CN201846534U - Solder paste coating aid - Google Patents
Solder paste coating aid Download PDFInfo
- Publication number
- CN201846534U CN201846534U CN2010202024864U CN201020202486U CN201846534U CN 201846534 U CN201846534 U CN 201846534U CN 2010202024864 U CN2010202024864 U CN 2010202024864U CN 201020202486 U CN201020202486 U CN 201020202486U CN 201846534 U CN201846534 U CN 201846534U
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- China
- Prior art keywords
- tin cream
- integrated circuit
- chip
- tin
- coating
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- Expired - Fee Related
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Abstract
The utility model provides a solder paste coating aid, which aids in solder paste being coated on solder balls of an integrated circuit chip. The solder paste coating aid comprises a base, a solder paste coating module, a holder and a vacuum sucker. The base is used for holding the integrated circuit chip. The solder paste coating module is used for being disposed on the base, and provided with a solder paste coating hole corresponding to the corresponding solder ball in position. The holder is provided with a holding area, after solder paste coating is completed and the solder paste coating module is detached from the base, the holder is used for being disposed on the base, and the holding area covers the integrated circuit chip. When the base, the integrated circuit chip and the holder are overturned so that the integrated circuit chip is held in the holding area, the vacuum sucker is used for sucking the integrated circuit chip from the holding area. The solder paste coating aid is used for directly coating solder paste on solder balls of the integrated circuit chip so as to substitute solder paste coating operation of pads of circuit boards in the traditional technique.
Description
Technical field
The utility model is relevant for a kind of tin cream coating servicing unit, and particularly relevant for the device of coating tin cream on a kind of tin ball that aids in integrated circuit (IC) chip.
Background technology
Based on the development trend of miniaturization and multifunction, circuit board carries integrated circuit (IC) chip in a large number.For assembling these integrated circuit (IC) chip, circuit board needs to form the tin ball of PAD (pad) for corresponding welding integrated circuit (IC) chip when forming surface conductor patterns.
Although present packaging technology is comparatively flourishing, in the process of test or practicality, still can find to have the phenomenon of damage or rosin joint.At this moment, just need to remove this integrated circuit (IC) chip, with the operation of rewelding or changing.Way commonly used at present is, with the tin cream apparatus for coating on the PAD of circuit board, be coating one deck tin cream on the position of corresponding tin ball, more original integrated circuit (IC) chip or new integrated circuit (IC) chip be placed on the circuit board that wherein tin ball correspondence has been coated with the PAD of tin cream.
Yet, at the less integrated circuit (IC) chip of PAD spacing, for example, the PAD spacing is less than 0.5 millimeter, because of locating the tin cream apparatus for coating by hand, personnel carry out tin cream coating operation, can't play pinpoint effect, and be easy to generate circuit board PAD and go up the tin cream problem of short-circuit, thereby cause board failure.
The utility model content
The utility model provides a kind of tin cream coating servicing unit, to solve described problem.
For solveing the technical problem, the technical solution of the utility model is:
The utility model provides a kind of tin cream coating servicing unit, in order to be coated with tin cream on the tin ball that aids in integrated circuit (IC) chip.Tin cream coating servicing unit comprises pedestal, tin cream coating module, load bearing seat and vacsorb spare.Pedestal is in order to the bearing integrated chip.Tin cream coating module is in order to being arranged at pedestal, and tin cream coating module has tin cream coating hole, the position of the corresponding tin ball in position in tin cream coating hole.Load bearing seat has supporting region, and when being coated with on the tin ball after tin cream and tin cream coating module breaks away from pedestal, load bearing seat is in order to being arranged at pedestal, and supporting region is covered in integrated circuit (IC) chip.When pedestal, integrated circuit (IC) chip and bearing part upset made that integrated circuit (IC) chip is carried in the supporting region, vacsorb spare was in order to draw integrated circuit (IC) chip in supporting region.
