CN202411607U - Fixture for repairing integrated circuit with ball grid array structure - Google Patents
Fixture for repairing integrated circuit with ball grid array structure Download PDFInfo
- Publication number
- CN202411607U CN202411607U CN2011202447187U CN201120244718U CN202411607U CN 202411607 U CN202411607 U CN 202411607U CN 2011202447187 U CN2011202447187 U CN 2011202447187U CN 201120244718 U CN201120244718 U CN 201120244718U CN 202411607 U CN202411607 U CN 202411607U
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- grid array
- array structure
- ball grid
- silk screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a fixture for repairing an integrated circuit with a ball grid array structure. The fixture comprises a fixture tray, a spring ring, a silk screen, a locking ring and a pressure reed, wherein the integrated circuit with the ball grid array structure is arranged in the fixture tray and is fixed through the spring ring arranged in the fixture tray, the silk screen is covered above the integrated circuit with the ball grid array structure in the fixture tray so that a pin of the integrated circuit with the ball grid array structure is positioned in a screen hole, the silk screen can be accurately aligned to a lug boss arranged in the fixture tray through a pit arranged on the outer peripheral edge; and the locking ring is covered on the silk screen and enables the screen hole of the silk screen to be exposed, the pressure reed at the upper end of the fixture tray is enabled to press the locking ring through rotating locking ring, so that the change of the alignment position during repairing is avoided. Therefore, the fixture is matched with a reflow welding process, a reflow welding furnace on a traditional production line for producing an electronic circuit board can be utilized for realizing batch repair and recycling of the integrated circuit with the ball grid array structure at low cost.
Description
Technical field
The utility model relates to a kind of tool, particularly relates to a kind of tool that the ball grid array structure integrated circuit is repaired that is used for.
Background technology
Along with electronic products such as LED illumination brightening product, MP4, MP5, digital camera, mobile phone and computer universal day by day in living in modern times, used by a large amount of as the integrated circuit control chip that constitutes its circuit structure.Because becoming increasingly complex of function, the more and more miniaturization of structure of integrated circuit, the field of its application also more and more widely.In view of the particularity of integrated circuit package structure, it is merely able to use the tin ball as pin.Yet in process of production because the generation of defective; Through regular meeting the pin of integrated circuit is damaged, cause integrated circuit under the intact situation of circuit structure and function, to have to scrap, caused serious waste; Simultaneously also produced a large amount of electronic wastes thus, brought pollution to environment.For these pins are damaged but can utilizing again of the intact integrated circuit of circuit structure and function need be planted the ball reparation once more to these integrated circuits.
Mostly the reparation of at present the most frequently used ball grid array structure integrated circuit is to adopt the manual ball of planting.It is low that traditional hand is planted the ball process efficiency, is not suitable for large batch of reparation.In addition along with the continuous progress of ball grid array structure integrated circuit technique; The diameter of tin bulb pin is more and more littler; Gap between tin ball and the tin ball is also more and more littler, and the quantity of the interior tin ball of unit are is more and more (like extra small size sphere diameter (2mm), extra small sphere gap (2mm) ball grid array structure integrated circuit (BGA)) also; (it generally is used for sphere diameter big (4mm or more than) for aligning accuracy less demanding because traditional hand is planted ball technology; The BGA of sphere gap big (5mm or more than) repairs), therefore ball grid array structure integrated circuit now to be planted the ratio of falling ball in the process of ball very high adopting traditional hand to plant ball technology, and the success rate of planting ball is low; Traditional hand is planted the small lot reparation that ball technology can only be used to analyze failure cause, and it can't satisfy industry requirement of repairing in enormous quantities at all.
In order to realize batch reparation, can consider to adopt the production line of the automation that is used for producing electronic circuit board to accomplish renovation technique to the ball grid array structure integrated circuit.The main production equipments of this production line comprises chip mounter and reflow soldering, therefore can consider to utilize the reflow soldering of this production line to carry out the batch reparation of ball grid array structure integrated circuit.
