CN208315528U - It is a kind of to cut isolated pad pasting component for DFN/QFN encapsulation - Google Patents
It is a kind of to cut isolated pad pasting component for DFN/QFN encapsulation Download PDFInfo
- Publication number
- CN208315528U CN208315528U CN201820946577.5U CN201820946577U CN208315528U CN 208315528 U CN208315528 U CN 208315528U CN 201820946577 U CN201820946577 U CN 201820946577U CN 208315528 U CN208315528 U CN 208315528U
- Authority
- CN
- China
- Prior art keywords
- fixed area
- pad pasting
- steel ring
- dfn
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Sampling And Sample Adjustment (AREA)
Abstract
Isolated pad pasting component is cut for DFN/QFN encapsulation the utility model relates to a kind of, steel ring and pad pasting disk including workbench and setting on the table, the steel ring is located at the periphery of pad pasting disk, the pad pasting disk is equipped with sucker, the first fixed area and the second fixed area, the sucker is arranged on the first fixed area and the second fixed area, and first fixed area and the second fixed area close on setting.Since first fixed area of the utility model and the second fixed area close on setting, by the spacing for reducing the first fixed area and the second fixed area, it is possible to reduce the area of pad pasting disk and steel ring.The product of DFN/QFN encapsulation is fixed on steel ring and needs since the area of steel ring reduces, the dosage of UV film to be correspondingly reduced, to reduce costs using UV film.By test, the utility model can reduce by 1/3 UV film dosage.
Description
Technical field
The utility model relates to chip encapsulation technology fields more particularly to a kind of encapsulate for DFN/QFN to cut separation
Pad pasting component.
Background technique
It is encapsulated in cutting separation in existing DFN/QFN, the product of DFN/QFN encapsulation is moved in cutting in order to prevent
It is dynamic, the case where so as to cause scrapping;Therefore the product encapsulated to DFN/QFN is needed to fix processing, existing way is to pass through
The product that UV film encapsulates DFN/QFN is fixed on steel ring, is then fixed on chopping disk by steel ring, to play fixed work
With.It is needed in pad pasting using pad pasting disk, pad pasting disk is equipped with multiple fixed areas and sets in the prior art in order to be adapted to pad pasting
Standby size, pad pasting disk needs are designed according to full-size, therefore cause the spacing of fixed area larger, and the waste of UV film is serious, at
This height.
Utility model content
The purpose of this utility model is to provide a kind of patches isolated for DFN/QFN encapsulation cutting for reducing UV film dosage
Membrane module.
In order to solve the above-mentioned technical problem, technical solution provided by the utility model are as follows:
It is a kind of to cut isolated pad pasting component for DFN/QFN encapsulation, including workbench and it is arranged on the table
Steel ring and pad pasting disk, the steel ring are located at the periphery of pad pasting disk, and it is solid that the pad pasting disk is equipped with sucker, the first fixed area and second
Determine area, the sucker is arranged on the first fixed area and the second fixed area, and first fixed area and the second fixed area are closed on and set
It sets.
Wherein, the spacing of first fixed area and the second fixed area is 20mm.
Wherein, the surrounding of first fixed area and the second fixed area is equipped with positive stop lug boss, the width of the positive stop lug boss
It is 0.3mm for 2mm, interior depth, outer a height of 0.5mm.
Wherein, the length of the pad pasting disk and wide respectively 290mm and 214mm.
Wherein, the length of the steel ring and wide respectively 340mm and 268mm.
Wherein, the steel ring is equipped with limited step, and the workbench is equipped with for matching determining for the limited step
Position pin.
Wherein, the quantity of the sucker is eight, is divided into two groups, is separately positioned on the first fixed area and second and fixes
Qu Shang.
Wherein, the groove for cutting membrane material is additionally provided on the workbench.
The utility model has the following beneficial effects: since first fixed area of the utility model and the second fixed area are closed on and are set
It sets, by the spacing for reducing the first fixed area and the second fixed area, it is possible to reduce the area of pad pasting disk and steel ring.By DFN/QFN
The product of encapsulation, which is fixed on steel ring, to be needed, since the area of steel ring reduces, to correspondingly reduce the use of UV film using UV film
Amount, to reduce costs.By test, the utility model can reduce by 1/3 UV film dosage.
