CN203973124U - Ground connection base wire bonds mould - Google Patents

Ground connection base wire bonds mould Download PDF

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Publication number
CN203973124U
CN203973124U CN201420428371.5U CN201420428371U CN203973124U CN 203973124 U CN203973124 U CN 203973124U CN 201420428371 U CN201420428371 U CN 201420428371U CN 203973124 U CN203973124 U CN 203973124U
Authority
CN
China
Prior art keywords
ground connection
connection base
plate
substrate
location
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420428371.5U
Other languages
Chinese (zh)
Inventor
常保仓
赵军宪
王�义
黄体运
郝春霞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
State Grid Corp of China SGCC
State Grid Hebei Electric Power Co Ltd
Xingtai Power Supply Co of State Grid Hebei Electric Power Co Ltd
Original Assignee
State Grid Corp of China SGCC
State Grid Hebei Electric Power Co Ltd
Xingtai Power Supply Co of State Grid Hebei Electric Power Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by State Grid Corp of China SGCC, State Grid Hebei Electric Power Co Ltd, Xingtai Power Supply Co of State Grid Hebei Electric Power Co Ltd filed Critical State Grid Corp of China SGCC
Priority to CN201420428371.5U priority Critical patent/CN203973124U/en
Application granted granted Critical
Publication of CN203973124U publication Critical patent/CN203973124U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of ground connection base wire bonds mould, relate to ground connection base mounting technology field.It comprises horizontally disposed substrate, is fixed on the vertical baffle plate arranging in substrate both sides, is fixed on the top board that substrate tail end vertically arranges, and is vertically connected with in the horizontal direction location-plate between two baffle plates; The bottom surface of location-plate coordinates with the thickness of ground connection base with the spacing of substrate.The utility model can needn't be measured welding position during welding one by one by a plurality of ground connection marshallings, has improved the operating efficiency of welding ground connection base lead-in wire.

Description

Ground connection base wire bonds mould
Technical field
The utility model relates to ground connection base mounting technology field.
Background technology
When carrying out ground connection base wire bonds, because quantity is many, need to measure by root, determine the position of welding, then carry out welding job, waste time and energy like this, inefficiency.
Utility model content
Technical problem to be solved in the utility model, be the technical deficiency for above-mentioned existence, a kind of ground connection base wire bonds mould is provided, it can be by a plurality of ground connection marshallings, during welding, needn't measure one by one welding position, improve the operating efficiency of welding ground connection base lead-in wire.
The technical solution adopted in the utility model is: a kind of ground connection base wire bonds mould is provided, comprise horizontally disposed substrate, be fixed on the vertical baffle plate arranging in substrate both sides, be fixed on the top board that substrate tail end vertically arranges, between two baffle plates, be vertically connected with in the horizontal direction location-plate; The bottom surface of location-plate coordinates with the thickness of ground connection base with the spacing of substrate.
Further optimize the technical program, the bolt at location-plate two ends and the strip hole of two baffle plate horizontal directions of ground connection base wire bonds mould are tightened.
Further optimize the technical program, between the location-plate of ground connection base wire bonds mould and top board, be provided with pressing plate, one end of pressing plate is connected with a side shield rotating shaft; The other end of pressing plate is by the buckle clamping of spring block tongue and opposite side baffle plate; The lower surface of pressing plate is provided with rubber blanket.
The beneficial effects of the utility model are: 1, can a plurality of ground connection bases of proper alignment on substrate, and the ground connection base after marshalling all exposes at location-plate place, and welding is to place one by one and to measure, and saves time, and increases work efficiency.2, the spacing of location-plate and top board can, by regulating location-plate bolts at two ends in the position adjustments of strip hole, adapt to the ground connection base welding of different size.3, pressing plate can compress ground connection base, during welding ground connection base, needn't manually help, and has improved operating efficiency.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the local structure for amplifying schematic diagram at Fig. 1 medi-spring block tongue place.
1, substrate; 2, baffle plate; 3, top board; 4, location-plate; 5, bolt; 6, strip hole; 7, pressing plate; 8, spring block tongue; 9, buckle; 10, rubber blanket; 11, ground connection base.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
As shown in Figure 1, 2, ground connection base wire bonds mould, comprises horizontally disposed substrate 1, is fixed on baffle plate 2 that substrate 1 both sides vertically arrange, is fixed between 3, two baffle plates 2 of top board that substrate 1 tail end vertically arranges and is vertically connected with in the horizontal direction location-plate 4; The bottom surface of location-plate 4 coordinates with the thickness of ground connection base 11 with the spacing of substrate; The strip hole 6 of the bolt 5 at location-plate 4 two ends and two baffle plate 2 horizontal directions is tightened; Between location-plate 4 and top board 3, be provided with pressing plate 7, one end of pressing plate 7 is connected with side shield 2 rotating shafts; The other end of pressing plate 7 is buckle 9 clampings with opposite side baffle plate 2 by spring block tongue 8; The lower surface of pressing plate 7 is provided with rubber blanket 10.
As shown in Figure 2, spring block tongue 8 is comprised of the spring and the block tongue that are fixed in slideway, the chamfering snapping of the end of block tongue and buckle 9, and when pressing plate 7 presses down, block tongue snaps in buckle 9 from top to bottom, until ground connection base 11 is compressed.While unclasping pressing plate 7, block tongue is peeled off from buckle 9.
In use, first, by identical ground connection base 11 marshalling on substrate 1 of a plurality of specifications, unclasp bolt 5, according to the specification of ground connection base 11, regulate the position of location-plate 4, then bolt 5 is tightened.Use pressing plate 7 that ground connection base 11 is compressed; Ground connection base 11 be because production error may cause thickness not etc., and the effect of rubber blanket 10 is exactly to utilize himself elasticity to guarantee that each ground connection base 11 is compacted.11 discharges of ground connection base are not compacted hand neatly, welding lead.