Compared with prior art, the beneficial effects of the utility model can be:
Tin cream that the utility model provides coating servicing unit is that the tin ball to integrated circuit (IC) chip directly is coated with tin cream, replaced in the conventional art operation to the PAD coating tin cream of circuit board.And, utilize the setting in tin cream coating hole in the tin cream coating module, can play pinpoint effect, thereby avoid the phenomenon of tin cream short circuit.After tin cream coating operation is finished, utilize upset pedestal, integrated circuit (IC) chip and load bearing seat, the feasible integrated circuit (IC) chip placed face down that has been coated with tin cream is damaged the tin ball when avoiding taking out integrated circuit (IC) chip.In addition, compared to the mode of taking out integrated circuit (IC) chip with tweezers, the utility model adopts the mode of vacsorb can further avoid damaging integrated circuit (IC) chip.
For described and other purpose, feature and advantage of the present utility model can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is the exploded view that the tin cream of a preferred embodiment of the present utility model is coated with the subelement of servicing unit.
Fig. 2 is the schematic diagram that the tin cream of a preferred embodiment of the present utility model is coated with the load bearing seat of servicing unit.
Fig. 3 A～Fig. 3 D is the operation chart of the tin cream coating servicing unit of a preferred embodiment of the present utility model.
Embodiment
Fig. 1 is the exploded view that the tin cream of a preferred embodiment of the present utility model is coated with the subelement of servicing unit.Fig. 2 is the schematic diagram that the tin cream of a preferred embodiment of the present utility model is coated with the load bearing seat of servicing unit.Please refer to Fig. 1 and Fig. 2.
In the present embodiment, tin cream coating servicing unit 1 is in order to be coated with tin cream on the tin ball that aids in integrated circuit (IC) chip.Tin cream coating servicing unit 1 comprises pedestal 10, tin cream coating module 11, load bearing seat 12 and vacsorb spare 13 (shown in Fig. 3 D).When practical operation, tin cream coating module 11 is arranged alternately in pedestal 10 with load bearing seat 12.Particularly, can earlier tin cream be coated with module 11 and be arranged at pedestal 10, to be coated with tin cream on the tin ball that aids in integrated circuit (IC) chip.After operation to be coated is finished, tin cream can be coated with module 11 and take off, and load bearing seat 12 is arranged at pedestal 10.13 of vacsorb spares are in order to draw integrated circuit (IC) chip.
In the present embodiment, pedestal 10 is in order to the bearing integrated chip.As shown in Figure 1, pedestal 10 has protuberance 100, and protuberance 100 has depressed area 101.The size of the corresponding integrated circuit (IC) chip of the size of depressed area 101, bearing integrated chip firmly when guaranteeing that integrated circuit (IC) chip is carried thereon, can not be subjected to displacement, so that follow-up coating operation is normally carried out thus.Yet the utility model is not done any qualification to this.In other embodiments, also can fix the integrated circuit (IC) chip snap action of (for example, by shell fragment etc.) by means of other fixture.In the present embodiment, four corners of depressed area 101 can be arranged to circular-arc and on-right angle, guaranteeing when the bearing integrated chip, and can the scratch integrated circuit (IC) chip.Yet the utility model is not done any qualification to this.In addition, pedestal 10 also has exhaust hole 102, is positioned at the bottom of depressed area 101.
Particularly, in the present embodiment, protuberance 100 comprises first protruding part 1001 and second protruding part 1002 that is provided with at interval.Both can become symmetrical form first protruding part 1001 and second protruding part 1002.Exhaust hole 102 can be between first protruding part 1001 and second protruding part 1002, and be positioned at the middle position of 101 bottoms, depressed area.Yet the utility model is not done any qualification to this.First protruding part 1001 provides an operating space with path 10 3 between second protruding part 1002 for the user picks and places integrated circuit (IC) chip from relative both sides.Yet the utility model is not done any qualification to this.
