CN218887008U - Solid-state capacitor rapid chip mounting mechanism - Google Patents
Solid-state capacitor rapid chip mounting mechanism Download PDFInfo
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- CN218887008U CN218887008U CN202320019291.3U CN202320019291U CN218887008U CN 218887008 U CN218887008 U CN 218887008U CN 202320019291 U CN202320019291 U CN 202320019291U CN 218887008 U CN218887008 U CN 218887008U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a quick paster mechanism of solid-state electric capacity, including lower plate and upper cover plate, the lower plate is swing joint with the upper cover plate, the lower plate is equipped with the constant head tank, electric capacity positioning die has been placed to the constant head tank, the upper cover plate is equipped with the tin cream steel mesh, the tin cream steel mesh is adjusted well with electric capacity positioning die. The capacitor positioning die is used for positioning the solid capacitor. Through putting into electric capacity positioning die with solid-state electric capacity, can fix a position solid-state electric capacity, place electric capacity positioning die again in the constant head tank of lower plate, cover the upper cover plate, scrape the one deck back with the tin cream on the tin cream steel mesh of upper cover plate, the mesh position of tin cream steel mesh leaves tin cream and adhesion on the pin of solid-state electric capacity, the problem of the quick brush tin cream of solid-state electric capacity pin has been solved, the manual work has been solved and has been put the big and inefficiency problem of solid-state electric capacity positional deviation on tai tan circuit board, realize the artifical problem of fixing a position the paster fast of solid-state electric capacity, and the efficiency is improved, and the production cost is reduced.
Description
Technical Field
The utility model relates to a solid-state capacitor equipment technical field, especially quick paster mechanism of solid-state electric capacity.
Background
At present, the solid capacitor of the Titan circuit board cannot be automatically pasted by a chip mounter during rework, and needs to be manually placed one by one, so that the production efficiency is low and the production cost is high.
In order to improve the reworking efficiency, the utility model provides a solid-state electric capacity quick paster mechanism.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above shortcoming of prior art, the utility model provides a quick paster mechanism of solid-state electric capacity to improve reworking efficiency and reduction in production cost.
The utility model provides a technical scheme that its technical problem adopted is: solid-state electric capacity quick paster mechanism, including lower plate and upper cover plate, lower plate and upper cover plate are swing joint, the lower plate is equipped with the constant head tank, the electric capacity positioning die who is used for fixing a position solid-state electric capacity is placed to the constant head tank, the upper cover plate is equipped with the tin cream steel mesh, the tin cream steel mesh is adjusted well with electric capacity positioning die.
As a further improvement of the utility model: the capacitor positioning die is provided with a plurality of capacitor positioning holes.
As a further improvement of the utility model: the capacitor positioning holes are distributed in two symmetrical L-shaped arrangements.
As a further improvement of the utility model: the capacitor positioning die is provided with 16 capacitor positioning holes, wherein 8 capacitor positioning holes are distributed in an L-shaped arrangement mode.
As a further improvement of the utility model: the capacitor positioning hole is circular.
As a further improvement of the utility model: the solder paste steel mesh is provided with a plurality of meshes, and the meshes are overlapped with the pins of the solid-state capacitor.
As a further improvement of the utility model: a plurality of the meshes are distributed in two symmetrical L-shaped arrangements.
As a further improvement of the utility model: the solder paste steel mesh is provided with 32 meshes, and the 32 meshes are respectively superposed with the positions of the pins of the solid-state capacitors.
As a further improvement of the utility model: the capacitor positioning die is provided with a PCB positioning hole, the PCB positioning hole corresponds to the positioning pin of the PCB, and the PCB positioning hole is used for positioning the PCB.
As a further improvement of the utility model: the electric capacity positioning die is equipped with 4 PCB board locating holes, PCB board locating hole symmetric distribution is in electric capacity positioning die's both sides.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a be equipped with electric capacity positioning die and can fix a position solid-state electric capacity, put into electric capacity positioning die with solid-state electric capacity, place electric capacity positioning die again into the constant head tank of lower plate, cover the upper cover plate, scrape the one deck with the tin cream on the tin cream steel mesh of upper cover plate after, the mesh position of tin cream steel mesh leaves tin cream and adhesion on the pin of solid-state electric capacity, has solved the problem that solid-state electric capacity pin brushed the tin cream fast.
