CN113329558A

CN113329558A - Mould for circuit printing

Info

Publication number: CN113329558A
Application number: CN202110464975.XA
Authority: CN
Inventors: 武雪涛
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-04-28
Filing date: 2021-04-28
Publication date: 2021-08-31

Abstract

The invention discloses a circuit printing die, which comprises symmetrically arranged sliding grooves, wherein a sliding rod is fixedly connected between two sides of an inner cavity of each sliding groove, the outer surfaces of the sliding rods are respectively connected with a first sliding plate and a second sliding plate in a sliding manner, and one side of the first sliding plate is fixedly connected with a first clamping plate. This mould for circuit printing, through the spout, the slide bar, first slide, the second slide, first splint, the second splint, first fixed spring and second fixed spring's cooperation is used, can adjust the interval between first splint and the second splint, and then realize carrying out the centre gripping to the circuit board of different specifications, the suitability of mould has been improved, current circuit board has been solved because of the great variety of specification kind, so the circuit board of each specification all needs a mould to correspond, the production efficiency of enterprise has not only been reduced, and the problem of manufacturing cost is influenced.

Description

Mould for circuit printing

Technical Field

The invention relates to the technical field of circuit board processing, in particular to a mold for circuit printing.

Background

The circuit board is named as a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB, an ultra-thin circuit board, a printed (copper etching technology) circuit board and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board can be called as a printed circuit board or a printed circuit board, the name of English is PCB, FPC circuit board (FPC circuit board is also called as flexible circuit board which is made of polyimide or polyester film as a base material, has the characteristics of high reliability and excellent flexibility, and has the characteristics of high wiring density, light weight, thin thickness and good bending property), and the birth and development of a rigid-flexible printed circuit board-FPC and PCB, and promotes the birth of a new product of the rigid-flexible printed circuit board. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like. Circuit boards are classified into three major categories, single-sided boards, double-sided boards, and multilayer circuit boards, depending on the number of layers. The single panel is on the most basic PCB with the parts concentrated on one side and the wires concentrated on the other side. The double-sided board is an extension of a single-sided board, and is used when a single-layer wiring cannot meet the requirements of an electronic product. The multilayer board refers to a printed board having three or more conductive pattern layers laminated with an insulating material therebetween at intervals, and the conductive patterns therebetween are interconnected as required. The multilayer circuit board is a product of the development of electronic information technology in the directions of high speed, multifunction, large capacity, small volume, thinning and light weight.

The circuit board is widely used as a basic part of an electronic product, and in order to meet high-efficiency and high-quality production, a plurality of enterprises can process the circuit board in a printing mode, but the existing circuit board has numerous electronic elements and uncertain distribution, so that a mould is required to be made when the circuit board is printed, the circuit arrangement on the circuit board is standardized, and the circuit board with each specification needs one mould to correspond to the circuit board with various specifications, thereby not only reducing the production efficiency of the enterprises, but also influencing the production cost.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a die for circuit printing, which solves the problems that the prior circuit board needs one die to correspond to each circuit board of each specification due to various specifications, thereby not only reducing the production efficiency of enterprises, but also influencing the production cost.

In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a mould for circuit printing, includes the mount, the holding tank has been seted up at the top of mount, be provided with fixture on the mount.

Fixture includes the spout that the symmetry set up, two equal fixedly connected with slide bar between the both sides of spout inner chamber, the surface difference sliding connection of slide bar has first slide and second slide, the first splint of one side fixedly connected with of first slide, one side fixedly connected with second splint of second slide, the surface of slide bar overlaps respectively and is equipped with first fixed spring and second fixed spring, the one end of first fixed spring and the opposite side fixed connection of first slide, the one end of second fixed spring and the opposite side fixed connection of second slide.

Preferably, the holding tank is communicated with the sliding groove, the bottom of the inner cavity of the holding tank is flush with the bottom of the inner cavity of the sliding groove, the other end of the first fixing spring is fixedly connected with one side of the inner cavity of the sliding groove, the other end of the second fixing spring is fixedly connected with the other side of the inner cavity of the sliding groove, and the sliding groove is arranged on the inner side of the fixing frame.

Preferably, the outer surfaces of the first sliding plate and the second sliding plate are matched with the inner part of the sliding chute, the height of the first clamping plate is higher than that of the first sliding plate, and the height of the second clamping plate is higher than that of the first sliding plate.

Preferably, the first sliding plate and the second sliding plate are not in contact with the bottom of the inner cavity of the accommodating groove, the distance between the front surface and the rear surface of the first clamping plate is smaller than the distance between the front surface and the rear surface of the first sliding plate, and the distance between the front surface and the rear surface of the second clamping plate is smaller than the distance between the front surface and the rear surface of the second sliding plate.

