CN111806066A - Ceramic substrate through-hole coating mechanism - Google Patents
Ceramic substrate through-hole coating mechanism Download PDFInfo
- Publication number
- CN111806066A CN111806066A CN202010756604.4A CN202010756604A CN111806066A CN 111806066 A CN111806066 A CN 111806066A CN 202010756604 A CN202010756604 A CN 202010756604A CN 111806066 A CN111806066 A CN 111806066A
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- Prior art keywords
- hole
- ceramic substrate
- guide rail
- steel plate
- transmission guide
- Prior art date
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- 239000000919 ceramic Substances 0.000 title claims abstract description 88
- 239000000758 substrate Substances 0.000 title claims abstract description 82
- 239000011248 coating agent Substances 0.000 title claims abstract description 41
- 238000000576 coating method Methods 0.000 title claims abstract description 41
- 230000007246 mechanism Effects 0.000 title claims abstract description 21
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 56
- 239000010959 steel Substances 0.000 claims abstract description 56
- 230000005540 biological transmission Effects 0.000 claims abstract description 51
- 239000002002 slurry Substances 0.000 claims description 47
- 239000007788 liquid Substances 0.000 claims description 8
- 230000003028 elevating effect Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 239000004020 conductor Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000007790 scraping Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0804—Machines for printing sheets
- B41F15/0813—Machines for printing sheets with flat screens
- B41F15/0818—Machines for printing sheets with flat screens with a stationary screen and a moving squeegee
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
- B41F15/36—Screens, Frames; Holders therefor flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/44—Squeegees or doctors
- B41F15/46—Squeegees or doctors with two or more operative parts
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a ceramic substrate through hole coating mechanism which comprises a machine base, a through hole jig and a steel plate net positioning frame, wherein the through hole jig and the steel plate net positioning frame are arranged on the machine base, the through hole jig is movably arranged below the steel plate net positioning frame, a first transmission guide rail is arranged at the bottom of the through hole jig, the steel plate net positioning frame is arranged on one side of the first transmission guide rail, the through hole jig is connected to the first transmission guide rail in a sliding mode, a ceramic substrate placing station is arranged on the through hole jig, a through hole needle block is movably arranged at the bottom of the ceramic substrate placing station corresponding to the through hole position of a ceramic substrate, a lifting rod is connected to the bottom of the through hole needle block, the shape of the through hole needle block corresponds to the shape of the through hole of the ceramic substrate, a coating gap is formed between the through hole wall of the ceramic substrate, a. The invention can realize that the through hole of the ceramic substrate is coated with a conductive layer in a wall hanging way.
Description
Technical Field
The invention relates to the technical field of ceramic substrate production equipment, in particular to a ceramic substrate through hole coating mechanism.
Background
The ceramic substrate may have various forms of lead conductors. The lead conductor may be formed, for example, by forming an internal conductive film extending along an interface between predetermined ceramic layers or a via conductor penetrating through predetermined ceramic layers in the ceramic substrate, or may be formed by forming an external conductive film extending along an outer surface of the ceramic substrate. The ceramic substrate can be used for mounting thereon a semiconductor chip component or other chip components, and also for interconnection between these electronic components. Lead conductors may be used to form electrical pathways for interconnection between these components. The ceramic substrate can also be used, for example, in an LCR hybrid high frequency device in the field of mobile communication terminal equipment; a composite device composed of an active element (e.g., a semiconductor IC chip) and a passive element (e.g., a capacitor, an inductor, or a resistor) in the field of computers; or a simple semiconductor IC package. In particular, ceramic substrates have been widely used in the manufacture of various electronic components, such as Power Amplifier (PA) module substrates, Radio Frequency (RF) diode switches, filters, patch antennas, various packaged devices, and hybrid devices.
The ceramic filter realizes the functions by printing a circuit on the surface of ceramic and welding the circuit board, and the silver has the advantages of strong conductive capability, thermal expansion coefficient close to that of a porcelain blank, good thermal stability, capability of directly welding metal on a silver layer and the like, and is used as an electrode material of the ceramic filter.
The conductive silver paste is one of the key materials of the filter, and the conductivity of the conductive silver paste and the compactness of the conductive layer formed by the conductive silver paste have important influence on the performance of the filter, so that manufacturers of the silver paste and the ceramic filter pay attention to the conductive silver paste and the ceramic filter.