Detailed description of the invention
Fig. 1 is the schematic diagram described in the utility model that isolated pad pasting component is cut for DFN/QFN encapsulation;
1, workbench;11, positioning pin;2, steel ring;21, limited step;3, pad pasting disk;31, sucker;32, the first fixed area;
33, the second fixed area.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
As the embodiment described in the utility model for cutting isolated pad pasting component for DFN/QFN encapsulation, such as Fig. 1 institute
Show, including workbench 1 and the steel ring being arranged on workbench 12 and pad pasting disk 3, the steel ring 2 is located at the periphery of pad pasting disk 3,
The pad pasting disk 3 is equipped with sucker 31, the first fixed area 32 and the second fixed area 33, and the sucker 31 is arranged in the first fixed area
32 and second on fixed area 33, and first fixed area 32 and the second fixed area 33 close on setting.
Since first fixed area 32 of the utility model and the second fixed area 33 close on setting, by reducing by the first fixed area
32 and second fixed area 33 spacing, it is possible to reduce the area of pad pasting disk 3 and steel ring 2.The DFN/QFN product encapsulated is fixed to
It needs, since the area of steel ring 2 reduces, the dosage of UV film to be correspondingly reduced, to reduce into using UV film on steel ring 2
This.By test, the utility model can reduce by 1/3 UV film dosage.It, can be by DFN/QFN by the adsorption capacity of sucker 31
The product of encapsulation is fixed firmly on the first fixed area 32 and the second fixed area 33, and UV film is made entirely to fit to DFN/QFN
On the product of encapsulation, to improve the yields of pad pasting.
In the present embodiment, the spacing of first fixed area 32 and the second fixed area 33 is 20mm.By test, cutting
During cutting, the safe spacing of the product of monolithic DFN/QFN encapsulation is in 20mm or more, by reducing by the first fixed area 32 and second
The spacing of fixed area 33 achievees the effect that reduce UV film dosage, to reduce cost.
In the present embodiment, the surrounding of first fixed area 32 and the second fixed area 33 is equipped with positive stop lug boss and (schemes not
Show), the width of the positive stop lug boss is 2mm, interior depth is 0.3mm, outer a height of 0.5mm.
In the present embodiment, the length of the pad pasting disk 3 and wide respectively 290mm and 214mm.It, should be having a size of by test
Optimal 3 size of pad pasting disk correspondingly reduces the dosage of UV film, to reduce cost by reducing the size of pad pasting disk 3.
In the present embodiment, the length of the steel ring 2 and wide respectively 340mm and 268mm.It, should be having a size of most by test
Good 2 size of steel ring correspondingly reduces the dosage of UV film, to reduce cost by reducing the size of steel ring 2.
In the present embodiment, the steel ring 2 is equipped with limited step 21, and the workbench 1 is equipped with described for matching
The positioning pin 11 of limited step 21.By the cooperation of limited step 21 and positioning pin 11, steel ring 2 can be fixed firmly to work
Make on platform 1, prevents steel ring 2 mobile in pad pasting, improve the yields of pad pasting.
In the present embodiment, the quantity of the sucker 31 is eight, is divided into two groups, is separately positioned on the first fixed area
32 and second on fixed area 33.Four suckers 31 can be improved stronger adsorption capacity, the product that can encapsulate monolithic DFN/QFN
It is fixed firmly on the first fixed area 32 and the second fixed area 33, UV film is made entirely to fit to the product of DFN/QFN encapsulation
On, to improve the yields of pad pasting.
In the present embodiment, the groove (not shown go out) for cutting membrane material is additionally provided on the workbench 1.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (8)
1. a kind of cut isolated pad pasting component for DFN/QFN encapsulation, which is characterized in that including workbench and be arranged in work
Make the steel ring and pad pasting disk on platform, the steel ring is located at the periphery of pad pasting disk, and the pad pasting disk is equipped with sucker, the first fixed area
And second fixed area, the sucker are arranged on the first fixed area and the second fixed area, first fixed area and second fixed
Setting is closed in area.
