installing hole comprises the Part I in the region being positioned at this circuit base plate and is positioned at this first metal layer, the Part II in the region of tin paste layer and reinforcing chip, the aperture of this Part I is less than the aperture of this Part II and the axial line of this Part I overlaps with the axial line of this Part II, this conductive hole is along the second area not forming reinforcing chip of the first metal layer, the stacked direction of circuit base plate and the second metal level is offered, and and this tin paste layer interval arrange.
2. circuit board as claimed in claim 1, is characterized in that: this conductive hole comprises a through hole and is formed at the coat of metal on this through hole hole wall, and this through hole runs through the first area of this first metal layer, circuit base plate and the second metal level.
3. circuit board as claimed in claim 2, it is characterized in that: this first metal layer offers at least one spacer region, this spacer region is between this first area and conductive hole.
4. circuit board as claimed in claim 1, is characterized in that: the material of this reinforcing chip is stainless steel.
5. a circuit board, it comprises a circuit base plate, be formed at the first metal layer on this circuit base plate two apparent surface and the second metal level respectively, be formed at the reinforcing chip of first area away from the side of this circuit base plate of this first metal layer, and the tin paste layer be connected between this first metal layer and reinforcing chip, this circuit board also comprises at least one along this reinforcing chip, tin paste layer, the first metal layer, the installing hole that circuit base plate and the second metal level stacked direction are offered, this installing hole runs through this reinforcing chip, tin paste layer, the first metal layer, circuit base plate and the second metal level, this circuit board also comprises the conductive hole of this first metal layer of at least one electrical connection and the second metal level, it is characterized in that: this installing hole comprises the Part I in the region being positioned at this circuit base plate and is positioned at this first metal layer, the Part II in the region of tin paste layer and reinforcing chip, the aperture of this Part I is less than the aperture of this Part II and the axial line of this Part I overlaps with the axial line of this Part II, this conductive hole only runs through this circuit base plate and this second metal level.
6. circuit board as claimed in claim 5, is characterized in that: this conductive hole is formed at this circuit base plate and to should on the second metal level of first area.
7. circuit board as claimed in claim 5, is characterized in that: this first metal layer also comprises the second area except this first area, and this conductive hole is formed at this circuit base plate and to should on the second metal level of second area.
8. circuit board as claimed in claim 5, is characterized in that: the material of this reinforcing chip is stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520621396.1U CN204968232U (en) | 2015-08-18 | 2015-08-18 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520621396.1U CN204968232U (en) | 2015-08-18 | 2015-08-18 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204968232U true CN204968232U (en) | 2016-01-13 |
Family
ID=55063264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520621396.1U Active CN204968232U (en) | 2015-08-18 | 2015-08-18 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204968232U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109769344A (en) * | 2017-11-10 | 2019-05-17 | 鹏鼎控股(深圳)股份有限公司 | The manufacturing method of circuit board and the circuit board |
-
2015
- 2015-08-18 CN CN201520621396.1U patent/CN204968232U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109769344A (en) * | 2017-11-10 | 2019-05-17 | 鹏鼎控股(深圳)股份有限公司 | The manufacturing method of circuit board and the circuit board |
| CN109769344B (en) * | 2017-11-10 | 2021-07-20 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204968232U (en) | Circuit board | |
| CN203482483U (en) | Circuit board | |
| CN204046920U (en) | Fastening type pcb board | |
| CN201654735U (en) | Touch screen display device | |
| CN203251506U (en) | Explosion proof structure of PCB board | |
| CN210042715U (en) | Multilayer high-frequency blind hole PCB circuit board | |
| CN209657925U (en) | A kind of folded-edge grid-type resistor | |
| CN203896582U (en) | High-efficiency heat radiation type PCB | |
| CN203057698U (en) | Metal substrate with isolated insulation through hole | |
| CN206451696U (en) | A kind of SMD triode | |
| CN201608449U (en) | Drawer cabinet mounting plate | |
| CN206271855U (en) | Mobile terminal | |
| CN203884076U (en) | Flexible circuit board of novel connecting structure | |
| CN201430348Y (en) | Equipotential connecting device | |
| CN203976901U (en) | A kind of electricity Ca mechanism for continous way magnetic control film coating production line | |
| CN204870464U (en) | Car windshield based on silver thick liquid line | |
| CN203912337U (en) | Circuit board assembly | |
| CN203984777U (en) | A kind of printed circuit board | |
| CN208273437U (en) | A kind of relay is combined with element cluster | |
| CN204335134U (en) | For the printed circuit board (PCB) of mobile device | |
| CN219627991U (en) | Composite metallurgical material low-temperature cofiring heat dissipation substrate | |
| CN202210904U (en) | Power supply printed wiring board | |
| CN211959736U (en) | Switching power supply box and switching power supply | |
| CN105338731B (en) | A kind of miniaturization strip line power amplifier module | |
| CN206947574U (en) | A kind of combined type pcb board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170301 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Patentee before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
| CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Co-patentee after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-patentee before: Peng Ding Polytron Technologies Inc |
|
| CP03 | Change of name, title or address |