Because the production procedure of electronic circuit board is components and parts to be attached on the wiring board of brushing tin cream through chip mounter, passes through reflow soldering again, with components and parts reliable soldering process in the circuit board.The temperature and time of its Reflow Soldering is based on that the quantity of thickness and the components and parts of plank adjusts, whole reflux course is by warming up period, temperature raising period, and the backflow phase, cooling cycle, accomplished whole welding job.Wherein the temperature of warming up period is that the duration is about 20s since 60 degree; Through the temperature raising period of excess temperature 140 degree, the duration is 1 minute about half again; Get into the backflow phase afterwards, its reflux temperature generally about 225 degree, continues the time of 15s; Experience cooling cycle at last, the temperature of wiring board is lowered, thereby reliably components and parts are welded on the plank.
If directly use the reflow soldering on this production line to come the pin tin ball of ball grid array structure integrated circuit is carried out automatic REPAIR WELDING, when practical application, can have following problem:
1. because the pin tin bulb diameter of ball grid array structure integrated circuit has only 2mm, and spacing also has only 2mm, in the process of Reflow Soldering, the hot blast in the reflow soldering can blow the tin ball, and the tin ball is dropped easily.
2. because through the backflow phase; The temperature that refluxes is higher; The tin ball is melted, because the tin sphere gap is very little, the pulling function of backflow can make the several adjacent pin of ball grid array structure integrated circuit be melted in together in the process that refluxes; Cause the short circuit of these several pins, thereby cause repairing failure.
This shows that the recovery technique of above-mentioned existing ball grid array structure integrated circuit obviously still has inconvenience and defective, and demands urgently further improving.In order to solve the problem of above-mentioned existence; Relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly; But do not see always that for a long time suitable design is developed completion, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of tool that the ball grid array structure integrated circuit is repaired that is used for of new structure; Realize the batch reparation of integrated circuit and utilization again to utilize the reflow soldering of producing on the electronic circuit board assembly line; And can guarantee the invariant position of pin tin ball on the ball grid array structure integrated circuit of ball grid array structure integrated circuit in reflow process; This real one of current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Summary of the invention
The purpose of the utility model is; Overcome the defective of the recovery technique existence of existing ball grid array structure integrated circuit; And a kind of tool that the ball grid array structure integrated circuit is repaired that is used for of new structure is provided; Technical problem to be solved is that it passes through the design to jig structure, the aligning accuracy when having improved welding, utilize reflow soldering economy on the existing production electronic circuit board assembly line realization the batch reparation and utilization again of ball grid array structure integrated circuit; And can guarantee the invariant position of pin tin ball on the ball grid array structure integrated circuit of ball grid array structure integrated circuit in reflow process, be very suitable for practicality.
The purpose of the utility model and solve its technical problem and adopt following technical scheme to realize.A kind of tool that is used for the reparation of ball grid array structure integrated circuit according to the utility model proposition; It comprises: a tool pallet; This tool pallet has a locating slot that is used for ccontaining this ball grid array structure integrated circuit, and this locating slot is to be made up of a square groove of the main body that is used for ccontaining this ball grid array structure integrated circuit that is positioned at the bottom and a superposed circular trough; Wherein the height of this square groove equals the thickness of the main body of this ball grid array structure integrated circuit, and the diameter of this circular trough is greater than the length of side of this square groove; Symmetry is provided with two projections that extend along the short transverse of this circular trough on the inwall of this circular trough; Two turns are arranged at respectively on the two adjacent sidewalls in this square groove, and respectively roof pressure in the side of the main body of this ball grid array structure integrated circuit; One silk screen is arranged in this circular trough of this tool pallet, and is covered in the top of this ball grid array structure integrated circuit, makes the pin of this ball grid array structure integrated circuit be positioned at the mesh of this silk screen fully; This silk screen is a diameter circular lamellar body identical with the diameter of this circular trough, is respectively arranged with two first recesses that match with described