CN107364023B - The method of cutting separated time net and separated time net cutting silicon wafer - Google Patents
The method of cutting separated time net and separated time net cutting silicon wafer Download PDFInfo
- Publication number
- CN107364023B CN107364023B CN201710597277.0A CN201710597277A CN107364023B CN 107364023 B CN107364023 B CN 107364023B CN 201710597277 A CN201710597277 A CN 201710597277A CN 107364023 B CN107364023 B CN 107364023B
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- cutting
- gauze
- guide wheel
- gap
- cutting gauze
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
Abstract
The present invention relates to a kind of cutting separated time nets, including the cutting gauze being arranged on guide wheel, wherein the end of incoming cables of the cutting line net and leading-out terminal are located at the head and tail portion of guide wheel, the cutting gauze is provided with cutting gauze gap in the tail portion of guide wheel, last root cutting line is not cut in silico briquette when enabling to cut silico briquette.Above-mentioned cutting separated time net, can ground realize the purpose do not cut in silico briquette of last root cutting line of cutting gauze.Since last root cutting line is not in the cut coverage of silico briquette, the fluctuation of cutting line tension is alleviated, last root cutting line wire jumper is avoided and causes to break, and avoid the abrasion to the guided wheel slot of guide wheel.Also propose a kind of cutting method of cutting separated time net.
Description
Technical field
The present invention relates to silicon wafers to cut field, more particularly to a kind of cutting separated time net and its method for cutting silicon wafer.
Background technique
With gold cutting line cutting technology constantly promoted, golden steel wire line footpath from 80 microns -70 microns -60 microns gradually
Reduce, as golden steel wire line footpath constantly reduces, cutting interrupt line is consequently increased, and being mainly embodied in unwrapping wire and take-up broken string has
Obvious ascendant trend.
Fig. 1 illustrates a kind of schematic diagram of traditional cutting separated time net cutting silico briquette.The of golden cutting line slice gauze 400
One last root cutting line connects actinobacillus wheel 410 and take-up pulley 420 with tail portion, since steel wire tension exists in cutting process
Fluctuation and gauze edge to coolant liquid carry it is unstable cause guide wheel slot type serious wear, be easy to cause retractable cable to break, cause
Loss to silico briquette 500.
Summary of the invention
Based on this, it is necessary to aiming at the problem that take-up is easy broken string, provide a kind of cutting separated time net.Also propose a kind of point
The method of gauze cutting silicon wafer.
A kind of cutting separated time net, including the cutting gauze being arranged on guide wheel, wherein the end of incoming cables of the cutting line net
The head and tail portion of guide wheel are located at leading-out terminal, the cutting gauze is provided with cutting gauze gap in the tail portion of guide wheel,
Last root cutting line is not cut in silico briquette when enabling to cut silico briquette.
Above-mentioned cutting separated time net, can ground realize cutting gauze last root cutting line (being connected to take-up pulley) do not exist
The purpose cut in silico briquette；Since last root cutting line is not in the cut coverage of silico briquette, the wave of cutting line tension is alleviated
It is dynamic, it avoids last root cutting line wire jumper and causes to break, and avoid the abrasion to the guided wheel slot of guide wheel.
The cutting gauze is also equipped with cutting gauze gap in the middle position of guide wheel in one of the embodiments,.
The cutting line in the cutting gauze gap is arranged in guide wheel bottom in one of the embodiments,.
The length in the cutting gauze gap is not more than 5mm in one of the embodiments,.
In one of the embodiments, further include actinobacillus wheel and take-up pulley, wherein the actinobacillus wheel and cutting gauze into
It is provided with tension pulley block between line end, is also equipped with tension pulley block between take-up pulley and the leading-out terminal for cutting gauze.
A kind of method of separated time net cutting silicon wafer, comprising steps of
Silico briquette is pushed, is cut using cutting gauze, the end of incoming cables of the cutting gauze and leading-out terminal are located at and lead
The head and tail portion of wheel, the cutting gauze are provided with cutting gauze gap in the tail portion of guide wheel, wherein the cutting line net
Last root cutting line is not cut in silico briquette.
Cutting gauze also is provided with cutting gauze gap in the middle position of guide wheel in one of the embodiments, and silico briquette is set
There are two setting, cutting gauze gap is corresponding with the interstitial site between two silico briquettes, when pushing silico briquette, makes described two silico briquettes
It is synchronous to push.
The cutting gauze gap in middle position of the cutting gauze in guide wheel is greater than two in one of the embodiments,
Gap between silico briquette.
In one of the embodiments, further comprise step:
Thread-changing is carried out to the cutting gauze, and makes position of first cutting line for cutting gauze on guide wheel compared with last time
Location guide wheel caudal directions retreat a guided wheel slot.
In one of the embodiments, further comprise step:
Locating adhesive tape is placed on cutting gauze gap location, pushes locating adhesive tape along guide wheel by the rotary state for keeping guide wheel
Axial movement and drive the cutting gauze for being located at cutting gauze gap side mobile, to change the length in cutting gauze gap
Degree.
Detailed description of the invention
Fig. 1 is the schematic diagram that traditional cutting is cut with separated time net；
Fig. 2 is the schematic diagram of the cutting separated time net of one embodiment of the invention.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.On the contrary, when element is referred to as " directly existing " another element "upper",
Intermediary element is then not present.Term as used herein "vertical", "horizontal", "left" and "right" and similar statement are only
It is for illustrative purposes.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
With reference to the accompanying drawing, the better embodiment of cutting separated time net is described in detail.
With reference to Fig. 2, the principle of silico briquette 200 is cut in the cutting for illustrating the application one embodiment with separated time net.Cutting is used
Separated time net includes the cutting gauze 120 being arranged on guide wheel 110.Silico briquette 200 is placed in the top of cutting gauze 120, when cutting, machine
Tool arm drives the silico briquette 200 being bonded in crystal holder 300 to push, and silico briquette 200 is cut into silicon wafer using cutting gauze 120.
As shown in Fig. 2, the end of incoming cables 121 of cutting gauze 120 and leading-out terminal 122 are located at 111 He of head of guide wheel 110
At tail portion 112.Wherein, cutting gauze 120 is provided with the first cutting gauze gap 123 in the tail portion of guide wheel 110 112.In other words,
The two sides in the first cutting gauze gap 123 have densely covered cutting line can be to cut, and the first cutting gauze gap 123 is only set
The cutting line 124 for playing connection function is set, to connect the densely covered cutting line of two sides.
In one embodiment, which is arranged in the lower section of guide wheel 110, is not involved in cutting silicon
Block.During another is implemented, since guide wheel 110 is to be arranged in pairs, it is two that cutting gauze, which is really used to cut the part of silico briquette 200,
Extend between a guide wheel 110, therefore the cutting line 124 for playing connection function is arranged in back to the side of another guide wheel 110.
It can when being cut when selecting the silico briquette 200 of appropriate size due to being provided with the first cutting gauze gap 123
To conveniently realize the purpose that last root cutting line (being connected to take-up pulley) of cutting gauze 120 is not cut in silico briquette 200.
Since last root cutting line is not in the cut coverage of silico briquette 200, the fluctuation of cutting line tension is alleviated, last root is avoided
Cutting line wire jumper and cause to break, and avoid the abrasion of the guided wheel slot to guide wheel 110.First cutting gauze gap 123 is usually set
It is set to no more than 5 millimeters.
In addition, when silico briquette length and gauze effective cutting length difference, the mode taken is in buttock line in traditional technology
Every knife will cut last root steel wire of tail portion when processing, troublesome in poeration and time-consuming.And in the present embodiment, due to being provided with first
Gauze gap 123 is cut, can according to need position of the first cutting of adjustment gauze gap 123 on guide wheel 110.
It further include actinobacillus wheel 130 and take-up pulley 140, wherein actinobacillus wheel 130 and cutting gauze 120 in one embodiment
It is provided with tension pulley block 150 between end of incoming cables 121, is also equipped with tensioning between take-up pulley 140 and the leading-out terminal for cutting gauze 120
Pulley 150.
In one embodiment, gauze 120 is cut in the middle position of guide wheel and is additionally provided with the second cutting gauze gap 125.
The setting position for the cutting line 124 for playing connection function at second cutting gauze gap 125 and rising at the first cutting gap 123
124 position of cutting line of connection function is similar.Second cutting gauze gap 125 will be located at the first cutting gauze gap 123 in Fig. 2
The gauze in left side is further divided into two sections.First cutting gauze gap 123 and the second cutting gauze gap 125 will cut gauze
120 are divided into three sections.
When bonding two silico briquettes 200 in crystal holder 300, the position and two silico briquettes 200 in the second cutting gauze gap 125 it
Between gap 210 it is corresponding.The size in the second cutting gauze gap 125 is greater than gap 210.For example, gap 210 is generally no greater than 3
Millimeter, the second cutting gauze gap 125 are set as no more than 5 millimeters.Due to being provided with the second cutting gauze gap 125, herein
There is no cutting line to participate in cutting, there is no because caused by 200 end face of silico briquette is uneven situations such as cutting impurity, broken string.
In addition, it is also proposed that a kind of method of separated time net cutting silicon wafer includes the following steps.
S100, silico briquette is pushed, is cut using cutting gauze, the end of incoming cables of the cutting gauze and leading-out terminal distinguish position
In the head and tail portion of guide wheel, the cutting gauze is provided with cutting gauze gap in the tail portion of guide wheel, the cutting gauze
Last root cutting line is not cut in silico briquette.
In one embodiment, cutting gauze is provided with cutting gauze gap in the tail portion of guide wheel to be made to cut when cutting silico briquette
Last root cutting line of gauze is not cut in silico briquette, to alleviate the fluctuation of cutting line tension, last root is avoided to cut
Secant wire jumper and cause to break, and avoid the abrasion to the guided wheel slot of guide wheel.Such as it is cut using cutting shown in Fig. 2 with separated time net
Silico briquette 200 is cut, cutting gauze 120 is equipped with the first cutting gauze gap 123, cuts silico briquette 200, makes to cut the last of gauze 120
A piece cutting line is not cut in silico briquette 200, is alleviated the fluctuation of cutting line tension, is avoided last root cutting line wire jumper and make
At broken string, and avoid the abrasion of the guided wheel slot to guide wheel 110.
Further, cutting gauze also is provided with cutting gauze gap in the middle position of guide wheel, and there are two silico briquette settings, cuts
Interstitial site between secant net gap and two silico briquettes is corresponding.When pushing silico briquette, described two silico briquettes are synchronous to be pushed.Such as
This, can cut two silico briquettes simultaneously, while cutting gauze and also being provided with cutting gauze gap, two silicon in the middle position of guide wheel
The impurity that block enters knife when cutting and knife generates out will not influence the cutting of gauze.
Further, between cutting gauze is greater than between two silico briquettes in the cutting gauze gap in the middle position of guide wheel
Gap.
Further, before S100 step, further include the steps that forming cutting gauze gap.Cut the formation in gauze gap
Mode are as follows: before wiring, need to be arranged the position setting locating adhesive tape in cutting gauze gap on guide wheel, then in other positions of guide wheel
Set wiring.Before cutting starts, locating adhesive tape is removed, then starts to cut.
Further, further include the steps that adjusting cutting gap length: keeping the rotary state of guide wheel, locating adhesive tape is put
It sets in cutting gauze gap location, push locating adhesive tape along the axial movement of guide wheel and drives cutting positioned at cutting gauze gap side
Secant net is mobile, to change the length in cutting gauze gap, guide wheel continues to rotate, running fix adhesive tape, pushes cutting gauze
Change position, to change the length in cutting gauze gap.
S200, thread-changing is carried out to the cutting gauze, and makes position of first cutting line for cutting gauze on guide wheel
Caudal directions compared with the location guide wheel of last time retreat a guided wheel slot.
By carrying out thread-changing to cutting gauze, continuous cutting is realized.Wherein, when thread-changing, make first that cuts gauze and cut
Position of the secant (being connected to actinobacillus wheel) on guide wheel retreats a guided wheel slot compared with the caudal directions of the location guide wheel of last time.Example
Such as, it is assumed that when cutting for the first time, first cutting line for cutting gauze is located in first guided wheel slot on guide wheel head.Then
When to cutting gauze thread-changing, first cutting line for cutting gauze is located in second guided wheel slot on guide wheel head.
Since first cutting line is connect with the cutting line on actinobacillus wheel, the tension of receiving is maximum, leads to first cutting
Guided wheel slot where line wears maximum, if still in original guided wheel slot, since guided wheel slot abrasion is larger, first after thread-changing
Cutting line is easy to break.Therefore in the present embodiment, the position of first cutting line is retreated into a guided wheel slot when each thread-changing, so
After cut, thus reduce by first cutting line broken string risk.
