CN111806066B - Ceramic substrate through hole coating mechanism - Google Patents
Ceramic substrate through hole coating mechanism Download PDFInfo
- Publication number
- CN111806066B CN111806066B CN202010756604.4A CN202010756604A CN111806066B CN 111806066 B CN111806066 B CN 111806066B CN 202010756604 A CN202010756604 A CN 202010756604A CN 111806066 B CN111806066 B CN 111806066B
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- Prior art keywords
- hole
- ceramic substrate
- steel plate
- guide rail
- plate mesh
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- 239000000919 ceramic Substances 0.000 title claims abstract description 90
- 239000000758 substrate Substances 0.000 title claims abstract description 85
- 239000011248 coating agent Substances 0.000 title claims abstract description 44
- 238000000576 coating method Methods 0.000 title claims abstract description 44
- 230000007246 mechanism Effects 0.000 title claims abstract description 22
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 56
- 239000010959 steel Substances 0.000 claims abstract description 56
- 239000002002 slurry Substances 0.000 claims abstract description 54
- 230000005540 biological transmission Effects 0.000 claims abstract description 47
- 238000007790 scraping Methods 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 4
- 230000003028 elevating effect Effects 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0804—Machines for printing sheets
- B41F15/0813—Machines for printing sheets with flat screens
- B41F15/0818—Machines for printing sheets with flat screens with a stationary screen and a moving squeegee
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
- B41F15/36—Screens, Frames; Holders therefor flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/44—Squeegees or doctors
- B41F15/46—Squeegees or doctors with two or more operative parts
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a ceramic substrate through hole coating mechanism which comprises a machine base, a through hole jig and a steel plate mesh positioning frame, wherein the through hole jig and the steel plate mesh positioning frame are arranged on the machine base, the through hole jig is movably arranged below the steel plate mesh positioning frame, a first transmission guide rail is arranged at the bottom of the through hole jig, the steel plate mesh positioning frame is positioned on one side of the first transmission guide rail, the through hole jig is connected to the first transmission guide rail in a sliding manner, a ceramic substrate placing station is arranged on the through hole jig, a through hole needle block is movably arranged at the bottom of the ceramic substrate placing station and corresponds to the through hole position of a ceramic substrate, the bottom of the through hole needle block is connected with a lifting rod, the shape of the through hole needle block corresponds to the through hole shape of the ceramic substrate, a coating gap is formed between the through hole needle block and the through hole wall of the ceramic substrate, the steel plate mesh positioning frame is provided with a slurry dripping gap corresponding to the coating gap. The invention can realize coating a conductive layer on the through hole of the ceramic substrate in a wall hanging mode.
Description
Technical Field
The invention relates to the technical field of ceramic substrate production equipment, in particular to a ceramic substrate through hole coating mechanism.
Background
The ceramic substrate may have various forms of lead conductors. For example, an internal conductive film extending along an interface between predetermined ceramic layers or a via conductor penetrating through the predetermined ceramic layers may be formed in the ceramic substrate, or an external conductive film extending along an outer surface of the ceramic substrate may be formed in the lead conductor. Ceramic substrates may be used for mounting semiconductor chip components or other chip components thereon, as well as for interconnecting such electronic components. The lead conductors may be used to form electrical pathways interconnecting these components. The ceramic substrate can also be used, for example, in LCR hybrid high frequency devices in the field of mobile communication terminal equipment; a composite device composed of an active element (e.g., a semiconductor IC chip) and a passive element (e.g., a capacitor, an inductor, or a resistor) in the computer field; or a simple semiconductor IC package. In particular, ceramic substrates have been widely used in the manufacture of various electronic components, such as Power Amplifier (PA) module substrates, radio Frequency (RF) diode switches, filters, chip antennas, various packaged devices, and hybrid devices.
The ceramic filter realizes the function by printing a circuit on the surface of the ceramic and welding with a circuit board, and silver has the advantages of strong electric conduction capacity, thermal expansion coefficient close to that of a porcelain blank, good thermal stability, capability of directly welding metal on a silver layer and the like, and is used as an electrode material of the ceramic filter.
Conductive silver paste is one of key materials of the filter, and the conductive performance of the conductive silver paste and the compactness of a conductive layer formed by the conductive silver paste have important influence on the performance of the filter, so that the silver paste and ceramic filter manufacturers pay attention to the key points.
