CN105479609A - Multi-wire cutting method for cutting spliced silicon rods - Google Patents
Multi-wire cutting method for cutting spliced silicon rods Download PDFInfo
- Publication number
- CN105479609A CN105479609A CN201510878729.3A CN201510878729A CN105479609A CN 105479609 A CN105479609 A CN 105479609A CN 201510878729 A CN201510878729 A CN 201510878729A CN 105479609 A CN105479609 A CN 105479609A
- Authority
- CN
- China
- Prior art keywords
- silicon rod
- splicing
- cutting
- line
- gauze
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Abstract
The invention discloses a multi-wire cutting method for cutting spliced silicon rods. According to the method, before the spliced silicon rods are cut, metal wires, located at the positions corresponding to splice joints of the spliced silicon rods, of a wire net of a multi-wire cutting machine are removed, and the integrity of the wire net is maintained. The multi-wire cutting method for cutting the spliced silicon rods has the advantages that the operation is simple and convenient, the splice joints of the spliced silicon rods are prevented from damaging the wire net, and the slicing accuracy of the silicon rods is guaranteed.
Description
Technical field
The present invention relates generally to silicon rod cutting technique field, refers in particular to a kind of multi-line cutting method for cutting splicing silicon rod.
Background technology
At present when carrying out silicon rod and cutting; when the length of silicon rod does not reach the requirement of cutting; usually after many silicon rods being spliced; directly cut again; but owing to there is splicing seams between adjacent silicon rod; therefore, when directly cutting, the section of splicing seams place silicon rod often can cause steel wire to break or damage, and therefore have impact on the quality of section greatly.
Summary of the invention
The technical problem to be solved in the present invention is just: for prior art exist technical problem, the invention provides a kind of easy and simple to handle, avoid metal wire impaired and ensure section precision for cut splicing silicon rod multi-line cutting method.
For solving the problems of the technologies described above, the technical scheme that the present invention proposes is:
For cutting a multi-line cutting method for splicing silicon rod, before splicing silicon rod being cut, removing the metal wire at the splicing seams place of corresponding splicing silicon rod in the gauze of multi-line cutting machine, and making gauze keep integrality.
Further improvement as technique scheme:
Metal line-width 2 ~ the 3mm larger than the width of splicing seams removed.
After removing the metal wire at the splicing seams place of corresponding splicing silicon rod in gauze, the metal wire broken by gauze by connection metal line is welded to connect to make gauze keep integrality.
Carrying out in the process of multi-wire saw to splicing silicon rod, swelling connection metal line is to keep the tension force of gauze.
By pulley swelling connection metal line.
Described metal wire is steel wire.
Compared with prior art, the invention has the advantages that:
Multi-line cutting method for cutting splicing silicon rod of the present invention, be applicable to the splicing silicon rod to being spliced by multiple silicon rod, carry out adding man-hour at splicing silicon rod, remove the metal wire of splicing seams corresponding position, thus splicing seams can be avoided the damage of metal wire or metal wire is ruptured, thus ensure section precision.
Accompanying drawing explanation
Fig. 1 is the structural representation of cutting machine in the present invention.
Number in the figure represents: 1, splice silicon rod; 11, splicing seams; 2, line roller; 21, gauze; 211, metal wire; 3, pulley.
Detailed description of the invention
Below in conjunction with Figure of description and specific embodiment, the invention will be further described.
As shown in Figure 1, the multi-line cutting method for cutting splicing silicon rod of the present embodiment, be applied in multi-line cutting machine, multi-line cutting machine is around in the groove of two or more line roller 2 by a lametta 211, groove on line roller 2 ensure that metal wire 211 is separated at a certain distance, metal wire 211 is around in the groove of line roller 2, form the cut surface (gauze 21) of many same intervals, space between metal wire 211 determines the thickness of silicon chip, silicon rod is being installed on above metal wire 211, high-speed cruising is carried out by controlling metal wire 211, and drive the particle loaded fluid being injected in cutting area to cut with silicon rod.The multi-line cutting method for cutting splicing silicon rod of the present embodiment, before cutting splicing silicon rod 1, removes the metal wire 211 at splicing seams 11 place of corresponding splicing silicon rod 1 in gauze 21, and makes gauze 21 keep integrality.The splicing silicon rod 1 that this method is directed to by multiple silicon rod is assembled cuts, owing to eliminating the metal wire 211 at splicing seams 11 place of corresponding splicing silicon rod 1 in gauze 21, thus the damage of splicing seams 11 pairs of metal wires 211 can be avoided, such as there is stria or fracture, ensure the precision of silicon rod slicing.
In the present embodiment, the metal wire 211(of removal is as steel wire) width is greater than splicing seams 11 about 2 ~ 3mm, ensure the metal wire 211 of gauze 21 do not contact with splicing seams 11 as far as possible but as far as possible more than cutting silicon rod, make splicing seams 11 place reserve sheet.
In the present embodiment, after removing the metal wire 211 at splicing seams 11 place of corresponding splicing silicon rod 1 in gauze 21, two the end of a thread can be left on the line roller 2 of side, now be welded to connect to make gauze 21 keep integrality with two metal wires 211 respectively by a connection metal line 211, namely gauze 21 is still a complete complete metal line 211.Carrying out in the process of multi-wire saw to splicing silicon rod 1, by being crossed on by connection metal line 211 with swelling connection metal line 211 on pulley 3, ensure the tension force of gauze 21.
