CN203085645U - Die bonder fixture - Google Patents

Die bonder fixture Download PDF

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Publication number
CN203085645U
CN203085645U CN 201320129357 CN201320129357U CN203085645U CN 203085645 U CN203085645 U CN 203085645U CN 201320129357 CN201320129357 CN 201320129357 CN 201320129357 U CN201320129357 U CN 201320129357U CN 203085645 U CN203085645 U CN 203085645U
Authority
CN
China
Prior art keywords
die bond
cob substrate
circular cob
cavity
length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 201320129357
Other languages
Chinese (zh)
Inventor
夏雪松
高艳春
陈志威
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silicon Energy Photoelectric Semiconductor Guangzhou Co ltd
Original Assignee
Guangzhou Ledteen Optoelectronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou Ledteen Optoelectronics Co ltd filed Critical Guangzhou Ledteen Optoelectronics Co ltd
Priority to CN 201320129357 priority Critical patent/CN203085645U/en
Application granted granted Critical
Publication of CN203085645U publication Critical patent/CN203085645U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a die bonder fixture comprising a dragging plate and a cover plate, wherein the dragging plate is provided with a cavity for placing circular COB (Chip On Board) substrates; the length of the cavity is X times as large as the diameter of each circular COB substrate, and the width of the cavity is Y times as large as the diameter of each circular COB substrate; the cover plate is provided with X elliptic openings along the length direction, and the X elliptic openings are formed into an opening group; the length of the opening group is matched with the length of the cavity; a long axis of each elliptic opening is matched with the sum of diameters of the Y circular COB substrates, and a short axis of each elliptic opening is matched with the diameter of single circular COB substrate; a compression bar is also arranged between every two adjacent elliptic openings; when the die bonder fixture is used, the cover plate is buckled and connected to the top of the cavity, and each elliptic opening aligns to the Y circular COB substrates; and X is a natural number larger than 2, and Y is a natural number larger than 1. The die bonder fixture can be used for fixing a plurality of COB substrates at one step, so that a die can be bounded by using a die bonder and the production efficiency can be favorably increased.

Description

A kind of die bond machine clamp
Technical field
The utility model relates to die bond machine technology field, is specifically related to a kind of die bond machine clamp .
Background technology
In encapsulation process at semiconductor device as IC and LED etc., die bond is extremely important link.And before die bond, the COB substrate is to be stacked in magazine, when the needs die bond by manually from magazine blocks of take out to be positioned on workbench and by fixture be fixed, after die bond completes, by manually the COB substrate on workbench being taken out and changes a slice COB substrate, be all manual operation owing to taking, putting substrate, and can only carry out die bond to a slice COB substrate at every turn again, more time-consuming, be unfavorable for enhancing productivity.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of die bond machine clamp, its can be once fixedly the circular COB substrate of polylith so that the die bond machine carries out die bond to it, save time, be conducive to enhance productivity.
For addressing the above problem, the technical scheme that the utility model adopts is as follows:
A kind of die bond machine clamp, comprise planker and cover plate, and described planker is provided with one for placing the cavity of circular COB substrate; The length of described cavity equals X times of single circular COB substrate diameter, and the width of described cavity equals Y times of single circular COB substrate diameter; Described cover plate is provided with X oval opening on along its length, and described X oval opening forms an opening group; The length of described opening group and the length of described cavity are complementary; The diameter sum of the major axis of each oval opening and Y circular COB substrate is complementary, and the diameter of minor axis and single circular COB substrate is complementary; Also be provided with press strip between adjacent oval opening; During use, described cover plate snaps onto on the end face of described cavity, and each oval opening is over against Y circular COB substrate; Wherein, X is the natural number more than 2, and Y is the natural number more than 1.
Like this, utilize die bond machine clamp of the present utility model, just can be disposable before die bond by X * Y circular COB substrate clamping between planker and cover plate, then the die bond machine see through oval opening just can to this oval opening over against circular COB substrate carry out die bond, not only can reduce the error rate of putting plate, and saved the time, improved widely production efficiency.Simultaneously, owing between adjacent oval opening, being provided with press strip, like this just further reduced the gap between cover plate, circular COB substrate and planker three, be conducive to improve the stability of circular COB substrate in die bond machine clamp of the present utility model, reduced the product fraction defective caused because of circular COB displacement substrate.
Preferably, the length of described cavity equals 4 times of single circular COB substrate diameter, and the width of described cavity equals 2 times of single circular COB substrate diameter; The quantity of described oval opening is 4.
For the ease of picking and placeing of circular COB substrate, preferably, also be provided with the fluting that the finger of at least one and staff is complementary on the edge of described cavity.
In order further to be convenient to picking and placeing of circular COB substrate, preferably, the quantity of described fluting is 4.
In order further to be convenient to picking and placeing of circular COB substrate, preferably, the large 0.2mm of the degree of depth of the described cavity of depth ratio of described fluting.
Preferably, the degree of depth of described fluting is 1.0mm, and the degree of depth of described cavity is 0.8mm.
For on the workbench that die bond machine clamp of the present utility model is fixed on to the die bond machine so that the die bond machine is carried out the die bond operation, preferably, also be provided with the fixing hole be interlockingly connected for the workbench with the die bond machine on described cover plate.
Preferably, the quantity of described fixing hole is 10.
Compared to existing technology, the beneficial effects of the utility model are:
Utilize die bond machine clamp of the present utility model, just can be disposable before die bond by X * Y circular COB substrate clamping between planker and cover plate, then the die bond machine see through oval opening just can to this oval opening over against circular COB substrate carry out die bond, not only can reduce the error rate of putting plate, and saved the time, improved widely production efficiency.Simultaneously, owing between adjacent oval opening, being provided with press strip, like this just further reduced the gap between cover plate, circular COB substrate and planker three, be conducive to improve the stability of circular COB substrate in die bond machine clamp of the present utility model, reduced the product fraction defective caused because of circular COB displacement substrate.
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
The accompanying drawing explanation
Fig. 1 is die bond machine clamp of the present utility model structural representation in use;
The structural representation that Fig. 2 is planker of the present utility model;
The structural representation that Fig. 3 is cover plate of the present utility model;
Fig. 4 is that circular COB substrate is placed on the structural representation in planker.
Embodiment
As shown in Figures 1 to 4, die bond machine clamp of the present utility model, comprise planker 1 and cover plate 2, and described planker 1 is provided with a cavity 11 for placing circular COB substrate 3; The length of described cavity 11 equals X times of single circular COB substrate 3 diameters, and the width of described cavity 11 equals Y times of single circular COB substrate 3 diameters; Described cover plate 2 is provided with X oval opening 21 on along its length, and a described X oval opening 21 forms an opening group; The length of the length of described opening group and described cavity 11 is complementary; The diameter sum of the major axis of each oval opening 21 and Y circular COB substrate 3 is complementary, and the diameter of minor axis and single circular COB substrate 3 is complementary; Also be provided with press strip 22 between adjacent oval opening 21; During use, described cover plate 2 snaps onto on the end face of described cavity 11, and each oval opening 21 is over against Y circular COB substrate 3; Wherein, X is the natural number more than 2, and Y is the natural number more than 1.
Like this, utilize die bond machine clamp of the present utility model, before die bond, just can disposable X * Y circular COB substrate 3 be clamped between planker 1 and cover plate 2, then the die bond machine see through oval opening 21 just can to 21 of this oval openings over against circular COB substrate 3 carry out die bond, not only can reduce the error rate of putting plate, and saved the time, improved widely production efficiency.Simultaneously, owing to being provided with press strip 22 between adjacent oval opening 21, like this just further reduced the gap between cover plate 2, circular COB substrate 3 and planker 1 three, be conducive to improve the stability of circular COB substrate 3 in die bond machine clamp of the present utility model, reduced the product fraction defective caused because of circular COB substrate 3 displacements.
Particularly, the length of described cavity 11 equals 4 times of single circular COB substrate 3 diameters, and the width of described cavity 11 equals 2 times of single circular COB substrate 3 diameters; The quantity of described oval opening 21 is 4.
For the ease of picking and placeing of circular COB substrate 3, particularly, also be provided with the fluting 12 that the finger of at least one and staff is complementary on the edge of described cavity 11.
In order further to be convenient to picking and placeing of circular COB substrate 3, particularly, the quantity of described fluting 12 is 4.
In order further to be convenient to picking and placeing of circular COB substrate 3, particularly, the large 0.2mm of the degree of depth of the described cavity 11 of the depth ratio of described fluting 12.
Particularly, the degree of depth of described fluting 12 is 1.0mm, and the degree of depth of described cavity 11 is 0.8mm.
For on the workbench that die bond machine clamp of the present utility model is fixed on to the die bond machine so that the die bond machine is carried out the die bond operation, particularly, also be provided with the fixing hole 23 be interlockingly connected for the workbench with the die bond machine on described cover plate 2.
Particularly, the quantity of described fixing hole 23 is 10.
Above-mentioned execution mode is only preferred implementation of the present utility model; can not limit with this scope of the utility model protection, the variation of any unsubstantiality that those skilled in the art does on basis of the present utility model and replacement all belong to the utility model scope required for protection.