2. The utility model discloses a capacitance positioning die once can fix a position a plurality of solid-state electric capacities, has solved the manual work and has put the problem that solid-state electric capacity positional deviation is big and inefficiency on the tai tan circuit board, realizes the artifical quick location paster's of solid-state electric capacity problem, and lifting efficiency reduces production cost.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is the assembly schematic diagram of the capacitor positioning mold and the solid capacitor of the present invention.
Fig. 3 is an exploded view of the capacitor positioning mold and the solid capacitor of the present invention.
Reference numerals: 1. a lower base plate; 2. an upper cover plate; 3. a solder paste steel mesh; 4. a capacitor positioning die; 5. a solid state capacitor; 6. a PCB board positioning hole; 7. and (6) capacitor positioning holes.
Detailed Description
In this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The invention will now be further described with reference to the accompanying drawings, in which:
referring to fig. 1-3, the solid-state capacitor fast mounting mechanism includes a lower plate 1 and an upper cover plate 2, the lower plate 1 is movably connected to the upper cover plate 2, the lower plate 1 is provided with a positioning groove, a capacitor positioning mold 4 is placed in the positioning groove, the upper cover plate 2 is provided with a solder paste steel mesh 3, and the solder paste steel mesh 3 is aligned with the capacitor positioning mold 4.
The capacitor positioning mould 4 is used for positioning the solid capacitor 5. Through putting into electric capacity positioning die 4 with solid-state electric capacity 5, can fix a position solid-state electric capacity 5, place electric capacity positioning die 4 again and go into the constant head tank of lower plate, cover upper cover plate 2, scrape the one deck back with the tin cream on the tin cream steel mesh 3 of upper cover plate 2, the mesh position of tin cream steel mesh 3 leaves tin cream and adhesion on solid-state electric capacity's pin, has solved the problem that solid-state electric capacity pin brushed the tin cream fast. Through electric capacity positioning die 4 once can fix a position a plurality of solid state electric capacity, solved the manual work and put the problem that solid state electric capacity positional deviation is big and the inefficiency on the taitan circuit board, realize the artifical quick location paster's of solid state electric capacity problem, raise the efficiency, reduction in production cost.
The capacitor positioning die 4 is provided with a plurality of capacitor positioning holes 7, and the capacitor positioning holes 7 are used for positioning the solid capacitors.
Preferably, the plurality of capacitor positioning holes 7 are arranged and distributed in two symmetrical L shapes.
Preferably, the capacitor positioning mold 4 is provided with 16 capacitor positioning holes 7, wherein each 8 capacitor positioning holes 7 are arranged in an L shape.
Preferably, the capacitor positioning hole 7 is circular.
The solder paste steel mesh 3 is provided with a plurality of meshes, and the meshes are superposed with the pin positions of the solid-state capacitors 5.
Preferably, a plurality of the meshes are distributed in two symmetrical L-shaped arrangements.
Preferably, the solder paste steel mesh 3 is provided with 32 meshes, and the 32 meshes are respectively overlapped with the pin positions of the solid-state capacitor.
The capacitor positioning die 4 is provided with a PCB positioning hole 6, the PCB positioning hole 6 corresponds to a positioning pin of the PCB, and the PCB positioning hole 6 is used for positioning the PCB.
Preferably, the capacitor positioning mold 4 is provided with 4 PCB positioning holes 6, and the PCB positioning holes 6 are symmetrically distributed on two sides of the capacitor positioning mold 4.
Preferably, the PCB positioning hole is circular.
The PCB locating hole of the capacitor positioning die 4 corresponds to the locating pin of the PCB and is positioned, the capacitor positioning die 4 is taken away after the PCB is turned over for 180 degrees after the capacitor positioning die is aligned, and at the moment, the solid capacitor 5 is attached to the PCB, so that the solid capacitor 5 and the solder paste are quickly pasted and mounted.
