CN202366837U - Adhesive dispensing head for heavy-power LED die bonder - Google Patents
Adhesive dispensing head for heavy-power LED die bonder Download PDFInfo
- Publication number
- CN202366837U CN202366837U CN2011205564549U CN201120556454U CN202366837U CN 202366837 U CN202366837 U CN 202366837U CN 2011205564549 U CN2011205564549 U CN 2011205564549U CN 201120556454 U CN201120556454 U CN 201120556454U CN 202366837 U CN202366837 U CN 202366837U
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- adhesive
- glue
- power led
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- head
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Abstract
The utility model discloses an adhesive dispensing head for a heavy-power LED die bonder, which is of an integrated structure formed by four adhesive heads with same sizes. Due to the adoption of the integrated structure formed by the four adhesive heads, the problem of incapability of meeting the requirement of adhesive quantity on the bottom of a heavy-power chip by the traditional adhesive dispensing head is effectively solved, labor intensity is lowered, production efficiency is increased; and spaces among the four adhesive heads are same, the distances among four dispensed adhesive stacks are consistent, thus the adhesive quantity on the bottom of the chip is effectively controlled, the dependence on the heavy-power chip is improved. In addition, lengths of the four adhesive heads are more than 0.5mm, the problems of adhesive climbing in an adhering process and untime excessive adhesive in a production process are effectively solved.
Description
Technical field
The utility model relates to the solid brilliant machine of a kind of LED, relates in particular to the solid brilliant machine of a kind of great power LED and uses Glue dripping head.
Background technology
At present, Glue dripping head is absolutely necessary in the accessory of using on the automatically solid brilliant equipment of semiconductor packages automatic production line, and it is mainly used in accomplishes getting glue and putting the glue action of automatically solid brilliant machine; Its accuracy and uniformity are very important, and like Fig. 1, used Glue dripping head is all the needle point head dummy on the at present all kinds of automatically solid brilliant equipment; Diameter is single Glue dripping head of 0.2mm, and this Glue dripping head is being produced the requirement that can also satisfy its chip bottom glue amount less than the chip of 500 square microns, if produce high-power LED chip; The large size chip of size more than 900 square microns is with regard to the minimum requirement that needs four glue of point could satisfy chip bottom glue amount; And because the equipment point glue equipment can produce machine error in running at a high speed, four glue heap spacings that cause being put are inconsistent, and it is uneven and cavitation arranged that bottom of wafer often produces the glue amount; Having a strong impact on the heat conduction and the light extraction efficiency of power LED; In addition, four times some glue has also strengthened labour intensity, has reduced production efficiency.
The utility model content
The purpose of the utility model is to the problems referred to above, provides the solid brilliant machine of a kind of great power LED use Glue dripping head, and can not to satisfy the labour intensity that the requirement of large scale power-type chip bottom glue amount causes big to solve traditional Glue dripping head, the problem that production efficiency is low.
The purpose of the utility model is to realize through following technical scheme:
The solid brilliant machine of a kind of great power LED is used Glue dripping head, and said Glue dripping head is four integrative-structures that the identical viscose glue head of size is formed.
Special, the spacing between the said viscose glue head is identical.
Special, the length of said viscose glue head is greater than 0.5mm.
The beneficial effect of the utility model is that the solid brilliant machine of said great power LED efficiently solves traditional Glue dripping head and can not satisfy the problem that high-power chip bottom glue amount requires with the integrative-structure of four viscose glue heads of Glue dripping head employing; Reduced labour intensity; Improved production efficiency, and four viscose glue heads spacing each other is identical, the distance between four glue heaps that point comes out is consistent; Effectively control the glue amount requirement of bottom of wafer, improved the reliability of product; In addition, the length of four viscose glue heads has effectively been controlled many glue of the not timing problem in glue phenomenon and the production of climbing in the viscose glue process greater than 0.5mm.
Description of drawings
With embodiment the utility model is further explained with reference to the accompanying drawings below.
Fig. 1 is that traditional LED consolidates the structural representation of brilliant machine with Glue dripping head;
Fig. 2 is the structural representation of the solid brilliant machine of the utility model great power LED with Glue dripping head;
Fig. 3 is the right view of the solid brilliant machine of the utility model great power LED with Glue dripping head.
Among the figure:
1, glue head.
The specific embodiment
Please with reference to Fig. 2 and shown in Figure 3, Fig. 2 is the structural representation of the solid brilliant machine of the utility model great power LED with Glue dripping head; Fig. 3 is the right view of the solid brilliant machine of the utility model great power LED with Glue dripping head; In present embodiment, the solid brilliant machine of a kind of great power LED is used Glue dripping head, and said Glue dripping head is four integrative-structures that the identical viscose glue head 1 of size is formed.
Special, the spacing between the said viscose glue head 1 is identical.
Special, the length of said viscose glue head 1 is greater than 0.5mm.
The whole glue face of disposable glue distributes and can make to measure by chip actual size size, and the uniformity of some glue is consistent with great power LED bottom of wafer size, and the size of four viscose glue heads 1 uses computer average mark incision technology to guarantee that size is consistent each other; But four the glue heap glue amounts distribution during guarantee point glue is consistent, and the making of computer average mark incision technology has guaranteed that again four viscose glue heads 1 spacing each other is identical, phase mutual edge distance unanimity between four glue heaps that point comes out; Effectively control the glue amount requirement of bottom of wafer, improved the reliability of product, in addition; The degree of depth of four viscose glue head 1 cuttings requires more than 0.5mm, has effectively controlled many glue of not timing problem of climbing in the viscose glue process in glue phenomenon and the production, and is simple in structure; Be easy to realize; Easy to operate, effectively reduce labour intensity, enhance productivity.
Above embodiment has just set forth the basic principle and the characteristic of the utility model; The utility model is not limited by the foregoing description; Under the prerequisite that does not break away from the utility model spirit and scope; The utility model also has various variations and change, and these variations and change all fall in the utility model scope that requires protection.The utility model requires protection domain to be defined by appending claims and equivalent thereof.
Claims (3)
1. the solid brilliant machine of great power LED is used Glue dripping head, it is characterized in that: said Glue dripping head is four integrative-structures that the identical viscose glue head of size is formed.
2. the solid brilliant machine of great power LED according to claim 1 is used Glue dripping head, and it is characterized in that: the spacing between the said viscose glue head is identical.
3. the solid brilliant machine of great power LED according to claim 1 is used Glue dripping head, and it is characterized in that: the length of said viscose glue head is greater than 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205564549U CN202366837U (en) | 2011-12-28 | 2011-12-28 | Adhesive dispensing head for heavy-power LED die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205564549U CN202366837U (en) | 2011-12-28 | 2011-12-28 | Adhesive dispensing head for heavy-power LED die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202366837U true CN202366837U (en) | 2012-08-08 |
Family
ID=46590562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205564549U Expired - Fee Related CN202366837U (en) | 2011-12-28 | 2011-12-28 | Adhesive dispensing head for heavy-power LED die bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202366837U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103639092A (en) * | 2013-12-30 | 2014-03-19 | 广州市鸿利光电股份有限公司 | Dispensing device and dispensing method of high-power LED (Light-Emitting Diode) |
-
2011
- 2011-12-28 CN CN2011205564549U patent/CN202366837U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103639092A (en) * | 2013-12-30 | 2014-03-19 | 广州市鸿利光电股份有限公司 | Dispensing device and dispensing method of high-power LED (Light-Emitting Diode) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120808 Termination date: 20151228 |
|
| EXPY | Termination of patent right or utility model |