The conventional spraying of a conductive layer on the outer surface of a ceramic substrate can be accomplished by using a plurality of spraying devices, but the spraying cannot be performed on the position of the through hole of the ceramic substrate.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a ceramic substrate through hole coating mechanism which can coat a conductive layer on a through hole of a ceramic substrate in a wall hanging mode.
The technical scheme of the invention is as follows:
The utility model provides a ceramic substrate through-hole coating mechanism for to ceramic substrate's through-hole coating one deck conducting layer, this ceramic substrate through-hole coating mechanism includes the frame, sets up through-hole tool and steel sheet net locating rack on the frame, the through-hole tool activity sets up the below of steel sheet net locating rack, the bottom of through-hole tool is provided with first transmission guide rail, steel sheet net locating rack is located one side of first transmission guide rail, through-hole tool sliding connection is in on the first transmission guide rail, be equipped with ceramic substrate on the through-hole tool and place the station, ceramic substrate places the station and ceramic substrate looks adaptation, ceramic substrate places the bottom of station and corresponds the through-hole position activity of ceramic substrate and be provided with the through-hole needle piece, the bottom of through-hole needle piece is connected with the lifter, the shape of through-hole needle piece corresponds with ceramic substrate's through-hole shape to form the coating clearance with between the through-hole pore wall of ceramic substrate, place on the steel sheet net locating rack and be used for packing into thick liquids the steel sheet net, set up with the thick liquids that correspond to coat the clearance drops.
Further, the slurry dripping gap is formed by a plurality of slurry dripping small holes.
Further, a first lifting device is further arranged at the bottom of the through hole jig, and the through hole jig is connected to the first transmission guide rail in a sliding manner through the first lifting device.
Further, a transmission manipulator is movably arranged above the other side of the first transmission guide rail, a second transmission guide rail is arranged on one side of the transmission manipulator, and the transmission manipulator is in sliding connection with the second transmission guide rail.
Further, a discharging bin is further arranged on the base and is located on one side of the second conveying guide rail.
Further, a plurality of layers of placing plates are arranged in the discharging bin at equal intervals along the vertical direction, and each layer of placing plate can be used for placing a plurality of ceramic substrates to be processed.
Further, a slurry collecting gap corresponding to the coating gap is formed in the peripheral side of the through hole needle block, a slurry collecting box is arranged below the ceramic substrate placing station, and the slurry collecting box is communicated with the slurry collecting gap.
Further, a vacuum blower is arranged in the slurry collecting box.
Further, the machine base is further provided with a slurry pushing and scraping device, the slurry pushing and scraping device comprises a support, a third transmission guide rail, a second lifting device and a scraper, the support is arranged on one side of the steel plate mesh positioning frame, the third transmission guide rail is located on the support and arranged along the transverse direction of the steel plate mesh, the scraper is in sliding connection with the third transmission guide rail through the second lifting device, and the scraper is movably arranged above the steel plate mesh and is connected with the output end of the second lifting device.
Further, four corners on the steel plate mesh locating frame are provided with locating devices for fixing the steel plate mesh, each locating device comprises a locating block and a locating cylinder, and the locating blocks are movably arranged above the steel plate mesh locating frame and are driven to lift through the locating cylinders.
Compared with the prior art, the invention has the beneficial effects that: the invention can realize coating a conductive layer on the through hole of the ceramic substrate in a wall hanging mode, and the whole process has continuous working procedures and high production efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic plan view of one side of a ceramic substrate according to the present invention;
FIG. 2 is a schematic plan view of the other side of the ceramic substrate according to the present invention;
FIG. 3 is a schematic structural view of a ceramic substrate through-hole coating mechanism according to the present invention;
FIG. 4 is a schematic diagram of the operation of a ceramic substrate via coating mechanism according to the present invention;
FIG. 5 is a schematic diagram showing the fit between the through-hole pin block and the through-hole of the ceramic substrate according to the present invention;
Fig. 6 is a schematic plan view of a steel sheet mesh according to the present invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In order to illustrate the technical scheme of the invention, the following description is made by specific examples.
Examples
The embodiment of the invention provides a ceramic substrate through hole coating mechanism, which is used for coating a conductive layer on a through hole of a ceramic substrate, and regarding the structure of the ceramic substrate, reference can be made to fig. 1 and 2, wherein "+" - "in the drawing is the through hole 11 of the ceramic substrate. "blind holes 12 of the ceramic substrate. It should be noted that the shapes of the through holes 11 and the blind holes 12 in the drawings are only for illustration, and are not limited to the shapes thereof.
Referring to fig. 3 and 4, the ceramic substrate through hole coating mechanism comprises a base 21, a lower bin 22 arranged on the base 21, a through hole jig 23, a steel plate mesh positioning frame 24, a transmission manipulator 25 and a slurry pushing and scraping device 26, wherein the through hole jig 23 is movably arranged below the steel plate mesh positioning frame 24, a first lifting device 27 is arranged at the bottom of the through hole jig 23, a first transmission guide rail 28 is arranged at the bottom of the first lifting device 27, the first lifting device 27 is in sliding connection with the first transmission guide rail 28, the through hole jig 23 can reciprocate left and right along the first transmission guide rail 28, the lower bin 22 and the steel plate mesh positioning frame 24 are respectively positioned at two sides of the first transmission guide rail 28, a plurality of placement plates are arranged in the lower bin 22 at equal intervals along the vertical direction, and each placement plate can be used for placing a plurality of ceramic substrates to be processed. The plate can be placed on a plurality of layers and unloading is carried out according to setting gradually, and transmission manipulator 25 activity sets up in the top of through-hole tool 23, and one side of transmission manipulator 25 is provided with the second transmission guide rail, and transmission manipulator 25 and second transmission guide rail sliding connection, transmission manipulator 25 can follow second transmission guide rail back and forth reciprocating motion, and lower feed bin 22 is located one side of second transmission guide rail. The general working procedure is that the blanking of the blanking bin 22 is started, one surface of the ceramic substrate with the blind hole 12 is downward, a ceramic substrate is grabbed by the transmission manipulator 25 and is placed on the through hole jig 23 for positioning and fixing, then the through hole jig 23 moves to the lower part of the steel plate net positioning frame 24 to coat a conductive layer on the through hole 11 of the ceramic substrate, after the completion, the through hole jig 23 is reset, and the ceramic substrate is grabbed by the transmission manipulator 25 and is transmitted to the next procedure.
Specifically, the through hole fixture 23 is provided with a ceramic substrate placing station 231, the ceramic substrate placing station 231 is adapted to the ceramic substrate, a through hole needle block 232 is movably arranged at the bottom of the ceramic substrate placing station 231 corresponding to the position of the through hole 11 of the ceramic substrate, the bottom of the through hole needle block 232 is connected with a lifting rod, the through hole needle block 232 drives up and down reciprocating motion through the lifting rod, as shown in fig. 5, the shape of the through hole needle block 232 corresponds to the shape of the through hole 11 of the ceramic substrate, a coating gap 233 is formed between the shape of the through hole needle block 232 and the wall of the through hole 11 of the ceramic substrate, a steel plate net 3 for filling slurry is placed on the steel plate net positioning frame 24, four corners on the steel plate net positioning frame 24 are respectively provided with a positioning device 241 for fixing the steel plate net 3, the positioning device 241 comprises a positioning block and a positioning cylinder, the positioning block is movably arranged above the steel plate net positioning frame 24, when the steel plate net 3 is placed, a space for filling the steel plate net 3 is formed between the positioning block and the steel plate net positioning frame 24 through the lifting cylinder, after the positioning block 3 is completely filled, the steel plate net 3 is fixed by dropping the steel plate net 3, and the slurry is dropped into the gap 31, as shown by the coating gap 31, and the holes are formed by the dropping holes 31. The working principle is that a ceramic substrate is grabbed by a transmission manipulator 25 and placed on a ceramic substrate placing station 231 for positioning and fixing, a through hole needle block 232 is jacked up to form a coating gap 233 with the wall of a through hole 11 of the ceramic substrate, then a through hole jig 23 moves to the lower side of a steel plate net 3 with the ceramic substrate, the through hole jig 23 is lifted up, the coating gap 233 is aligned with a slurry dripping gap 31, then slurry is poured into the steel plate net 3, and the slurry is dripped into the coating gap 233 through the slurry dripping gap 31. Further, a slurry collecting gap corresponding to the coating gap 233 is further provided on the peripheral side of the through hole needle block 232, a slurry collecting box 29 is provided below the ceramic substrate placing station 231, the slurry collecting box 29 is communicated with the slurry collecting gap, and a vacuum blower is provided in the slurry collecting box 29. After the coating gap 233, a vacuum blower is started to suck the slurry from the coating gap 233 so as to achieve the wall-hanging effect and realize the coating of the slurry on the wall of the through hole 1. The slurry collecting box 29 at the bottom can collect redundant slurry, and the redundant slurry flows into the slurry collecting box 29 from the slurry collecting gap, so that the inflow of the redundant slurry can be accelerated under the action of the vacuum blower, and the collection of the redundant slurry is accelerated. In addition, the steel plate net 3 can be detached and replaced, and when the steel plate net 3 is detached, the positioning block is lifted, and at the moment, the steel plate net 3 can be pulled out.
Regarding the slurry pushing and scraping device 26, which is used for pushing and scraping the slurry on the steel plate net 3, and is helpful for maintaining the smoothness of the slurry and pushing the slurry to the slurry dripping gap 31, specifically, the slurry pushing and scraping device 26 includes a support 261, a third conveying rail 262, a second lifting device 263 and a scraper 264, the support 261 is disposed on one side of the steel plate net positioning frame 24, the third conveying rail 262 is disposed on the support 261 and is disposed along the transverse direction of the steel plate net 3, the scraper 264 is slidably connected with the third conveying rail 262 through the second lifting device 263, the scraper 264 can reciprocate left and right along the third conveying rail 262, the scraper 264 is movably disposed above the steel plate net 3 and is connected with the output end of the second lifting device 263, and the second lifting device 263 can drive the scraper 264 to reciprocate up and down. In this embodiment, two scrapers 264 are symmetrically disposed, and the second lifting device 263 includes two lifting cylinders, where each lifting cylinder is correspondingly connected to one scraper 264.
In this embodiment, a slurry collecting tray 4 is further provided on one side of the steel plate net 3, and the slurry collecting tray 4 is used for changing the steel plate net 3, and the doctor blade 264 needs to be moved above the slurry collecting tray 4 to make room for changing the steel plate net 3, but at the same time, the slurry on the doctor blade 264 may drop, so that the slurry collecting tray 4 needs to be used for receiving the dropped slurry.
After the coating of the through holes 11 is completed, the through hole jig 23 is reset, and the ceramic substrate is grasped by the transmission manipulator 25 and transmitted to the next process.
The foregoing description of the preferred embodiment of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (10)
1. The utility model provides a ceramic substrate through-hole coating mechanism for to ceramic substrate's through-hole coating one deck conducting layer, its characterized in that: the ceramic substrate through hole coating mechanism comprises a machine base, a through hole jig and a steel plate mesh positioning frame, wherein the through hole jig and the steel plate mesh positioning frame are arranged on the machine base, the through hole jig is movably arranged below the steel plate mesh positioning frame, a first transmission guide rail is arranged at the bottom of the through hole jig, the steel plate mesh positioning frame is positioned on one side of the first transmission guide rail, the through hole jig is slidably connected onto the first transmission guide rail, a ceramic substrate placing station is arranged on the through hole jig, the ceramic substrate placing station is matched with the ceramic substrate, a through hole needle block is movably arranged at the bottom of the ceramic substrate placing station, corresponding to the through hole position of the ceramic substrate, a lifting rod is connected at the bottom of the through hole needle block, the shape of the through hole needle block corresponds to that of the ceramic substrate, a coating gap is formed between the through hole needle block and the through hole wall of the ceramic substrate, a steel plate mesh used for loading slurry is placed on the steel plate mesh positioning frame, and a slurry dripping gap corresponding to the coating gap is formed on the steel plate mesh.
2. The ceramic substrate through-hole coating mechanism of claim 1, wherein: the slurry dripping gap is composed of a plurality of slurry dripping small holes.
3. The ceramic substrate through-hole coating mechanism of claim 1, wherein: the bottom of through-hole tool still is provided with a elevating gear, the through-hole tool passes through a elevating gear sliding connection is in on the first transmission guide rail.
