CN211321669U - Paster device is used in integrated circuit board processing - Google Patents

Paster device is used in integrated circuit board processing Download PDF

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Publication number
CN211321669U
CN211321669U CN202020368744.XU CN202020368744U CN211321669U CN 211321669 U CN211321669 U CN 211321669U CN 202020368744 U CN202020368744 U CN 202020368744U CN 211321669 U CN211321669 U CN 211321669U
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China
Prior art keywords
circuit board
vacuum
upper portion
integrated circuit
paster
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CN202020368744.XU
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Chinese (zh)
Inventor
张敏
王朝晖
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Nanjing Putao Electronic Equipment Manufacturing Co ltd
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Nanjing Putao Electronic Equipment Manufacturing Co ltd
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Abstract

The utility model relates to a circuit board processing technology field just discloses a paster device is used in integrated circuit board processing, the on-line screen storage device comprises a base, fixed mounting has rotating device in the middle of the upper portion of base, rotating device's upper portion fixed mounting has the lift post, the upper portion fixed mounting of lift post has the installation cloud platform, one side fixed mounting of installation cloud platform has the telescopic link, the one end bottom fixed mounting of telescopic link has the support column, the bottom fixed mounting of support column has the connecting plate. This paster device is used in integrated circuit board processing has vacuum fixing device through the middle part fixed mounting who places the platform, and has seted up long banding suction hole on vacuum fixing device to be connected vacuum fixing device through connecting pipe and vacuum device, be convenient for fix the circuit board through vacuum device and vacuum fixing device, avoid the circuit board to take place to rock and the dislocation at the in-process of paster, guarantee the paster quality of circuit board.

