CN203992730U - For welding the weldering mould of semi-conductor power module - Google Patents
For welding the weldering mould of semi-conductor power module Download PDFInfo
- Publication number
- CN203992730U CN203992730U CN201420498420.2U CN201420498420U CN203992730U CN 203992730 U CN203992730 U CN 203992730U CN 201420498420 U CN201420498420 U CN 201420498420U CN 203992730 U CN203992730 U CN 203992730U
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- China
- Prior art keywords
- welding
- gap bridge
- weldering mould
- weldering
- mould
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Abstract
The utility model discloses and belong to tool and mould scope a kind of for welding the weldering mould of semi-conductor power module who makes semiconductor power device.This weldering mould is the improvement of carrying out on the basis of original weldering mould, and weldering mould base two ends or the vertical fixing column of periphery in lengthening, first put gasket ring in the lower end of every root post, and gasket ring upper end is overlapped lower platen, lower spring, top board and upper spring successively; Pressing respectively electrode location-plate and chip positioning sheet, the adjusting nut of upper and lower pressing plate are screwed in the upper end of every root post; Regulate the pressure of upper and lower spring; Electrode location-plate entangles each module electrodes and weldering mould positioning vertical column, respectively places the gap bridge depression bar of a band gap bridge stage clip movable up and down over against the top of passing a bridge, and gap bridge depression bar leads by gap bridge depression bar guide pipe.The utility model weldering mode structure simplicity of design, practicality, number of parts and cost increase are seldom, easy to use; The sideslip of passing a bridge when when welding prevents in melts soldering tin, has guaranteed welding quality, has improved yield rate.
Description
Technical field
The utility model belongs to the tool and mould scope of making semiconductor power device, particularly a kind of for welding the weldering mould of semi-conductor power module.A kind of mould that can be applicable to the automatic welding device of semi-conductor power module batch production specifically.
Background technology
Existing semiconductor power device weld mold as shown in Figure 1 mainly by weldering mould base 1, module copper soleplate 2, ceramics spacer 3, chip positioning sheet 4, weldering mould positioning vertical column 5 and electrode location-plate 6 form; During due to melts soldering tin, mobility is very large, and the floating gap bridge resting on chip is easy to slide and is partially welded, and is only suitable for small lot batch manufacture.While using automatic welding chain-conveyer furnace or box soldering furnace when batch production, because slight vibrations make to pass a bridge, be partially welded, cause in batch and scrap.
Utility model content
The purpose of this utility model is while using automatic welding chain-conveyer furnace or box soldering furnace for existence in prior art when producing in batches, because making to pass a bridge, slight vibrations are partially welded, cause the deficiency of scrapping in batch and propose a kind of for welding the weldering mould of semi-conductor power module, it is characterized in that, on the basis of original weldering mould, improve, weldering mould base 1 two ends or the vertical fixing column 9 of periphery in lengthening, lower end at every root post 9 first puts gasket ring 16, gasket ring 16 upper end cover lower platens 10, lower spring 13 is being pressed lower platen 10, top board 11 is being pressed lower spring 13, top board 11 is being pressed upper spring 12 above, adjusting nut 17 is screwed in the upper end of every root post 9, regulate the pressure of upper and lower spring, the other end of upper and lower pressing plate is being pressed respectively electrode location-plate 6 and chip positioning sheet 4, in electrode location-plate 6 middle parts of original weldering mould, over against 8 tops of passing a bridge, respectively there is the gap bridge depression bar 15 of a band gap bridge stage clip 14 movable up and down, and on electrode location-plate 6, weld gap bridge depression bar guide pipe 18, in when welding, with the gap bridge depression bar 15 of gap bridge stage clip 14, be pressed in and pass a bridge on 8, prevent the sideslip of passing a bridge when melts soldering tin, guaranteed welding quality, improved yield rate.
The vertical fixing column of described weldering mould base two ends or periphery must be to be arranged symmetrically with.
Described upper and lower pressing plate is rotatable on spring column, facilitates mould loading, unloading.
The utility model beneficial effect is this weldering mode structure simplicity of design, practicality, and number of parts and cost increase are seldom, easy to use, prevents the sideslip of passing a bridge when melts soldering tin, has guaranteed welding quality, has improved yield rate.
Accompanying drawing explanation
Fig. 1 is former weldering mode structure schematic diagram.
Fig. 2 is improved weldering mode structure schematic diagram.
The specific embodiment
The utility model proposes a kind of for welding the weldering mould of semi-conductor power module.Below in conjunction with accompanying drawing, be explained.
Figure 2 shows that improved weldering mode structure schematic diagram.At weldering mould base 1 two ends or the vertical vertical columns 9 of periphery that lengthen, this column must be to be arranged symmetrically with; Lower end at every root post 9 first puts gasket ring 16, gasket ring 16 upper end cover lower platens 10, and lower spring 13 is being pressed lower platen 10, and top board 11 is being pressed lower spring 13, and top board 11 is being pressed upper spring 12 above, and adjusting nut 17 is screwed in the upper end of every root post 9; Regulate the pressure of upper and lower spring; The other end of upper and lower pressing plate is being pressed respectively electrode location-plate 6 and chip positioning sheet 4, and on electrode location-plate 6, welds gap bridge depression bar guide pipe 18; Described upper and lower pressing plate is rotatable on column 9, facilitates mould loading, unloading.