Although the existing method for spraying a conductive layer on the outer surface of a ceramic substrate can be completed by adopting a plurality of spraying devices, the spraying can not be carried out on the through hole position of the ceramic substrate.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a through hole coating mechanism for a ceramic substrate, which can coat a conductive layer on a through hole of the ceramic substrate in a wall hanging manner.
The technical scheme of the invention is as follows:
a ceramic substrate through hole coating mechanism is used for coating a conductive layer on a through hole of a ceramic substrate and comprises a base, a through hole jig and a steel plate mesh positioning frame, wherein the through hole jig and the steel plate mesh positioning frame are arranged on the base, the through hole jig is movably arranged below the steel plate mesh positioning frame, a first transmission guide rail is arranged at the bottom of the through hole jig, the steel plate mesh positioning frame is positioned at one side of the first transmission guide rail, the through hole jig is connected on the first transmission guide rail in a sliding manner, a ceramic substrate placing station is arranged on the through hole jig and is matched with a ceramic substrate, a through hole needle block is movably arranged at the bottom of the ceramic substrate placing station corresponding to the through hole position of the ceramic substrate, the bottom of the through hole needle block is connected with a lifting rod, and the shape of the through hole needle block corresponds to the shape of the through hole of the ceramic substrate, and a coating gap is formed between the ceramic substrate and the wall of the through hole, a steel plate net for filling slurry is placed on the steel plate net positioning frame, and a slurry dripping gap corresponding to the coating gap is formed in the steel plate net.
Furthermore, the slurry dripping gap is composed of a plurality of slurry dripping small holes.
Furthermore, the bottom of the through hole jig is also provided with a first lifting device, and the through hole jig is connected to the first transmission guide rail through the first lifting device in a sliding manner.
Furthermore, a transmission manipulator is movably arranged above the other side of the first transmission guide rail, a second transmission guide rail is arranged on one side of the transmission manipulator, and the transmission manipulator is connected with the second transmission guide rail in a sliding mode.
Further, still be provided with down the feed bin on the frame, it is located to lower the feed bin one side of second transmission guide rail.
Furthermore, a plurality of layers of placing plates are arranged in the lower storage bin at equal intervals along the vertical direction, and a plurality of ceramic substrates to be processed can be placed on each layer of placing plates.
Furthermore, the periphery of the through-hole needle block is provided with a slurry collecting gap corresponding to the coating gap, a slurry collecting box is arranged below the ceramic substrate placing station, and the slurry collecting box is communicated with the slurry collecting gap.
Further, a vacuum blower is arranged in the slurry collecting box.
Further, still be provided with thick liquids on the frame and push away and scrape the device, thick liquids push away and scrape the device and include support, third transmission guide rail, second elevating gear and scraper, the support sets up one side of steel sheet net locating rack, third transmission guide rail is located on the support, and along the transverse direction setting of steel sheet net, the scraper passes through second elevating gear with third transmission guide rail sliding connection, the scraper activity sets up the top of steel sheet net with second elevating gear's output is connected.
Furthermore, four corners on the steel plate mesh positioning frame are provided with positioning devices for fixing the steel plate mesh, each positioning device comprises a positioning block and a positioning cylinder, and the positioning blocks are movably arranged above the steel plate mesh positioning frame and driven to lift by the positioning cylinders.
Compared with the prior art, the invention has the beneficial effects that: the invention can realize that the through hole of the ceramic substrate is coated with a conductive layer in a wall-hanging way, the whole process is continuous, and the production efficiency is high.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic plan view of one side of a ceramic substrate according to the present invention;
FIG. 2 is a schematic plan view of another side of the ceramic substrate according to the present invention;
FIG. 3 is a schematic structural diagram of a through-hole coating mechanism for a ceramic substrate according to the present invention;
FIG. 4 is a schematic diagram of the through-hole coating mechanism for a ceramic substrate according to the present invention;
FIG. 5 is a schematic view of the through-hole pin block of the present invention engaged with a through-hole of a ceramic substrate;
fig. 6 is a schematic plan view of the steel plate net according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In order to explain the technical means of the present invention, the following description will be given by way of specific examples.
