CN202948916U - Semiconductor lead frame capable of preventing chip crushing - Google Patents
Semiconductor lead frame capable of preventing chip crushing Download PDFInfo
- Publication number
- CN202948916U CN202948916U CN 201220440597 CN201220440597U CN202948916U CN 202948916 U CN202948916 U CN 202948916U CN 201220440597 CN201220440597 CN 201220440597 CN 201220440597 U CN201220440597 U CN 201220440597U CN 202948916 U CN202948916 U CN 202948916U
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- CN
- China
- Prior art keywords
- lead frame
- chip
- weld tabs
- semiconductor lead
- pressing claw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to the field of the semiconductor packaging technology, especially to a semiconductor lead frame capable of preventing chip crushing. The semiconductor lead frame comprises a lead frame body and a fixed pressing claw. The lead frame body includes a welding sheet; and a chip is welded on the welding sheet. The fixed pressing claw is pressed against the edge of the welding sheet, wherein the distance between the end, pressed against the edge of the welding sheet, of the fixed pressing claw and the chip is 0.08m to 0.15mm. According to the utility model, on the basis of the cooperation structure with the fixed pressing claw and the semiconductor lead frame, the space for pressing of the fixed pressing claw is arranged, the welding sheet area is enlarged, and the gap between the chip and the pressing claw is expanded to be 0.08m to 0.15mm. The provided semiconductor lead frame with the simple structure is designed reasonably; major problems are solved by simple improvement; the product unqualification phenomenon caused by chip crushing by the fixed pressing claw can be reduced; and the raw materials can be saved.
Description
Technical field
The utility model relates to the semiconductor packaging field, particularly relates to a kind of semiconductor lead frame that prevents that chip from weighing wounded.
Background technology
In recent years, along with the progress of integrated circuit technique, semiconductor packages has also obtained very large development.The lead frame that uses in semiconductor packages is a kind of primary structure material of semiconductor packages.It mainly plays carries chips in circuit, work simultaneously to connect chip and the outside line plate signal of telecommunication, and fixing mechanism etc. is installed.
Wherein a procedure carries out bonding wire after using pressing plate that lead frame or power device chip are fixed in semiconductor packages.Pressing plate is by the paw on it, lead frame to be fixed.
Semiconductor lead frame of the prior art, as shown in Figure 1, comprise lead frame body 1, lead frame body 1 comprises the weld tabs 4 for carries chips 3, described weld tabs 4 size design less, and the chip 3 of reservation is very little to the gap between fixing press claw 2, the fixing press claw 2 that causes pressing plate occurring in process of production easily weighs chip 3 wounded, cause product rejection, defect rate is high, wastes raw-material problem.
Summary of the invention
The purpose of this utility model is to avoid weak point of the prior art and a kind of semiconductor lead frame that prevents that chip from weighing wounded is provided, and it is simple in structure, reasonable in design, yields is high, cuts the waste.
The purpose of this utility model is achieved through the following technical solutions:
A kind of semiconductor lead frame that prevents that chip from weighing wounded, comprise lead frame body and fixing press claw, the lead frame body comprises weld tabs, be welded with chip on weld tabs, the edge butt of fixing press claw and weld tabs, edge butt one end of fixing press claw and weld tabs and the distance of chip are 0.08m to 0.15mm.
Further, the distance of an end of the edge butt of fixing press claw and weld tabs and chip is 0.115mm.
Further, an end of the close fixing press claw of weld tabs arranges projection to the direction of fixing press claw.
Further, projection is positioned at weld tabs near the middle part of an end of fixing press claw.
The beneficial effects of the utility model:
A kind of semiconductor lead frame that prevents that chip from weighing wounded of the present utility model, it has increased the space of pressing for fixing press claw newly, increased the weld tabs area, make chip expand to 0.08m to 0.15mm to the gap of paw, it is simple in structure, reasonable in design, solve large problem by slight improvement, reduced that to weigh the product that chip causes wounded bad due to fixing press claw, saved raw material.
