KR102592384B1 - Method of scribing bonded substrate and apparatus for scribing bonded substrate - Google Patents

Abstract

(Problem) To provide a scribing method and scribing device for a bonded substrate that can suppress deformation of the terminal area during scribing and obtain a high-quality product.
(Solution) A bonded substrate in which a part of the edge portion of the first substrate 1 is cut off and a terminal region T is formed in the edge portion of the second substrate 2 is oriented in the direction of the terminal region T. A process of machining a scribe line for division on the upper and lower surfaces of the substrate with upper and lower cutter wheels 3a and 3b toward each other, and selecting an appropriate cutting amount that does not exceed a preset terminal breakage point at which breakage of the terminal area occurs; A step of scribing a region other than the terminal region of the bonded substrate with a first scribing load, a step of scribing the terminal region with a second scribing load smaller than the first scribing load, and a step of scribing the terminal region at an end portion of the terminal region. The method includes a step of retracting the cutter wheel from the end portion without stopping.

Description

Scribing method and scribing device for bonded substrate {METHOD OF SCRIBING BONDED SUBSTRATE AND APPARATUS FOR SCRIBING BONDED SUBSTRATE}

The present invention relates to a scribing method for processing a scribe line for division on a bonded substrate (also referred to as a bonded mother substrate, hereinafter referred to as a “mother substrate”) formed by bonding two substrates, particularly at the edge portion. It relates to a scribing method and scribing device for a mother board having a terminal area.

The mother substrate for manufacturing a liquid crystal display panel includes a first substrate on which a plurality of color filters are patterned (also referred to as a CF side substrate) and a second substrate on which a plurality of TFTs and terminal areas are patterned (also referred to as a TFT side substrate). They are bonded together by sandwiching a sealant that encapsulates them. Then, this mother board is divided into unit products by processing scribe lines using a cutter wheel or the like along grid-shaped division lines. Additionally, the terminal area is formed by cutting the upper CF side substrate inward from the edge by a required width (terminal width) (see Patent Documents 1 and 2).

2 to 4 show an example of a process for cutting out a unit product from a mother board. Here, a case where eight unit products are cut out from the mother board (M) will be explained.

First, as shown in FIGS. 1 and 7(a), the mother substrate (M) is cut using the first and second cutter wheels (3a, 3b) arranged above and below to face each other with the mother substrate (M) in between. ) For each of the CF side substrate 1 and the TFT side substrate 2 constituting the Engrave line (S1). Next, as shown in FIG. 7(b), a scribe line S2 for forming a terminal area is formed on the CF side substrate 1 using the first cutter wheel 3a. The scribe line S1 is formed with an incision sufficient to cause cracks in the thickness direction of the substrate, and is divided by bending the substrate in a later process. As shown in FIG. 3, the mother board M divided from the scribe line S1 becomes a single board M1 each containing four unit products, and is divided into strips by the scribe line S2. The end portion of the divided CF side substrate 1 is removed as an end material E to expose the terminal area T.

Next, after rotating the single-panel board M1 by 90 degrees, scribing is performed while simultaneously pressing the first and second cutter wheels 3a and 3b along the scheduled division line to carve a scribe line S3 on each board. The unit product M2 shown in FIG. 4 is cut out by dividing along the scribe line S3.

In addition, in addition to the case where the terminal area T is formed only on one side of the unit product as described above, the terminal area T may be formed on both left and right sides as shown in FIG. 5(a) or on two adjacent sides as shown in FIG. 5(b). In some cases, it is formed into an L shape, or, although not shown, in some cases, it is formed in a U shape along the three sides of the unit product.

In addition, when scribing the upper and lower surfaces of a substrate with the first and second cutter wheels 3a and 3b, in addition to “simultaneous cutting” in which the first and second cutter wheels 3a and 3b travel at the same opposing positions, FIG. 6 “Preceding cutting” in which the first and second cutter wheels 3a and 3b move forward and backward with respect to the scribing direction as shown in (a), and the first and second cutter wheels 3a and 3b as shown in FIG. 6(b). ) There is "shift cutting" in which the first and second cutter wheels travel offset left and right with respect to the scribing direction, and "advance/shift cutting" in which the first and second cutter wheels travel offset left and right forward and backward relative to the scribing direction, although not shown, and the substrate It is used separately depending on the thickness, type, location of the upper and lower division lines, etc. In general, when a terminal area exists at the starting or ending point of scribing, “preceding cutting” or “preceding/shift cutting” is used so that the first and second cutter wheels contact the substrate at the same time or move away from the substrate at the same time. Many methods are used.

WO2005/087458 Japanese Patent Publication No. 2015-13783

In the process of dividing the mother board described above, in the product area, the CF side board (1) and the TFT side board (2) are cut into the upper and lower surfaces of the mother board (M) using the first and second cutter wheels (3a, 3b), respectively. It gets scribed. At this time, conventionally, the cutter wheel travels with a predetermined pressing load to the end of the substrate, stops, and then moves up and down to move away from the substrate.

On the other hand, when scribing the portion where the terminal area is formed, as shown in FIG. 8, the second cutter wheel 3b cuts the lower part of the terminal area T without the upper CF side substrate 1. Only the TFT side substrate (2) is press-fitted and scribed. Normally, a thin TFT side substrate of 0.3 mm to 1.0 mm is scribed with a load of 4 N to 8 N using a cutter wheel with a diameter of 2 mm to 3 mm. When scribing the terminal area (T), Since the upper substrate is cut and the terminal area T cannot be supported by the upper CF side substrate 1 and the opposing first cutter wheel 3a, as shown in FIG. 9, the terminal area T cannot be supported by the upper CF side substrate 1 and the opposing first cutter wheel 3a. A phenomenon occurs in which the portion of the terminal area (T) is deformed starting from the root (R) due to pressurization. This deformation of the terminal area T increases as the substrate becomes thinner and the terminal width becomes longer.

In addition, after the cutter wheel stops at the end of the board, there is some time (measured value: 0.18 seconds) for it to retract up and down. Therefore, a load continues to be applied to the board during the stopping time, which causes damage to the terminal area ( T) It is a major factor in deformation. If such deformation occurs, the terminal area (T) may be destroyed, or a crack in the scribe line may extend from just below the wheel toward the front in the scribing direction, causing a foreshortening phenomenon that does not occur on the intended scribe line, resulting in a defective product. It becomes the cause of.

In addition, when performing “advance/shift cutting”, the first and second cutter wheels travel shifted left and right with respect to the scribing direction. For this reason, the deformation of the substrate becomes asymmetric when viewed from the scribing direction, and a phenomenon called “oblique cracking,” in which cracks in the scribe line are formed at an angle with respect to the thickness direction of the substrate, is likely to occur.

Therefore, in consideration of the above-mentioned problems, the present invention suppresses the deformation phenomenon of the terminal area during scribing even when the substrate is thin and the terminal width is long, and a high-quality product without breakage, leading edge, or diagonal cracks can be obtained. The main purpose is to provide a scribing method and scribing device for a bonded substrate.

In order to achieve the above object, the present invention sought the following technical means. That is, in the scribing method of the present invention, a bonded substrate in which a part of the end edge of the first substrate is cut off and a terminal area is formed in the end edge of the second substrate is cut using two cutter wheels facing each other. A scribing method for a bonded substrate in which a scribe line for dividing is machined on the upper and lower surfaces of a substrate by scribing in the direction of a terminal region, wherein a second cutter wheel for scribing the second substrate having the terminal region is positioned at an end position of the terminal region. It is driven along a traveling line parallel to the surface of the second substrate until it reaches the vicinity, and is driven gradually away from the surface of the terminal area from the vicinity of the terminal position of the terminal area to the terminal position of the terminal area. When the end position of the area is reached, it is made to evacuate from the terminal area instantly with zero stopping time.

In addition, the scribing method in another aspect of the present invention is a bonded substrate in which a part of the end edge of the first substrate is cut off and a terminal area is formed in the end edge of the second substrate by using two cutter wheels facing each other. A scribing method for a bonded substrate in which a scribe line for dividing is machined on the upper and lower surfaces of the substrate by scribing in the direction of the terminal area using a processing condition of at least one appropriate cutting amount that does not exceed the terminal breaking point and is searched in advance. One of the scribe recipes in which data is stored is selected, and the bonded substrate is scribed based on the processing conditions.

In addition, in the scribing method of the present invention, the product area where the first substrate and the second substrate are bonded are scribed with a first scribing load, and at least the terminal area is scribed with a second scribing load that is smaller than the first scribing load. You can also scribe.

In addition, the present invention is a scribing device for processing scribe lines for parting on the upper and lower surfaces of a bonded substrate in which a part of the end edge of the first substrate is cut off and a terminal area is formed in the end edge of the second substrate. A table holding a bonded substrate, upper and lower cutter wheels disposed above and below the bonded substrate held on the table to be able to be raised and lowered through a lifting mechanism and running in the direction of the terminal area of the bonded substrate, and It includes a control unit that performs overall processing of the substrate, and a scribing recipe stored in the control unit, wherein the scribe recipe prevents destruction of the terminal area from occurring when the cutter wheel cuts into the terminal area and scribes. Data of processing conditions including an uncut amount of cut, a first scribing load for scribing the product area of the bonded substrate, and a second scribing load smaller than the first scribing load for scribing the terminal area are described, , the control unit selects one of these scribe recipes, performs scribing based on the processing conditions, and raises and lowers the lifting mechanism so that the cutter wheel retracts from the terminal area immediately before the end portion of the terminal area. It also features a scribing device.

As described above, in the present invention, when scribing a second substrate having a terminal area with a cutter wheel, it gradually moves away from the surface of the terminal area from near the end position of the terminal area until it reaches the end position, so that the cutter wheel In addition to alleviating the pressing force on the terminal area, when the cutter wheel reaches the end position of the terminal area, it is instantly retracted from the terminal area with zero stopping time, preventing the load from continuing to be applied to the terminal area during the stopping time as in the past. The case disappears. This has the effect of suppressing deformation of the terminal area at the time of termination of the scribe and preventing the terminal area from being broken or skipped.

In addition, another aspect of the present invention is to select an appropriate cutting amount that does not exceed the terminal breaking point where the terminal area is deformed and fracture occurs when the terminal area portion is cut with a cutter wheel and scribed, and scribing is performed based on the processing conditions. As a result, deformation of the terminal area at the time of scribing termination of the cutter wheel is suppressed. This has the effect of reliably preventing the destruction of the terminal area, leading edge, and diagonal cracks even under conditions where deformation of the terminal area is likely to increase, such as when the substrate is thin or the terminal width is long.

In addition, the product area is scribed with a relatively high first scribing load, and when scribing the terminal area where deformation is likely to occur, the deformation of the terminal area T is suppressed by scribing with a second scribing load smaller than the first scribing load. , deeper vertical cracks can be formed in the product area that occupies most of the scribe line. As a result, the separability of subsequent processes can be improved, the dividing process can be simplified, and the decline in product quality caused by poor dividing can be suppressed.

In the above invention, the first cutter wheel for scribing the first substrate is moved along a traveling line parallel to the surface of the first substrate until it reaches the vicinity of the end position of the first substrate, and the first cutter wheel for scribing the first substrate is moved along a running line parallel to the surface of the first substrate. is made to travel gradually away from the surface of the first substrate from the vicinity of the terminal position to the terminal position of the first substrate, and when it reaches the terminal position of the first substrate, it is instantly retracted from the first substrate with zero stopping time. You can do it. As a result, the first cutter wheel for scribing the first substrate also instantly retracts from the end of the substrate, so after the second cutter wheel retracts, the load continues to be applied only to the end of the first board during the stop time of the first cutter wheel. There is no case of loss, and deformation of the first board and the entire mother board can be suppressed.

In addition, the scribe recipe is recommended to include, in addition to the thickness of the substrate, information on the width of the terminal area, the diameter of the cutter wheel used, the type of blade tip, and the running speed of the cutter wheel.

As a result, the selection range of scribe recipes is expanded, making it possible to scribe a variety of substrates.

1 is a diagram showing an example of a scribing device for carrying out the scribing method of the present invention.
Figure 2 is a plan view and a front view showing an example of a mother substrate to be processed.
FIG. 3 is a plan view and a side view showing a single board divided from the mother board of FIG. 2.
Fig. 4 is a perspective view showing a unit product cut out from the single board of Fig. 3.
Fig. 5 is a perspective view showing another example of the formation of a terminal area formed in a unit product.
Fig. 6 is an explanatory diagram showing scribing means for advance cutting and shift cutting.
Fig. 7 is an explanatory diagram when processing a scribe line on a mother substrate.
Fig. 8 is an explanatory diagram when scribing a terminal area with a second cutter wheel.
Fig. 9 is an explanatory diagram showing the warping phenomenon when a terminal area is scribed with a second cutter wheel.
Fig. 10 is an explanatory diagram showing a good state when the terminal area is scribed with the second cutter wheel.
Figure 11 is an explanatory diagram showing the scribing process using the first and second cutter wheels.
Fig. 12 is an explanatory diagram showing the scribing process of the terminal area using the first and second cutter wheels.
Fig. 13 is an explanatory diagram showing an example of a scribing recipe.
Fig. 14 is a block diagram showing the structure of a computer accompanying the scribe device.
Figure 15 is a diagram showing the maximum amount of change in the Z-axis address for each depth of cut.

The details of the present invention are described below.

1 is a perspective view schematically showing an example of a scribing device for carrying out the scribing method of the present invention. This scribing device includes a horizontal table (4) that attracts and holds the mother substrate (M) to be processed, and a scribe disposed above and below the table (4) so as to face each other with the table (4) in between. It is equipped with 1 cutter wheel (3a) and a 2nd cutter wheel (3b). The table 4 is divided into front and back at a predetermined interval along the Y direction in FIG. 1, and is arranged so that the first cutter wheel 3a and the second cutter wheel 3b are located within this interval.

The first and second cutter wheels 3a and 3b are held on upper and lower holders 5, 5, respectively, and the holders 5, 5 are connected to the scribe heads 6, 6 through a lifting mechanism (not shown). It is equipped to be raised and lowered. In addition, the scribe heads 6, 6 are movably mounted along the guides 9, 9 of the upper and lower guide bars 8, 8 horizontally crossed in the X direction by support pillars 7, 7 on both sides. It is formed to be able to move in the X direction by rotation of the motors 10, 10.

Using the first and second cutter wheels 3a and 3b of this scribing device, scribe lines S1 and S2 are scribed on the mother substrate M in the same order as shown in FIGS. 2 to 4 described above. The strip board M1 having the terminal area T is cut out by processing. Thereafter, a scribe line S3 is processed on the single-table board M1 along the division line to cut out a unit product M2 having a product area P and a terminal area T. Here, the product area (P) is an area having the first substrate (CF side substrate) (1) and the second substrate (TFT side substrate) (2), respectively, and the terminal area (T) is the area having the CF side substrate (1). This is an area that has been excised in advance to the width of the terminal, leaving only the TFT side substrate.

In the present invention, processing of the scribe line S3 on the single board M1 having the terminal area T is carried out by the following means. That is, when the second substrate (TFT side substrate) 2 having the terminal area T is pressed and scribed with the second cutter wheel 3b, the cutter wheel 3b is damaged in advance in the terminal area T. ) of the substrate is searched and set as the breaking depth of cut, and when scribing, the cutter wheel 3b is pressed in and scribed within the processing condition range of an appropriate cutting depth that does not exceed the breaking depth of cut, thereby creating a terminal area ( The deformation of T) was alleviated to eliminate the occurrence of breakage in the terminal area T.

The inventors used a bonded board (single board M1) with a thickness of the TFT side board 2 of 0.3 mm and a terminal width of 6 mm, and first and second cutter wheels 3a and 3b with a diameter of 2 mm. Then, a scribing experiment was conducted in which a scribe line was processed with a depth of cut of 1.0 mm using the “preceding cutting” scribing method. As a result, as shown in FIG. 9, it was confirmed that destruction occurred due to deformation of the terminal area T, and the amount of change (h) in the Z-axis address of the second cutter wheel 3b at that time was 0.41 mm. . In addition, the Z-axis address refers to the position of the cutter wheel's movement trace along the substrate thickness direction during scribing, and the change amount (h) is set based on the position where the cutter wheel contacts the substrate (0 point). This refers to the amount of change in the actual cutter wheel position depending on the amount of cut.

In addition, a scribing experiment was performed on the same bonded substrate as above, with a depth of cut of 0.1 mm to 0.9 mm. The results are shown in Figure 15. According to this, when the depth of cut is 0.1 mm to 0.3 mm, the maximum change in the Z-axis address in the terminal area T is 0.4 mm or less, and is within the range not exceeding the terminal breakdown point described above. Above 0.5 mm, the maximum change in the Z-axis address exceeds the terminal destruction point, increasing the possibility of destruction occurring in the terminal area (T). Therefore, 0.1 mm to 0.3 mm is the appropriate depth of cut. In fact, when the depth of cut is 0.3 mm in FIG. 15, the maximum change in the Z-axis address in FIG. 10 is 0.253 mm, so the deformation of the terminal area T is suppressed to a small extent, and the destruction of the terminal area T is minimized. does not occur

By performing such scribing experiments on bonded substrates with a thickness of 0.1 mm to 1.0 mm, an appropriate depth of cut at which the maximum change in the Z-axis address does not exceed the terminal breaking point is categorized and set for each plate thickness. Then, this setting value was set as a scribing recipe, stored in the control unit of the computer accompanying the scribing device, and at the start of scribing, the desired depth of cut corresponding to the substrate to be processed was selected from the recipe and scribing was performed under computer control.

Next, with reference to FIGS. 11 and 12, in the second substrate including the terminal area (T), the starting point of the scribe line is located in the product area (P), and the terminal area (T) is located at the end point of the scribe line. The scribing process performed in this case will be explained. FIG. 11 is an explanatory diagram showing the scribing process using the first and second cutter wheels, and FIG. 12 is an explanatory drawing showing the scribing process of the terminal area using the first and second cutter wheels.

For the TFT side substrate 2, the above appropriate cutting amount and first scribing load are selected, and the second cutter wheel 3b is pressed at the time of scribing. When the second cutter wheel 3b is driven at a predetermined traveling speed (scribe speed), a scribe line is formed in the product area P. Subsequently, when scribing the terminal area T, a second scribing load that is, for example, 20 to 50% smaller than the first scribing load is selected. Specifically, the scribe load is changed from a predetermined distance inside the terminal area T, and the second scribe is applied from the root part R of the terminal area T to the end part, that is, a distance corresponding to the terminal width w. A scribe line is formed by the load. In order to ensure that the second scribe load starts from the root (R) of the terminal area (T), the load begins to change inward from the terminal area (T), that is, near the terminal area (T) in the product area (P). It is desirable. On the other hand, when the scribing load in the product area P is small, the depth of the vertical crack becomes small, and there is a possibility that segmentation defects may occur in the subsequent segmentation process. For this reason, it is preferable to change the load from a position 1 to 2 mm inside the root portion (R) of the terminal region (T) in the product region (P). As a result, deformation of the terminal area can be further suppressed, and in particular, when shift cutting causes deformation of the substrate to become asymmetric when viewed from the scribing direction, the occurrence of diagonal cracks can be suppressed.

Furthermore, at the terminal area T, as shown in FIG. 12, the terminal area T is moved along the horizontal running line 15 up to the vicinity N2 of the terminal position T. It is made to travel gradually and slightly away from the surface of the terminal area T from the vicinity of the terminal position N2 to the terminal position of the terminal area T. And, when the end position of the terminal area T is reached, it is instantly retracted in the vertical direction with zero stopping time. Specifically, the second cutter wheel 3b begins to move away from the surface of the terminal area T from, for example, 10 μm inside the end position, thereby ensuring that it does not stop at the end position of the terminal area T. It is possible to retreat in the vertical direction.

Next, the scribing operation of the first substrate (CF side substrate) 1 will be described. In this embodiment, the first substrate (CF side substrate) 1 and the second substrate (TFT side substrate) 2 are simultaneously cut by the first cutter wheel 3a and the second cutter wheel 3b. A scribing operation is performed. In the CF side substrate 1, as in the TFT side substrate 2, the depth of cut and the above-described first scribing load are selected, the first cutter wheel 3a is pressed at the time of scribing, and a predetermined scribing speed is achieved. The scribe of the product area (P) is executed. Subsequently, while the terminal area T of the opposing TFT substrate is scribed, scribing is performed by a second scribing load that is, for example, 20 to 50% smaller than the first scribing load. Specifically, at the same time that the load applied by the second cutter wheel 3b on the TFT side substrate begins to change, the load on the CF side substrate also changes, corresponding to the terminal width w of the TFT side substrate. The distance is scribed with a second scribe load. That is, it is preferable to change the load from a position 1 to 2 mm inside the terminal width w, rather than from the end of the product area P. In this way, since the loads on the first cutter wheel 3a and the second cutter wheel 3b change simultaneously, the load applied to the mother board does not become uneven. Therefore, deformation of the entire mother substrate can be suppressed.

In addition, the first cutter wheel 3a is moved along the running line 16 horizontal to the surface of the first substrate until near the terminal position (N1) of the first substrate, and near the terminal position (N1) of the CF side substrate 1. ) to the terminal position, it is driven slowly and slightly away from the surface of the first substrate. Then, when the end position of the first substrate is reached, it is instantly retracted in the vertical direction with zero stopping time. Specifically, the first cutter wheel 3a begins to move away from the surface of the CF side substrate 1 from, for example, 10 μm inside the terminal position, so that it reliably stops at the terminal position of the CF side substrate 1. It is possible to retreat in the vertical direction without doing so. In addition, since the first cutter wheel 3a, which scribes the CF side substrate 1 in this way, also instantly retracts from the end of the substrate, the load is applied only to the end of the CF side substrate 1 during the stopping time of the first cutter wheel. There are no more cases where it continues to be applied. Therefore, deformation of the CF side substrate (1) and the entire mother substrate (M) can be suppressed.

At this time, the first cutter wheel 3a and the second cutter wheel 3b simultaneously retract from the mother substrate M, in other words, the first cutter wheel 3a reaches the end position of the CF side substrate. It is desirable to set scribing conditions such as scribing speed so that the second cutter wheel 3b reaches the terminal position of the terminal area T of the TFT side substrate 2 at the same time. Thereby, since the first cutter wheel 3a and the second cutter wheel 3b are instantly retracted from the end of the mother board M, the load applied to the mother board M does not become uneven. Therefore, deformation of the entire mother substrate can also be suppressed.

In addition, since the terminal area T does not exist in the CF side substrate 1, the same appropriate cutting amount as that of the TFT side substrate 2 may be used as the cutting amount in the CF side substrate 1, It is possible to use a depth of cut that is larger than the appropriate depth of cut. In the product area (P), the CF side substrate (1) and the TFT side substrate (2) are bonded together, so even if a cutting amount exceeding the terminal break point is used in the CF side substrate (1), the substrate is not likely to be destroyed. This is because no deformation occurs.

Figure 13 is a diagram showing an example of a scribe recipe (SD). Each scribe recipe (SD) contains Recipe No. 1… Each recipe is given a number to identify it, such as No.n. In each scribe recipe (SD), the thickness of the substrate, the amount of cut, the terminal width, the diameter of the cutter wheel used, the type of blade tip, the running speed of the cutter wheel, the scribe load, etc. are classified and described as scribe information. Then, when one of the recipes suitable for the scribing process to be executed is selected by the operator, the control unit reads this, and the lifting amount of the cutter wheel is controlled based on the contents described in the scribing recipe (SD), and the scribing process is executed. do.

FIG. 14 is a block diagram showing the structure of the computer 11. The computer 11 includes a control unit 12 realized by computer hardware such as CPU, RAM, and ROM, an input unit 13, and a display unit 14 on which processing menus and operation status are displayed. The control unit 12 controls the substrate by adsorbing and holding the substrate by the table 4, moving the scribe heads 6, 6 by the motor 10, and lifting and lowering the cutter wheels 3a, 3b by the lifting mechanism. Controls overall processing operations. The input unit 13 is an interface for the operator to input various operation instructions or data to the scribe device.

As described above, the present invention refers to the location of the cutter wheel where the terminal area (T) is deformed and failure occurs when the part of the terminal area (T) is cut and scribed with the second cutter wheel (3b) as the terminal failure point. In addition, scribing was performed by selecting an appropriate amount of cut that does not exceed this terminal breaking point, and the cutter wheel was made to retreat from the terminal area without stopping at the end of the terminal area. As a result, even under conditions where deformation of the terminal area T is likely to occur where the thickness of the substrate is small and the terminal width is large, deformation of the terminal area T is suppressed at the time of scribing termination of the second cutter wheel 3b. , it is possible to reliably prevent the terminal area (T) from being destroyed. In addition, by reducing the scribing load when scribing the terminal area (T), problems such as leading edge and diagonal cracking can be suppressed even when the scribing load other than the terminal area (T) is increased, thereby producing high-quality products. You can get it.

Although representative embodiments of the present invention have been described above, the present invention is not necessarily specific to the above-mentioned embodiments, and may be appropriately modified and changed to achieve the purpose of the present invention and without departing from the scope of the claims. possible.

For example, in this embodiment, the mother substrate M is arranged on the table 4 so that the CF side substrate 1 is the upper surface, but it may be arranged so that the TFT side substrate 2 is the upper surface. In this case, the first cutter wheel 3a is disposed below the table, and the second cutter wheel 3b is disposed above the table.

The scribing method and scribing device for a laminated substrate of the present invention can be used when processing a scribe line for dividing a laminated substrate having a terminal area.

M: Mother board
M1: Single desk board
M2: unit product
SD: Scribe Recipe
T: terminal area
1: First substrate (CF side substrate)
2: Second substrate (TFT side substrate)
3a: first cutter wheel
3b: second cutter wheel
4: table
11: computer
12: control unit

Claims (9)

A bonded substrate in which a portion of the edge portion of the first substrate is cut off and a terminal region is formed at the edge portion of the second substrate is scribed in the direction of the terminal region using two cutter wheels facing each other. A scribing method for a laminated substrate in which a scribe line for dividing is processed on the upper and lower surfaces of the substrate, comprising:
A second cutter wheel for scribing the second substrate having the terminal region is moved along a running line parallel to the surface of the second substrate until it reaches the vicinity of a termination position of the terminal region, and the second cutter wheel scribes the second substrate having the terminal region. It travels gradually away from the surface of the terminal area along the thickness direction of the second substrate from the vicinity of the position to the terminal position of the terminal area, and when it reaches the terminal position of the terminal area, it instantly retreats from the terminal area with zero stopping time. A scribing method for a bonded substrate. According to claim 1,
The first cutter wheel for scribing the first substrate is moved along a traveling line parallel to the surface of the first substrate until it reaches the vicinity of the terminal position of the first substrate, and then moves from the vicinity of the terminal position of the first substrate. The first substrate is driven gradually away from the surface of the first substrate along the thickness direction of the first substrate until the end position of the first substrate is reached, and when the end position of the first substrate is reached, the first substrate is instantly moved away with zero stopping time. A method of scribing a bonded substrate to avoid it from According to claim 2,
A method of scribing a bonded substrate, wherein the first cutter wheel and the second cutter wheel simultaneously retract from the terminal regions of the first substrate and the second substrate. A bonded substrate in which a portion of the edge portion of the first substrate is cut off and a terminal region is formed at the edge portion of the second substrate is scribed in the direction of the terminal region using two cutter wheels facing each other, thereby cutting the upper and lower surfaces of the substrate. A scribing method for a bonded substrate that processes a scribe line for dividing,
Selecting one of the scribe recipes that has been searched in advance and storing data on processing conditions for at least one appropriate cutting amount that does not exceed the terminal breakage point, and scribing the bonded substrate based on the processing conditions,
A second cutter wheel for scribing the second substrate having the terminal region is moved along a running line parallel to the surface of the second substrate until it reaches the vicinity of a termination position of the terminal region, and the second cutter wheel scribes the second substrate having the terminal region. It travels gradually away from the surface of the terminal area along the thickness direction of the second substrate from the vicinity of the position to the terminal position of the terminal area, and when it reaches the terminal position of the terminal area, it instantly retreats from the terminal area with zero stopping time. A scribing method for a bonded substrate. delete The method according to any one of claims 1 to 4,
Scribing the product area where the first substrate and the second substrate are bonded with a first scribing load,
A method of scribing a bonded substrate, wherein at least the terminal area is scribed with a second scribing load that is smaller than the first scribing load. According to claim 4,
A scribing method for a laminated substrate in which the scribing recipe is created by classifying the thickness of the substrate, and the depth of cut corresponding to the substrate to be processed is selected from the recipe to scribe. According to claim 4,
The scribe recipe is a method of scribing a bonded substrate, including information on the width of the terminal area, the diameter of the cutter wheel used, the type of the blade tip, and the running speed of the cutter wheel. A scribing device for a laminated substrate that processes scribe lines for dividing on the upper and lower surfaces of a laminated substrate in which a part of the end edge of the first substrate is cut off and a terminal area is formed in the end edge of the second substrate, comprising:
a table holding the bonded substrate to be processed;
a first cutter wheel and a second cutter wheel disposed above and below the bonded substrate held on the table so as to be capable of being raised and lowered through a lifting mechanism, and running opposite to each other in the direction of the terminal area of the bonded substrate;
a control unit that performs overall substrate processing using the first cutter wheel and the second cutter wheel;
Includes a scribe recipe stored in the control unit,
The scribe recipe describes data on processing conditions for an infeed amount that does not cause destruction of the terminal area when the second cutter wheel cuts into the terminal area and scribes, and one of these scribe recipes is selected. to scribe based on the processing conditions,
The second cutter wheel for scribing the second substrate having the terminal region is moved along a running line parallel to the surface of the second substrate until it reaches the vicinity of the end position of the terminal region. It is driven gradually away from the surface of the terminal area along the thickness direction of the second substrate from the vicinity of the terminal position to the terminal position of the terminal area, and when it reaches the terminal position of the terminal area, it is moved from the terminal area in an instant with zero stopping time. A scribe device for bonded substrates designed to slough off.

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