By using the cutting method of step S100, cut last root cutting line for cutting gauze in silico briquette,
The tension fluctuation that last root cutting line can be alleviated avoids last root cutting line wire jumper and causes to break, and avoids to leading
The abrasion of the guided wheel slot of wheel 110.Further, it when cooperating the thread-changing method of S200 to realize continuous cutting, also further decreases
The risk of first cutting line broken string reduces the loss to silico briquette to reduce retractable cable broken string risk.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (6)
1. a kind of method of separated time net cutting silicon wafer, which is characterized in that comprising steps of
Silico briquette is pushed, is cut using cutting gauze, the end of incoming cables of the cutting gauze and leading-out terminal are located at guide wheel
Head and tail portion, the cutting gauze is provided with cutting gauze gap in the tail portion of guide wheel, wherein the cutting line net is last
A piece cutting line is not cut in silico briquette；
Further comprise step:
Locating adhesive tape is placed on cutting gauze gap location, pushes locating adhesive tape along the axis of guide wheel by the rotary state for keeping guide wheel
To movement and drive the cutting gauze for being located at cutting gauze gap side mobile, to change the length in cutting gauze gap.
2. the method according to claim 1, wherein cutting gauze also is provided with cutting line in the middle position of guide wheel
Gap is netted, there are two silico briquette settings, and cutting gauze gap is corresponding with the interstitial site between two silico briquettes, when pushing silico briquette,
Make described two silico briquettes are synchronous to push.
3. according to the method described in claim 2, it is characterized in that, the cutting line in middle position of the cutting gauze in guide wheel
Net the gap that gap is greater than between two silico briquettes.
4. the method according to claim 1, wherein further comprising step:
Thread-changing is carried out to the cutting gauze, and makes position of position of first cutting line for cutting gauze on guide wheel compared with last time
It sets to the caudal directions of guide wheel and retreats a guided wheel slot.
5. the method as described in claim 1, which is characterized in that the length in the cutting gauze gap is not more than 5mm.
6. the method as described in claim 1, which is characterized in that further include actinobacillus wheel and take-up pulley, wherein the actinobacillus wheel with
It cuts and is provided with tension pulley block between the end of incoming cables of gauze, tensioning is also equipped between take-up pulley and the leading-out terminal for cutting gauze and is slided
Wheel.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710597277.0A CN107364023B (en) | 2017-07-20 | 2017-07-20 | The method of cutting separated time net and separated time net cutting silicon wafer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710597277.0A CN107364023B (en) | 2017-07-20 | 2017-07-20 | The method of cutting separated time net and separated time net cutting silicon wafer |
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| CN107364023B true CN107364023B (en) | 2019-04-09 |
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Families Citing this family (5)
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| CN110341062B (en) * | 2019-06-24 | 2020-11-13 | 内蒙古中环光伏材料有限公司 | Method for preventing splicing seam from jumping and doubling |
| CN110466082A (en) * | 2019-07-26 | 2019-11-19 | 扬州续笙新能源科技有限公司 | A kind of cutter device and cutting method suitable for king kong line network adjustment |
| CN112622079B (en) * | 2020-12-10 | 2022-10-04 | 宜昌南玻硅材料有限公司 | Netting cutting method for superfine wire cutting silicon block |
| CN113183344A (en) * | 2021-04-23 | 2021-07-30 | 苏州协鑫光伏科技有限公司 | Wire distribution network method for quickly adjusting gap between diamond wire networks |
| CN113829530A (en) * | 2021-08-24 | 2021-12-24 | 隆基绿能科技股份有限公司 | Cutting method and silicon wafer |
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| JPH1044142A (en) * | 1996-08-01 | 1998-02-17 | Citizen Watch Co Ltd | Multiple wire saw |
| JP4743801B2 (en) * | 2009-03-31 | 2011-08-10 | コマツＮｔｃ株式会社 | Work cutting method and wire winding width changing device for work cutting |
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| CH700047B1 (en) * | 2009-01-09 | 2010-10-29 | Deutsche Solar Ag | Tensioning device for tensioning a wire loop occurring in a wire saw. |
| CN203331254U (en) * | 2013-06-20 | 2013-12-11 | 晶科能源有限公司 | Silicon wafer cutting assembly |
| CN205033405U (en) * | 2015-10-16 | 2016-02-17 | 无锡荣能半导体材料有限公司 | Cutting is with dividing gauze |
| CN107443599A (en) * | 2016-05-31 | 2017-12-08 | 胜高股份有限公司 | The cutting-off method of workpiece |
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Effective date of registration: 20201204 Address after: 224400 No. 888, Hongkong Road, Funing Economic Development Zone, Yancheng City, Jiangsu Patentee after: FUNING XIEXIN PHOTOVOLTAIC TECHNOLOGY Co.,Ltd. Patentee after: Jurong GCL Photovoltaic Technology Co., Ltd Address before: 224400 No. 888, Hongkong Road, Funing Economic Development Zone, Yancheng City, Jiangsu Patentee before: FUNING XIEXIN PHOTOVOLTAIC TECHNOLOGY Co.,Ltd. |