JP2019182742A - Scribing method and scribing apparatus - Google Patents

Abstract

To provide a scribing method and scribing apparatus, capable of suppressing the deformation of a substrate when scribing to obtain a high quality product.SOLUTION: A scribing method for processing a division scribe line on a substrate by cutter wheels 3a and 3b comprises: moving the cutter wheel along a travel line parallel to the surface of the substrate until reaching the vicinity of an end position of the substrate; travelling the cutter wheel from the vicinity of the end position of the substrate to the end position of the substrate so as to gradually separate the cutter wheel from the surface of the substrate; and instantaneously evacuating the cutter wheel from the substrate for a stop time of zero when the substrate reaches the end position.SELECTED DRAWING: Figure 12

Description

  The present invention relates to a scribing method for processing a cutting scribe line on a bonded substrate (or a bonded mother substrate, hereinafter referred to as a “mother substrate”) formed by bonding two substrates. The present invention relates to a scribing method and a scribing device for a mother board having a terminal region at an edge.

  A mother substrate for manufacturing a liquid crystal display panel includes a first substrate (also referred to as a CF side substrate) on which a plurality of color filters are patterned, and a second substrate (also referred to as a TFT side substrate) on which a plurality of TFTs and terminal regions are patterned. Are attached to each other with a sealing material enclosing the liquid crystal in between. And this mother board | substrate is divided | segmented into the unit product by processing a scribe line with a cutter wheel etc. along the grid-like parting line. Further, the terminal region is formed by cutting the upper CF-side substrate at a position inside the necessary width (terminal width) from the edge (see Patent Documents 1 and 2).

2 to 4 show an example of the process of cutting out the unit product from the mother substrate. Here, a case where eight unit products are cut out from the mother substrate M will be described.
First, as shown in FIG. 1 and FIG. 7A, the mother substrate M is configured by using the first and second cutter wheels 3a and 3b that are vertically arranged so as to face each other with the mother substrate M interposed therebetween. For each of the CF side substrate 1 and the TFT side substrate 2 to be scribed, the first and second cutter wheels 3a and 3b are pressed and scribed along the planned cutting line in the X direction, thereby forming a scribe line S1 on each substrate. Engrave. Next, as shown in FIG. 7B, a scribe line S2 for forming a terminal region is formed on the CF side substrate 1 by the first cutter wheel 3a. The scribe line S <b> 1 is formed with a notch that can crack in the thickness direction of the substrate, and is divided by bending the substrate in a subsequent process. As shown in FIG. 3, the mother substrate M divided from the scribe line S1 becomes a strip-shaped substrate M1 including four unit products, and the end of the CF side substrate 1 divided by the scribe line S2 is an end material. E is removed and the terminal region T is exposed.

Next, after the strip-shaped substrate M1 is rotated by 90 degrees, the first and second cutter wheels 3a and 3b are simultaneously pressed along the line to be divided, and the scribe line S3 is engraved on each substrate. Dividing along the line S3, the unit product M2 shown in FIG. 4 is cut out.
In addition to the case where the terminal region T is formed only on one side of the unit product as described above, the terminal region T may be formed on both the left and right sides as shown in FIG. 5A, or as shown in FIG. When it is formed in an L shape along two adjacent sides, or although not shown, it may be formed in a U shape along three sides of a unit product.

  When scribing the upper and lower surfaces of the substrate with the first and second cutter wheels 3a and 3b, in addition to “simultaneous cutting” in which the first and second cutter wheels 3a and 3b travel at the same facing position, “First cutting” in which the first and second cutter wheels 3a and 3b run forward and backward with respect to the scribe direction as shown in FIG. 6 (a), and the first and second cutter wheels as shown in FIG. 6 (b). Although the illustration is omitted, the “shift cut” in which the cutter wheels 3a and 3b are shifted to the left and right with respect to the scribe direction is omitted, but the first and second cutter wheels are shifted to the front and rear and the left and right with respect to the scribe direction. There are “advance / shift cutting”, which are used depending on the thickness and type of the substrate and the positions of the upper and lower cut lines. Generally, when there is a terminal area at the start or end of the scribe, the “first cutting” or “leading / shifting” is performed so that the first and second cutter wheels are simultaneously in contact with the substrate or separated from the substrate at the same time. The “cut” method is often used.

WO2005 / 087458 JP2015-13783A

  In the process of dividing the mother substrate described above, in the product region, the upper and lower surfaces of the mother substrate M are scribed on the CF side substrate 1 and the TFT side substrate 2 with the first and second cutter wheels 3a and 3b, respectively. At this time, conventionally, after the cutter wheel travels to a terminal end of the substrate with a predetermined pressing load and stops, the cutter wheel is retreated up and down so as to be separated from the substrate.

  On the other hand, when the portion where the terminal region is formed is scribed, as shown in FIG. 8, the second cutter wheel 3b is connected to the lower TFT side without the upper CF side substrate 1 in the portion of the terminal region T. Only the substrate 2 is pushed in and scribed. Usually, scribing is performed on a thin TFT side substrate of 0.3 mm to 1.0 mm with a load of 4 N to 8 N using a cutter wheel having a diameter of 2 mm to 3 mm, but when the portion of the terminal region T is scribed, Since the upper substrate is removed and the terminal region T cannot be supported by the upper CF side substrate 1 and the first cutter wheel 3a facing the upper substrate 1, the terminal region T is pressed by pressing the second cutter wheel 3b as shown in FIG. This causes a phenomenon in which the portion is deformed with the root portion R as a base point. Such deformation of the terminal region T becomes larger as the substrate is thinner and the terminal width is longer.

  In addition, after the cutter wheel stops at the end of the substrate, there is a short time (0.18 seconds in the measured value) until the cutter wheel is retracted up and down, so the load continues to be applied to the substrate during the stop time, This is a major factor in deformation of the terminal region T. If such deformation occurs, the terminal region T may be broken, or cracks in the scribe line may extend from directly under the wheel to the front of the scribe direction, resulting in a pre-run phenomenon that does not occur on the scheduled scribe line. It causes non-defective products.

  Further, when performing “advance / shift cut”, the first and second cutter wheels are shifted to the left and right with respect to the scribe direction. For this reason, the deformation of the substrate becomes asymmetrical when viewed from the direction of scribe, and a phenomenon called “sedge” is likely to occur, in which the cracks of the scribe line are inclined with respect to the thickness direction of the substrate.

Therefore, in view of the above-described problems, the present invention obtains a high-quality product that is free from sowing by suppressing the deformation phenomenon of the terminal region at the time of scribing even when the substrate is thin and the terminal width is long. a main object to provide a scribing method and the scribing apparatus can Ru groups board.

In order to achieve the above object, the present invention takes the following technical means. That, in the scribing method of the present invention is a scribing method for processing a scribe line for dividing the front surface of the base plate, the cutter wheel, is up to the vicinity of the end position of the substrate of the substrate A transition is made along a travel line parallel to the surface, the travel is performed so as to gradually move away from the surface of the substrate from the vicinity of the end position of the substrate to the end position of the substrate. Evacuated from the substrate instantly at zero .

Further, the present invention provides a scribing apparatus for processing a scribe line for dividing the front surface of the substrate, through a table for holding the workpiece all-out board, the lifting mechanism on the substrate held by the table lifting It is capable disposed includes a Luca Tsu coater wheel to travel the substrate, and a control unit for controlling the substrate processing in general by the cutter wheel, the control unit, the cutter wheel, the end position of the substrate It moves along a travel line parallel to the surface of the substrate until it reaches the vicinity, and travels gradually away from the surface of the substrate from the vicinity of the end position of the substrate to the end position of the substrate. The scribing apparatus is also characterized in that the elevating mechanism is moved up and down so as to retreat from the substrate instantaneously with zero stop time when reaching the end position .

The present invention, as described above, when the scribing base plate with a cutter wheel, so travels gradually away from the surface of the substrate from the vicinity of the end position of the substrate up to the end position, into the substrate by the cutter wheel with pressing force is reduced, and because the cutter wheel is to be retracted from the substrate instantaneously and downtime reaching the end position of the substrate, that the substrate during the stop time as in the conventional continuously applied load Disappear. Accordingly, etc. substrate is thin case, even in the modified large tends condition of the substrate, the substrate damage or getting ahead of ourselves, there is advantage of the ability to reliably prevent the occurrence of splintering.

