CN205609513U - Heap packaging structure - Google Patents

Heap packaging structure Download PDF

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Publication number
CN205609513U
CN205609513U CN201620257369.5U CN201620257369U CN205609513U CN 205609513 U CN205609513 U CN 205609513U CN 201620257369 U CN201620257369 U CN 201620257369U CN 205609513 U CN205609513 U CN 205609513U
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CN
China
Prior art keywords
bronze medal
packaging body
packaging material
plastic packaging
medal post
Prior art date
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Active
Application number
CN201620257369.5U
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Chinese (zh)
Inventor
王亚琴
刘恺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCET Group Co Ltd
Original Assignee
Jiangsu Changjiang Electronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Changjiang Electronics Technology Co Ltd filed Critical Jiangsu Changjiang Electronics Technology Co Ltd
Priority to CN201620257369.5U priority Critical patent/CN205609513U/en
Application granted granted Critical
Publication of CN205609513U publication Critical patent/CN205609513U/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Packages (AREA)

Abstract

The utility model relates to a heap packaging structure, it includes first packaging body (1) and second packaging body (2), first packaging body (1) is including first base plate (14) and first chip (16), first base plate (14) are including the first line pattern (15) and first copper post (11), first base plate top is provided with first plastic envelope material (17), the position that first plastic envelope material (17) upper surface corresponds first copper post (11) is provided with trompil (18), first copper post (11) top exposes in trompil (18) of first plastic envelope material (17) upper surface, first copper post (11) top is provided with tin ball (13), second packaging body (2) are including second base plate (19), second chip (20) and second plastic envelope material (21), be provided with second copper post (12) on second base plate (19) lower surface, in trompil (18) of second copper post (12) cartridge on (17) are expected to first plastic envelope to form electric connection through tin ball (13) and first copper post (11). The utility model relates to a heap packaging structure and process make back the tin ball when welding can avoid taking place the bridging phenomenon to the yield of product is promoted, and the demand of thin space can be satisfied.