In the present embodiment, first protruding part 1001 has that first depressed part, 1003, the second protruding parts 1002 have second depressed part, 1004, the first depressed parts 1003 and second depressed part 1004 promptly forms depressed area 101, with the bearing integrated chip.In the present embodiment, in order to make integrated circuit (IC) chip exhaust in follow-up coating operation process smooth and easy, reserved an exhaust space in the present embodiment, soon the degree of depth of depressed area 101 is set to the height greater than the integrated circuit (IC) chip of being carried.Thus, integrated circuit (IC) chip can directly not contact with the bottom surface of pedestal 10, can and exhaust hole 102 between have a spacing distance.In the present embodiment, can make integrated circuit (IC) chip to be carried on reposefully on the step 1005 along level and smooth step 1005 of each self-forming of its sidewall in first depressed part 1003 of formation depressed area 101 and second depressed part 1004.Yet the utility model is not done any qualification to this.
In the present embodiment, tin cream coating module 11 comprises the first hollow framework 110, tin cream coated panel 111 and the second hollow framework 112 that interfixes.Tin cream coated panel 111 is located in 112 of the first hollow framework 110 and the second hollow frameworks.The material of the first hollow framework 110 and the second hollow framework 112 can be the metal material of antistatic, for example is aluminum or aluminum alloy.The material of tin cream coated panel 111 can be stainless steel.Yet the utility model is not done any qualification to this.
Particularly, in the present embodiment, the first hollow framework 110 has the reference column 1101 and first fixing hole 1102.The number of reference column 1101 can be four, and the middle position of the first hollow framework, 110 each sides can respectively be provided with one.The number of first fixing hole 1102 can be eight, can respectively be provided with two on the first hollow framework, 110 each sides.Yet, the utility model to the number of the reference column 1101 and first fixing hole 1102 with the position be set do not do any qualification.
In the present embodiment, the size of the protuberance 100 that the hollow region size of the first hollow framework 110 can corresponding pedestal 10 is with ccontaining protuberance 100.Thus, when being coated with operation, can utilize the hollow region of the first hollow framework 110 to locate tin cream coating module 11 quickly and accurately with the fixation that cooperates of the protuberance 100 of pedestal 10.After the coating operation is finished, also can remove tin cream coating module 11 apace.Yet the utility model is not done any qualification to this.In other embodiments, also can locate and fixing tin cream coating module 11 snap action of shell fragment etc. (for example, by) by means of other fixture.In addition, can be arranged to circular-arc and on-right angle for four corners of the hollow region of protuberance 100, the first hollow frameworks 110 of avoiding scratch pedestal 10.Yet the utility model is not done any qualification to this.
In the present embodiment, tin cream coated panel 111 has tin cream coating hole 1110, and the position of tin ball on the corresponding integrated circuit (IC) chip in position in tin cream coating hole 1110, to guarantee to be coated with exactly by 111 pairs of tin balls of this tin cream coated panel the operation of tin cream.In addition, tin cream coated panel 111 has first location hole 1111 and second fixing hole 1112.For the number of the reference column 1101 of the corresponding first hollow framework 110 with the position is set, the number of first location hole 1111 also can be four, the middle position of tin cream coated panel 111 each sides can respectively be provided with one.In like manner, for the number of first fixing hole 1102 of the corresponding first hollow framework 110 with the position is set, the number of second fixing hole 1112 also can be eight, can respectively be provided with two on tin cream coated panel 111 each sides.Yet, the utility model to the number of first location hole 1111 and second fixing hole 1112 with the position be set do not do any qualification.
In the present embodiment, the second hollow framework 112 has second location hole 1121 and the 3rd fixing hole 1122.For the number of the reference column 1101 of the corresponding first hollow framework 110 with the position is set, the number of second location hole 1121 also can be four, the middle position of the second hollow framework, 112 each sides can respectively be provided with one.In like manner, for the number of first fixing hole 1102 of the corresponding first hollow framework 110 with the position is set, the number of the 3rd fixing hole 1122 also can be eight, can respectively be provided with two on the second hollow framework, 112 each sides.Yet, the utility model to the number of second location hole 1121 and the 3rd fixing hole 1122 with the position be set do not do any qualification.