Examples
An embodiment of the present invention provides a through hole coating mechanism for a ceramic substrate, which is used to coat a conductive layer on a through hole of the ceramic substrate, and as for the structure of the ceramic substrate, reference may be made to fig. 1 and 2, where "+" - "denotes a through hole 11 of the ceramic substrate. "blind holes 12 of the ceramic substrate. It should be noted that the shapes of the through hole 11 and the blind hole 12 in the drawings are only for examples, and the shapes thereof are not limited thereto.
Referring to fig. 3 and 4, the ceramic substrate through-hole coating mechanism includes a base 21, a lower bin 22 disposed on the base 21, a through-hole jig 23, a steel mesh positioning frame 24, a transmission manipulator 25, and a slurry scraping device 26, wherein the through-hole jig 23 is movably disposed below the steel mesh positioning frame 24, a first lifting device 27 is disposed at the bottom of the through-hole jig 23, a first transmission guide rail 28 is disposed at the bottom of the first lifting device 27, the first lifting device 27 is slidably connected to the first transmission guide rail 28, the through-hole jig 23 can reciprocate left and right along the first transmission guide rail 28, the lower bin 22 and the steel mesh positioning frame 24 are respectively disposed at two sides of the first transmission guide rail 28, a plurality of layers of placing plates are disposed in the lower bin 22 at equal intervals along a vertical direction, and a plurality of ceramic substrates to be processed can be placed on each layer of placing plates. The plurality of layers of placing plates can be discharged according to a set layer by layer, the transmission manipulator 25 is movably arranged above the through hole jig 23, a second transmission guide rail is arranged on one side of the transmission manipulator 25, the transmission manipulator 25 is connected with the second transmission guide rail in a sliding mode, the transmission manipulator 25 can reciprocate back and forth along the second transmission guide rail, and the discharging bin 22 is located on one side of the second transmission guide rail. To this end, roughly work flow does, unloading storehouse 22 unloading, and at first, the one side that ceramic substrate has blind hole 12 is for down, snatchs a ceramic substrate by transmission manipulator 25 and puts through-hole tool 23 on the location fixed, and through-hole tool 23 removes the below of steel sheet net locating rack 24 and to ceramic substrate's through-hole 11 coating one deck conducting layer after accomplishing, and through-hole tool 23 resets, snatchs ceramic substrate by transmission manipulator 25 and transmits next process.
Specifically, a ceramic substrate placing station 231 is arranged on the through hole jig 23, the ceramic substrate placing station 231 is matched with the ceramic substrate, a through hole needle block 232 is movably arranged at the bottom of the ceramic substrate placing station 231 corresponding to the position of a through hole 11 of the ceramic substrate, a lifting rod is connected to the bottom of the through hole needle block 232, the through hole needle block 232 is driven by the lifting rod to reciprocate up and down, as shown in fig. 5, the shape of the through hole needle block 232 corresponds to the shape of the through hole 11 of the ceramic substrate, a coating gap 233 is formed between the through hole needle block and the wall of the through hole 11 of the ceramic substrate, a steel plate mesh 3 for filling slurry is placed on the steel plate mesh positioning frame 24, positioning devices 241 for fixing the steel plate mesh 3 are arranged at four corners on the steel plate mesh positioning frame 24, each positioning device 241 comprises a positioning block and a positioning cylinder, the positioning block is movably arranged above the steel plate mesh positioning frame 24 and, when the steel plate net 3 is placed, an interval for placing the steel plate net 3 is formed between the positioning block and the steel plate net positioning frame 24, after the steel plate net 3 is completely placed, the positioning block descends to position and fix the steel plate net 3, a slurry dripping gap 31 corresponding to the coating gap 233 is formed in the steel plate net 3, and as shown in fig. 6, the slurry dripping gap 31 is composed of a plurality of slurry dripping small holes. The theory of operation, snatch a ceramic substrate by transmission manipulator 25 and put ceramic substrate and place the location fixed on station 231, through-hole needle piece 232 jack-up, and form coating clearance 233 between ceramic substrate's the through-hole 11 pore wall, through-hole tool 23 takes ceramic substrate to move to the below of steel sheet net 3 after that, through-hole tool 23 rises for coating clearance 233 aims at thick liquids and drips space 31, then pours thick liquids into in the steel sheet net 3, thick liquids are then dripped coating clearance 233 by thick liquids dripping space 31. Further, a slurry collecting gap corresponding to the coating gap 233 is further formed in the peripheral side of the through-hole needle block 232, a slurry collecting box 29 is arranged below the ceramic substrate placing station 231, the slurry collecting box 29 is communicated with the slurry collecting gap, and a vacuum blower is arranged in the slurry collecting box 29. After the coating gap 233 is coated, the vacuum blower is started to suck the slurry from the coating gap 233 so as to achieve the effect of wall hanging and realize coating the slurry on the wall of the through hole 1. The slurry collecting box 29 at the bottom can collect redundant slurry, the redundant slurry flows into the slurry collecting box 29 from the slurry collecting gap, the inflow of the redundant slurry can be accelerated under the action of the vacuum blower, and the collection of the redundant slurry is accelerated. The steel plate net 3 can be detached and replaced, and when detached, the positioning block is lifted, and at this time, the steel plate net 3 can be pulled out.
The slurry pushing and scraping device 26 is used for pushing and scraping slurry on the steel plate mesh 3, and is helpful for maintaining smoothness of the slurry and pushing the slurry to the slurry dropping gap 31, specifically, the slurry pushing and scraping device 26 includes a bracket 261, a third transmission guide rail 262, a second lifting device 263 and a scraper 264, the bracket 261 is disposed on one side of the steel plate mesh positioning frame 24, the third transmission guide rail 262 is disposed on the bracket 261 and is disposed along a transverse direction of the steel plate mesh 3, the scraper 264 is slidably connected with the third transmission guide rail 262 through the second lifting device 263, the scraper 264 can reciprocate left and right along the third transmission guide rail 262, the scraper 264 is movably disposed above the steel plate mesh 3 and is connected with an output end of the second lifting device 263, and the second lifting device 263 can drive the scraper 264 to reciprocate up and down. In this embodiment, the two scrapers 264 are symmetrically arranged, the second lifting device 263 includes two lifting cylinders, and each lifting cylinder is correspondingly connected with one scraper 264.
In this embodiment, a slurry collecting tray 4 is further disposed on one side of the steel expanded metal 3, and when the steel expanded metal 3 is replaced, the scraper 264 needs to move above the slurry collecting tray 4 to make room for replacing the steel expanded metal 3, but at the same time, the slurry on the scraper 264 may drip, so that the slurry collecting tray 4 needs to be used to receive the dripping slurry.
After the coating of the through-hole 11 is completed, the through-hole jig 23 is reset, and the ceramic substrate is grabbed by the transfer robot 25 and transferred to the next process.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a ceramic substrate through-hole coating mechanism for to the through-hole coating one deck conducting layer of ceramic substrate which characterized in that: the ceramic substrate through hole coating mechanism comprises a machine base, a through hole jig and a steel plate net positioning frame, wherein the through hole jig and the steel plate net positioning frame are arranged on the machine base, the through hole jig is movably arranged below the steel plate net positioning frame, a first transmission guide rail is arranged at the bottom of the through hole jig, the steel plate net positioning frame is arranged on one side of the first transmission guide rail, the through hole jig is connected onto the first transmission guide rail in a sliding mode, a ceramic substrate placing station is arranged on the through hole jig and matched with a ceramic substrate, a through hole needle block is movably arranged at the bottom of the ceramic substrate placing station corresponding to the through hole position of the ceramic substrate, a lifting rod is connected to the bottom of the through hole needle block, the shape of the through hole needle block corresponds to the shape of the through hole of the ceramic substrate, a coating gap is formed between the through hole needle block and the through hole of the ceramic substrate, and a steel plate net used, and slurry dripping gaps corresponding to the coating gaps are formed in the steel plate net.
2. The through-hole coating mechanism for ceramic substrates as claimed in claim 1, wherein: the slurry dripping gap is composed of a plurality of slurry dripping pores.
3. The through-hole coating mechanism for ceramic substrates as claimed in claim 1, wherein: the bottom of the through hole jig is also provided with a first lifting device, and the through hole jig is connected to the first transmission guide rail through the first lifting device in a sliding manner.
4. The through-hole coating mechanism for ceramic substrates as claimed in claim 1, wherein: the transmission manipulator is movably arranged above the other side of the first transmission guide rail, a second transmission guide rail is arranged on one side of the transmission manipulator, and the transmission manipulator is connected with the second transmission guide rail in a sliding mode.
5. The through-hole coating mechanism for ceramic substrates as claimed in claim 4, wherein: and the base is also provided with a blanking bin which is positioned at one side of the second transmission guide rail.