projection in the outer peripheral edges of this silk screen corresponding to the said projection of this circular trough; This silk screen has a mesh portion corresponding to this square groove of this tool pallet; Described mesh is positioned at this mesh portion; And the position of the said mesh of this mesh portion is corresponding with the position of the pin of this ball grid array structure integrated circuit, and the diameter of said mesh equals the diameter as the tin ball of the pin of this ball grid array structure integrated circuit; One clamp ring is a torus, and it is arranged at the top of this silk screen in this circular trough, and exposes the mesh portion of this silk screen, and the diameter of its cylindrical equals the diameter of this circular trough; Also be respectively arranged with two second recesses in the outer peripheral edges of this clamp ring corresponding to the said projection of this circular trough; Wherein said second recess length along the circumferential direction is greater than said projection length along the circumferential direction, and described projection is to be arranged at slidably in described second recess along circumferencial direction; And at least one making leaf spring; Be arranged on the inwall of this circular trough; And described making leaf spring be positioned at this circular trough inwall this clamp ring of upper end the top and stretch out and be pressed in this clamp ring to this circular trough obliquely downwards, and expose the mesh portion of this silk screen; Wherein, in this silk screen and this clamp ring, also correspond respectively to said making leaf spring and be provided with one the 3rd recess and one the 4th recess that matches with said making leaf spring.
The purpose of the utility model and solve its technical problem and also can adopt following technical measures further to realize.
The aforesaid tool that is used for the reparation of ball grid array structure integrated circuit, wherein said turn is to be individually fixed on the sidewall in this square groove by the stainless steel wire two ends that a diameter is 1mm to form.
The aforesaid tool that is used for the reparation of ball grid array structure integrated circuit; Comprise four described making leaf springs; And four described making leaf springs are along the equally spaced upper end that is arranged at this circular trough inwall of the inwall of this circular trough; And in this circular trough, stretch out obliquely and be pressed in this clamp ring, and expose the mesh portion of this silk screen downwards.
Aforesaidly be used for the tool that the ball grid array structure integrated circuit is repaired, wherein in described clamp ring, also be provided with and make described making leaf spring be pressed in the swing handle in this clamp ring in order to rotate this clamp ring.
The aforesaid tool that is used for the reparation of ball grid array structure integrated circuit, wherein said making leaf spring and silk screen are to use the stainless steel material manufacturing, and described tool pallet and clamp ring are to use the aluminium manufacturing.
The utility model compared with prior art has tangible advantage and beneficial effect.By technique scheme; The tool that the utility model is used for the reparation of ball grid array structure integrated circuit has advantage and beneficial effect at least: the utility model is through the design to jig structure; Aligning accuracy when having improved welding; And the cooperation reflow solder technique can guarantee the invariant position of pin tin ball on the ball grid array structure integrated circuit of ball grid array structure integrated circuit in reflow process, thereby utilizes the reflow soldering on the existing production electronic circuit board assembly line to realize the reparation to the pin of ball grid array structure integrated circuit; The supervisor who makes the intact integrated circuit of function damage can repair intact cheaply; Be reused at production line, and can form batch process, guarantee the success rate and the efficient of repairing.
In sum, the utility model has obvious improvement technically, and has tangible good effect, really is the new design of a novelty, progress, practicality.
Above-mentioned explanation only is the general introduction of the utility model technical scheme; In order more to know the technological means of understanding the utility model; And can implement according to the content of specification, and for let the above-mentioned of the utility model with other purposes, feature and advantage can be more obviously understandable, below special act preferred embodiment; And conjunction with figs., specify as follows.
Description of drawings
Fig. 1 is the exploded perspective view that the utility model is used for the tool of ball grid array structure integrated circuit reparation.
Fig. 2 A is the vertical view that the utility model is used for the tool pallet of the tool that the ball grid array structure integrated circuit repairs.
Fig. 2 B is that the utility model is used for the cutaway view of the tool of ball grid array structure integrated circuit reparation along Fig. 2 A A-A line.
Fig. 3 is the sketch map that the utility model is used for the silk screen of the tool that the ball grid array structure integrated circuit repairs.