Weldering mould base 1 middle part lengthening, the weldering mould positioning vertical column 5 of vertical fixing original weldering mould, module copper soleplate 2, ceramics spacer 3 are enclosed within on weldering mould positioning vertical column 5 successively, chip positioning sheet 4 is placed on ceramics spacer 3, module electrodes 7, gap bridge 8 are according to semi-conductor power module Standard, and module electrodes 7,8 relative positions of passing a bridge are fixed by chip positioning sheet 4; Electrode location-plate 6 entangles each module electrodes 7 and weldering mould positioning vertical column 5, over against 8 tops of passing a bridge, respectively place the gap bridge depression bar 15 of a band gap bridge stage clip 14 movable up and down, gap bridge depression bar 15 is by gap bridge depression bar guide pipe 18 guiding, when welding, gap bridge depression bar 15 with gap bridge stage clip 14 is pressed on gap bridge 8, prevent the sideslip of passing a bridge when melts soldering tin, guaranteed welding quality, improved yield rate.
Claims (3)
1. one kind for welding the weldering mould of semi-conductor power module, it is characterized in that, on the basis of original weldering mould, improve, weldering mould base (1) two ends or the vertical fixing column (9) of periphery in lengthening, in the lower end of every root post (9), first put gasket ring (16), gasket ring (16) upper end cover lower platen (10), lower spring (13) is being pressed lower platen (10), top board (11) is being pressed lower spring (13), top board (11) is being pressed upper spring (12) above, and adjusting nut (17) is screwed in the upper end of every root post (9); Regulate the pressure of upper and lower spring; The other end of upper and lower pressing plate is being pressed respectively electrode location-plate (6) and chip positioning sheet (4); In electrode location-plate (6) middle part of original weldering mould, over against (8) top of passing a bridge, respectively there is the gap bridge depression bar (15) of a band gap bridge stage clip movable up and down (14), and at the upper welding of electrode location-plate (6) gap bridge depression bar guide pipe (18); When welding, it is upper that the gap bridge depression bar (15) of band gap bridge stage clip (14) is pressed in gap bridge (8), prevents the sideslip of passing a bridge when melts soldering tin, guaranteed welding quality, improved yield rate.
2. a kind ofly according to claim 1 for welding the weldering mould of semi-conductor power module, it is characterized in that, the vertical fixing column of described weldering mould base two ends or periphery must be to be arranged symmetrically with.
3. a kind ofly according to claim 1 for welding the weldering mould of semi-conductor power module, it is characterized in that, described upper and lower pressing plate is rotatable on spring column, facilitates mould loading, unloading.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420498420.2U CN203992730U (en) | 2014-09-01 | 2014-09-01 | For welding the weldering mould of semi-conductor power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420498420.2U CN203992730U (en) | 2014-09-01 | 2014-09-01 | For welding the weldering mould of semi-conductor power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203992730U true CN203992730U (en) | 2014-12-10 |
Family
ID=52032794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420498420.2U Withdrawn - After Issue CN203992730U (en) | 2014-09-01 | 2014-09-01 | For welding the weldering mould of semi-conductor power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203992730U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104191063A (en) * | 2014-09-01 | 2014-12-10 | 徐州汉通电子科技有限公司 | Improved welding mold for welding semiconductor power module |
| CN110757054A (en) * | 2019-09-20 | 2020-02-07 | 中国航发航空科技股份有限公司 | Welding device for casing diffuser shell assembly |
| CN113369777A (en) * | 2021-06-30 | 2021-09-10 | 中国航发动力股份有限公司 | Clamp for wave spring energy storage spot welding |
-
2014
- 2014-09-01 CN CN201420498420.2U patent/CN203992730U/en not_active Withdrawn - After Issue
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104191063A (en) * | 2014-09-01 | 2014-12-10 | 徐州汉通电子科技有限公司 | Improved welding mold for welding semiconductor power module |
| CN104191063B (en) * | 2014-09-01 | 2016-04-27 | 徐州汉通电子科技有限公司 | A kind of weldering mould of welding semi-conductor power module of improvement |
| CN110757054A (en) * | 2019-09-20 | 2020-02-07 | 中国航发航空科技股份有限公司 | Welding device for casing diffuser shell assembly |
| CN110757054B (en) * | 2019-09-20 | 2022-02-08 | 中国航发航空科技股份有限公司 | Welding device for casing diffuser shell assembly |
| CN113369777A (en) * | 2021-06-30 | 2021-09-10 | 中国航发动力股份有限公司 | Clamp for wave spring energy storage spot welding |
| CN113369777B (en) * | 2021-06-30 | 2023-01-31 | 中国航发动力股份有限公司 | Clamp for wave spring energy storage spot welding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20141210 Effective date of abandoning: 20160427 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |