CN218333698U - Elastic wafer type fixing device for AI chip sealing and measuring - Google Patents

Elastic wafer type fixing device for AI chip sealing and measuring Download PDF

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Publication number
CN218333698U
CN218333698U CN202221994142.0U CN202221994142U CN218333698U CN 218333698 U CN218333698 U CN 218333698U CN 202221994142 U CN202221994142 U CN 202221994142U CN 218333698 U CN218333698 U CN 218333698U
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China
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fixedly connected
screw rod
fixing device
base
type fixing
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CN202221994142.0U
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Chinese (zh)
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潘宪峰
方家恩
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Suzhou Ruijie Micro Technology Group Co ltd
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Suzhou Ruijie Micro Technology Group Co ltd
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Abstract

The utility model discloses an elasticity wafer-level type fixing device for AI chip seals usefulness, comprising a base plate, bottom plate top fixedly connected with telescopic link, the telescopic link symmetry is provided with four, the equal swing joint in telescopic link one side has the bolt, the equal fixedly connected with platen in telescopic link top, all through backup pad fixed connection between the telescopic link is adjacent, platen top fixedly connected with base, through setting up the clamping piece, the clamping piece symmetry is provided with four, and the clamping piece bottom all is through second screw rod and slider swing joint, and slider one side all rotates and is connected with first screw rod, the equal fixedly connected with knob of first screw rod one end, the equal threaded connection in the first screw rod outside has the frame, and rotatory knob drives the clamping piece at slider top through first screw rod and carries out the centre gripping to putting thing board center removal, can comparatively effectually seal by the chip of the different specifications of same device centre gripping and survey, has effectively reduced manufacturing cost, reduces operating time, has increased the productivity.