In the above invention, the terminal position of the substrate is preferably located in the terminal region of the substrate .
Accordingly , even when the terminal area is likely to be greatly deformed, such as when the terminal width is long, it is possible to reliably prevent the terminal area from being destroyed, pre-run, and soggy.
In the above invention, one of the scribe recipes stored in advance in which data of processing conditions of at least one appropriate cutting amount not exceeding the terminal breaking point is stored is selected, and the substrate is selected based on the processing conditions. You may make it scribe.
When cutting the terminal area with the cutter wheel and scribing, the terminal area is deformed to cause destruction and the appropriate cutting amount that does not exceed the terminal breaking point is selected and scribed based on the processing conditions. Deformation of the terminal area at the end of the cutter wheel scribe is suppressed.
Further, the cutter wheel is scribed with a first scribe load until it reaches the vicinity of the end position of the substrate, and is smaller than the first scribe load from the vicinity of the end position of the substrate to the end position of the substrate. You may make it scribe by a 2nd scribe load.
The product area is scribed with a relatively high first scribe load, and when scribing the end position of the substrate where deformation is likely to occur, by scribing with a second scribe load smaller than the first scribe load, Deeper vertical cracks can be formed in the product region occupying most of the scribe line while suppressing deformation. Thereby, the separability of a subsequent process can be improved, the division process can be simplified, and the deterioration of the product quality accompanying the malfunction of a division can be suppressed.

The figure which shows an example of the scribing apparatus for enforcing the scribing method of this invention. The top view and front view which show an example of the mother board | substrate used as a process target. The top view and side view which show the strip-shaped board | substrate parted from the mother board | substrate of FIG. The perspective view which shows the unit product cut out from the strip-shaped board | substrate of FIG. The perspective view which shows another example of formation of the terminal area | region formed in a unit product. Explanatory drawing which shows the scribing means of prior cut and shift cut. Explanatory drawing when processing a scribe line on a mother substrate. Explanatory drawing when scribing a terminal area | region with a 2nd cutter wheel. Explanatory drawing which shows the curvature phenomenon when scribing a terminal area | region with the 2nd cutter wheel. Explanatory drawing which shows a favorable state when the terminal area | region was scribed with the 2nd cutter wheel. Explanatory drawing which shows the scribe process by a 1st, 2nd cutter wheel. Explanatory drawing which shows the scribe process of the terminal area | region by a 1st, 2nd cutter wheel. Explanatory drawing which shows an example of a scribe recipe. The block diagram which shows the structure of the computer incidental to a scribe apparatus. The figure which displayed the maximum change amount of the Z-axis address for every cutting amount.

Details of the present invention will be described below.
FIG. 1 is a perspective view schematically showing an example of a scribing apparatus for carrying out the scribing method of the present invention. The scribing device includes a horizontal table 4 that sucks and holds a mother substrate M to be processed, and a first cutter wheel 3a that is disposed above and below the table 4 so as to face each other across the table 4. And a second cutter wheel 3b. The table 4 is divided back and forth with a predetermined interval along the Y direction in FIG. 1, and the first cutter wheel 3a and the second cutter wheel 3b are arranged within this interval.

  The first and second cutter wheels 3a and 3b are respectively held by upper and lower holders 5 and 5, and the holders 5 and 5 are attached to the scribe heads 6 and 6 so as to be movable up and down via a lifting mechanism (not shown). ing. The scribing heads 6 and 6 are attached so as to be movable along the guides 9 and 9 of the upper and lower guide bars 8 and 8 bridged horizontally in the X direction by the support pillars 7 and 7 on both sides. It is formed so that it can move in the X direction by the rotation of.

  Using the first and second cutter wheels 3a and 3b of this scribing device, the scribe lines S1 and S2 are processed on the mother board M by the same procedure as that shown in FIGS. The strip-shaped substrate M1 having the region T is cut out. Thereafter, the scribe line S3 is processed on the strip-shaped substrate M1 along the planned dividing line to cut out the unit product M2 having the product region P and the terminal region T. Here, the product region P is a region having each of the first substrate (CF side substrate) 1 and the second substrate (TFT side substrate) 2, and the terminal region T is obtained by cutting the CF side substrate 1 in advance by the terminal width. This is a region where only the TFT side substrate remains.