In the present embodiment, when assembling tin cream coating module 11, the reference column 1101 of the first hollow framework 110 is arranged in first location hole 1111 of tin cream coated panel 111 and second location hole 1121 of the second hollow framework 112 successively, to determine the relative position relation of the first hollow framework 110, tin cream coated panel 111 and the second hollow framework 112.Subsequently, fixture (for example screw, double-screw bolt or fixed leg etc.) can be passed first fixing hole 1102, second fixing hole 1112 and the 3rd fixing hole 1122 successively interfixes the first hollow framework 110, tin cream coated panel 111 and the second hollow framework 112.Yet the utility model is not done any qualification to this.In other embodiments, can not fix the first hollow framework 110, tin cream coated panel 111 and the second hollow framework 112 by means of extra fixture yet, and directly being set, fixed leg fixes the snap action of (for example, by shell fragment etc.) on the first hollow framework 110, tin cream coated panel 111 or the second hollow framework 112.
In the present embodiment, after 11 assemblings of tin cream coating module are finished, the hollow region that can utilize the first hollow framework 110 and the protuberance 100 of pedestal 10 cooperate fixation that tin cream is coated with module 11 to be arranged at pedestal 10, the user can be coated with tin cream on tin cream coated panel 111, tin cream can be coated with hole 1110 by tin cream and be applied on the corresponding tin ball, to finish the coating operation.In the present embodiment, for guaranteeing to be coated with the uniformity of tin cream, the thickness of tin cream coated panel 111 should cooperate the height of tin ball on the integrated circuit (IC) chip, should correspond to the setting height(from bottom) of tin ball on integrated circuit (IC) chip and the total value of the thickness of desire coating tin cream.For example, the height after the tin ball is installed on the integrated circuit (IC) chip is 0.2 millimeter, and the thickness of desire coating tin cream is 0.05 millimeter, and then the thickness of this tin cream coated panel 111 should be 0.25 millimeter.
In the present embodiment, as shown in Figure 2, load bearing seat 12 has disposal area 120, and the size of the protuberance 100 of the corresponding pedestal 10 of the size of disposal area 120, with ccontaining protuberance 100.In addition, be the protuberance 100 of avoiding scratch pedestal 10, four corners of disposal area 120 can be arranged to circular-arc and on-right angle.Yet the utility model is not done any qualification to this.
In the present embodiment, load bearing seat 12 also has supporting region 121, and this supporting region 121 is positioned at disposal area 120.When carrying out the operation of drawing integrated circuit (IC) chip, supporting region 121 can be used for the bearing integrated chip.Be bearing integrated chip firmly, the size of supporting region 121 can be corresponding to the size of integrated circuit (IC) chip.Yet the utility model is not done any qualification to this.In addition, for avoiding the scratch integrated circuit (IC) chip, four corners of supporting region 121 can be arranged to circular-arc and on-right angle.Yet the utility model is not done any qualification to this.
In the present embodiment, because load bearing seat 12 bearing integrated chips are after being coated with tin cream, and the tin ball surface of coating tin cream can be in the face of the supporting region 121 of load bearing seat 12, therefore for to avoid running into the tin cream that is applied to tin ball surface, the degree of depth of supporting region 121 can be greater than the height of integrated circuit (IC) chip.And in the present embodiment, the bottom of supporting region 121 has two steps of establishing relatively 123, in order to the relative both sides of bearing integrated chip.In addition, load bearing seat 12 also has exhaust hole 122, is positioned at supporting region 121.As shown in Figure 2, exhaust hole 122 can be positioned at the bottom center of supporting region 121.Yet the utility model is not done any qualification to this.
Fig. 3 A～Fig. 3 D is the operation chart of the tin cream coating servicing unit of a preferred embodiment of the present utility model.Below specify the operating process of tin cream coating servicing unit in the present embodiment.Please refer to Fig. 3 A～Fig. 3 D.
In the present embodiment, integrated circuit (IC) chip can be ball bar array encapsulation (Ball Grid Array Package, BGA) chip 2, are implanted with a plurality of tin balls 21 on it.The tin cream coating servicing unit 1 that present embodiment provides is promptly in order to be coated with tin cream on the tin ball 21 that aids in this bga chip 2.Yet the utility model is not done any qualification to the type of integrated circuit (IC) chip and the number of tin ball.
