CN202259269U - Lead frame of improved semiconductor element - Google Patents
Lead frame of improved semiconductor element Download PDFInfo
- Publication number
- CN202259269U CN202259269U CN 201120416525 CN201120416525U CN202259269U CN 202259269 U CN202259269 U CN 202259269U CN 201120416525 CN201120416525 CN 201120416525 CN 201120416525 U CN201120416525 U CN 201120416525U CN 202259269 U CN202259269 U CN 202259269U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- support pin
- extreme support
- lower limb
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to a lead frame of an improved semiconductor element. The lead frame is manufactured by a tablet of an electrical conduction material through stamping processing, the lead frame comprises an upper edger, a lower edger and a support unit, and a plurality of support units are vertically arranged between the upper edger and the lower edger; each support unit midline of the surfaces of the upper edger and the lower edger is provided with a plurality of roundness through holes, and the surface of the lower edger is provided with a plurality of triangle holes and disassembly-cutting holes; and the position of each triangle hole is corresponding to each support unit, and the disassembly-cutting holes are arranged on the midline positioned adjacent support units on the surface of the lower edger. The lead frame provided by the utility model has beneficial effect of simple structure, and saves time, and can improve work efficiency.
Description
Technical field
The utility model relates to a kind of semiconductor element, relates in particular to the lead frame of the semiconductor element after a kind of architecture advances.
Background technology
Follow the development of electronic market, the integrated level of semiconductor components and devices is increasingly high, and its memory space, conversion speed and power increases rapidly, yet volume is but more and more littler.This trend has been quickened the development of semiconductor device packaging technique, so the importance of semiconductor device packaging technique has been subjected to the concern of manufacturing enterprise.In order to satisfy the demand of market development, lead frame also needs constantly innovation in structure and in function aspects.
Summary of the invention
The purpose of the utility model has provided a kind of lead frame of improved semiconductor element, and its structure can help identification and weld extreme support pin, and goes for the encapsulation of large-size crystal.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of lead frame of improved semiconductor element; This lead frame is to be processed through punch process by the tablet that can be used as conductive material; Described lead frame comprises top edge, lower limb and carrier unit, between described top edge and lower limb, is vertically installed with some carrier units.
Wherein, The surface of described top edge and lower limb is provided with some manholes at each carrier unit mid line place; Described lower limb surface is provided with somely tri-angle-holedly tears the hole open with cutting; Described tri-angle-holed position is corresponding with each carrier unit, and described cutting torn the mid line place that surface that the hole is arranged on lower limb is positioned at the adjacent supports unit open.
Wherein, Described carrier unit comprises the first extreme support pin and the second extreme support pin; The described first extreme support pin and the second extreme support pin are the strip lamellar body; The described first extreme support pin and the second extreme support pin are set to " recessed " type, leave the slit in the middle of the described second extreme support pin, and described gap width is 0.8mm～1mm.
The beneficial effect of the utility model is: be provided with some tri-angle-holed on the lower limb surface of lead frame; Each tri-angle-holed position is corresponding with each carrier unit, can be through leg-of-mutton wedge angle towards the welding position that helps discerning in the short time luminescent crystal and the first extreme support pin and the second extreme support pin.And simple in structure, save time, improved virtually operating efficiency.
Description of drawings
Accompanying drawing 1 is the structural representation of the lead frame of a kind of improved semiconductor element of the utility model.
In the accompanying drawing: the 1-top edge; The 2-lower limb; The 3-carrier unit; The 4-manhole; 5-cuts and tears the hole open; 6-is tri-angle-holed; The 31-first extreme support pin; The 32-second extreme support pin.
Embodiment
Below in conjunction with embodiment shown in the drawings the technical scheme of the utility model is done following detailed description the in detail:
See also shown in the accompanying drawing 1; The lead frame of a kind of improved semiconductor element of the utility model; This lead frame is to be processed through punch process by the tablet that can be used as conductive material; Lead frame comprises top edge 1, lower limb 2 and carrier unit 3, on top is vertically installed with some carrier units 3 between edge 1 and the lower limb 2.
Wherein, The surface of top edge 1 and lower limb 2 is provided with some manholes 4 at each carrier unit 3 mid line places; Lower limb 2 surfaces are provided with some tri-angle-holed 6 and tear hole 5 open with cutting; Tri-angle-holed 6 position is corresponding with each carrier unit 3, cuts and tears the mid line place that surface that hole 5 is arranged on lower limb 2 is positioned at adjacent supports unit 3 open.
Wherein, Carrier unit 3 comprises the first extreme support pin 31 and the second extreme support pin 32; The first extreme support pin 31 and the second extreme support pin 32 are the strip lamellar body; First extreme support 31 pins and the second extreme support pin 32 are set to " recessed " type, leave the slit in the middle of the second extreme support pin 32, and gap width is 0.8mm～1mm.
The beneficial effect of the utility model is: lower limb 2 surfaces at lead frame are provided with some tri-angle-holed 6; Each position of tri-angle-holed 6 is corresponding with each carrier unit 3, can be through leg-of-mutton wedge angle towards the welding position that helps discerning in the short time luminescent crystal and the first extreme support pin 31 and the second extreme support pin 32.And simple in structure, save time, improved virtually operating efficiency.
What should explain at last is: above embodiment only in order to the explanation the utility model and and the described technical scheme of unrestricted the utility model; Therefore, although this specification has carried out detailed explanation to the utility model with reference to each above-mentioned embodiment,, those of ordinary skill in the art should be appreciated that still and can make amendment or be equal to replacement the utility model; And all do not break away from the technical scheme and the improvement thereof of the spirit and the scope of the utility model, and it all should be encompassed in the claim scope of the utility model.
Claims (3)
1. the lead frame of an improved semiconductor element; It is characterized in that: this lead frame is to be processed through punch process by the tablet that can be used as conductive material; Described lead frame comprises top edge, lower limb and carrier unit, between described top edge and lower limb, is vertically installed with some carrier units.
2. the lead frame of a kind of improved semiconductor element according to claim 1; It is characterized in that: the surface of described top edge and lower limb is provided with some manholes at each carrier unit mid line place; Described lower limb surface is provided with somely tri-angle-holedly tears the hole open with cutting; Described tri-angle-holed position is corresponding with each carrier unit, and described cutting torn the mid line place that surface that the hole is arranged on lower limb is positioned at the adjacent supports unit open.
3. the lead frame of a kind of improved semiconductor element according to claim 1; It is characterized in that: described carrier unit comprises the first extreme support pin and the second extreme support pin; The described first extreme support pin and the second extreme support pin are the strip lamellar body; The described first extreme support pin and the second extreme support pin are set to " recessed " type, leave the slit in the middle of the described second extreme support pin, and described gap width is 0.8mm～1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120416525 CN202259269U (en) | 2011-10-25 | 2011-10-25 | Lead frame of improved semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120416525 CN202259269U (en) | 2011-10-25 | 2011-10-25 | Lead frame of improved semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202259269U true CN202259269U (en) | 2012-05-30 |
Family
ID=46120468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120416525 Expired - Fee Related CN202259269U (en) | 2011-10-25 | 2011-10-25 | Lead frame of improved semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202259269U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368485A (en) * | 2011-10-25 | 2012-03-07 | 张轩 | Improved semiconductor element lead framework |
-
2011
- 2011-10-25 CN CN 201120416525 patent/CN202259269U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368485A (en) * | 2011-10-25 | 2012-03-07 | 张轩 | Improved semiconductor element lead framework |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20121025 |