CN203331254U - Silicon wafer cutting assembly - Google Patents
Silicon wafer cutting assembly Download PDFInfo
- Publication number
- CN203331254U CN203331254U CN2013203555826U CN201320355582U CN203331254U CN 203331254 U CN203331254 U CN 203331254U CN 2013203555826 U CN2013203555826 U CN 2013203555826U CN 201320355582 U CN201320355582 U CN 201320355582U CN 203331254 U CN203331254 U CN 203331254U
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- CN
- China
- Prior art keywords
- cutting
- silicon chip
- cutting assembly
- cut
- assembly
- Prior art date
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- 238000005520 cutting process Methods 0.000 title claims abstract description 87
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 50
- 239000010703 silicon Substances 0.000 title claims abstract description 50
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound data:image/svg+xml;base64,<?xml version='1.0' encoding='iso-8859-1'?>
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 [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 48
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
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Abstract
The utility model discloses a silicon wafer cutting assembly. The silicon wafer cutting assembly comprises a driving roller and a driven roller, wherein the driving roller and the driven roller are arranged in parallel. The driving roller and the driven roller are provided with a plurality of cutting sets in a sleeved mode. Each cutting set comprises a plurality of cutting wires arranged in parallel, the extension direction of the cutting wires is perpendicular to the extension direction of the axis of the driving roller, and the cutting gap matched with the splicing portion of a silicon ingot is formed between every two adjacent cutting sets. In the working process, due to the cutting gaps, the phenomenon that no-load abrasion is generated when the cutting wires enter the slicing portion of the silicon ingot can be effectively avoided, the phenomenon of non-work wire breaking caused by no-load abrasion can be avoided, the wire breaking rate of the silicon wafer cutting assembly is effectively lowered, and then the machining efficiency of the silicon wafer cutting assembly is improved.
Description
Technical field
The utility model relates to the polysilicon technical field of processing equipment, particularly a kind of silicon chip cutting assembly.
Background technology
Silicon chip is that application is a kind of processing raw material widely in current photovoltaic field, and it is normally formed through cutting processing by silicon ingot, and, along with the improving constantly of user demand, people also have higher requirement to the associative operation of silicon chip cutting.
In current existing silicon chip cutting process, it normally carries mortar pending silicon ingot is carried out to grinding and cutting by being wound in line of cut on roller.Although current silicon chip cutting operation can meet basic production and processing needs, but because its each line of cut is equidistant distribution equalizing structure, place, gap in the silicon ingot splicing easily forms the steel wire heel and toe wear, and then cause the broken string phenomenon, seriously restrict integral production efficiency, and caused the excessive loss of silicon material.
Therefore, how to reduce the outage in the silicon chip cutting process, and to improve its working (machining) efficiency be the important technological problems that those skilled in the art need to solve at present.
The utility model content
The purpose of this utility model is to provide a kind of silicon chip cutting assembly, and the outage of this silicon chip cutting assembly is lower, and its working (machining) efficiency is higher.
For solving the problems of the technologies described above, the utility model provides a kind of silicon chip cutting assembly, comprise the drive roll and the driven voller that be arranged in parallel, be arranged with some cutting groups on described drive roll and described driven voller, described cutting group comprises some lines of cut that be arranged in parallel, the bearing of trend of the bearing of trend of described line of cut and the axis of described drive roll is perpendicular, forms the cutting gaps matched with silicon ingot splicing place between adjacent two cutting groups.
Preferably, the width of described cutting gaps is 5 millimeters.
Preferably, between adjacent two lines of cut of described cutting group, form cutting gap, each described line of cut is uniform successively along the bearing of trend of the axis of described drive roll with described cutting gap.
Preferably, the width of described cutting gap is 334 microns.
Preferably, described line of cut is steel wire.
Relative above-mentioned background technology, silicon chip cutting assembly provided by the utility model, comprise the drive roll and the driven voller that be arranged in parallel, be arranged with some cutting groups on described drive roll and described driven voller, described cutting group comprises some lines of cut that be arranged in parallel, the bearing of trend of the bearing of trend of described line of cut and the axis of described drive roll is perpendicular, forms the cutting gaps matched with silicon ingot splicing place between adjacent two cutting groups.In the course of work, described cutting gaps can effectively be avoided described line of cut to enter silicon ingot splicing place and produce unloaded wearing and tearing, avoid the generation of the inoperative broken string phenomenon that causes because of zero load wearing and tearing, effectively reduce the outage of described silicon chip cutting assembly, and make the corresponding raising of its working (machining) efficiency.
The accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, below will the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
The assembly structure schematic diagram of the silicon chip cutting assembly that Fig. 1 provides for a kind of specific embodiment of the utility model.
The specific embodiment
Core of the present utility model is to provide a kind of silicon chip cutting assembly, and the outage of this silicon chip cutting assembly is lower, and its working (machining) efficiency is higher.
In order to make those skilled in the art person understand better the utility model scheme, below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Please refer to Fig. 1, the assembly structure schematic diagram of the silicon chip cutting assembly that Fig. 1 provides for a kind of specific embodiment of the utility model.
In the specific embodiment, silicon chip cutting assembly provided by the utility model, comprise the drive roll 11 and the driven voller 12 that be arranged in parallel, be arranged with some cutting groups 13 on drive roll 11 and driven voller 12, cutting group 13 comprises some lines of cut that be arranged in parallel 131, the bearing of trend of the axis of the bearing of trend of line of cut 131 and drive roll 11 is perpendicular, forms the cutting gaps 14 matched with silicon ingot splicing place between adjacent two cutting groups 13.In the course of work, cutting gaps 14 can effectively be avoided line of cut 131 to enter silicon ingot splicing place and produce unloaded wearing and tearing, avoid the generation of the inoperative broken string phenomenon that causes because of zero load wearing and tearing, effectively reduce the outage of described silicon chip cutting assembly, and make the corresponding raising of its working (machining) efficiency.
Further, the width of cutting gaps 14 is 5 millimeters.It is only preferred version that the width that it should be pointed out that this cutting gaps 14 is 5 millimeters, and its width is not limited to mentioned above 5 millimeters, so long as can meet the actual use needs of described silicon chip cutting assembly, all can.
On the other hand, 131 of adjacent two lines of cut of cutting group 13 form cutting gap 132, and each line of cut 131 is uniform successively along the bearing of trend of the axis of drive roll 11 with cutting gap 132.The effective operation gap that this cutting gap 132 is described silicon chip cutting assembly, can realize the silicon chip excision forming of set specification.
More specifically, the width of cutting gap 132 is 334 microns.Certainly, the width of this cutting gap 132 is not limited to mentioned above 334 microns, so long as can meet the actual use needs of described silicon chip cutting assembly, all can.
In addition, line of cut 131 is steel wire.The structural strength of this kind of steel wire is large, and shock-resistant wear-resistant, can fully meet the high strength cutting operation needs of described silicon chip cutting assembly.
Should be clear and definite, above-mentioned line of cut 131 is not limited to steel wire, so long as can meet the actual use needs of described silicon chip cutting assembly, all can.
In summary, the silicon chip cutting assembly provided in the utility model, comprise the drive roll and the driven voller that be arranged in parallel, be arranged with some cutting groups on described drive roll and described driven voller, described cutting group comprises some lines of cut that be arranged in parallel, the bearing of trend of the bearing of trend of described line of cut and the axis of described drive roll is perpendicular, forms the cutting gaps matched with silicon ingot splicing place between adjacent two cutting groups.In the course of work, described cutting gaps can effectively be avoided described line of cut to enter silicon ingot splicing place and produce unloaded wearing and tearing, avoid the generation of the inoperative broken string phenomenon that causes because of zero load wearing and tearing, effectively reduce the outage of described silicon chip cutting assembly, and make the corresponding raising of its working (machining) efficiency.
Above silicon chip cutting assembly provided by the utility model is described in detail.Applied specific case herein principle of the present utility model and embodiment are set forth, the explanation of above embodiment is just for helping to understand method of the present utility model and core concept thereof.Should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model principle, can also carry out some improvement and modification to the utility model, these improvement and modification also fall in the protection domain of the utility model claim.
Claims (5)
1. a silicon chip cutting assembly, comprise the drive roll and the driven voller that be arranged in parallel, it is characterized in that: be arranged with some cutting groups on described drive roll and described driven voller, described cutting group comprises some lines of cut that be arranged in parallel, the bearing of trend of the bearing of trend of described line of cut and the axis of described drive roll is perpendicular, forms the cutting gaps matched with silicon ingot splicing place between adjacent two cutting groups.
2. silicon chip cutting assembly as claimed in claim 1, it is characterized in that: the width of described cutting gaps is 5 millimeters.
3. silicon chip cutting assembly as claimed in claim 1, it is characterized in that: form cutting gap between adjacent two lines of cut of described cutting group, each described line of cut is uniform successively along the bearing of trend of the axis of described drive roll with described cutting gap.
4. silicon chip cutting assembly as claimed in claim 3, it is characterized in that: the width of described cutting gap is 334 microns.
5. silicon chip cutting assembly as described as any one in claim 1 to 4, it is characterized in that: described line of cut is steel wire.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2013203555826U CN203331254U (en) | 2013-06-20 | 2013-06-20 | Silicon wafer cutting assembly |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2013203555826U CN203331254U (en) | 2013-06-20 | 2013-06-20 | Silicon wafer cutting assembly |
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| CN203331254U true CN203331254U (en) | 2013-12-11 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103786274A (en) * | 2014-01-23 | 2014-05-14 | 中国有色桂林矿产地质研究院有限公司 | Diamond fretsaw device for polycrystalline silicon ingot squaring |
| CN105479609A (en) * | 2015-12-04 | 2016-04-13 | 湖南红太阳光电科技有限公司 | Multi-wire cutting method for cutting spliced silicon rods |
| CN107364023A (en) * | 2017-07-20 | 2017-11-21 | 阜宁协鑫光伏科技有限公司 | The method that cutting cuts silicon chip with separated time net and separated time net |
| CN110341062A (en) * | 2019-06-24 | 2019-10-18 | 内蒙古中环光伏材料有限公司 | A method of it prevents piece from jumping doubling and generates |
-
2013
- 2013-06-20 CN CN2013203555826U patent/CN203331254U/en active IP Right Grant
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103786274A (en) * | 2014-01-23 | 2014-05-14 | 中国有色桂林矿产地质研究院有限公司 | Diamond fretsaw device for polycrystalline silicon ingot squaring |
| CN105479609A (en) * | 2015-12-04 | 2016-04-13 | 湖南红太阳光电科技有限公司 | Multi-wire cutting method for cutting spliced silicon rods |
| CN107364023A (en) * | 2017-07-20 | 2017-11-21 | 阜宁协鑫光伏科技有限公司 | The method that cutting cuts silicon chip with separated time net and separated time net |
| CN107364023B (en) * | 2017-07-20 | 2019-04-09 | 阜宁协鑫光伏科技有限公司 | The method of cutting separated time net and separated time net cutting silicon wafer |
| CN110341062A (en) * | 2019-06-24 | 2019-10-18 | 内蒙古中环光伏材料有限公司 | A method of it prevents piece from jumping doubling and generates |
| CN110341062B (en) * | 2019-06-24 | 2020-11-13 | 内蒙古中环光伏材料有限公司 | Method for preventing splicing seam from jumping and doubling |
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