CN202088318U - Silicon wafer cutting equipment - Google Patents
Silicon wafer cutting equipment Download PDFInfo
- Publication number
- CN202088318U CN202088318U CN2011201868422U CN201120186842U CN202088318U CN 202088318 U CN202088318 U CN 202088318U CN 2011201868422 U CN2011201868422 U CN 2011201868422U CN 201120186842 U CN201120186842 U CN 201120186842U CN 202088318 U CN202088318 U CN 202088318U
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- CN
- China
- Prior art keywords
- separated time
- silicon
- cutting
- cutting equipment
- silicon chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides silicon wafer cutting equipment which comprises a fixing device for fixing silicon materials, wherein, a cutting device arranged below the fixing device comprises cutting steel wires wound on a roll shaft; two silicon blocks are mounted on the fixing device side by side; and a line distributing wheel is arranged on one side of the joint part of the two silicon blocks. The silicon wafer cutting equipment has the advantages that the wafer yield is high when the same silicon materials are used, the production efficiency is high, the unit cost of a silicon wafer is low, and the production process is simple.
Description
Technical field
The utility model relates to a kind of cutter sweep, relates in particular to a kind of silicon chip cutting equipment.
Background technology
Silicon chip is the most expensive part in the crystal silicon photovoltaic cell technology, and the cost of silicon chip cutting technique has occupied the bigger part of silicon chip production cost, so the height of cutting technique cost is bigger to the production cost influence of silicon chip.Traditional silicon chip cutting technique is relatively ripe, adopt mostly and divide gauze technique, so-called " branch gauze technique " cutting respectively keeps a segment distance with silicon material two heads with exactlying does not cut, and prevents the sliver of two silicon chip and causes breaking because of the influence to section of the inclined-plane of end face.
But this technology is abandoned the part of silicon material fully, and waste of material is serious, and the unit's of causing silicon material piece rate is low, and cutting cost is higher.
The utility model content
The utility model is for solving the prior art problem, and a kind of silicon material less wastage, silicon chip cutting equipment that cutting cost is lower are provided.
The technical solution of the utility model is: a kind of silicon chip cutting equipment, comprise the fixedly fixture of silicon material, this fixture below is provided with cutter sweep, and this cutter sweep comprises the cutting steel wire, the cutting steel wire is around on the roll shaft, and a side of described fixture is provided with the separated time wheel.
In traditional branch line cutting technology, the silicon material at first needs through check, then with the underproof part excision in silicon material edge, fetch bit is cut in silicon material center right rail, do not cut for one section and divide the gauze cutting technique need keep silicon material two heads, therefore each cutting all can be wasted by some qualified silicon material; In the utility model, install the separated time wheel on traditional cutter sweep additional, widen the retention position of former separated time, simultaneously on technology, during the defective operation of silicon material check back cutting, keep a part of underproof silicon material, this defective silicon material that is retained is placed into the retention position of branch gauze, what divide gauze to keep this moment not cut is underproof silicon material, and qualified silicon material is cut fully, can not be subjected to simultaneously of the influence of the inclined-plane of the easy sliver of two silicon chip, end face again to section, identical silicon material piece rate height, the technology cost is low.
As preferably, described cutting steel wire is provided with separated time portion, and the width of described separated time wheel is greater than this separated time portion.
As preferably, described separated time wheel is arranged at the rear of separated time portion.
As preferably, described separated time wheel is arranged at the top of separated time portion.
In sum, the utlity model has following advantage:
1, identical silicon material piece rate height, the production efficiency height;
2, the unit cost of silicon chip is low, and production technology is simple.
Description of drawings
Fig. 1 is the utility model embodiment one structural representation;
Fig. 2 is the utility model embodiment two structural representations.
Among the figure, 1, silico briquette, 11, the joint portion, 12, separated time portion, 2, fixture, 3, the cutting steel wire, 4, roll shaft, 5, the separated time wheel.
The specific embodiment
The utility model is described in further detail with embodiment below in conjunction with accompanying drawing.
Embodiment one:
A kind of silicon chip cutting equipment, as shown in Figure 1, comprise the fixture 2 that is fixed with two silico briquettes 1, these fixture 2 belows are provided with cutter sweep, this cutter sweep comprises cutting steel wire 3, cutting steel wire 3 is around on the roll shaft 4, cutting steel wire 3 is provided with separated time portion 12, and separated time portion 12 be positioned at two silico briquettes 1 joint portion 11 under, the arranged outside of separated time portion 12 has separated time wheel 5, and the width of separated time wheel 5 is greater than this separated time portion 12, wherein, roll shaft 4 is inboard near a side-looking of fixture 2, and opposite side is considered as the outside.