Fig. 4 is the sketch map that the utility model is used for the clamp ring of the tool that the ball grid array structure integrated circuit repairs.
1: tool pallet 11: square groove
12: circular trough 13: projection
2: turn 3: silk screen
Recess 32 in 31: the first: mesh portion
Recess 4 in 33: the three: clamp ring
42: the four recesses of 41: the second recesses
43: swing handle 5: making leaf spring
6: the integrated circuit of ball grid array structure
The specific embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined goal of the invention is taked; Below in conjunction with accompanying drawing and preferred embodiment; To its specific embodiment of tool, structure, method, step, characteristic and the effect thereof that the ball grid array structure integrated circuit is repaired that be used for that proposes according to the utility model, specify as after.
Aforementioned and other technology contents, characteristics and the effect of relevant the utility model can be known to appear in the following detailed description that cooperates with reference to graphic preferred embodiment.Explanation through the specific embodiment; Should be to reach technological means that predetermined purpose takes and effect to obtain one more deeply and concrete understanding to the utility model; Yet the appended graphic usefulness that only provides reference and explanation is not to be used for the utility model is limited.
The utility model proposition utilizes the reflow soldering of the production line of the automation of producing electronic circuit board to realize the batch reparation of ball grid array structure integrated circuit, and has proposed a kind of tool that the ball grid array structure integrated circuit is repaired that is used for according to the actual needs of renovation technique.
See also shown in Figure 1ly, Fig. 1 is the exploded perspective view that the utility model is used for the tool that the ball grid array structure integrated circuit repairs.The tool that is used for the reparation of ball grid array structure integrated circuit of the utility model preferred embodiment mainly is made up of tool pallet 1, turn 2, silk screen 3, clamp ring 4 and making leaf spring 5.
Please consult shown in Fig. 2 A and Fig. 2 B, Fig. 2 A is the vertical view that the utility model is used for the tool pallet of the tool that the ball grid array structure integrated circuit repairs again.Fig. 2 B is that the utility model is used for the cutaway view of the tool of ball grid array structure integrated circuit reparation along Fig. 2 A A-A line.The tool pallet 1 of the utility model has a locating slot that is used for ccontaining ball grid array structure integrated circuit 6.This locating slot is that the square groove 11 by the main body that is used for ccontaining ball grid array structure integrated circuit 6 that is positioned at the bottom constitutes with a superposed circular trough 12.Wherein the height of square groove 11 equals the thickness of the main body of ball grid array structure integrated circuit, and the diameter of circular trough 12 is greater than the length of side of square groove 11.Symmetry is provided with two projections 13 that extend along the short transverse of circular trough 12 on the inwall of circular trough 12.
Shown in Fig. 2 A; The turn 2 of the utility model is two; And be arranged at respectively on the two adjacent sidewalls in the square groove 11, play the fixedly effect of the integrated circuit 6 of ball grid array structure in the side of the main body of ball grid array structure integrated circuit 6 with roof pressure respectively.This law is bright through utilizing the adjustable characteristic of turn 2 elasticity, applicable to the integrated circuit 6 of the ball grid array structure of different size.Wherein, turn 2 can be to be individually fixed on the sidewall in the square groove 11 by the stainless steel wire two ends that a diameter is 1mm to form.
Seeing also shown in Figure 3ly, is the sketch map that the utility model is used for the silk screen of the tool that the ball grid array structure integrated circuit repairs.The silk screen 3 of the utility model is arranged in the circular trough 12 of tool pallet 1, and is covered in the top of ball grid array structure integrated circuit 6, makes the pin of ball grid array structure integrated circuit 6 be positioned at the mesh of silk screen 3 fully.Silk screen 3 is a diameter circular lamellar body identical with the diameter of circular trough 12, and is respectively arranged with two first recesses 31 that match with projection 13 in the outer peripheral edges of silk screen 3 corresponding to the projection 13 of circular trough 12, and silk screen 3 can accurately be located with tool pallet 1.Silk screen 3 has a mesh portion 32 corresponding to the square groove 11 of tool pallet 1; The mesh of silk screen 3 promptly is positioned at mesh portion 32; And the position of the mesh of mesh portion 32 is corresponding with the position of the pin of ball grid array structure integrated circuit 6, and the diameter of the mesh of mesh portion 32 equals the diameter as the tin ball of the pin of ball grid array structure integrated circuit 6.
Seeing also shown in Figure 4ly, is the sketch map that the utility model is used for the clamp ring of the tool that the ball grid array structure integrated circuit repairs.The clamp ring 4 of the utility model is a torus, and it is arranged at the top of silk screen 3 in the circular trough 12, and the mesh portion 32 of silk screen 3 is exposed, and the diameter of clamp ring 4 cylindricals equals the diameter of circular trough 12.Also be respectively arranged with two second recesses 41 in the outer peripheral edges of clamp ring 4 corresponding to the projection 13 of circular trough 12.Wherein second recess 41 length along the circumferential direction is greater than projection 13 length along the circumferential direction, and projection 13 is to be arranged at slidably in second recess 41 along circumferencial direction.In clamp ring 4, also being provided with in order to rotation lock collar 4 makes making leaf spring 5 be pressed in the swing handle 43 in the clamp ring 4.
Please consult shown in Figure 1 again; The utlity model has at least one making leaf spring 5; It is arranged on the inwall of circular trough 12; And making leaf spring 5 be positioned at circular trough 12 inwalls upper end locking circle 4 the top and downwards obliquely circular trough 12 stretch out and be pressed in the clamp ring 4, and the mesh portion 32 of silk screen 3 is exposed.In a specific embodiment of the utility model; The tool of the utility model is provided with four making leaf springs 5; And these four making leaf springs 5 are along the equally spaced upper end that is arranged at circular trough 12 inwalls of the inwall of circular trough 12; And in circular trough 12, stretch out obliquely and be pressed in jointly in the clamp ring 4, and the mesh portion 32 of silk screen 3 is exposed downwards.Wherein, In the silk screen 3 of the utility model and clamp ring 4, also correspond respectively to making leaf spring 5 and be provided with the 3rd recess 33 and the 4th recess 42 that matches with making leaf spring 5; Like Fig. 3 and shown in Figure 4, can be smoothly pack in the circular trough 12 through making leaf spring to guarantee silk screen 3 and clamp ring 4.
As shown in Figure 1; The utility model in use; At first; Be that integrated circuit 6 pins of ball grid array structure are packed in the square groove 11 of tool pallet 1 up, and with two turns 2 side of the main body of roof pressure ball grid array structure integrated circuits 6 respectively, with the fixing position of the integrated circuit 6 of ball grid array structure.Then, will have with the silk screen 3 of the corresponding mesh in position of the pin of the integrated circuit 6 of ball grid array structure and pack in the circular trough 12 of tool pallet 1, and make the pin tin ball of the integrated circuit 6 of ball grid array structure be positioned at corresponding mesh fully.Wherein first recess 31 through silk screen 3 matches with projection 13 on the corresponding tool pallet 1, and silk screen 3 can accurately be positioned in the tool pallet 1.Afterwards, clamp ring 4 is packed in the circular trough 12 of tool pallet 1, and make in the interior circle of mesh portion 32 by clamp ring 4 of silk screen 3 and expose.The projection 13 of tool pallet 1 is second recess 41 that is positioned at corresponding clamp ring 4 outer peripheral edges at this moment, and the 4th recess 42 in the clamp ring 4 is corresponding to making leaf spring 5.At last, through swing handle 43 in the trip lock collar 4, rotation lock collar 4 and since second recess 41 of clamp ring 4 along the length of circumferencial direction greater than tool pallet 1 upper protruding block 13 length along the circumferential direction.Therefore, this moment, projection 13 meetings were slided along circumferencial direction in second recess 41, thereby made making leaf spring 5 depart from four recess 42 corresponding with it, and clamp ring 4 gets into the below of making leaf springs 5.Because making leaf spring 5 is to be made in circular trough 12, to stretch out in the upper end of the circular trough 12 of tool pallet 1 with having a downward-sloping angle; Make making leaf spring 5 can play the effect of spring; Clamp ring 4 to entering into making leaf spring 5 belows applies downward pressure; Making leaf spring 5 is pressed in the clamp ring 4, thus the silk screen 3 of locking clamp ring 4 and below thereof, and the while still exposes the mesh portion of silk screen 3.Change with the contraposition position of causing of expanding with heat and contract with cold of each part of tool in the brave process that correct to reflux effectively, particularly control the influence that the distortion of silk screen causes aligning accuracy.The integrated circuit 6 of ball grid array structure is used through tool, makes the pin of chip can be accurately and the mesh contraposition of silk screen 3, and after contraposition, tin bulb pin through reflow soldering, can make pin repaired again at the mesh place of silk screen 3.
Because the utility model is the batch reparation that realizes the ball grid array structure integrated circuit through the reflow soldering of the production line of the automation of adopting existing production electronic circuit board, the brave temperature and time that therefore in practical application, refluxes also will be made adjustment to be fit to the repair of ball grid array structure integrated circuit thereupon accordingly.
In addition, because the making leaf spring 5 of the utility model is to use the stainless steel material manufacturing with silk screen 3, and tool pallet 1 is to use the aluminium manufacturing with clamp ring 4.Therefore in order to reach best repairing effect, we have also done corresponding change to the technological process of original electronic circuit board Reflow Soldering, and original warming up period and temperature raising period are merged.Its concrete step is following:
Facts have proved, adopt the technological process of above-mentioned this Reflow Soldering to come the ball grid array structure integrated circuit is carried out batch reparation, make the success rate of repairing to reach 97%, thereby reached the purpose of repairing in batches.
The reparation that tool that is used for the reparation of ball grid array structure integrated circuit that the utility model disclosed and method are suitable for the ball grid array structure integrated circuit of all sizes, different lead pin pitch; More be applicable to tin bulb diameter 2mm, tin ball and tin sphere gap are less than the integrated circuit of the ball grid array structure of 2mm.Can be through reflow soldering to the production of repairing of large batch of ball grid array structure integrated circuit.If according to the integrated circuit output of the ball grid array structure in the annual whole world 5,000,000,000; 000 calculating is scrapped according to the integrated circuit that the quality of Six Sigma will have a ball grid array structure of 15,000,000 so; If on average about 50 yuan, annual direct losses are 750,000 for the price of the integrated circuit of every ball grid array structure; 000 yuan, and can produce the nondegradable electronic waste of thousands of tons of, pollute the environment of human survival.The novel tool that the utility model provided makes aligning accuracy reach instructions for use, through the welding of reflow soldering; Can accomplish the batch reparation of ball grid array structure integrated circuit; And the success rate of repairing is higher, and through overtesting, success rate can reach 97%.Wherein the application of turn of the utility model and clamp ring makes the contraposition of tool position accurately can reach 0.1mm, makes all ball grid array structure integrated circuits can reach the purpose of repairing and reusing through the tool that uses the utility model.Practical effect is desirable.
The above; It only is the preferred embodiment of the utility model; Not being that the utility model is done any pro forma restriction, though the utility model with the preferred embodiment exposure as above, yet is not in order to limit the utility model; Anyly be familiar with the professional and technical personnel; In not breaking away from the utility model technical scheme scope, make a little change or be modified to the equivalent embodiment of equivalent variations when the method for above-mentioned announcement capable of using and technology contents, be the content that does not break away from the utility model technical scheme in every case;, all still belong in the scope of the utility model technical scheme any simple modification, equivalent variations and modification that above embodiment did according to the technical spirit of the utility model.
Claims (5)
1. one kind is used for the tool that the ball grid array structure integrated circuit is repaired, and it is characterized in that it comprises:
One tool pallet; This tool pallet has a locating slot that is used for ccontaining this ball grid array structure integrated circuit, and this locating slot is to be made up of a square groove of the main body that is used for ccontaining this ball grid array structure integrated circuit that is positioned at the bottom and a superposed circular trough; Wherein the height of this square groove equals the thickness of the main body of this ball grid array structure integrated circuit, and the diameter of this circular trough is greater than the length of side of this square groove; Symmetry is provided with two projections that extend along the short transverse of this circular trough on the inwall of this circular trough;
Two turns are arranged at respectively on the two adjacent sidewalls in this square groove, and respectively roof pressure in the side of the main body of this ball grid array structure integrated circuit;
One silk screen is arranged in this circular trough of this tool pallet, and is covered in the top of this ball grid array structure integrated circuit, makes the pin of this ball grid array structure integrated circuit be positioned at the mesh of this silk screen fully; This silk screen is a diameter circular lamellar body identical with the diameter of this circular trough, is respectively arranged with two first recesses that match with described projection in the outer peripheral edges of this silk screen corresponding to the said projection of this circular trough; This silk screen has a mesh portion corresponding to this square groove of this tool pallet; Described mesh is positioned at this mesh portion; And the position of the said mesh of this mesh portion is corresponding with the position of the pin of this ball grid array structure integrated circuit, and the diameter of said mesh equals the diameter as the tin ball of the pin of this ball grid array structure integrated circuit;
One clamp ring is a torus, and it is arranged at the top of this silk screen in this circular trough, and exposes the mesh portion of this silk screen, and the diameter of its cylindrical equals the diameter of this circular trough; Also be respectively arranged with two second recesses in the outer peripheral edges of this clamp ring corresponding to the said projection of this circular trough; Wherein said second recess length along the circumferential direction is greater than said projection length along the circumferential direction, and described projection is to be arranged at slidably in described second recess along circumferencial direction; And
At least one making leaf spring; Be arranged on the inwall of this circular trough; And described making leaf spring be positioned at this circular trough inwall this clamp ring of upper end the top and stretch out and be pressed in this clamp ring to this circular trough obliquely downwards, and expose the mesh portion of this silk screen;
Wherein, in this silk screen and this clamp ring, also correspond respectively to said making leaf spring and be provided with one the 3rd recess and one the 4th recess that matches with said making leaf spring.
2. the tool that is used for the reparation of ball grid array structure integrated circuit according to claim 1 is characterized in that wherein said turn is to be individually fixed on the sidewall in this square groove by the stainless steel wire two ends that a diameter is 1mm to form.
3. the tool that is used for the reparation of ball grid array structure integrated circuit according to claim 1; It is characterized in that it comprises four described making leaf springs; And four described making leaf springs are along the equally spaced upper end that is arranged at this circular trough inwall of the inwall of this circular trough; And in this circular trough, stretch out obliquely and be pressed in this clamp ring, and expose the mesh portion of this silk screen downwards.
4. the tool that is used for the reparation of ball grid array structure integrated circuit according to claim 1 is characterized in that wherein in described clamp ring, also being provided with in order to rotate this clamp ring making described making leaf spring be pressed in the swing handle in this clamp ring.
5. the tool that is used for the reparation of ball grid array structure integrated circuit according to claim 1 is characterized in that wherein said making leaf spring and silk screen are to use the stainless steel material manufacturing, and described tool pallet and clamp ring are to use the aluminium manufacturing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202447187U CN202411607U (en) | 2011-07-08 | 2011-07-08 | Fixture for repairing integrated circuit with ball grid array structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202447187U CN202411607U (en) | 2011-07-08 | 2011-07-08 | Fixture for repairing integrated circuit with ball grid array structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202411607U true CN202411607U (en) | 2012-09-05 |
Family
ID=46736402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202447187U Expired - Fee Related CN202411607U (en) | 2011-07-08 | 2011-07-08 | Fixture for repairing integrated circuit with ball grid array structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202411607U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102861963A (en) * | 2011-07-08 | 2013-01-09 | 洛阳博信光电科技有限公司 | Jig and method for repairing ball grid array structured integrated circuit |
| CN106216788A (en) * | 2016-08-23 | 2016-12-14 | 安徽华东光电技术研究所 | A kind of Electronic Control aperture plate welding tooling and welding method |
-
2011
- 2011-07-08 CN CN2011202447187U patent/CN202411607U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102861963A (en) * | 2011-07-08 | 2013-01-09 | 洛阳博信光电科技有限公司 | Jig and method for repairing ball grid array structured integrated circuit |
| CN102861963B (en) * | 2011-07-08 | 2015-11-25 | 河南博信光电科技有限公司 | The tool repaired for ball grid array structure integrated circuit and method |
| CN106216788A (en) * | 2016-08-23 | 2016-12-14 | 安徽华东光电技术研究所 | A kind of Electronic Control aperture plate welding tooling and welding method |
| CN106216788B (en) * | 2016-08-23 | 2019-07-02 | 安徽华东光电技术研究所 | A kind of welding method that aperture plate welding tooling is controlled electronically |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202411607U (en) | Fixture for repairing integrated circuit with ball grid array structure | |
| CN102861963B (en) | The tool repaired for ball grid array structure integrated circuit and method | |
| CN103579017B (en) | What encapsulate for Ceramic column grid array plants post and welder automatically | |
| CN208116548U (en) | A kind of pawl stamping parts production mould | |
| CN102335790B (en) | Method for maintaining AQFN (Advanced Quad Flat No-Lead Package) mobile phone motherboard and maintenance table | |
| CN204937696U (en) | A kind of efficient labeling board apparatus | |
| CN201323709Y (en) | Ball mounting clamp | |
| CN201657519U (en) | PCB braze welding clamp | |
| CN205380359U (en) | Laser welding equipment of components and parts | |
| CN208210456U (en) | A kind of tool for crossing Reflow Soldering for assembling patch contact pin | |
| CN206293416U (en) | A kind of BGA ball-planting devices | |
| CN203992730U (en) | For welding the weldering mould of semi-conductor power module | |
| CN105870027B (en) | A kind of plant ball instrument for bga chip | |
| CN205816510U (en) | A kind of automatic position-changing decompressor based on Malta's runner | |
| CN206415777U (en) | Heat ironware all-in-one | |
| CN201985082U (en) | Tinning device for chips | |
| CN204449520U (en) | A kind of special right angle of automobile pump cover is two attacks machine | |
| CN209773672U (en) | full-automatic wicking machine in transformer PIN angle | |
| CN208369986U (en) | A kind of LGA device wards off tin jig | |
| CN205609476U (en) | A plant ball instrument for BGA chip | |
| CN208614117U (en) | Electric power electronic module weld mold | |
| CN103237414B (en) | A kind of key circuit board production method | |
| CN206241536U (en) | A kind of welding positioning tool of winding wiring terminal | |
| CN202639671U (en) | Welding device for tower foot of transmission line iron tower | |
| CN102076178A (en) | Fixture for solder paste printing and method for repairing integrated circuit board by utilizing same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Beijing Solnar Metrolight Technology Co., Ltd. Assignor: Luoyang Boxin Photoelectric Technology Co.,Ltd. Contract record no.: 2013990000431 Denomination of utility model: Jig and method for repairing ball grid array structured integrated circuit Granted publication date: 20120905 License type: Exclusive License Record date: 20130725 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| C56 | Change in the name or address of the patentee |
Owner name: HENAN BOXIN PHOTOELECTRIC TECHNOLOGY CO., LTD. Free format text: FORMER NAME: LUOYANG BOXIN PHOTOELECTRIC TECHNOLOGY CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: High tech Development Zone, Henan city of Luoyang province Yan Guang Lu 471000 torch Park B block four Room 401 Patentee after: Luoyang Boxin Photoelectric Technology Co.,Ltd. Address before: High tech Development Zone, Henan city of Luoyang province Yan Guang Lu 471000 torch Park B block four Room 401 Patentee before: Luoyang Boxin Photoelectric Technology Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120905 Termination date: 20170708 |