Description

Elastic wafer type fixing device for AI chip sealing and measuring
Technical Field
The utility model belongs to the technical field of AI chip seals surveys, concretely relates to elasticity wafer formula fixing device that is used for AI chip to seal survey usefulness.
Background
The chip sealing and testing refers to a process of processing a wafer passing a test according to a product model and a functional requirement of the wafer, and then obtaining an independent chip.
The existing elastic wafer-type fixing device for partially sealing and measuring AI chips is single in chip specification, and when the chips with different specifications are sealed and measured, the fixing device needs to be replaced so as to meet the sealing and measuring requirements of the chips with different specifications, so that the production cost is improved, the operation time is prolonged, and the productivity is reduced.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is overcome current defect, a elasticity wafer formula fixing device for AI chip seals usefulness is provided, the chip specification that the elasticity wafer formula fixing device who seals usefulness of surveying was to solving the partial AI chip that proposes among the above-mentioned background art is comparatively single, need change the demand of surveying in order to satisfy the sealing of the chip of different specifications to fixing device when sealing the chip of surveying different specifications, and the production cost is promoted, and the operation time is prolonged, and the problem of productivity is reduced.
In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides an elasticity wafer formula fixing device for AI chip seals usefulness, includes the bottom plate, bottom plate top fixedly connected with telescopic link, the telescopic link symmetry is provided with four, the equal swing joint in telescopic link one side has the bolt, the equal fixedly connected with platen in telescopic link top, all through backup pad fixed connection between the telescopic link is adjacent, platen top fixedly connected with base, base top fixedly connected with stopper, the stopper symmetry is provided with four, the inside equal sliding connection of stopper has the slider, the slider top all has the clamping piece through second screw rod swing joint, slider one side all rotates and is connected with first screw rod, the equal fixedly connected with knob of first screw rod one end, the equal threaded connection in first screw rod outside has the frame, base top intermediate position department fixedly connected with base, base top fixedly connected with puts the thing board.
Preferably, the bottom of the bottom plate is fixedly connected with four universal wheels, and the number of the universal wheels is four.
Preferably, one side of the telescopic rod is provided with a limiting hole.
Preferably, the bottom of the outer frame is fixedly connected with four fixing blocks, and one side of each fixing block is fixedly connected with a base.
Preferably, the inner sides of the limit blocks are provided with sliding grooves.
Preferably, the outer side of the first screw rod is movably connected with a spring, one side of the spring is movably connected with an outer frame, and the other side of the spring is movably connected with a sliding block.
Preferably, the clamping piece is made of rubber.
Compared with the prior art, the utility model provides an elasticity wafer formula fixing device for AI chip seals usefulness possesses following beneficial effect:
1. the utility model discloses a set up the clamping piece, the clamping piece symmetry is provided with four, clamping piece bottom all is through second screw rod and slider swing joint, slider one side all rotates and is connected with first screw rod, the equal fixedly connected with knob of first screw rod one end, the equal threaded connection in first screw rod outside has the frame, rotatory knob drives the clamping piece at slider top through first screw rod and removes to putting thing board center and carry out the centre gripping to the chip, can comparatively effectually seal by the chip of different specifications of same device centre gripping, effectively reduced manufacturing cost, reduce operating time, increased the productivity;
2. the utility model discloses a set up the universal wheel, the universal wheel symmetry is provided with four, and the universal wheel top all fixedly connected with bottom plate can be comparatively convenient with the device removal to predetermined position, has promoted the convenience of device;
3. the utility model discloses a set up spacing hole, extract the bolt and adjust the telescopic link to suitable height after insert spacing downthehole fixing with the bolt again, the convenience is adjusted the height of device.
The part that does not relate to in the device all is the same with prior art or can adopt prior art to realize, the utility model has the advantages of being scientific and reasonable in structure, convenience safe in utilization provides very big help for people.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and do not constitute a limitation on the invention, and in the drawings:
fig. 1 is a schematic axial view of an elastic wafer-type fixing device for AI chip sealing and testing according to the present invention;
FIG. 2 is an enlarged schematic view of A of FIG. 1;
fig. 3 is a schematic side view of an elastic wafer-type fixing device for AI chip sealing and measuring according to the present invention;
fig. 4 is a schematic top view of an elastic wafer-type fixing device for AI chip encapsulation according to the present invention;
in the figure: the device comprises a bottom plate 1, a telescopic rod 2, a base 3, a limiting block 4, a sliding block 5, a first screw 6, a spring 7, a knob 8, a second screw 9, a clamping piece 10, an object placing plate 11, a base 12, a sliding groove 13, an outer frame 14, a bedplate 15, a bolt 16, a limiting hole 17, a universal wheel 18, a fixing block 19 and a supporting plate 20.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides an elasticity wafer-level type fixing device for AI chip seals usefulness, comprising a base plate 1, 1 top fixedly connected with telescopic link 2 of bottom plate, 2 symmetries of telescopic link are provided with four, 2 equal swing joint in one side of telescopic link has bolt 16, 2 equal fixedly connected with platen 15 in top of telescopic link, all through backup pad 20 fixed connection between the telescopic link 2 is adjacent, platen 15 top fixedly connected with base 3, 3 top fixedly connected with stopper 4 of base, stopper 4 symmetry is provided with four, stopper 4 inside equal sliding connection has slider 5, 5 tops all have clamping piece 10 through second screw rod 9 swing joint, 5 one side of slider all rotates and is connected with first screw rod 6, 6 one end equal fixedly connected with knob 8 of first screw rod, 6 outside equal threaded connection has frame 14, 3 top intermediate position department fixedly connected with base 12 of base 3, base 12 top fixedly connected with puts thing board 11, move the device to preset position through universal wheel 18, extract behind bolt 16 adjusts telescopic link 2 to suitable height, fix the spacing hole 17 that bolt 16 corresponds, place the chip on putting thing board 11, rotatory screw rod 8 drives thing 10 through first screw rod and has carried out the effectual reduction of the effective productivity of the clamp device of the removal of the clamp volume of the effectual clamp that can be carried out the production of the clamp to the effectual fixed clamp piece, the slider 7 outside of the clamp that the clamp piece, the clamp point has reduced the effective production cost of the clamp piece, the effective range of the clamp piece, the effective production cost of the clamp piece, the clamp piece is carried out.