Below be only the preferred embodiment of the present invention, protection scope of the present invention be not only confined to above-described embodiment, all technical schemes belonged under thinking of the present invention all belong to protection scope of the present invention.It should be pointed out that for those skilled in the art, some improvements and modifications without departing from the principles of the present invention, should be considered as protection scope of the present invention.
Claims (6)
1. one kind for cut splicing silicon rod multi-line cutting method, it is characterized in that, before splicing silicon rod (1) is cut, remove the metal wire (211) at splicing seams (11) place of corresponding splicing silicon rod (1) in the gauze (21) of multi-line cutting machine, and make gauze (21) keep integrality.
2. the multi-line cutting method for cutting splicing silicon rod according to claim 1, is characterized in that, metal wire (211) width 2 ~ 3mm larger than the width of splicing seams (11) of removal.
3. the multi-line cutting method for cutting splicing silicon rod according to claim 1 and 2, it is characterized in that, after removing the metal wire (211) at splicing seams (11) place of corresponding splicing silicon rod (1) in gauze (21), the metal wire (211) broken by gauze (21) by connection metal line (211) is welded to connect to make gauze (21) keep integrality.
4. the multi-line cutting method for cutting splicing silicon rod according to claim 3, is characterized in that, carrying out in the process of multi-wire saw to splicing silicon rod (1), swelling connection metal line (211) is to keep the tension force of gauze (21).
5. the multi-line cutting method for cutting splicing silicon rod according to claim 4, is characterized in that, by pulley (3) swelling connection metal line (211).
6. the multi-line cutting method for cutting splicing silicon rod according to claim 1 and 2, it is characterized in that, described metal wire (211) is steel wire.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510878729.3A CN105479609A (en) | 2015-12-04 | 2015-12-04 | Multi-wire cutting method for cutting spliced silicon rods |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510878729.3A CN105479609A (en) | 2015-12-04 | 2015-12-04 | Multi-wire cutting method for cutting spliced silicon rods |
Publications (1)
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CN105479609A true CN105479609A (en) | 2016-04-13 |
Family
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Family Applications (1)
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CN201510878729.3A Pending CN105479609A (en) | 2015-12-04 | 2015-12-04 | Multi-wire cutting method for cutting spliced silicon rods |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109808093A (en) * | 2019-04-16 | 2019-05-28 | 江苏美科硅能源有限公司 | A kind of silicon wafer dicing method |
CN110341062A (en) * | 2019-06-24 | 2019-10-18 | 内蒙古中环光伏材料有限公司 | A method of it prevents piece from jumping doubling and generates |
Citations (6)
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US20070283944A1 (en) * | 2004-05-18 | 2007-12-13 | Hukin David A | Abrasive Wire Sawing |
JP2010253664A (en) * | 2009-03-31 | 2010-11-11 | Komatsu Ntc Ltd | Workpiece cutting method and apparatus for changing workpiece cutting wire winding |
CN202088318U (en) * | 2011-06-04 | 2011-12-28 | 湖州金科光伏科技有限公司 | Silicon wafer cutting equipment |
CN203171863U (en) * | 2013-04-02 | 2013-09-04 | 浙江精功科技股份有限公司 | Subnet slicing device for double-layer wire network |
CN103407008A (en) * | 2013-07-19 | 2013-11-27 | 镇江环太硅科技有限公司 | Improvement method for crystal rod cutting |
CN203331254U (en) * | 2013-06-20 | 2013-12-11 | 晶科能源有限公司 | Silicon wafer cutting assembly |
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2015
- 2015-12-04 CN CN201510878729.3A patent/CN105479609A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070283944A1 (en) * | 2004-05-18 | 2007-12-13 | Hukin David A | Abrasive Wire Sawing |
JP2010253664A (en) * | 2009-03-31 | 2010-11-11 | Komatsu Ntc Ltd | Workpiece cutting method and apparatus for changing workpiece cutting wire winding |
CN202088318U (en) * | 2011-06-04 | 2011-12-28 | 湖州金科光伏科技有限公司 | Silicon wafer cutting equipment |
CN203171863U (en) * | 2013-04-02 | 2013-09-04 | 浙江精功科技股份有限公司 | Subnet slicing device for double-layer wire network |
CN203331254U (en) * | 2013-06-20 | 2013-12-11 | 晶科能源有限公司 | Silicon wafer cutting assembly |
CN103407008A (en) * | 2013-07-19 | 2013-11-27 | 镇江环太硅科技有限公司 | Improvement method for crystal rod cutting |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109808093A (en) * | 2019-04-16 | 2019-05-28 | 江苏美科硅能源有限公司 | A kind of silicon wafer dicing method |
CN110341062A (en) * | 2019-06-24 | 2019-10-18 | 内蒙古中环光伏材料有限公司 | A method of it prevents piece from jumping doubling and generates |
CN110341062B (en) * | 2019-06-24 | 2020-11-13 | 内蒙古中环光伏材料有限公司 | Method for preventing splicing seam from jumping and doubling |
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Application publication date: 20160413 |
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