When operation, as shown in Figure 3A, at first bga chip 2 can be carried in the depressed area 101 of pedestal 10.Subsequently, can cover tin cream coating module 11.As shown in Figure 1, can utilize the hollow region of the first hollow framework 110 to locate tin cream coating module 11 quickly and accurately with the fixation that cooperates of the protuberance 100 of pedestal 10.At this moment, the operator can be coated with tin cream on tin cream coated panel 111, and tin cream can be coated with hole 1110 by tin cream and be applied on the corresponding tin ball 21, to finish the coating operation.
In the present embodiment, after being coated with tin cream and tin cream coating module 11 disengaging pedestals 10 on the tin ball 21, shown in Fig. 3 B, load bearing seat 12 can be arranged at pedestal 10, and the supporting region 121 of load bearing seat 12 is covered in bga chip 2.Particularly, after being coated with tin cream on the tin ball 21, the user can be coated with tin cream module 11 and remove on pedestal 10, and load bearing seat 12 is arranged at pedestal 10.Because the size of the protuberance 100 of the corresponding pedestal 10 of the size of the disposal area 120 of load bearing seat 12, therefore, when load bearing seat 12 is set, selection will have the one side of disposal area 120 in the face of pedestal 10, and disposal area 120 will be sheathed on the protuberance 100 of pedestal 10.At this moment, the supporting region 121 of load bearing seat 12 can be covered on the bga chip 2.Because the degree of depth of supporting region 121 is greater than the height of bga chip 2, therefore, bga chip 2 can not run in the bottom surface of supporting region 121 yet, can avoid wiping off the tin cream on the tin ball 21 thus.
In the present embodiment, shown in Fig. 3 C, at this moment, pedestal 10, bga chip 2 and load bearing seat 12 upsets promptly can be inverted and come, make bga chip 2 be carried in the supporting region 121.Again pedestal 10 is removed subsequently.
In the present embodiment, shown in Fig. 3 D, at this moment, the user can utilize vacsorb spare 13 to draw bga chip 2 in the supporting region 121 of load bearing seat 12.In the present embodiment, vacsorb spare 13 can be vacuum WAND.Yet the utility model is not done any qualification to this.The user is behind the starting switch 130 that starts vacsorb spare 13, and its inner power-equipment (figure does not show) can be positioned at the bga chip 2 of suction nozzle 131 belows to suction nozzle 131 part extracting vacuum with absorption.Because bga chip 2 is to be upside down in the supporting region 121, the one side that tin ball 21 (shown in Fig. 3 B) is promptly arranged is the bottom in the face of supporting region 121, therefore, when drawing bga chip 2, can not run into tin ball 21, to avoid wiping off the tin cream on the tin ball 21.In addition, adopt the mode of vacsorb can avoid damaging bga chip 2.
In sum, tin cream that preferred embodiment of the present utility model provides coating servicing unit is that the tin ball to integrated circuit (IC) chip directly is coated with tin cream, has replaced in the conventional art operation to the PAD coating tin cream of circuit board.And, utilize the setting in tin cream coating hole in the tin cream coating module, can play pinpoint effect, thereby avoid the phenomenon of tin cream short circuit.After tin cream coating operation is finished, utilize upset pedestal, integrated circuit (IC) chip and load bearing seat, the feasible integrated circuit (IC) chip placed face down that has been coated with tin cream is damaged the tin ball when avoiding taking out integrated circuit (IC) chip.In addition, compared to the mode of taking out integrated circuit (IC) chip with tweezers, the utility model preferred embodiment adopts the mode of vacsorb can further avoid damaging integrated circuit (IC) chip.
Though the utility model discloses as above with preferred embodiment; right its is not in order to limit the utility model; anyly have the knack of this skill person; in not breaking away from spirit and scope of the present utility model; when doing a little change and retouching, therefore protection range of the present utility model is as the criterion when looking claims person of defining.