4. The ceramic substrate through-hole coating mechanism of claim 1, wherein: the upper part of the other side of the first transmission guide rail is movably provided with a transmission manipulator, one side of the transmission manipulator is provided with a second transmission guide rail, and the transmission manipulator is in sliding connection with the second transmission guide rail.
5. The ceramic substrate through-hole coating mechanism of claim 4, wherein: and a discharging bin is further arranged on the base and is positioned on one side of the second transmission guide rail.
6. The ceramic substrate through-hole coating mechanism of claim 5, wherein: a plurality of layers of placing plates are arranged in the discharging bin at equal intervals along the vertical direction, and each layer of placing plates can be used for placing a plurality of ceramic substrates to be processed.
7. The ceramic substrate through-hole coating mechanism of claim 1, wherein: the periphery of the through hole needle block is provided with a slurry collecting gap corresponding to the coating gap, a slurry collecting box is arranged below the ceramic substrate placing station, and the slurry collecting box is communicated with the slurry collecting gap.
8. The ceramic substrate through-hole coating mechanism of claim 7, wherein: a vacuum blower is arranged in the slurry collecting box.
9. The ceramic substrate through-hole coating mechanism of claim 1, wherein: the machine seat is further provided with a slurry pushing and scraping device, the slurry pushing and scraping device comprises a support, a third transmission guide rail, a second lifting device and a scraper, the support is arranged on one side of the steel plate mesh positioning frame, the third transmission guide rail is located on the support and is arranged along the transverse direction of the steel plate mesh, the scraper is in sliding connection with the third transmission guide rail through the second lifting device, and the scraper is movably arranged above the steel plate mesh and is connected with the output end of the second lifting device.
10. The ceramic substrate through-hole coating mechanism of claim 1, wherein: four corners on the steel plate mesh locating frame are all provided with locating devices for fixing the steel plate mesh, each locating device comprises a locating block and a locating cylinder, and the locating blocks are movably arranged above the steel plate mesh locating frame and are driven to lift through the locating cylinders.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010756604.4A CN111806066B (en) | 2020-07-31 | 2020-07-31 | Ceramic substrate through hole coating mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010756604.4A CN111806066B (en) | 2020-07-31 | 2020-07-31 | Ceramic substrate through hole coating mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111806066A CN111806066A (en) | 2020-10-23 |
| CN111806066B true CN111806066B (en) | 2024-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010756604.4A Active CN111806066B (en) | 2020-07-31 | 2020-07-31 | Ceramic substrate through hole coating mechanism |
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| Country | Link |
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| CN (1) | CN111806066B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113829743B (en) * | 2021-09-17 | 2023-11-03 | 方飞鸿 | Ferrite ceramic substrate production line group of power converter based on electric light source |
| CN115635765B (en) * | 2022-12-26 | 2023-03-07 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Ceramic packaging tube shell pore wall metallization die and screen printing equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103862838A (en) * | 2013-07-17 | 2014-06-18 | 昆山双特科技有限公司 | PCB (printed circuit board) printing all-in-one machine |
| CN104259057A (en) * | 2014-09-18 | 2015-01-07 | 中国建筑材料科学研究总院 | Vacuum pasting equipment |
| CN106658997A (en) * | 2016-12-29 | 2017-05-10 | 中国电子科技集团公司第二研究所 | Printing mechanism for raw ceramic chip through hole wall metallization |
| CN212446678U (en) * | 2020-07-31 | 2021-02-02 | 东莞市微格能自动化设备有限公司 | Ceramic substrate through-hole coating mechanism |
-
2020
- 2020-07-31 CN CN202010756604.4A patent/CN111806066B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103862838A (en) * | 2013-07-17 | 2014-06-18 | 昆山双特科技有限公司 | PCB (printed circuit board) printing all-in-one machine |
| CN104259057A (en) * | 2014-09-18 | 2015-01-07 | 中国建筑材料科学研究总院 | Vacuum pasting equipment |
| CN106658997A (en) * | 2016-12-29 | 2017-05-10 | 中国电子科技集团公司第二研究所 | Printing mechanism for raw ceramic chip through hole wall metallization |
| CN212446678U (en) * | 2020-07-31 | 2021-02-02 | 东莞市微格能自动化设备有限公司 | Ceramic substrate through-hole coating mechanism |
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| Publication number | Publication date |
|---|---|
| CN111806066A (en) | 2020-10-23 |
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