  In the present invention, when the scribe line S3 is processed on the strip-shaped substrate M1 having the terminal region T, the following means is used. That is, when the second substrate (TFT side substrate) 2 having the terminal region T is pressed and scribed by the second cutter wheel 3b, the cutting amount of the cutter wheel 3b in which the terminal region T is broken in advance is destroyed. By searching and setting as the cutting depth and scribing by pushing the cutter wheel 3b within the range of the appropriate cutting depth machining conditions that do not exceed the fracture cutting depth at the time of scribing, the deformation of the terminal region T is alleviated. Thus, the occurrence of destruction in the terminal region T is eliminated.

  The inventors use a first and second cutter wheels 3a and 3b having a diameter of 2 mm to attach a bonded substrate (strip-shaped substrate M1) having a TFT side substrate 2 thickness of 0.3 mm and a terminal width of 6 mm. A scribing experiment was performed in which a scribing line was processed with a cutting depth of 1.0 mm by the scribing method of “cutting”. As a result, as shown in FIG. 9, it was confirmed that destruction occurred due to the deformation of the terminal region T, and the change amount h of the Z-axis address of the second cutter wheel 3b at that time was 0.41 mm. The Z-axis address refers to the position of the movement trajectory along the substrate thickness direction of the cutter wheel at the time of scribing, and the change amount h is set based on the position (0 point) where the cutter wheel contacts the substrate. The amount of change in the actual cutter wheel position according to the cut depth.

  In addition, scribing experiments were performed on the same bonded substrate as described above by setting a cutting amount of 0.1 mm to 0.9 mm. The result is shown in FIG. According to this, when the cutting depth is 0.1 mm to 0.3 mm, the maximum change amount of the Z-axis address in the terminal region T is 0.4 mm or less, and is within a range not exceeding the above-described terminal breaking point. However, when the cutting depth is 0.5 mm or more, the maximum amount of change in the Z-axis address exceeds the terminal breakdown point, and the possibility that the terminal area T is broken increases. Therefore, the appropriate cutting amount is 0.1 mm to 0.3 mm. Actually, the maximum change amount of the Z-axis address in FIG. 10 when the depth of cut is 0.3 mm in FIG. 15 is 0.253 mm, the deformation of the terminal region T is suppressed to a small extent, and the destruction of the terminal region T occurs. do not do.

  By performing such a scribing experiment on each of the bonded substrates having a thickness of 0.1 mm to 1.0 mm, an appropriate cutting amount in which the maximum change amount of the Z-axis address does not exceed the terminal breaking point is set for each plate thickness. Classify and set for each. This set value is stored as a scribing recipe in a computer control unit attached to the scribing device, and at the start of scribing, a desired cutting amount corresponding to the substrate to be processed is selected from the recipe and the scribing is performed by computer control. I tried to do it.

  Next, referring to FIG. 11 and FIG. 12, in the second substrate including the terminal region T, this is performed when the start point of the scribe line is located in the product region P and the terminal region T is located at the end point of the scribe line. The scribe process will be described. FIG. 11 is an explanatory view showing a scribing process by the first and second cutter wheels, and FIG. 12 is an explanatory view showing a terminal area scribing process by the first and second cutter wheels.

  The appropriate cutting amount and the first scribe load are selected for the TFT side substrate 2, and the second cutter wheel 3b is pressed against the scribe start point. A scribe line is formed in the product region P by causing the second cutter wheel 3b to roll at a predetermined traveling speed (scribe speed). Subsequently, when the terminal region T is scribed, a second scribe load that is, for example, 20 to 50% smaller than the first scribe load is selected. Specifically, the scribe load changes from the inside of the terminal region T by a predetermined distance, and a scribe line is formed by the second scribe load from the root portion R to the terminal portion of the terminal region T. In order to ensure the second scribe load from the root portion R of the terminal region T, it is preferable that the load starts to change from the terminal region T, that is, in the vicinity of the terminal region T of the product region P. On the other hand, when the scribe load in the product region P is small, the depth of the vertical crack becomes small, and there is a possibility that a division failure may occur in the subsequent division step. For this reason, it is preferable to change a load from the position inside 1-2 mm from the root part R of the terminal area | region T of the product area | region P. FIG. As a result, the deformation of the terminal region can be further suppressed, and in particular, the generation of soge can be suppressed when the deformation of the substrate becomes asymmetric when viewed from the scribe progression direction due to shift cutting.