Preferably, the equal fixedly connected with support frame in both sides of mount, two be provided with the backup pad between the support frame, the top fixedly connected with bracing piece of backup pad, the top fixedly connected with supporting pad of bracing piece.

Preferably, the bottom of mount is run through and is seted up the through-hole, bracing piece and through-hole all are provided with a plurality ofly, the quantity of bracing piece and through-hole is the same, the supporting pad is made by insulating material.

Preferably, two the lift groove has all been seted up to the relative one side of support frame, the equal fixedly connected with connecting plate in both sides of backup pad, the surface of connecting plate and the inside looks adaptation in lift groove.

Preferably, the through hole is communicated with the accommodating groove, and the inside of the through hole is matched with the outer surface of the supporting pad.

Preferably, the outer surface of the supporting plate is fixedly connected with a connecting block, the top of the connecting block is rotatably connected with a threaded rod, and the top end of the threaded rod is fixedly connected with a rotating block.

Preferably, the top of the support frame is provided with a vertical groove, the vertical groove is communicated with the lifting groove, and the inside of the vertical groove is matched with the outer surface of the threaded rod.

Advantageous effects

The invention provides a mold for circuit printing. Compared with the prior art, the method has the following beneficial effects:

(1) the mold for circuit printing comprises symmetrically arranged sliding grooves in a clamping mechanism, a sliding rod is fixedly connected between two sides of inner cavities of the two sliding grooves, the outer surface of the sliding rod is respectively and slidably connected with a first sliding plate and a second sliding plate, one side of the first sliding plate is fixedly connected with a first clamping plate, one side of the second sliding plate is fixedly connected with a second clamping plate, the outer surface of the sliding rod is respectively sleeved with a first fixing spring and a second fixing spring, one end of the first fixing spring is fixedly connected with the other side of the first sliding plate, one end of the second fixing spring is fixedly connected with the other side of the second sliding plate, and circuit boards of different specifications can be clamped by matching the sliding grooves, the sliding rod, the first sliding plate, the second sliding plate, the first clamping plate, the second clamping plate, the first fixing spring and the second fixing spring, the applicability of the die is improved, and the problems that the existing circuit boards are various in specification, so that the circuit boards of each specification need one die to correspond to each other, the production efficiency of enterprises is reduced, and the production cost is influenced are solved.

(2) This mould for circuit printing, through the equal fixedly connected with support frame in the both sides of mount, be provided with the backup pad between two support frames, the top fixedly connected with bracing piece of backup pad, the top fixedly connected with supporting pad of bracing piece, the through-hole has been seted up in the bottom of mount through, bracing piece and through-hole all are provided with a plurality ofly, the quantity of bracing piece and through-hole is the same, the supporting pad is made by insulating material, the lift groove has all been seted up to two relative one sides of support frame, the equal fixedly connected with connecting plate in both sides of backup pad, the surface of connecting plate and the inside looks adaptation in lift groove, through the backup pad, the cooperation of bracing piece and supporting pad is used, in the printing, can support the circuit board bottom, make circuit board bottom atress, conveniently process the circuit board, avoid the circuit board fracture.

(3) This mould for circuit printing, be connected with the connecting block through the fixed surface at the backup pad, the top of connecting block is rotated and is connected with the threaded rod, the top fixedly connected with turning block of threaded rod, perpendicular groove has been seted up at the top of support frame, intercommunication between perpendicular groove and the lift groove, the inside in perpendicular groove and the surface looks adaptation of threaded rod, use through connecting block, the threaded rod, the turning block and the cooperation of erecting the groove, through rotating the turning block, can drive the backup pad and go up and down, thereby the realization goes up and down the circuit board, make things convenient for the staff to process the circuit board.

Drawings

FIG. 1 is a front view of the internal structure of the present invention;

FIG. 2 is a bottom view of the internal mechanism of the present invention;

FIG. 3 is a partial cross-sectional view taken at A of FIG. 2 in accordance with the present invention;

FIG. 4 is a perspective view of the external structure of the fixing frame of the present invention;

fig. 5 is a top view of the external structure of the support plate of the present invention.

In the figure: 1-fixed frame, 2-accommodating groove, 3-clamping mechanism, 31-sliding groove, 32-sliding rod, 33-first sliding plate, 34-second sliding plate, 35-first clamping plate, 36-second clamping plate, 37-first fixing spring, 38-second fixing spring, 4-supporting frame, 5-supporting plate, 6-supporting rod, 7-supporting pad, 8-through hole, 9-lifting groove, 10-connecting plate, 11-connecting block, 12-threaded rod, 13-rotating block and 14-vertical groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: a mould for circuit printing comprises a fixed frame 1, a through hole 8 is formed in the bottom of the fixed frame 1 in a penetrating manner, the through hole 8 is communicated with an accommodating groove 2, the inside of the through hole 8 is matched with the outer surface of a supporting pad 7, the supporting pad 6 and the through hole 8 are both provided with a plurality of through holes, the supporting pad 7 is made of an insulating material, supporting frames 4 are fixedly connected to the two sides of the fixed frame 1, a vertical groove 14 is formed in the top of each supporting frame 4, an internal thread is formed in the inner surface of the vertical groove 14, the vertical groove 14 is communicated with a lifting groove 9, the inside of the vertical groove 14 is matched with the outer surface of a threaded rod 12, the threaded rod 12 is connected with the rotating block 13 and the vertical groove 14 through a connecting block 11, the supporting plate 5 can be driven to lift through rotating the rotating block 13, thereby the circuit board is lifted and lifted, and the circuit board is convenient for workers to process the circuit board, the opposite sides of the two support frames 4 are respectively provided with a lifting groove 9, the two sides of the support plate 5 are respectively fixedly connected with a connecting plate 10, the outer surface of the connecting plate 10 is matched with the inner part of the lifting groove 9, the support plate 5 is arranged between the two support frames 4, the top part of the support plate 5 is fixedly connected with a support rod 6, the top end of the support rod 6 is fixedly connected with a support pad 7, the bottom of the circuit board can be supported by matching the support plate 5, the support rod 6 and the support pad 7 when in printing, so that the bottom of the circuit board is stressed, the circuit board is conveniently processed, the circuit board is prevented from being broken, the top part of the fixed frame 1 is provided with an accommodating groove 2, the accommodating groove 2 is communicated with the sliding groove 31, the bottom of the inner cavity of the accommodating groove 2 is flush with the bottom of the inner cavity of the sliding groove 31, and the other end of the first fixing spring 37 is fixedly connected with one side of the inner cavity of the sliding groove 31, the other end of the second fixed spring 38 is fixedly connected with the other side of the inner cavity of the sliding chute 31, the sliding chute 31 is arranged at the inner side of the fixed frame 1, and the fixed frame 1 is provided with a clamping mechanism 3; the clamping mechanism 3 comprises sliding chutes 31 which are symmetrically arranged, sliding rods 32 are fixedly connected between two sides of inner cavities of the two sliding chutes 31, the outer surfaces of the sliding rods 32 are respectively connected with a first sliding plate 33 and a second sliding plate 34 in a sliding manner, neither the first sliding plate 33 nor the second sliding plate 34 is in contact with the bottom of the inner cavity of the accommodating groove 2, the distance between the front and back surfaces of the first clamping plate 35 is smaller than that between the front and back surfaces of the first sliding plate 33, the distance between the front and back surfaces of the second clamping plate 36 is smaller than that between the front and back surfaces of the second sliding plate 34, the outer surfaces of the first sliding plate 33 and the second sliding plate 34 are matched with the inner part of the sliding chute 31, the height of the first clamping plate 35 is higher than that of the first sliding plate 33, the height of the second clamping plate 36 is higher than that of the first sliding plate 33, one side of the first sliding plate 33 is fixedly connected with a first clamping plate 35, one side of the second sliding plate 34 is fixedly connected with a second clamping plate 36, the outer surfaces of the sliding rods 32 are respectively sleeved with a first fixing spring 37 and a second fixing spring 38, one end of the first fixing spring 37 is fixedly connected with the other side of the first sliding plate 33, one end of the second fixing spring 38 is fixedly connected with the other side of the second sliding plate 34, the first fixing spring 37 is matched with the second fixing spring 38, the sliding groove 31, the sliding rod 32, the first sliding plate 33, the second sliding plate 34, the first clamping plate 35, the second clamping plate 36 and the first fixing spring 37 are matched with the second fixing spring 38, the distance between the first clamping plate 35 and the second clamping plate 36 can be adjusted, the circuit boards of different specifications are clamped, the applicability of the die is improved, the problem that the existing circuit boards are various in specification is solved, the circuit boards of each specification need one die to correspond to each other, the production efficiency of enterprises is reduced, and the problem of production cost is influenced.

And those not described in detail in this specification are well within the skill of those in the art.