The utility model discloses a theory of operation:
the frame of the quick paster mechanism of solid-state electric capacity is formed by lower plate 1 and 2 combinations of apron, and electric capacity positioning die 4 is put in the constant head tank of lower plate 1, and the fretwork position installation tin cream steel mesh 3 of upper cover plate 2 closes back tin cream steel mesh 3 and electric capacity positioning die 4 and adjusts well. The specific process is as follows:
firstly, as shown in fig. 3, a capacitor positioning die 4 designs directional positioning characteristics on the capacitor positioning die 4 according to the structural characteristics of a solid capacitor, and 16 solid capacitors 5 are manually installed in the capacitor positioning die 4 in the direction of the capacitor positioning die 4; after installation, the effect is as shown in fig. 2, the solid capacitor pin faces upwards and is fixed in the direction;
placing a capacitor positioning die 4 into a positioning groove of a lower base plate 1 in the figure 1, and then covering an upper cover plate 2, wherein the mesh of a solder paste steel mesh 3 on the upper cover plate 2 is superposed with the solid capacitor pin;
after the solder paste is scraped on the solder paste steel mesh 3 by a layer, the solder paste is left at the mesh position of the solder paste steel mesh 3 and is adhered to the solid-state capacitor pin;
opening the upper cover plate 1, taking out the capacitor positioning die 4, covering the PCB on the capacitor positioning die 4, correspondingly positioning the PCB positioning hole of the capacitor positioning die 4 and the positioning pin of the PCB, turning the PCB 180 degrees after aligning, taking away the capacitor positioning die 4, attaching the solid capacitor 5 on the PCB, and completing the rapid mounting of the solid capacitor and the solder paste;
the capacitor positioning die 4 is used for loading the solid capacitor for the next time, the capacitor positioning die 4 is provided with a plurality of capacitors, uninterrupted circulating operation can be realized, the operation time is improved from the original 200 seconds to 30 seconds, and the production efficiency is improved.
The first embodiment is as follows:
solid-state electric capacity quick paster mechanism, including lower plate 1 and upper cover plate 2, lower plate 1 is swing joint with upper cover plate 2, lower plate 1 is equipped with the constant head tank, electric capacity positioning die 4 has been placed to the constant head tank, upper cover plate 2 is equipped with tin cream steel mesh 3, tin cream steel mesh 3 is adjusted well with electric capacity positioning die 4. The capacitor positioning mold 4 is used for positioning the solid capacitor 5. Through putting into electric capacity positioning die 4 with solid-state electric capacity 5, can fix a position solid-state electric capacity 5, place electric capacity positioning die 4 again and go into the constant head tank of lower plate 1, cover upper cover plate 2, scrape the one deck back with the tin cream on the tin cream steel mesh 3 of upper cover plate 2, the mesh position of tin cream steel mesh 3 leaves the tin cream and the adhesion on solid-state electric capacity 5's pin, has solved the problem that solid-state electric capacity 5 pins brushed the tin cream fast. Can once fix a position a plurality of solid state electric capacity 5 through electric capacity positioning die 4, solve the manual work and put the big and inefficiency problem of solid state electric capacity positional deviation on the tai tan circuit board, realize the artifical problem of quick location paster of solid state electric capacity, raise the efficiency, reduction in production cost.
The second embodiment is as follows:
solid-state electric capacity quick paster mechanism, including lower plate 1 and upper cover plate 2, lower plate 1 is swing joint with upper cover plate 2, lower plate 1 is equipped with the constant head tank, electric capacity positioning die 4 has been placed to the constant head tank, upper cover plate 2 is equipped with tin cream steel mesh 3, tin cream steel mesh 3 is adjusted well with electric capacity positioning die 4. The capacitor positioning mould 4 is used for positioning the solid capacitor 5. Through putting into electric capacity positioning die 4 with solid-state electric capacity 5, can fix a position solid-state electric capacity 5, place electric capacity positioning die 4 again and put into the constant head tank of lower plate, cover upper cover plate 2, scrape the one deck back with the tin cream on the tin cream steel mesh 3 of upper cover plate 2, the mesh position of tin cream steel mesh 3 leaves the tin cream and the adhesion on solid-state electric capacity's pin, has solved the problem that solid-state electric capacity pin brushed the tin cream fast. Can once fix a position a plurality of solid state electric capacity through electric capacity positioning die 4, solve artifical putting the big and inefficiency problem of solid state electric capacity positional deviation on tai tan circuit board, realize the artifical problem of quick location paster of solid state electric capacity, raise the efficiency, reduction in production cost.
The capacitor positioning die 4 is provided with a plurality of capacitor positioning holes 7, and the capacitor positioning holes 7 are used for positioning the solid capacitors. The capacitor positioning holes 7 are distributed in two symmetrical L-shaped arrangements. The capacitor positioning hole 7 is circular.
The solder paste steel mesh 3 is provided with a plurality of meshes, and the meshes are superposed with the pins of the solid-state capacitor. A plurality of the meshes are distributed in two symmetrical L-shaped arrangements.