Claims (8)

1. a die bond machine clamp, it is characterized in that: comprise planker and cover plate, described planker is provided with one for placing the cavity of circular COB substrate; The length of described cavity equals X times of single circular COB substrate diameter, and the width of described cavity equals Y times of single circular COB substrate diameter; Described cover plate is provided with X oval opening on along its length, and described X oval opening forms an opening group; The length of described opening group and the length of described cavity are complementary; The diameter sum of the major axis of each oval opening and Y circular COB substrate is complementary, and the diameter of minor axis and single circular COB substrate is complementary; Also be provided with press strip between adjacent oval opening; During use, described cover plate snaps onto on described cavity end face, and each oval opening is over against Y circular COB substrate; Wherein, X is the natural number more than 2, and Y is the natural number more than 1.
2. die bond machine clamp as claimed in claim 1, it is characterized in that: the length of described cavity equals 4 times of single circular COB substrate diameter, and the width of described cavity equals 2 times of single circular COB substrate diameter; The quantity of described oval opening is 4.
3. die bond machine clamp as claimed in claim 1 is characterized in that: also be provided with the fluting that the finger of at least one and staff is complementary on the edge of described cavity.
4. die bond machine clamp as claimed in claim 3, it is characterized in that: the quantity of described fluting is 4.
5. die bond machine clamp as claimed in claim 3, is characterized in that: the large 0.2mm of the degree of depth of the described cavity of depth ratio of described fluting.
6. die bond machine clamp as claimed in claim 5, it is characterized in that: the degree of depth of described fluting is 1.0mm, the degree of depth of described cavity is 0.8mm.
7. die bond machine clamp as claimed in claim 1, is characterized in that: also be provided with the fixing hole be interlockingly connected for the workbench with the die bond machine on described cover plate.
8. die bond machine clamp as claimed in claim 7, it is characterized in that: the quantity of described fixing hole is 10.
CN 201320129357 2013-03-20 2013-03-20 Die bonder fixture Expired - Lifetime CN203085645U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320129357 CN203085645U (en) 2013-03-20 2013-03-20 Die bonder fixture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320129357 CN203085645U (en) 2013-03-20 2013-03-20 Die bonder fixture

Publications (1)

Publication Number Publication Date
CN203085645U true CN203085645U (en) 2013-07-24

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201320129357 Expired - Lifetime CN203085645U (en) 2013-03-20 2013-03-20 Die bonder fixture

Country Status (1)

Country Link
CN (1) CN203085645U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107425105A (en) * 2017-08-17 2017-12-01 广东聚科照明股份有限公司 A kind of COB clamp structures of LED sealed in units
CN108772262A (en) * 2018-08-27 2018-11-09 广东华辉煌光电科技有限公司 A kind of porous pit filament cover board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107425105A (en) * 2017-08-17 2017-12-01 广东聚科照明股份有限公司 A kind of COB clamp structures of LED sealed in units
CN108772262A (en) * 2018-08-27 2018-11-09 广东华辉煌光电科技有限公司 A kind of porous pit filament cover board

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CP03 Change of name, title or address

Address after: 510000 Room 201, building A4, No. 11, Kaiyuan Avenue, Huangpu District, Guangzhou, Guangdong

Patentee after: Silicon energy photoelectric semiconductor (Guangzhou) Co.,Ltd.

Address before: 510000 second floor, building A4, No. 11, Kaiyuan Avenue, Science City, Guangzhou high tech Industrial Development Zone, Guangzhou, Guangdong Province

Patentee before: GUANGZHOU LEDTEEN OPTOELECTRONICS Co.,Ltd.

CP03 Change of name, title or address
CX01 Expiry of patent term

Granted publication date: 20130724

CX01 Expiry of patent term