Description

Paster device is used in integrated circuit board processing
Technical Field
The utility model relates to a circuit board processing technology field specifically is a paster device is used in integrated circuit board processing.
Background
The circuit board is important constitutional part among the smart machine, in circuit board production and processing process, often need laminate some electrical component to the circuit board on, but current paster device intelligent degree is low, and the artificial mode control paster distance is adopted to most of all, leads to production efficiency greatly reduced, and simultaneously when the paster, probably because under the unstable condition of voltage, when leading to the paster device paster, can be too big to the circuit board application of force to cause the damage to the circuit board.
And in the traditional paster technology of circuit board, need dedicated anchor clamps to press from both sides tight fixedly to the circuit board, however this kind of fixed mode causes excessively tight easily, causes the damage to the circuit board, moreover, carries out the paster operation to every circuit board, all will carry out the dismouting change, trouble very, and the cost of labor improves, and production efficiency is underneath, consequently, needs the novel paster device of a circuit board production.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a paster device is used in integrated circuit board processing possesses the advantage of fixed effectual, the spoilage that reduces the circuit board, has solved the problem mentioned among the above-mentioned background art.
The utility model provides a following technical scheme: a paster device for processing an integrated circuit board comprises a base, wherein a rotating device is fixedly mounted in the middle of the upper portion of the base, a lifting column is fixedly mounted on the upper portion of the rotating device, an installation holder is fixedly mounted on the upper portion of the lifting column, a telescopic rod is fixedly mounted on one side of the installation holder, a support column is fixedly mounted at the bottom of one end of the telescopic rod, a connecting plate is fixedly mounted at the bottom of the support column, the bottom of the connecting plate is fixedly connected to one end of a first spring, the other end of the first spring is fixedly connected to a suction nozzle, a cylinder is fixedly mounted in the middle of the upper portion of the suction nozzle, the upper end of the cylinder is movably mounted in the support column, a placing table is fixedly mounted below the suction nozzle, a vacuum fixing device is movably mounted in the middle of the, the other end of the connecting pipe is fixedly connected to the vacuum device, the bottom of the placing table is movably sleeved with a fixing block, the upper portion of the fixing block is fixedly connected to the bottom of the second spring, and the upper portion of the second spring is fixedly connected to the inner wall of the placing table.
Carefully, the installation cloud platform is the cross boss, the quantity of telescopic link is four, four the telescopic link is equidistant to be installed in a week of installation cloud platform.
Carefully selecting, the support column is the circular cone form cylinder, the round hole has been seted up to the bottom of support column, the diameter value of round hole is greater than cylindrical diameter value.
Carefully, place the platform and the quantity of vacuum fixing device is eight, eight place the platform and the vacuum fixing device all be the circular ring equidistant install the upper portion at the base.
Carefully selecting, the bottom of base is cavity, the inside fixed mounting of base has vacuum apparatus.
Carefully, rectangular suction hole has been seted up at vacuum fixing device's middle part, the quantity of rectangular suction hole is three.
Compared with the prior art, the utility model discloses possess following beneficial effect:
1. this paster device is used in integrated circuit board processing has vacuum fixing device through the middle part fixed mounting who places the platform, and has seted up long banding suction hole on vacuum fixing device to be connected vacuum fixing device through connecting pipe and vacuum device, be convenient for fix the circuit board through vacuum device and vacuum fixing device, avoid the circuit board to take place to rock and the dislocation at the in-process of paster, guarantee the paster quality of circuit board.
2. This paster device is used in integrated circuit board processing has spring two through the middle part fixed mounting placing platform and fixed block to middle part fixed mounting at support column and suction nozzle has spring one, is convenient for make the suction nozzle carry out elastic contact when carrying out the paster with placing the epaxial circuit board of platform through spring one and spring two, avoids under the unstable condition of voltage, can be too big to the circuit board application of force when leading to paster device paster, thereby causes the damage to the circuit board.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a bottom view of the structure of the present invention;
FIG. 3 is a schematic view of the suction nozzle of the present invention;
fig. 4 is an explosion diagram of the placing table of the present invention.
In the figure: 1. a base; 2. a rotating device; 3. a lifting column; 4. mounting a holder; 5. a telescopic rod; 6. a support pillar; 7. a suction nozzle; 8. a first spring; 9. a cylinder; 10. a connecting plate; 11. a placing table; 12. a vacuum fixture; 13. a connecting pipe; 14. a second spring; 15. a fixed block; 16. and (4) a vacuum device.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, a chip mounting device for integrated circuit board processing comprises a base 1, wherein the bottom of the base 1 is hollow, a vacuum device 16 is fixedly installed inside the base 1, the vacuum device 16 is fixedly connected with eight vacuum fixing devices 12, eight vacuum fixing devices 12 and chips and circuit boards on the upper portions of the vacuum fixing devices are fixedly installed, a rotating device 2 is fixedly installed in the middle of the upper portion of the base 1, a lifting column 3 is fixedly installed on the upper portion of the rotating device 2, an installation platform 4 is fixedly installed on the upper portion of the lifting column 3, the installation platform 4 is a cross-shaped boss, the number of telescopic rods 5 is four, four telescopic rods 5 are installed on one circle of the installation platform 4 at equal intervals, four telescopic rods 5 and suction nozzles 7 are installed on four branches of the installation platform 4 at equal intervals, single processing efficiency is improved conveniently, the telescopic rods 5 are fixedly installed on one side of the installation, the bottom of one end of the telescopic rod 5 is fixedly provided with a supporting column 6, the supporting column 6 is a conical cylinder, the bottom of the supporting column 6 is provided with a round hole, the diameter value of the round hole is larger than that of the cylinder 9, the diameter value of the cylinder 9 is two centimeters, the diameter value of the round hole is two and five centimeters, the cylinder 9 is sleeved with the supporting column 6, the suction nozzle 7 at the bottom of the supporting column 6 is convenient to buffer, the bottom of the supporting column 6 is fixedly provided with a connecting plate 10, the bottom of the connecting plate 10 is fixedly connected to one end of a spring I8, a spring I8 is fixedly arranged in the middle of the supporting column 6 and the suction nozzle 7, the suction nozzle 7 is convenient to elastically contact with a circuit board on a placing table 11 during pasting through the spring I8, and the phenomenon that the force applied