The third embodiment is as follows:
solid-state electric capacity quick paster mechanism, including lower plate 1 and upper cover plate 2, lower plate 1 is swing joint with upper cover plate 2, lower plate 1 is equipped with the constant head tank, electric capacity positioning die 4 has been placed to the constant head tank, upper cover plate 2 is equipped with tin cream steel mesh 3, tin cream steel mesh 3 is adjusted well with electric capacity positioning die 4. The capacitor positioning mould 4 is used for positioning the solid capacitor 5. Through putting into electric capacity positioning die 4 with solid-state electric capacity 5, can fix a position solid-state electric capacity 5, place electric capacity positioning die 4 again and put into the constant head tank of lower plate, cover upper cover plate 2, scrape the one deck back with the tin cream on the tin cream steel mesh 3 of upper cover plate 2, the mesh position of tin cream steel mesh 3 leaves the tin cream and the adhesion on solid-state electric capacity's pin, has solved the problem that solid-state electric capacity pin brushed the tin cream fast. Can once fix a position a plurality of solid state electric capacity through electric capacity positioning die 4, solve artifical putting the big and inefficiency problem of solid state electric capacity positional deviation on tai tan circuit board, realize the artifical problem of quick location paster of solid state electric capacity, raise the efficiency, reduction in production cost. The capacitor positioning die 4 is provided with a plurality of capacitor positioning holes 7, and the capacitor positioning holes 7 are used for positioning the solid capacitors. The capacitor positioning holes 7 are distributed in two symmetrical L-shaped arrangement. The capacitor positioning hole 7 is circular. The solder paste steel mesh 3 is provided with a plurality of meshes, and the meshes are superposed with the pins of the solid-state capacitor. A plurality of the meshes are distributed in two symmetrical L-shaped arrangements.
The capacitor positioning die 4 is provided with a PCB positioning hole, the PCB positioning hole corresponds to the positioning pin of the PCB, and the PCB positioning hole is used for positioning the PCB, and the PCB positioning hole is circular. The PCB locating hole of the capacitor positioning die 4 corresponds to the locating pin of the PCB and is positioned, the capacitor positioning die 4 is taken away after the PCB is turned over for 180 degrees after the capacitor positioning die is aligned, and the solid capacitor 5 is attached to the PCB, so that the solid capacitor and the solder paste are quickly pasted.
The third embodiment is as follows:
solid-state electric capacity quick paster mechanism, including lower plate 1 and upper cover plate 2, lower plate 1 is swing joint with upper cover plate 2, lower plate 1 is equipped with the constant head tank, electric capacity positioning die 4 has been placed to the constant head tank, upper cover plate 2 is equipped with tin cream steel mesh 3, tin cream steel mesh 3 is adjusted well with electric capacity positioning die 4. The capacitor positioning mould 4 is used for positioning the solid capacitor 5. Through putting into electric capacity positioning die 4 with solid-state electric capacity 5, can fix a position solid-state electric capacity 5, place electric capacity positioning die 4 again and put into the constant head tank of lower plate, cover upper cover plate 2, scrape the one deck back with the tin cream on the tin cream steel mesh 3 of upper cover plate 2, the mesh position of tin cream steel mesh 3 leaves the tin cream and the adhesion on solid-state electric capacity's pin, has solved the problem that solid-state electric capacity pin brushed the tin cream fast. Can once fix a position a plurality of solid state electric capacity through electric capacity positioning die 4, solve artifical putting the big and inefficiency problem of solid state electric capacity positional deviation on tai tan circuit board, realize the artifical problem of quick location paster of solid state electric capacity, raise the efficiency, reduction in production cost.
The capacitor positioning die 4 is provided with 16 capacitor positioning holes 7, wherein 8 capacitor positioning holes 7 are distributed in an L-shaped arrangement. The capacitor positioning hole is circular.
The solder paste steel mesh 3 is provided with 32 meshes, and the 32 meshes are respectively superposed with the positions of the pins of the solid-state capacitor. The meshes are distributed in two symmetrical L-shaped arrangements.
The capacitor positioning die 4 is provided with 4 PCB positioning holes, and the PCB positioning holes are symmetrically distributed on two sides of the capacitor positioning die 4. The PCB positioning hole corresponds to the positioning pin of the PCB, and the PCB positioning hole is used for positioning the PCB. The PCB positioning hole is circular.
16 solid capacitors 5 are arranged in the direction of the capacitor positioning mould 4; after installation, the effect is as shown in fig. 2, the solid capacitor pin faces upwards and is fixed in the direction; placing a capacitor positioning die 4 into a positioning groove of a lower base plate 1 in the figure 1, and then covering an upper cover plate 2, wherein the mesh of a solder paste steel mesh 3 on the upper cover plate 2 is superposed with the solid capacitor pin; after the solder paste is scraped on the solder paste steel mesh 3 by a layer, the solder paste is left at the mesh position of the solder paste steel mesh 3 and is adhered to the solid-state capacitor pin; open upper cover plate 1, take out electric capacity positioning die 4 to cover the PCB circuit board on electric capacity positioning die 4, electric capacity positioning die 4's PCB board locating hole corresponds the location with the locating pin of PCB board, takes away electric capacity positioning die 4 after adjusting the back with PCB board upset 180 degrees well, and solid-state electric capacity 5 just attached on the PCB board this moment accomplishes the quick subsides of solid-state electric capacity and tin cream and pastes the dress.
The utility model discloses a main function:
the utility model discloses a be equipped with electric capacity positioning die and can fix a position solid-state electric capacity, put into electric capacity positioning die with solid-state electric capacity, place electric capacity positioning die again into the constant head tank of lower plate, cover the upper cover plate, scrape the one deck with the tin cream on the tin cream steel mesh of upper cover plate after, the mesh position of tin cream steel mesh leaves tin cream and adhesion on the pin of solid-state electric capacity, has solved the problem that solid-state electric capacity pin brushed the tin cream fast. The utility model discloses a capacitance positioning die once can fix a position a plurality of solid-state electric capacities, has solved the manual work and has put the problem that solid-state electric capacity positional deviation is big and inefficiency on the tai tan circuit board, realizes the artifical quick location paster's of solid-state electric capacity problem, and lifting efficiency reduces production cost.
In the description of the present invention, it should be understood that the terms "upper end surface", "lower end surface", "top", "bottom", "left", "right", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, and are only for convenience of description of the present invention, and therefore, cannot be understood as a limitation to the practical use direction of the present invention.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.
Claims (10)
1. Solid-state electric capacity quick paster mechanism, its characterized in that: the capacitor positioning device comprises a lower bottom plate and an upper cover plate, wherein the lower bottom plate is movably connected with the upper cover plate, a positioning groove is formed in the lower bottom plate, a capacitor positioning die used for positioning a solid capacitor is placed in the positioning groove, a solder paste steel mesh is arranged on the upper cover plate, and the solder paste steel mesh is aligned with the capacitor positioning die.
2. The solid state capacitive fast pad mechanism of claim 1, wherein: the capacitor positioning die is provided with a plurality of capacitor positioning holes.
3. The solid state capacitor fast pad mechanism of claim 2, wherein: the capacitor positioning holes are distributed in two symmetrical L-shaped arrangements.
4. The solid state capacitor fast pad mechanism of claim 3, wherein: the capacitor positioning die is provided with 16 capacitor positioning holes, wherein 8 capacitor positioning holes are distributed in an L-shaped arrangement mode.
5. The solid state capacitive fast pad mechanism of claim 4, wherein: the capacitor positioning hole is circular.
6. The solid state capacitor fast pad mechanism of claim 5, wherein: the solder paste steel mesh is provided with a plurality of meshes, and the meshes are overlapped with the pins of the solid-state capacitor.
7. The solid state capacitor fast pad mechanism of claim 6, wherein: a plurality of the meshes are distributed in two symmetrical L-shaped arrangements.
8. The solid state capacitor fast pad mechanism of claim 7, wherein: the solder paste steel mesh is provided with 32 meshes.
9. The solid state capacitor fast pad mechanism of claim 8, wherein: the capacitor positioning die is provided with a PCB positioning hole, and the PCB positioning hole corresponds to the positioning pin of the PCB.
10. The solid state capacitor fast pad mechanism of claim 9, wherein: the electric capacity positioning die is equipped with 4 PCB board locating holes, PCB board locating hole symmetric distribution is in electric capacity positioning die's both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320019291.3U CN218887008U (en) | 2023-01-05 | 2023-01-05 | Solid-state capacitor rapid chip mounting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320019291.3U CN218887008U (en) | 2023-01-05 | 2023-01-05 | Solid-state capacitor rapid chip mounting mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218887008U true CN218887008U (en) | 2023-04-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320019291.3U Active CN218887008U (en) | 2023-01-05 | 2023-01-05 | Solid-state capacitor rapid chip mounting mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218887008U (en) |
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2023
- 2023-01-05 CN CN202320019291.3U patent/CN218887008U/en active Active
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