During operation, the rotating block 13 is rotated to drive the threaded rod 12 to rotate in the vertical groove 14, under the connecting action of the connecting block 11, the connecting plate 10 and the supporting plate 5 are lifted, the supporting rod 6 and the supporting pad 7 are driven to move into the accommodating groove 2 through the through hole 8, after the supporting pad 7 is moved to a proper position, the rotating block 13 is stopped rotating, the first sliding plate 33 and the second sliding plate 34 are respectively pushed to two sides, the first sliding plate 33 and the second sliding plate 34 slide on the sliding rod 32, the first sliding plate 33 and the second sliding plate 34 respectively compress the first fixing spring 37 and the second fixing spring 38, along with the movement of the first sliding plate 33 and the second sliding plate 34, the first clamping plate 35 moves along with the first sliding plate 33, the second clamping plate 36 moves along with the second sliding plate 34, at this time, the circuit board is placed between the first clamping plate 35 and the second clamping plate 36, utilize supporting pad 7 to support the circuit board bottom, make circuit board bottom atress, conveniently process the circuit board, avoid the circuit board fracture, then, loosen first slide 33 and second slide 34, under the effect in the hot water of first fixed spring 37 and second fixed spring 38, and then reset first slide 33 and second slide 34, and then drive first splint 35 and second splint 36 and reset, and then utilize first splint 35 and second splint 36 to carry out the centre gripping to the circuit board, and then realize carrying out the centre gripping to the circuit board of different specifications, the suitability of mould has been improved, the current circuit board is avoided because of the great variety of specification, so the circuit board of each specification all needs a mould to correspond, the production efficiency of enterprise has not only been reduced, and the problem of influence manufacturing cost.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a mould for circuit printing, includes mount (1), its characterized in that: the top of the fixed frame (1) is provided with a containing groove (2), and the fixed frame (1) is provided with a clamping mechanism (3);

fixture (3) is including spout (31) that the symmetry set up, two equal fixedly connected with slide bar (32) between the both sides of spout (31) inner chamber, the surface of slide bar (32) is sliding connection respectively has first slide (33) and second slide (34), the first splint (35) of one side fixedly connected with of first slide (33), one side fixedly connected with second splint (36) of second slide (34), the surface of slide bar (32) is overlapped respectively and is equipped with first fixed spring (37) and second fixed spring (38), the one end of first fixed spring (37) and the opposite side fixed connection of first slide (33), the one end of second fixed spring (38) and the opposite side fixed connection of second slide (34).

2. The mold for circuit printing according to claim 1, wherein: communicate between holding tank (2) and spout (31), and the bottom of holding tank (2) inner chamber is in the state of flushing with the bottom of spout (31) inner chamber, the other end of first fixed spring (37) and one side fixed connection of spout (31) inner chamber, the other end of second fixed spring (38) and the opposite side fixed connection of spout (31) inner chamber, the inboard of mount (1) is seted up in spout (31).

3. The mold for circuit printing according to claim 1, wherein: the outer surfaces of the first sliding plate (33) and the second sliding plate (34) are matched with the inner part of the sliding chute (31), the height of the first clamping plate (35) is higher than that of the first sliding plate (33), and the height of the second clamping plate (36) is higher than that of the first sliding plate (33).

4. The mold for circuit printing according to claim 1, wherein: the first sliding plate (33) and the second sliding plate (34) are not in contact with the bottom of the inner cavity of the accommodating groove (2), the distance between the front surface and the rear surface of the first clamping plate (35) is smaller than the distance between the front surface and the rear surface of the first sliding plate (33), and the distance between the front surface and the rear surface of the second clamping plate (36) is smaller than the distance between the front surface and the rear surface of the second sliding plate (34).

5. The mold for circuit printing according to claim 1, wherein: the support frame is characterized in that support frames (4) are fixedly connected to two sides of the fixing frame (1), a support plate (5) is arranged between the support frames (4), a support rod (6) is fixedly connected to the top of the support plate (5), and a support pad (7) is fixedly connected to the top of the support rod (6).

6. The mold for circuit printing according to claim 5, wherein: the bottom of mount (1) is run through and is seted up through-hole (8), bracing piece (6) and through-hole (8) all are provided with a plurality ofly, the quantity of bracing piece (6) and through-hole (8) is the same, supporting pad (7) are made by insulating material.

7. The mold for circuit printing according to claim 5, wherein: two lift groove (9) have all been seted up to one side that support frame (4) is relative, the equal fixedly connected with connecting plate (10) in both sides of backup pad (5), the surface of connecting plate (10) and the inside looks adaptation of lift groove (9).

8. The mold for circuit printing according to claim 6, wherein: through-hole (8) and holding tank (2) between intercommunication, the inside of through-hole (8) and the surface looks adaptation of supporting pad (7).

9. The mold for circuit printing according to claim 5, wherein: the outer fixed surface of backup pad (5) is connected with connecting block (11), the top of connecting block (11) is rotated and is connected with threaded rod (12), the top fixedly connected with turning block (13) of threaded rod (12).

10. The mold for circuit printing according to claim 5, wherein: vertical groove (14) have been seted up at the top of support frame (4), communicate between vertical groove (14) and lift groove (9), the inside of vertical groove (14) and the surface looks adaptation of threaded rod (12).