The utility model discloses in, preferred, 1 bottom fixedly connected with universal wheel 18 of bottom plate, the 18 symmetries of universal wheel are provided with four, and mobile device that can be comparatively convenient has promoted the convenience of device.
The utility model discloses in, preferred, 2 one sides of telescopic link are provided with spacing hole 17, can adjust through plug bolt 16 to the height of telescopic link 2, comparatively effectual hoisting device is to the adaptation ability of different production environment.
The utility model discloses in, preferred, 14 bottom fixedly connected with fixed blocks 19 of frame, the 19 symmetry of fixed block are provided with four, and the equal fixedly connected with base 3 in fixed block 19 one side can be comparatively effectual the stability of improvement frame 14, reduces the range of rocking of frame 14 in the use.
The utility model discloses in, preferred, spout 13 has all been seted up to stopper 4 inboard, can comparatively effectual restriction slider 5's moving direction, reduces the skew that slider 5 produced at the removal in-process.
The utility model discloses in, preferred, 6 outside swing joint of first screw rod have spring 7, and spring 7 one side swing joint has frame 14, and 7 opposite side swing joint of spring has slider 5, can comparatively effectually reduce the range of rocking that first screw rod 6 produced when using, has promoted the stability of centre gripping when fixed device.
The utility model discloses in, it is preferred, clamping piece 10 is the rubber material, can comparatively effectually reduce the wearing and tearing of clamping piece 10 to the chip.
The utility model discloses a theory of operation and use flow: during the use, remove the device to preset position through universal wheel 18, extract bolt 16 and adjust suitable high back with telescopic link 2, insert corresponding spacing hole 17 with bolt 16 and fix, place the chip on putting thing board 11, rotatory knob 8 drives clamping piece 10 at slider 5 top through first screw rod 6 and removes to putting thing board 11's center, the swing range of slider 5 can comparatively effectually be reduced to spring 7 of first screw rod 6 outside swing joint, it is fixed to carry out the centre gripping to the chip, can effectually seal by the chip of the different specifications of same device centre gripping and survey, production cost has effectively been reduced, reduce operating time, the productivity has been increased.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. An elasticity wafer-type fixing device for AI chip seals usefulness, includes bottom plate (1), its characterized in that: the improved storage rack is characterized in that a telescopic rod (2) is fixedly connected to the top of the base plate (1), four telescopic rods (2) are symmetrically arranged, a bolt (16) is movably connected to one side of each telescopic rod (2), a table plate (15) is fixedly connected to the top of each telescopic rod (2), supporting plates (20) are fixedly connected between adjacent telescopic rods (2), a base (3) is fixedly connected to the top of each table plate (15), a limiting block (4) is fixedly connected to the top of each base (3), four limiting blocks (4) are symmetrically arranged, a sliding block (5) is slidably connected to the inside of each limiting block (4), clamping pieces (10) are movably connected to the tops of the sliding blocks (5) through second screw rods (9), a first screw rod (6) is rotatably connected to one side of each sliding block (5), a knob (8) is fixedly connected to one end of each first screw rod (6), an outer frame (14) is connected to the outer side of each first screw rod (6), a base (12) is fixedly connected to the middle position of the top of each base (3), and a storage plate (11) is fixedly connected to the top of each base (12).
2. The elastic wafer-type fixing device for AI chip encapsulation as claimed in claim 1, wherein: the bottom of the bottom plate (1) is fixedly connected with four universal wheels (18), and the four universal wheels (18) are symmetrically arranged.
3. The elastic wafer-type fixing device for AI chip encapsulation as claimed in claim 2, wherein: one side of the telescopic rod (2) is provided with a limiting hole (17).
4. The elastic wafer-type fixing device for AI chip encapsulation according to claim 3, characterized in that: the frame (14) bottom fixedly connected with fixed block (19), fixed block (19) symmetry is provided with four, equal fixedly connected with base (3) of fixed block (19) one side.
5. The elastic wafer-type fixing device for AI chip encapsulation according to claim 4, wherein: the inner side of the limiting block (4) is provided with a sliding groove (13).
6. The elastic wafer-type fixing device for AI chip encapsulation according to claim 5, characterized in that: the outer side of the first screw rod (6) is movably connected with a spring (7), one side of the spring (7) is movably connected with an outer frame (14), and the other side of the spring (7) is movably connected with a sliding block (5).
7. The elastic wafer-type fixing device for AI chip encapsulation as claimed in claim 6, wherein: the clamping piece (10) is made of rubber.
CN202221994142.0U 2022-08-01 2022-08-01 Elastic wafer type fixing device for AI chip sealing and measuring Active CN218333698U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221994142.0U CN218333698U (en) 2022-08-01 2022-08-01 Elastic wafer type fixing device for AI chip sealing and measuring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221994142.0U CN218333698U (en) 2022-08-01 2022-08-01 Elastic wafer type fixing device for AI chip sealing and measuring

Publications (1)

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CN218333698U true CN218333698U (en) 2023-01-17

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115855479A (en) * 2023-03-03 2023-03-28 江苏泛腾电子科技有限公司 Method and device for testing service life of data recording module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115855479A (en) * 2023-03-03 2023-03-28 江苏泛腾电子科技有限公司 Method and device for testing service life of data recording module

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