Description

A kind of stack encapsulation structure
Technical field
This utility model relates to a kind of stack encapsulation structure, belongs to technical field of semiconductor encapsulation.
Background technology
Flourish along with portable electronic product in recent years, all kinds of Related products are increasingly towards high density, high-performance and light, thin, short, little trend and walk, and each style encapsulated layer is folded (package on package, PoP) also thus coordinate and weed out the old and bring forth the new, compact with highdensity requirement to meeting.
As it is shown in figure 1, the cross-sectional schematic that it is existing POP encapsulating structure.This encapsulation stack apparatus includes two encapsulating structure 100 being stacked and another encapsulating structures 200.After forming the first packaging body 100, carrying out thinning to the first packaging body upper surface, expose copper post 101, the second encapsulation 200 stacks and is electrically coupled to lower package body 100 by the stannum ball 201 of its substrate back.
There is following defect in above-mentioned stacked structure:
1, along with the miniaturization of electronic building brick, the line pitch in packaging body diminishes, and the spacing between each welding stannum ball need to reduce, and causes adjacent stannum ball to be susceptible to bridge the phenomenon of (bridge)；
2, the tolerance of stannum ball volume after reflow and height is big, and during reflow, stannum club first becomes weak state, simultaneously after the weight bearing top packaging body 200, and flat deformation of easily collapsing, bridge；
3, the palisade array (grid array) that stannum ball is arranged in Easily produce coplanarity bad, cause contact unequal power distribution to easily cause stacked structure.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of stack encapsulation structure for above-mentioned prior art, makes stannum ball during reflow be avoided that generation bridge joint phenomenon, with the yield of improving product, and can meet the demand of thin space.
Another object of the present utility model is to provide a kind of stack encapsulation structure, and coplanarity (coplanarity) is good, it is easy to controls product height, does not tilts；
The technical scheme in the invention for solving the above technical problem is: a kind of stack encapsulation structure, it includes the first packaging body and the second packaging body, described first packaging body includes first substrate and the first chip, described first substrate includes first line pattern and the first bronze medal post, described first substrate is provided above the first plastic packaging material, the position of the corresponding first bronze medal post of described first plastic packaging material upper surface is provided with perforate, described first bronze medal column top is exposed in the perforate of the first plastic packaging material upper surface, described first bronze medal column top is provided with stannum ball, described second packaging body includes second substrate, second chip and the second plastic packaging material, the second bronze medal post it is provided with on described second substrate lower surface, described second bronze medal post is plugged in the perforate on the first plastic packaging material, and be electrically connected by stannum ball and the first bronze medal post.
Described first chip and the first line pattern in first substrate realize being electrically connected with, and the upper surface of described first chip and first line pattern is positioned at inside the first plastic packaging material.
Described first bronze medal post and the second bronze medal column top are convex structure.
Described first plastic packaging material and the second plastic packaging material use filler or packless epoxy resin.
Compared with prior art, the utility model has the advantage of:
1, the copper post 11 of this utility model the first packaging body and the copper post 12 of the second packaging body are electrically connected by stannum ball in perforate, metal column contacting metal ball, the place of fusing during reflow is made to occur only at metal column contact jaw in perforate, the place of fusing is positioned in perforate, so being avoided that generation bridge joint phenomenon, with the yield of improving product, and the demand of thin space can be met；
2, this utility model is when reflow due to the support of metal column, and the tolerance of packaging height is little, and contact is not likely to produce defect, and coplanarity (coplanarity) is good, it is easy to controls product height, does not tilts.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of existing POP encapsulating structure.
Fig. 2 is the schematic diagram of a kind of stack encapsulation structure of this utility model.
Fig. 3 ~ Figure 13 is the process chart of a kind of stack encapsulation structure of this utility model.
Figure 14, Figure 15 are the schematic diagram of this utility model another embodiment of a kind of stack encapsulation structure.
Wherein:
First packaging body 1
Second packaging body 2
First bronze medal post 11
Second bronze medal post 12
Stannum ball 13
First substrate 14
First line pattern 15
First chip 16
First plastic packaging material 17
Perforate 18
Second substrate 19
Second chip 20
Second plastic packaging material 21.
Detailed description of the invention
Below in conjunction with accompanying drawing embodiment, this utility model is described in further detail.
nullAs shown in Figure 2，A kind of stack encapsulation structure in the present embodiment，It includes the first packaging body 1 and the second packaging body 2，Described first packaging body 1 includes first substrate 14 and the first chip 16，Described first substrate 14 includes first line pattern 15 and the first bronze medal post 11，The first chip 16 it is provided with on described first line pattern 15，Described first chip 16 realizes being electrically connected with first line pattern 15，Described first substrate 14 is provided above the first plastic packaging material 17，The position of the corresponding first bronze medal post 11 of described first plastic packaging material 17 upper surface is provided with perforate 18，Described first bronze medal post 11 top is exposed in the perforate 18 of the first plastic packaging material 17 upper surface，Described first bronze medal post 11 top is provided with stannum ball 13，Described second packaging body 2 includes second substrate 19、Second chip 20 and the second plastic packaging material 21，It is provided with the second bronze medal post 12 on described second substrate 19 lower surface，Described second bronze medal post 12 is plugged in the perforate 18 on the first plastic packaging material 17，And be electrically connected with the first bronze medal post 11 by stannum ball 13.
Its processing step is as follows:
Step one, see Fig. 3, take the first metal basal board；
Step 2, see Fig. 4, the photoresistance film that can be exposed development is sticked respectively in the first metal basal board front and the back side, exposure imaging equipment is utilized metal basal board front to carry out graph exposure, develop and removes partial graphical photoresistance film, to expose the regional graphics that the first follow-up needs in metal basal board front are etched, first metal basal board is etched, forms the first bronze medal post；
Step 3, see Fig. 5, the photoresistance film that can be exposed development is sticked in the first metal basal board front of step 2, exposure imaging equipment is utilized the first metal basal board front to carry out graph exposure again, develop and removes partial graphical photoresistance film, to expose the regional graphics that the first follow-up needs in metal basal board front are etched, first metal basal board is etched, form first line pattern, remove the photoresistance film of the first metallic substrate surfaces；
Step 4, see Fig. 6; chip is arranged in step 3 on the first metal basal board completing etching; chip and first line pattern realize being electrically connected with; again the first metal basal board front is carried out epoxy resin plastic packaging protection; form the first plastic packaging material; first plastic packaging material upper surface exceeds the upper surface of the first bronze medal post, and epoxide resin material can select according to product attribute to be had filler or do not have the kind of filler；
Step 5, see Fig. 7, carry out perforate in the position of the corresponding first bronze medal post of the first plastic packaging material, it is therefore an objective to expose the first bronze medal post；
Step 6, see Fig. 8, the lower surface of the first metal basal board is carried out thinning in order to realize first line pattern and the separation of the first bronze medal post, thus forms the first packaging body；
Step 7, see Fig. 9, take the second metal basal board；
Step 8, see Figure 10; second metal basal board of step 7 arranges the second chip; second chip and the second metal basal board realize being electrically connected with; again the second metal basal board front is carried out epoxy resin plastic packaging protection; forming the second plastic packaging material, epoxide resin material can select according to product attribute to be had filler or not to have the kind of filler；
Step 9, see Figure 11, the photoresistance film that can be exposed development is sticked at the second metal basal board back side that step 8 completes encapsulating, exposure imaging equipment is utilized the second metal basal board back side to carry out graph exposure, develop and removes partial graphical photoresistance film, to expose the regional graphics that the second follow-up needs in the metal basal board back side are etched, second metal basal board is etched, forms the second bronze medal post；
Step 10, see Figure 12, stannum ball is placed in the perforate of the first plastic packaging material of the first packaging body of step 6 formation, the second packaging body and the first packaging body that are formed in step 9 are combined, make the second bronze medal post of the second packaging body lower surface insert in the perforate of the first plastic packaging material upper surface of the first packaging body；
Step 11, see Figure 13, carry out Reflow Soldering, make the second bronze medal post of the second packaging body lower surface be electrically connected by the first bronze medal post of stannum ball and the first packaging body；
Step 12, step 11 is completed packaging body stacking semi-finished product carry out cutting operation, prepare stack encapsulation structure.
Such as Figure 14, shown in Figure 15, another embodiment for a kind of stack encapsulation structure of the present invention, it includes the first packaging body 1 and the second packaging body 2, the first bronze medal post 11 top in described first packaging body 1 is convex structure, described second packaging body 2 lower surface the second bronze medal post 12 top is convex structure, described second bronze medal post 12 is plugged in the perforate 18 on the first plastic packaging material 17, and be electrically connected with the first bronze medal post 11 by stannum ball 13, owing to the first bronze medal column top and the second bronze medal column top are convex structure, when Reflow Soldering, solder can envelope the salient point on copper post completely, by the solder grasping force to the salient point that it is coated with, the adhesion between the first packaging body and the second packaging body can be strengthened further.
In addition to the implementation, this utility model also includes the technical scheme that other embodiments, all employing equivalents or equivalence substitute mode are formed, within all should falling into this utility model scope of the claims.