2. pad pasting component according to claim 1, which is characterized in that the spacing of first fixed area and the second fixed area
For 20mm.
3. pad pasting component according to claim 1, which is characterized in that the surrounding of first fixed area and the second fixed area
It is equipped with positive stop lug boss, the width of the positive stop lug boss is 2mm, interior depth is 0.3mm, outer a height of 0.5mm.
4. pad pasting component according to claim 1, which is characterized in that the length of the pad pasting disk and it is wide be respectively 290mm and
214mm。
5. pad pasting component according to claim 1, which is characterized in that the length of the steel ring and it is wide be respectively 340mm and
268mm。
6. pad pasting component according to claim 1, which is characterized in that the steel ring is equipped with limited step, the work
Platform is equipped with the positioning pin for matching the limited step.
7. pad pasting component according to claim 1, which is characterized in that the quantity of the sucker is eight, is divided into two
Group is separately positioned on the first fixed area and the second fixed area.
8. pad pasting component according to claim 1, which is characterized in that be additionally provided on the workbench for cutting membrane material
Groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820946577.5U CN208315528U (en) | 2018-06-19 | 2018-06-19 | It is a kind of to cut isolated pad pasting component for DFN/QFN encapsulation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820946577.5U CN208315528U (en) | 2018-06-19 | 2018-06-19 | It is a kind of to cut isolated pad pasting component for DFN/QFN encapsulation |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208315528U true CN208315528U (en) | 2019-01-01 |
Family
ID=64707468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201820946577.5U Active CN208315528U (en) | 2018-06-19 | 2018-06-19 | It is a kind of to cut isolated pad pasting component for DFN/QFN encapsulation |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208315528U (en) |
-
2018
- 2018-06-19 CN CN201820946577.5U patent/CN208315528U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN208315528U (en) | It is a kind of to cut isolated pad pasting component for DFN/QFN encapsulation | |
CN208841092U (en) | Permanent-magnet ferrite tile-type product grinding attachment | |
CN218333698U (en) | Elastic wafer type fixing device for AI chip sealing and measuring | |
CN202241415U (en) | Corner cutting machine and workpiece in-advance positioning auxiliary mechanism of corner cutting machine | |
CN201195423Y (en) | Pad pasting positioning clamper | |
CN203092517U (en) | Vacuum working table for grinding machine and grinding machine | |
CN203171788U (en) | Grinding wheel floating die pressing base device | |
AR035145A1 (en) | A MOLDING PLANT, SPECIALLY INTENDED FOR THE PRODUCTION OF ELECTRODES, AND A METHOD IMPLEMENTED IN THE PLANT | |
CN103862265A (en) | Dustproof sealing cover upper and lower cover pressing mold | |
CN209077555U (en) | A kind of punching die for dust catcher filter plate | |
CN203437949U (en) | Rotation device for machining of water pump housing | |
CN104924114A (en) | Universal chuck for engraving and milling machine | |
CN206382867U (en) | A kind of axle system of Simple linkage five | |
CN206199905U (en) | Simple plate bending mould | |
CN202527848U (en) | Turntable type ultrasonic welding machine | |
CN202948916U (en) | Semiconductor lead frame capable of preventing chip crushing | |
CN204671884U (en) | A kind of mahjong machine frame | |
CN205660571U (en) | Vacuum adsorption plate | |
CN209665952U (en) | It is a kind of for processing the secondary fixture of full porcelain artificial tooth zirconium oxide block | |
TW200725716A (en) | Wafer level packaging process | |
CN206356930U (en) | A kind of backing plate recessing frock | |
CN204505000U (en) | A kind of cylinder is processed into positive pentagonal prism clamp | |
CN205319143U (en) | Be packaged with a plurality of audio power amplifier chip's circuit structure | |
CN105081839A (en) | Transversely-adjustable workpiece pressing device for hydraulic type lathe | |
TW200723459A (en) | Filp-chip leadframe type package and fabrication method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |