CN106077880B - Soldering wires winding displacement tooling - Google Patents
Soldering wires winding displacement tooling Download PDFInfo
- Publication number
- CN106077880B CN106077880B CN201610542559.6A CN201610542559A CN106077880B CN 106077880 B CN106077880 B CN 106077880B CN 201610542559 A CN201610542559 A CN 201610542559A CN 106077880 B CN106077880 B CN 106077880B
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- China
- Prior art keywords
- wire
- bottom plate
- wire rod
- tooling
- winding displacement
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Wire Processing (AREA)
Abstract
The invention discloses soldering wires winding displacement toolings and winding displacement technique, tooling includes bottom plate, high temperature gummed tape, paper tape and alignment tooling, bottom plate is strip structure, and width direction is equipped with several parallel wire casings, and the depth of each wire casing is to place both threads material as standard；It is aligned the both ends that tooling is set to the wire casing of bottom plate, high temperature gummed tape is bonded the wire rod after alignment, and the wire rod being bonded on high temperature gummed tape is transferred on paper tape etc. to be welded.Using the soldering wires winding displacement technique of above-mentioned tooling, including at least the wire casing technique of wire rod insertion bottom plate, alignment wire craft, transfer wire craft and interposer chip head technique.Soldering wires of the invention winding displacement tooling and winding displacement technique, it is easy to operate, not high to the post skill requirement of employee, and its efficiency is twice or more that traditional-handwork welds one by one, it reduces costs, shorten delivery date and promote quality, for the process after winding displacement, such as welding of whole frame, encapsulating, semi-automatic measuring are laid a good foundation.
Description
Technical field
The present invention relates to chips and soldering wires technology field, more particularly to soldering wires winding displacement tooling and row
Wiring technology.
Background technique
The welding procedure engineering of existing chip and wire rod is complex, and employee is not easy to grasp, and the upper hand of new employee needs to train
Instruction can be only achieved the quality requirement of new process welding for 4-6 months, but efficiency but can only achieve the half of old employee.In addition, core
Sheet head is welded upward, and head, the tail portion of chip are particularly easy to generate viscous tin phenomenon, because wire rod tail portion is by two root skin wire bondings
Find that viscous tin phenomenon is not easy to check afterwards, quality hidden danger is larger.
Summary of the invention
In order to overcome the above-mentioned deficiencies of the prior art, the present invention provides soldering wires winding displacement tooling and winding displacement technique,
Its object is to shorten chip and the time before soldering wires, while guaranteeing to be not likely to produce viscous tin when chip and soldering wires
Phenomenon, and guarantee that it has preferable quality in welding.
The technical scheme adopted by the invention is that: soldering wires winding displacement tooling, including bottom plate, high temperature gummed tape, paper tape and
It is aligned tooling, bottom plate is strip structure, and width direction is equipped with several parallel wire casings, and the depth of each wire casing is to put
Setting both threads material is standard；The both ends that tooling is set to the wire casing of bottom plate are aligned, high temperature gummed tape is bonded the wire rod after alignment, and
The wire rod being bonded on high temperature gummed tape is transferred on paper tape etc. to be welded.
Further, the upper end of bottom plate is additionally provided with fixed part, and fixed structure or connecting hole are additionally provided on fixed part.
Further, bus cable device is additionally provided with above bottom plate, bus cable device smoothes out wire rod in the wire casing on bottom plate.
Further, the both threads material being vertically arranged under the overlay is placed in wire casing, or places two of horizontal alignment arrangement
Wire rod.
Using the soldering wires winding displacement technique of above-mentioned tooling, include at least following four processing step: wire rod is inserted into bottom plate
Wire casing technique, alignment wire craft, transfer wire craft and interposer chip head technique,
The first step, wire rod are inserted into the wire casing technique of bottom plate, and each wire rod is smeared in corresponding wire casing, until every
A both threads material is placed in one wire casing；
Second step is aligned wire craft, after the first step is completed, using alignment tooling by the head end of the wire rod in wire casing and
Tail end is aligned respectively；
Third step shifts wire craft, is bonded in above the wire casing of bottom plate with high temperature gummed tape, guarantees that wire rod is bonded in height
After on warm adhesive tape, high temperature gummed tape and wire rod are attached to together on the paper tape in chip head docking station；
Chip head is plugged into the end of wire rod by the 4th step, interposer chip head technique, forms wire rod item.
Further, the 5th step prepares to weld, after the completion of the step 4, upward by the chip head portion of wire rod item
It is placed in aluminium frame, after filling to aluminium frame, whole frame dipping scaling powder prepares welding.
Further, after the completion of step 5, the chip head of whole wire material item is welded towards the lower entire welding rod of placement
It connects.
Further, after the completion of step 4, before carrying out step 5, bent angle work is carried out to adjacent both threads material head
Two adjacent wire head bendings are become toed-in or toed-out type structure using bent angle tooling, to reach receipts by skill
The intermediate distance of stringing material guarantees not falling out after chip insertion.
Further, after step 6 is completed, encapsulating and semi-automatic measuring are successively carried out to welding rod.
Further, winding displacement technique is suitble to the chip product that length of wires is 35-120mm to use.