to the circuit board is overlarge when the pasting device is, the other end of the first spring 8 is fixedly connected to the suction nozzle 7, a cylinder 9 is fixedly installed in the middle of the upper portion of the suction nozzle 7, the upper end of the cylinder 9 is movably installed inside the supporting column 6, a placing table 11 is fixedly installed below the suction nozzle 7, the number of the placing tables 11 and the number of the vacuum fixing devices 12 are eight, the eight placing tables 11 and the vacuum fixing devices 12 are installed on the upper portion of the base 1 in a circular ring shape at equal intervals, the eight placing tables 11 are respectively used for placing circuit boards and patches at intervals, the circuit boards are convenient to patch and process and are fixed under the fixing of the vacuum fixing devices 12, the circuit boards are prevented from shaking and dislocating, the vacuum fixing devices 12 are movably installed in the middle of the placing tables 11, long suction holes are formed in the middle of the vacuum fixing devices 12, the number of the long suction holes is three, and the vacuum, the vacuum fixing device 12 is provided with a strip-shaped suction hole, the vacuum fixing device 12 is connected with the vacuum device 16 through the connecting pipe 13, the circuit board is conveniently fixed through the vacuum device 16 and the vacuum fixing device 12, the circuit board is prevented from shaking and dislocation in the process of chip mounting, the chip mounting quality of the circuit board is ensured, the bottom of the vacuum fixing device 12 is fixedly connected with the connecting pipe 13, the other end of the connecting pipe 13 is fixedly connected on the vacuum device 16, the bottom of the placing table 11 is movably sleeved with the fixing block 15, the upper part of the fixing block 15 is fixedly connected at the bottom of the spring II 14, the spring II 14 is fixedly arranged in the middle of the placing table 11 and the fixing block 15, the suction nozzle 7 is conveniently in elastic contact with the circuit board on the placing table 11 during chip mounting through the spring II 14, and the problem that the chip mounting device is caused by unstable voltage is avoided, the circuit board is damaged due to excessive force applied to the circuit board, and the upper part of the second spring 14 is fixedly connected to the inner wall of the placing table 11.
The working principle is as follows: during the use, placing paster and circuit board spaced through the conveyer of upper level on placing platform 11, paster and circuit board are all through vacuum fixing device 12 and 16 fixed mounting in the upper portion of placing platform 11 of vacuum device, make and place platform 11 and paster and circuit board and tightly laminate, avoided carrying out the during operation, the circuit board can rotate on placing platform 11 upper portion, make the paster position take place the skew easily, thereby influence the paster quality, and with suction nozzle 7 suction under the vacuum effect of computer and get the paster, then through lift post 3, rotating device 2 and telescopic link 5 drive suction nozzle 7 and do the side-to-side movement from top to bottom, make suction nozzle 7 and laminate each other with the paster circuit board, and make the paster laminate to the corresponding position of circuit board, can.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Simultaneously in the utility model discloses an in the drawing, fill the pattern and just do not do any other injecions for distinguishing the picture layer.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a paster device is used in integrated circuit board processing, includes base (1), its characterized in that: the improved automatic lifting device is characterized in that a rotating device (2) is fixedly mounted in the middle of the upper portion of the base (1), a lifting column (3) is fixedly mounted on the upper portion of the rotating device (2), an installation holder (4) is fixedly mounted on the upper portion of the lifting column (3), a telescopic rod (5) is fixedly mounted on one side of the installation holder (4), a supporting column (6) is fixedly mounted at the bottom of one end of the telescopic rod (5), a connecting plate (10) is fixedly mounted at the bottom of the supporting column (6), the bottom of the connecting plate (10) is fixedly connected to one end of a first spring (8), the other end of the first spring (8) is fixedly connected to a suction nozzle (7), a cylinder (9) is fixedly mounted in the middle of the upper portion of the suction nozzle (7), the upper end of the cylinder (9) is movably mounted inside the supporting column (6), and a placing, the vacuum fixing device (12) is movably mounted in the middle of the placing table (11), a connecting pipe (13) is fixedly connected to the bottom of the vacuum fixing device (12), the other end of the connecting pipe (13) is fixedly connected to a vacuum device (16), a fixing block (15) is movably sleeved on the bottom of the placing table (11), the upper portion of the fixing block (15) is fixedly connected to the bottom of a second spring (14), and the upper portion of the second spring (14) is fixedly connected to the inner wall of the placing table (11).
2. A chip mounting apparatus for integrated circuit board fabrication according to claim 1, wherein: the installation cloud platform (4) are the cross boss, the quantity of telescopic link (5) is four, four telescopic link (5) are equidistant to be installed in a week of installation cloud platform (4).
3. A chip mounting apparatus for integrated circuit board fabrication according to claim 1, wherein: the support column (6) is a conical cylinder, a round hole is formed in the bottom of the support column (6), and the diameter value of the round hole is larger than that of the cylinder (9).
4. A chip mounting apparatus for integrated circuit board fabrication according to claim 1, wherein: the number of the placing tables (11) and the number of the vacuum fixing devices (12) are eight, and the eight placing tables (11) and the eight vacuum fixing devices (12) are all installed on the upper portion of the base (1) in a circular ring shape at equal intervals.
5. A chip mounting apparatus for integrated circuit board fabrication according to claim 1, wherein: the bottom of the base (1) is hollow, and a vacuum device (16) is fixedly installed inside the base (1).
6. A chip mounting apparatus for integrated circuit board fabrication according to claim 1, wherein: the middle part of the vacuum fixing device (12) is provided with strip-shaped air suction holes, and the number of the strip-shaped air suction holes is three.
CN202020368744.XU 2020-03-20 2020-03-20 Paster device is used in integrated circuit board processing Active CN211321669U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020368744.XU CN211321669U (en) 2020-03-20 2020-03-20 Paster device is used in integrated circuit board processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020368744.XU CN211321669U (en) 2020-03-20 2020-03-20 Paster device is used in integrated circuit board processing

Publications (1)

Publication Number Publication Date
CN211321669U true CN211321669U (en) 2020-08-21

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CN202020368744.XU Active CN211321669U (en) 2020-03-20 2020-03-20 Paster device is used in integrated circuit board processing

Country Status (1)

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CN (1) CN211321669U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113038711A (en) * 2021-03-05 2021-06-25 合肥高地创意科技有限公司 Paster device is used in integrated circuit board processing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113038711A (en) * 2021-03-05 2021-06-25 合肥高地创意科技有限公司 Paster device is used in integrated circuit board processing

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