Claims (3)

1. a ground connection base wire bonds mould, it is characterized in that: comprise horizontally disposed substrate (1), be fixed on the vertical baffle plate (2) arranging in substrate (1) both sides, be fixed on the top board (3) that substrate (1) tail end vertically arranges, between two baffle plates (2), be vertically connected with in the horizontal direction location-plate (4); The bottom surface of location-plate (4) coordinates with the thickness of ground connection base (11) with the spacing of substrate.
2. ground connection base wire bonds mould according to claim 1, is characterized in that: the bolt (5) at location-plate (4) two ends is tightened with the strip hole (6) of two baffle plates (2) horizontal direction.
3. ground connection base wire bonds mould according to claim 2, is characterized in that: between location-plate (4) and top board (3), be provided with pressing plate (7), one end of pressing plate (7) is connected with a side shield (2) rotating shaft; The other end of pressing plate (7) is buckle (9) clamping with opposite side baffle plate (2) by spring block tongue (8); The lower surface of pressing plate (7) is provided with rubber blanket (10).
CN201420428371.5U 2014-07-31 2014-07-31 Ground connection base wire bonds mould Expired - Fee Related CN203973124U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420428371.5U CN203973124U (en) 2014-07-31 2014-07-31 Ground connection base wire bonds mould

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420428371.5U CN203973124U (en) 2014-07-31 2014-07-31 Ground connection base wire bonds mould

Publications (1)

Publication Number Publication Date
CN203973124U true CN203973124U (en) 2014-12-03

Family

ID=51970608

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420428371.5U Expired - Fee Related CN203973124U (en) 2014-07-31 2014-07-31 Ground connection base wire bonds mould

Country Status (1)

Country Link
CN (1) CN203973124U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106077880A (en) * 2016-07-12 2016-11-09 南京时恒电子科技有限公司 Soldering wires winding displacement frock and winding displacement technique

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106077880A (en) * 2016-07-12 2016-11-09 南京时恒电子科技有限公司 Soldering wires winding displacement frock and winding displacement technique
CN106077880B (en) * 2016-07-12 2019-06-25 南京时恒电子科技有限公司 Soldering wires winding displacement tooling

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141203

Termination date: 20210731