6. The through-hole coating mechanism for ceramic substrates as claimed in claim 5, wherein: and a plurality of layers of placing plates are arranged in the lower storage bin at equal intervals along the vertical direction, and a plurality of ceramic substrates to be processed can be placed on each layer of placing plates.
7. The through-hole coating mechanism for ceramic substrates as claimed in claim 1, wherein: the side of the through-hole needle block is provided with a slurry collecting gap corresponding to the coating gap, a slurry collecting box is arranged below the ceramic substrate placing station, and the slurry collecting box is communicated with the slurry collecting gap.
8. The through-hole coating mechanism for ceramic substrates as claimed in claim 7, wherein: a vacuum blower is arranged in the slurry collection box.
9. The through-hole coating mechanism for ceramic substrates as claimed in claim 1, wherein: still be provided with thick liquids on the frame and push away and scrape the device, thick liquids push away and scrape the device and include support, third transmission guide rail, second elevating gear and scraper, the support sets up one side of steel sheet net locating rack, third transmission guide rail is located on the support, and along the transverse direction of steel sheet net sets up, the scraper passes through second elevating gear with third transmission guide rail sliding connection, the scraper activity sets up the top of steel sheet net with second elevating gear's output is connected.
10. The through-hole coating mechanism for ceramic substrates as claimed in claim 1, wherein: four corners on the steel plate mesh positioning frame are provided with positioning devices used for fixing the steel plate mesh, each positioning device comprises a positioning block and a positioning cylinder, and the positioning blocks are movably arranged above the steel plate mesh positioning frame and driven to lift through the positioning cylinders.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010756604.4A CN111806066B (en) | 2020-07-31 | 2020-07-31 | Ceramic substrate through hole coating mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010756604.4A CN111806066B (en) | 2020-07-31 | 2020-07-31 | Ceramic substrate through hole coating mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111806066A true CN111806066A (en) | 2020-10-23 |
| CN111806066B CN111806066B (en) | 2024-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010756604.4A Active CN111806066B (en) | 2020-07-31 | 2020-07-31 | Ceramic substrate through hole coating mechanism |
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| Country | Link |
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| CN (1) | CN111806066B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113829743A (en) * | 2021-09-17 | 2021-12-24 | 方飞鸿 | Power converter ferrite ceramic substrate production line group based on electric light source |
| CN115635765A (en) * | 2022-12-26 | 2023-01-24 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Ceramic package tube shell pore wall metallization mould and screen printing equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103862838A (en) * | 2013-07-17 | 2014-06-18 | 昆山双特科技有限公司 | PCB (printed circuit board) printing all-in-one machine |
| CN104259057A (en) * | 2014-09-18 | 2015-01-07 | 中国建筑材料科学研究总院 | Vacuum pasting equipment |
| CN106658997A (en) * | 2016-12-29 | 2017-05-10 | 中国电子科技集团公司第二研究所 | Printing mechanism for raw ceramic chip through hole wall metallization |
| CN212446678U (en) * | 2020-07-31 | 2021-02-02 | 东莞市微格能自动化设备有限公司 | Ceramic substrate through-hole coating mechanism |
-
2020
- 2020-07-31 CN CN202010756604.4A patent/CN111806066B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103862838A (en) * | 2013-07-17 | 2014-06-18 | 昆山双特科技有限公司 | PCB (printed circuit board) printing all-in-one machine |
| CN104259057A (en) * | 2014-09-18 | 2015-01-07 | 中国建筑材料科学研究总院 | Vacuum pasting equipment |
| CN106658997A (en) * | 2016-12-29 | 2017-05-10 | 中国电子科技集团公司第二研究所 | Printing mechanism for raw ceramic chip through hole wall metallization |
| CN212446678U (en) * | 2020-07-31 | 2021-02-02 | 东莞市微格能自动化设备有限公司 | Ceramic substrate through-hole coating mechanism |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113829743A (en) * | 2021-09-17 | 2021-12-24 | 方飞鸿 | Power converter ferrite ceramic substrate production line group based on electric light source |
| CN113829743B (en) * | 2021-09-17 | 2023-11-03 | 方飞鸿 | Ferrite ceramic substrate production line group of power converter based on electric light source |
| CN115635765A (en) * | 2022-12-26 | 2023-01-24 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Ceramic package tube shell pore wall metallization mould and screen printing equipment |
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| CN111806066B (en) | 2024-05-14 |
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