During work, preceding working procedure is at first tested to silico briquette 1, mark the right rail on the silico briquette, excise a part of defective part, then silico briquette 1 is adhered on the fixture 2, adjust separated time portion 12, make cutting steel wire 3 begin cutting with qualified of mark as initiating terminal, open nozzle simultaneously, mortar is delivered to nozzle along conduit 6, and, be attached to cutting steel wire 3 surfaces from the nozzle ejection.
Embodiment two:
A kind of silicon chip cutting equipment, as shown in Figure 2, comprise the fixture 2 that is fixed with two silico briquettes 1, these fixture 2 belows are provided with cutter sweep, and this cutter sweep comprises cutting steel wire 3, and cutting steel wire 3 is around on the roll shaft 4, cutting steel wire 3 is provided with separated time portion 12, and separated time portion 12 be positioned at two silico briquettes 1 joint portion 11 under, the upside of separated time portion 12 is provided with separated time wheel 5, the width of separated time wheel 5 is greater than this separated time portion 12.
Claims (4)
1. a silicon chip cutting equipment comprises the fixedly fixture of silicon material, and this fixture below is provided with cutter sweep, and this cutter sweep comprises the cutting steel wire, and the cutting steel wire is around on the roll shaft, it is characterized in that: a side of described fixture is provided with the separated time wheel.
2. according to the described silicon chip cutting equipment of claim 1, it is characterized in that: described cutting steel wire is provided with separated time portion, and the width of described separated time wheel is greater than this separated time portion.
3. according to the described silicon chip cutting equipment of claim 2, it is characterized in that: described separated time wheel is arranged at the rear of separated time portion.
4. according to the described silicon chip cutting equipment of claim 2, it is characterized in that: described separated time wheel is arranged at the top of separated time portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201868422U CN202088318U (en) | 2011-06-04 | 2011-06-04 | Silicon wafer cutting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201868422U CN202088318U (en) | 2011-06-04 | 2011-06-04 | Silicon wafer cutting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202088318U true CN202088318U (en) | 2011-12-28 |
Family
ID=45363407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201868422U Expired - Fee Related CN202088318U (en) | 2011-06-04 | 2011-06-04 | Silicon wafer cutting equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202088318U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103372922A (en) * | 2013-07-30 | 2013-10-30 | 衡水英利新能源有限公司 | Method of cutting ingot by wire-cutting mesh |
| CN103407008A (en) * | 2013-07-19 | 2013-11-27 | 镇江环太硅科技有限公司 | Improvement method for crystal rod cutting |
| CN104149214A (en) * | 2014-06-13 | 2014-11-19 | 镇江环太硅科技有限公司 | Lengthened guide wheel |
| CN105479609A (en) * | 2015-12-04 | 2016-04-13 | 湖南红太阳光电科技有限公司 | Multi-wire cutting method for cutting spliced silicon rods |
-
2011
- 2011-06-04 CN CN2011201868422U patent/CN202088318U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103407008A (en) * | 2013-07-19 | 2013-11-27 | 镇江环太硅科技有限公司 | Improvement method for crystal rod cutting |
| CN103372922A (en) * | 2013-07-30 | 2013-10-30 | 衡水英利新能源有限公司 | Method of cutting ingot by wire-cutting mesh |
| CN103372922B (en) * | 2013-07-30 | 2015-05-20 | 衡水英利新能源有限公司 | Method of cutting ingot by wire-cutting mesh |
| CN104149214A (en) * | 2014-06-13 | 2014-11-19 | 镇江环太硅科技有限公司 | Lengthened guide wheel |
| CN104149214B (en) * | 2014-06-13 | 2016-06-29 | 镇江环太硅科技有限公司 | A kind of lengthening directive wheel |
| CN105479609A (en) * | 2015-12-04 | 2016-04-13 | 湖南红太阳光电科技有限公司 | Multi-wire cutting method for cutting spliced silicon rods |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: HUZHOU JINKE TECHNOLOGY CO., LTD. Free format text: FORMER NAME: HUZHOU JINKE PHOTOVOLTAIC TECHNOLOGY CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 313000 Cao village, eight Li Town, Wuxing District, Zhejiang, Huzhou Patentee after: Huzhou Jinke Technology Co., Ltd. Address before: 313000 No. 10 standard factory building, eight mile town, Huzhou District, Wuxing District, Zhejiang, China Patentee before: Huzhou Jinke PV Technology Co.,Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111228 Termination date: 20130604 |