Claims (4)

  1. null1. a stack encapsulation structure，It is characterized in that: it includes the first packaging body (1) and the second packaging body (2)，Described first packaging body (1) includes first substrate (14) and the first chip (16)，Described first substrate (14) includes first line pattern (15) and the first bronze medal post (11)，Described first substrate is provided above the first plastic packaging material (17)，The position of the corresponding first bronze medal post (11) of described first plastic packaging material (17) upper surface is provided with perforate (18)，Described first bronze medal post (11) top is exposed in the perforate (18) of the first plastic packaging material (17) upper surface，Described first bronze medal post (11) top is provided with stannum ball (13)，Described second packaging body (2) includes second substrate (19)、Second chip (20) and the second plastic packaging material (21)，The second bronze medal post (12) it is provided with on described second substrate (19) lower surface，Described second bronze medal post (12) is plugged in the perforate (18) on the first plastic packaging material (17)，And be electrically connected with the first bronze medal post (11) by stannum ball (13).
  2. A kind of stack encapsulation structure the most according to claim 1, it is characterized in that: described first chip (16) and the first line pattern (15) in first substrate (14) realize being electrically connected with, and it is internal that described first chip (16) and first line pattern (15) upper surface are positioned at the first plastic packaging material (17).
  3. A kind of stack encapsulation structure the most according to claim 1, it is characterised in that: described first bronze medal post (11) and the second bronze medal post (12) top are convex structure.
  4. A kind of stack encapsulation structure the most according to claim 1, it is characterised in that: described first plastic packaging material (17) and the second plastic packaging material (21) use filler or packless epoxy resin.
CN201620257369.5U 2016-03-30 2016-03-30 Heap packaging structure Active CN205609513U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620257369.5U CN205609513U (en) 2016-03-30 2016-03-30 Heap packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620257369.5U CN205609513U (en) 2016-03-30 2016-03-30 Heap packaging structure

Publications (1)

Publication Number Publication Date
CN205609513U true CN205609513U (en) 2016-09-28

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CN201620257369.5U Active CN205609513U (en) 2016-03-30 2016-03-30 Heap packaging structure

Country Status (1)

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CN (1) CN205609513U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105762133A (en) * 2016-03-30 2016-07-13 江苏长电科技股份有限公司 Stacked packaging structure and process method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105762133A (en) * 2016-03-30 2016-07-13 江苏长电科技股份有限公司 Stacked packaging structure and process method thereof

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