Description of drawings
Utilize accompanying drawing that the utility model is described further, but the content in accompanying drawing does not consist of any restriction of the present utility model.
Fig. 1 is the working state schematic representation of a kind of semiconductor lead frame of prior art;
Fig. 2 is a kind of working state schematic representation that prevents the semiconductor lead frame that chip weighs wounded of the present utility model.
Include in Fig. 1, Fig. 2:
1---the lead frame body;
2---fixing press claw;
3---chip;
4---weld tabs;
5---projection.
Embodiment
The utility model is described in further detail with the following Examples.
A kind of semiconductor lead frame that prevents that chip from weighing wounded described in the utility model, as shown in Figure 2, its structure comprises lead frame body 1 and fixing press claw 2, lead frame body 1 comprises weld tabs 4, be welded with chip 3 on weld tabs 4, the edge butt of fixing press claw 2 and weld tabs 4, fixing press claw 2 is 0.115mm with edge butt one end of weld tabs 4 and the distance of chip.Compared with prior art increase fixing press claw 2 to the gap of chip 3, effectively avoided the fixing press claw 2 to weigh the generation of chip 3 wounded.
One end of weld tabs 4 close fixing press claws 2 arranges projection 5 to the direction of fixing press claw 2.According to the size of the size design projection 5 of fixing press claw 2, both guaranteed that fixing press claw 2 pressing firmly, do not weighing wounded chip 3, can save the space again, be conducive to the miniaturization of product.
It should be noted that at last: these are only preferred embodiment of the present utility model, be not limited to the utility model, although with reference to embodiment, the utility model is had been described in detail, for a person skilled in the art, it still can be modified to the technical scheme that aforementioned each embodiment puts down in writing, and perhaps part technical characterictic wherein is equal to replacement.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (4)
1. semiconductor lead frame that prevents that chip from weighing wounded, it is characterized in that: comprise lead frame body and fixing press claw, described lead frame body comprises weld tabs, be welded with chip on described weld tabs, the edge butt of described fixing press claw and described weld tabs, edge butt one end of described fixing press claw and described weld tabs and the distance of chip are 0.08m to 0.15mm.
2. the semiconductor lead frame that prevents that chip from weighing wounded according to claim 1, it is characterized in that: an end of the edge butt of described fixing press claw and described weld tabs and the distance of chip are 0.115mm.
3. the semiconductor lead frame that prevents that chip from weighing wounded according to claim 1 is characterized in that: described weld tabs arranges projection near an end of described fixing press claw to the direction of described fixing press claw.
4. the semiconductor lead frame that prevents that chip from weighing wounded according to claim 3 is characterized in that: described projection is positioned at described weld tabs near the middle part of an end of described fixing press claw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220440597 CN202948916U (en) | 2012-08-31 | 2012-08-31 | Semiconductor lead frame capable of preventing chip crushing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220440597 CN202948916U (en) | 2012-08-31 | 2012-08-31 | Semiconductor lead frame capable of preventing chip crushing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202948916U true CN202948916U (en) | 2013-05-22 |
Family
ID=48424606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220440597 Expired - Fee Related CN202948916U (en) | 2012-08-31 | 2012-08-31 | Semiconductor lead frame capable of preventing chip crushing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202948916U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111162052A (en) * | 2020-01-03 | 2020-05-15 | 长电科技（宿迁）有限公司 | Semiconductor packaging structure and bonding and pressing method thereof |
-
2012
- 2012-08-31 CN CN 201220440597 patent/CN202948916U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111162052A (en) * | 2020-01-03 | 2020-05-15 | 长电科技（宿迁）有限公司 | Semiconductor packaging structure and bonding and pressing method thereof |
| CN111162052B (en) * | 2020-01-03 | 2021-05-04 | 长电科技（宿迁）有限公司 | Semiconductor packaging structure and bonding and pressing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130522 Termination date: 20140831 |
|
| EXPY | Termination of patent right or utility model |