CN201985082U

CN201985082U - Tinning device for chips

Info

Publication number: CN201985082U
Application number: CN2010206196323U
Authority: CN
Inventors: 李小东; 明正东
Original assignee: DONGGUAN QIAOTOU SHINTECH Co Ltd
Current assignee: Dongguan Shin Tech Engineering Co.,Ltd.
Priority date: 2010-11-23
Filing date: 2010-11-23
Publication date: 2011-09-21
Anticipated expiration: 2020-11-23

Abstract

The utility model provides a tinning device for chips, which is used for fixing the chips during tin cream printing. The device comprises a support plate; a plurality of chip containing grooves are arranged on the front of the support plate; tin brushing grooves which are dead against the chip containing grooves are formed on the back of the support plate; pin holes are arranged at the bottoms of the chip containing grooves; and the pin holes penetrate through the tin brushing grooves and the chip containing grooves of the support plate and correspond to the pins of the contained chips. Through the tinning device for chips, the repair difficulty and the repair cost are reduced, the difficulty of printing tin cream on repaired circuit boards is solved and the local damage degree of products caused by repair is reduced.

Description

Tin device on the chip

Technical field

The utility model relates to the surface mounting technology field, relates more specifically to tin device on a kind of chip.

Background technology

The nineties in 20th century is along with the progress of integrated technology, the improvement of equipment and the use of deep sub-micron technique, large scale integrated circuit, very lagre scale integrated circuit (VLSIC), great scale integrated circuit occur in succession, silicon single-chip integrated level improves constantly, encapsulation requires strict more to integrated circuit, the I/O number of pins sharply increases, and power consumption also increases thereupon.For satisfying the needs of development, on original encapsulation kind basis, increased BGA Package again, be called for short BGA (Ball Grid Array Package).The nineties in 20th century, chip integration improved constantly along with development of technology, and the I/O number of pins sharply increases, and power consumption also increases thereupon, and is also strict more to the requirement of integrated circuit encapsulation.In order to satisfy the needs of development, the BGA encapsulation begins to be applied to produce.BGA is the abbreviation of English Ball Grid Array Package, i.e. BGA Package.Adopt the internal memory of BGA technology encapsulation, can make internal memory memory size under the situation of constancy of volume improve two to three times, BGA has littler volume, better heat dispersion and electrical property.The BGA encapsulation technology makes memory space per square inch that very big lifting arranged, the internal memory product that adopts the BGA encapsulation technology is under same capability, chip than other packaged types has littler volume, in addition, compare with the conventional package mode, the BGA packaged type has quicker and effective heat radiation approach.The I/O terminal of BGA encapsulation is distributed in below the encapsulation by array format with circle or column solder joint, has increased though the advantage of BGA technology is the I/O number of pins, and pin-pitch does not reduce to have increased on the contrary, thereby has improved assembly yield; Though its power consumption increases, BGA can weld with the control collapsed chip method, thereby can improve its electric heating property; Thickness and weight all than before encapsulation technology reduce to some extent; Parasitic parameter reduces, and signal transmission delay is little, and frequency of utilization improves greatly; Assemble available coplane welding, the reliability height.

In production and debug process, unavoidably can be because BGA damages or other reasons replacing BGA.BGA reclamation work station can be finished the work of dismounting BGA equally.Dismounting BGA can be regarded as the reverse process of welding BGA.Different is, treat that temperature curve finishes after, BGA is siphoned away with vacuum WAND, why without other instruments,, be because will avoid because exert oneself excessive damage pad such as tweezers.The PCB that takes off BGA is carried out the detin operation while hot, why to operate while hot? because the PCB of heat is suitable and the function of preheating, can guarantee that the work of detin is more prone to.Weld new BGA then.In the prior art field, welding new BGA, a critical step is arranged is to plant ball, and the purpose of planting ball is exactly that the tin ball is implanted on the pad of BGA again, can reach and the new same arrangement effect of BGA, and the PCB that reprocesses often is not an only a few.Present circuit board integrated level height, the part of periphery is separated by too near, on the finished product circuit board print solder paste very because of difficulty, and bigger to the product local lesion when repairing.

Therefore need badly a kind of can reduce repair difficulty and repair cost, solution reprocess print solder paste difficulty on the circuit board, reduce repair the chip of product local lesion degree on the tin device.

The utility model content

The purpose of this utility model provide a kind of can reduce repair difficulty and repair cost, solution reprocess print solder paste difficulty on the circuit board, reduce repair the chip of product local lesion degree on the tin device.

To achieve these goals, tin device on a kind of chip of the utility model, be used for chip is fixed when the print solder paste, it comprises supporting bracket, the front of described supporting bracket offers the plurality of chips storage tank, and the back side of described supporting bracket is recessed to form the brush molten tin bath over against described chip containing groove place, and the bottom land of described chip containing groove offers pin bores, described pin bores runs through described support scrubbing brush molten tin bath and described chip containing groove, and with appearance pin of chip corresponding.

Preferably, convex with raised line in the described chip containing groove.Described raised line is set can be conveniently to be gone out chip gripping in the described chip containing groove.

Compared with prior art, on the utility model chip in the tin device, the front of described supporting bracket offers the plurality of chips storage tank, the back side of described supporting bracket is recessed to form the brush molten tin bath over against described chip containing groove place, the bottom land of described chip containing groove offers pin bores, described pin bores runs through described support scrubbing brush molten tin bath and described chip containing groove, and with appearance pin of chip corresponding.Therefore, only need in described chip containing groove, to put into new chip, new pin of chip stretches into the back side of described pin bores to described supporting bracket, only need to brush tin cream at the back side of described supporting bracket, then new chip is taken out, tin cream will be stayed on the pin of new chip automatically, finish the brush process of tin of new chip easily.Therefore, reduced the repairing difficulty and the repair cost of surface-mounted integrated circuit, solved and reprocessed print solder paste difficulty on the circuit board, reducing and repair product local lesion degree.

By following description also in conjunction with the accompanying drawings, it is more clear that the utility model will become, and these accompanying drawings are used to explain embodiment of the present utility model.

Description of drawings

Fig. 1 is the structural representation of an embodiment of the utility model print solder paste tool.

Fig. 2 inserts the structural representation of new chip for the utility model print solder paste tool.

Fig. 3 is the view of another angle of print solder paste tool shown in Figure 1.

Fig. 4 is the zoomed-in view of tin device A part on the chip shown in Figure 1.

Fig. 5 is the zoomed-in view of tin device B part on the chip shown in Figure 3.

Embodiment

With reference now to accompanying drawing, describe embodiment of the present utility model, the similar elements label is represented similar elements in the accompanying drawing.As mentioned above, shown in Fig. 1-5, tin device 100 on the chip that the utility model provides, it comprises supporting bracket 10, and the positive 10b of described supporting bracket 10 offers four chip containing groove 11, and the back side 10a of described supporting bracket 10 is recessed to form brush molten tin bath 15, described brush molten tin bath 15 and described chip containing groove 11 over against, the bottom land of described chip containing groove 11 offers pin bores 13, and described pin bores 13 runs through the back side 10a of described supporting bracket 10, and described pin bores 13 with appearance pin of chip corresponding.Particularly, described pin bores 13 runs through described brush molten tin bath 15 and described chip containing groove 11.In the back side of described supporting bracket 10 10a described brush molten tin bath 15 splendid attire tin cream preferably is set, reaches the waste that prevents to cause tin cream when repeatedly operation is saved in printing.The preferably as Fig. 1, Fig. 2 and shown in Figure 4, convexes with raised line 14 in the described chip containing groove 11.Described raised line 14 is set can conveniently be gone out chip 20 from described chip containing groove 11 interior grippings.

In conjunction with Fig. 1-5, in the tin device 100, the back side 10a that the bottom land of described chip containing groove 11 runs through described supporting bracket 10 offers and hold of the corresponding pin bores 13 of pin of chip on the utility model chip.Therefore, only need in described chip containing groove 11, to put into new chip 20, the pin of new chip 20 stretches into the back side 10a of described pin bores 13 to described supporting bracket 10, only need to brush tin cream at the back side of described supporting bracket 10 10a, then new chip 20 is taken out, tin cream will be stayed on the pin of new chip 20 automatically, finish the brush process of tin of new chip 20 easily.Therefore, reduced the repairing difficulty and the repair cost of surface-mounted integrated circuit, solved and reprocessed print solder paste difficulty on the circuit board, reducing and repair product local lesion degree.

Abovely the utility model is described, but the utility model is not limited to the embodiment of above announcement, and should contains various modification, equivalent combinations of carrying out according to essence of the present utility model in conjunction with most preferred embodiment.

Claims

1. tin device on the chip, be used for chip is fixed when the print solder paste, it is characterized in that: comprise supporting bracket, the front of described supporting bracket offers the plurality of chips storage tank, the back side of described supporting bracket is recessed to form the brush molten tin bath over against described chip containing groove place, the bottom land of described chip containing groove offers pin bores, and described pin bores runs through described support scrubbing brush molten tin bath and described chip containing groove, and with appearance pin of chip corresponding.

2. tin device on the chip as claimed in claim 1 is characterized in that: convex with raised line in the described chip containing groove.