Claims (10)
1. a tin cream coating servicing unit in order to be coated with tin cream on the tin ball that aids in integrated circuit (IC) chip, is characterized in that, described tin cream coating servicing unit comprises:
Pedestal is in order to carry described integrated circuit (IC) chip;
Tin cream coating module, in order to be arranged at described pedestal, described tin cream coating module has tin cream coating hole, the position of the corresponding described tin ball in position in described tin cream coating hole;
Load bearing seat has supporting region, and after being coated with the coating of tin cream and described tin cream on the described tin ball module breaks away from described pedestal, described load bearing seat is in order to being arranged at described pedestal, and described supporting region is covered in described integrated circuit (IC) chip; And
Vacsorb spare, when described pedestal, described integrated circuit (IC) chip and the upset of described load bearing seat made that described integrated circuit (IC) chip is carried in the described supporting region, described vacsorb spare was in order to draw described integrated circuit (IC) chip in described supporting region.
2. tin cream according to claim 1 coating servicing unit is characterized in that described pedestal has protuberance, and described protuberance has the depressed area, and the size of the corresponding described integrated circuit (IC) chip of the size of described depressed area is to carry described integrated circuit (IC) chip.
3. tin cream coating servicing unit according to claim 2, it is characterized in that described load bearing seat also has the disposal area, described supporting region is positioned at described disposal area, and the size of the described protuberance of the corresponding described pedestal of the size of described disposal area is with ccontaining described protuberance.
4. tin cream coating servicing unit according to claim 2 is characterized in that described pedestal also has exhaust hole, is positioned at the bottom of described depressed area.
5. tin cream coating servicing unit according to claim 2, it is characterized in that, described protuberance comprises first protruding part and second protruding part that is provided with at interval, described first protruding part has first depressed part, described second protruding part has second depressed part, and described first depressed part and described second depressed part form described depressed area.
6. tin cream coating servicing unit according to claim 1, it is characterized in that, described tin cream coating module comprises the first hollow framework, the second hollow framework and the tin cream coated panel that interfixes, described tin cream coated panel is located between described first hollow framework and the described second hollow framework, and described tin cream coated panel has described tin cream coating hole.
7. tin cream coating servicing unit according to claim 6, it is characterized in that, the described first hollow framework has reference column, described tin cream coated panel has first location hole, the described second hollow framework has second location hole, and described reference column is arranged in described first location hole and described second location hole.
8. tin cream coating servicing unit according to claim 1 is characterized in that described load bearing seat has exhaust hole, is positioned at described supporting region.
9. tin cream coating servicing unit according to claim 1 is characterized in that the degree of depth of described supporting region is greater than the height of described integrated circuit (IC) chip.
10. tin cream coating servicing unit according to claim 1 is characterized in that the bottom of described supporting region has two steps of establishing relatively, in order to carry the relative both sides of described integrated circuit (IC) chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202024864U CN201846534U (en) | 2010-05-21 | 2010-05-21 | Solder paste coating aid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202024864U CN201846534U (en) | 2010-05-21 | 2010-05-21 | Solder paste coating aid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201846534U true CN201846534U (en) | 2011-05-25 |
Family
ID=44041406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202024864U Expired - Fee Related CN201846534U (en) | 2010-05-21 | 2010-05-21 | Solder paste coating aid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201846534U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103917050A (en) * | 2014-04-22 | 2014-07-09 | 无锡市同步电子制造有限公司 | PCB special device manual printing method |
-
2010
- 2010-05-21 CN CN2010202024864U patent/CN201846534U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103917050A (en) * | 2014-04-22 | 2014-07-09 | 无锡市同步电子制造有限公司 | PCB special device manual printing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20140319 Address after: Suzhou City, Jiangsu province Jinfeng Road 215011 No. 233 Patentee after: Maintek Computer (Suzhou) Co., Ltd. Patentee after: Pegatron Corporation Address before: Suzhou City, Jiangsu province Jinfeng Road 215011 No. 233 Patentee before: Maintek Computer (Suzhou) Co., Ltd. Patentee before: Pegatron Corporation |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110525 Termination date: 20140521 |