  Furthermore, at the terminal portion of the terminal region T, as shown in FIG. 10, the terminal region T is moved along the horizontal travel line 15 up to the vicinity N of the terminal region T, and from the vicinity N of the terminal region T to the terminal region T. The terminal region T is caused to travel gradually and slightly away from the surface of the terminal region T until the terminal position of the terminal region T is reached. Then, when the terminal position of the terminal region T is reached, it is retracted instantaneously in the vertical direction with zero stop time. Specifically, the second cutter wheel 3b starts to move away from the surface of the terminal region T from, for example, 10 μm from the end position, so that it can be retracted in the vertical direction without stopping at the end position of the terminal region T. It is.

  Next, the scribing operation of the first substrate (CF side substrate) 1 will be described. In the present embodiment, a scribing operation is simultaneously performed on the first substrate (CF side substrate) 1 and the second substrate (TFT side substrate) 2 by the first cutter wheel 3a and the second cutter wheel 3b. Similarly to the TFT side substrate 2, the CF side substrate 1 selects the cutting amount and the first scribe load described above, and the first cutter wheel 3 a is pressed against the scribe start point, so that the product is obtained at a predetermined scribe speed. The scribing of the area P is executed. Subsequently, while the terminal region T of the opposing TFT substrate is scribed, scribing is performed with a second scribe load that is 20 to 50% smaller than the first scribe load, for example. Specifically, the load applied by the second cutter wheel 3b of the TFT side substrate starts to change, and at the same time, the load is also changed in the CF side substrate, and the distance corresponding to the terminal width w of the TFT side substrate is the first. Scribing is performed with a second scribe load. That is, it is preferable to change the load from a position on the inner side of 1 to 2 mm in addition to the terminal width w from the end portion of the product region P. Thus, since the load of the 1st cutter wheel 3a and the 2nd cutter wheel 3b changes simultaneously, the load concerning a mother board | substrate does not become non-uniform | heterogenous. Therefore, deformation of the entire mother board can be suppressed.

Further, the first cutter wheel 3a is moved along the traveling line horizontal to the surface of the first substrate up to the vicinity of the first substrate end position, and from the vicinity of the end position of the CF side substrate 1 to the end position of the first substrate. Run slowly and slightly away from the surface. When the end position of the first substrate is reached, the first substrate is instantaneously retracted in the vertical direction with zero stop time. Specifically, the first cutter wheel 3a starts to move away from the surface of the CF side substrate 1 from, for example, 10 μm from the end position, so that the first cutter wheel 3a can be surely retracted without stopping at the end position of the CF side substrate 1. Is possible . Since the first cutter wheel 3a scribing CF side substrate 1 as this also retracts instantly at the end of the substrate, that load only at the end of the CF-side substrate 1 is continuously applied while the first cutter wheel downtime Disappear. Therefore, deformation of the CF side substrate 1 and the mother substrate M as a whole can also be suppressed.

  At this time, the first cutter wheel 3a and the second cutter wheel 3b are retracted from the mother substrate M at the same time, in other words, the first cutter wheel 3a reaches the terminal position of the CF side substrate and at the same time the second cutter wheel. It is preferable to set a scribe condition such as a scribe speed so that 3b reaches the terminal position of the terminal region T of the TFT side substrate 2. As a result, the first cutter wheel 3a and the second cutter wheel 3b are retracted instantaneously at the end of the mother substrate M, so that the load on the mother substrate M does not become uneven. Therefore, deformation of the entire mother board can also be suppressed.

  In addition, since the terminal area T does not exist in the CF side substrate 1, the same appropriate cutting amount as that of the TFT side substrate 2 may be used as the cutting amount in the CF side substrate 1, and the cutting amount larger than the appropriate cutting amount may be used. Complicated amount may be used. In the product region P, the CF side substrate 1 and the TFT side substrate 2 are bonded to each other, and even if a cut amount exceeding the terminal breakdown point is used in the CF side substrate 1, no deformation that leads to the destruction of the substrate occurs. It is.

  FIG. 13 is a diagram illustrating an example of the scribe recipe SD. Each scribe recipe SD has a recipe no. 1 ... No. A number for identifying each recipe, such as n, is attached. In each scribe recipe SD, the thickness of the substrate, the depth of cut, the terminal width, the diameter of the cutter wheel used, the type of blade edge, the traveling speed of the cutter wheel, the scribe load, etc. are classified and described as scribe information. Yes. Then, when one of the recipes suitable for the scribe process to be executed is selected by the operator, the controller reads the recipe, and the amount of lift of the cutter wheel is controlled based on the contents described in the scribe recipe SD. The scribe process is executed.

  FIG. 14 is a block diagram showing the structure of the computer 11. The computer 11 includes a control unit 12 realized by computer hardware such as a CPU, a RAM, and a ROM, an input unit 13, and a display unit 14 on which a processing menu and an operation status are displayed. The control unit 12 controls the overall processing operation of the substrate, such as suction holding of the substrate by the table 4, movement of the scribe heads 6 and 6 by the motor 10, and lifting and lowering of the cutter wheels 3a and 3b by the lifting mechanism. The input unit 13 is an interface for an operator to input various operation instructions and data to the scribe device.

  As described above, according to the present invention, when the portion of the terminal region T is cut by the second cutter wheel 3b and scribed, the position of the cutter wheel where the terminal region T is deformed and broken is defined as the terminal breaking point. Scribing was performed by selecting an appropriate cutting amount not exceeding the point, and the cutter wheel was retracted from the terminal area without stopping at the end of the terminal area. Accordingly, even when the terminal region T is thin and has a large terminal width, the terminal region T is prevented from being deformed at the end of the scribing of the second cutter wheel 3b. Can be reliably prevented from being destroyed. Further, by reducing the scribe load when scribing the terminal region T, it is possible to suppress problems such as pre-running and sogging even when the scribe load other than the terminal region T is increased, and to obtain a high-quality product. it can.

As described above, the representative examples of the present invention have been described. However, the present invention is not necessarily limited to the above-described embodiments, and can be appropriately modified within the scope of achieving the object of the present invention and not departing from the scope of the claims. It is possible to change.
For example, in the present embodiment, the mother substrate M is arranged on the table 4 so that the CF side substrate 1 becomes the upper surface, but may be arranged so that the TFT side substrate 2 becomes the upper surface. In this case, the first cutter wheel 3a is disposed below the table, and the second cutter wheel 3b is disposed above the table.

Scribe method and the scribing apparatus of the board of the present invention can be utilized when processing a scribe line for dividing the substrate.

M Mother board M1 Strip board M2 Unit product SD Scribe recipe T Terminal area 1 First board (CF side board)
2 Second substrate (TFT side substrate)
3a 1st cutter wheel 3b 2nd cutter wheel 4 Table 11 Computer 12 Control part

Claims (5)

A scribing method for processing a scribe line for dividing a surface of a base plate,
The cutter wheel is moved along a travel line parallel to the surface of the substrate until it reaches the vicinity of the end position of the substrate, and from the vicinity of the end position of the substrate to the end position of the substrate from the surface of the substrate. A scribing method in which the vehicle is moved away gradually, and when it reaches the end position of the substrate, it is retracted from the substrate instantaneously with zero stop time . The scribing method according to claim 1 , wherein an end position of the substrate is located in a terminal region of the substrate . A scribing recipe in which data of processing conditions of at least one appropriate cutting amount that does not exceed a terminal breaking point, which is searched in advance, is stored is selected, and the substrate is scribed based on the processing conditions. 2. The scribing method according to 2. The cutter wheel is scribed with a first scribe load until it reaches the vicinity of the end position of the substrate, and a second smaller than the first scribe load from the vicinity of the end position of the substrate to the end position of the substrate. The scribing method according to any one of claims 1 to 3, wherein scribing is performed with a scribing load of. A scribing apparatus for processing a scribe line for dividing the front surface of the base plate,
A table for holding the workpiece all-out board,
Through the lifting mechanism to the substrate held on the table it is movable vertically arranged, includes a Luca Tsu coater wheel to travel a pre-Symbol substrate, and a control unit for controlling the substrate processing in general by the cutter wheel,
The controller is
The cutter wheel moves along a running line parallel to the surface of the substrate until it reaches the vicinity of the termination position of the substrate, and the surface of the substrate extends from the vicinity of the termination position of the substrate to the termination position of the substrate. gradually it travels away from the scan Clive apparatus the lifting mechanism so as to retreat from the substrate instantaneously and downtime reaching the end position of the substrate so as to lift.