Compared with prior art, the beneficial effects of the present invention are: soldering wires of the invention winding displacement tooling and winding displacement work
Skill, it is easy to operate, it is not high to the post skill requirement of employee, it is easy to operate, and its efficiency is two that traditional-handwork welds one by one
Times or more.When because of welding, entire welding rod is placed towards lower in chip head, fundamentally can reduce or reduce the generation of viscous tin product,
Even if there is tin to be sticked on whole chip head, also it is easy discovery and checks.Improve chip and soldering wires efficiency and
Welding quality reduces costs, shortens delivery date and promote quality, certainly for the process after winding displacement, such as welding of whole frame, encapsulating, half
Dynamic measurement is laid a good foundation, and has preferable use value.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one embodiment of soldering wires winding displacement tooling；
Fig. 2 is the top view of the embodiment bottom plate 1 of Fig. 1；
Fig. 3 be Fig. 1 embodiment be transferred on paper tape 3 using high temperature gummed tape 2, and plug chip head equipment welding when
Weld preparation state diagram；
Fig. 4 be Fig. 2 embodiment A to wire arrangement single line embodiment direction view；
Fig. 5 be Fig. 2 embodiment A to wire arrangement double line embodiment direction view；
Fig. 6 is the bending structure schematic diagram that two adjacent wire head bendings are become to toed-in using bent angle tooling；
The chip structure schematic diagram obtained after the bending that Fig. 7 is Fig. 6；
Wherein: 1- bottom plate, 11- wire casing, 12- fixed part, 121- fixed structure or connecting hole；2- high temperature gummed tape, 3- paper
Band, 4- are aligned tooling, 5- wire rod, 6- bus cable device, 7- chip head, 8- bent angle tooling.
Specific embodiment
In order to deepen the understanding of the present invention, present invention will be further explained below with reference to the attached drawings and examples, the implementation
Example for explaining only the invention, does not constitute protection scope of the present invention and limits.
As depicted in figs. 1 and 2, soldering wires winding displacement tooling, including bottom plate 1, high temperature gummed tape 2, paper tape 3 and alignment tooling
4, bottom plate 1 is strip structure, and width direction is equipped with several parallel wire casings 11, and the depth of each wire casing 11 is to place
Both threads material 5 is standard；The both ends that tooling 4 is set to the wire casing 11 of bottom plate 1 are aligned, high temperature gummed tape 2 is bonded the wire rod after alignment
5, and the wire rod 5 being bonded on high temperature gummed tape 2 is transferred on paper tape 3 etc. to be welded.
In the above-described embodiments, the upper end of bottom plate 1 is additionally provided with fixed part 12, be additionally provided on fixed part 12 fixed structure or
Connecting hole 121.Bus cable device 6 is additionally provided with above bottom plate 1, bus cable device 6 smoothes out wire rod 5 in the wire casing 11 on bottom plate 1, such as
Shown in Fig. 2, Fig. 4 and Fig. 5, the both threads material being vertically arranged under the overlay is placed in wire casing 11, that is, adapts to single Wiring technology, referring to fig. 4,
Or place the both threads material of horizontal alignment arrangement, that is, double Wiring technology is adapted to, referring to Fig. 5.
Using the soldering wires winding displacement technique of above-mentioned tooling, include at least following four processing step: wire rod is inserted into bottom plate
Wire casing technique, alignment wire craft, transfer wire craft and 7 technique of lock pin head,
The first step, wire rod are inserted into the wire casing technique of bottom plate, and each wire rod is smeared in corresponding wire casing, until every
A both threads material is placed in one wire casing；
Second step is aligned wire craft, after the first step is completed, using alignment tooling by the head end of the wire rod in wire casing and
Tail end is aligned respectively；
Third step shifts wire craft, is bonded in above the wire casing of bottom plate with high temperature gummed tape, guarantees that wire rod is bonded in height
After on warm adhesive tape, high temperature gummed tape and wire rod are attached to together on the paper tape in chip head docking station；
Chip head is plugged into the end of wire rod by the 4th step, interposer chip head technique, forms wire rod item, shown in Figure 3.
Furthermore above-mentioned technique can also include the 5th step, prepare to weld, after the completion of the step 4, by the core of wire rod item
Head head is placed on upward in aluminium frame, and after filling to aluminium frame, whole frame dipping scaling powder prepares welding.Step 5 is completed
Afterwards, the chip head of whole wire material item is welded towards the lower entire welding rod of placement.As shown in fig. 6, after the completion of step 4,
Before carrying out step 5, bent angle technique is carried out to adjacent both threads material head, that is, uses bent angle tooling 8 by two adjacent wire rods
Head bending becomes toed-in or toed-out type structure, as shown in fig. 7, guaranteeing core to reach the intermediate distance of tightening wire rod
It does not fall out after piece insertion.After step 6 is completed, encapsulating and semi-automatic measuring are successively carried out to welding rod.
Finally, winding displacement technique is suitble to when the chip product welding that length of wires is 35-120mm or uses when assembly, line
The wire rod that material specification is No. 26-32 has better using effect.
Soldering wires of the invention winding displacement tooling and winding displacement technique, it is easy to operate, not to the post skill requirement of employee
Height is easy to operate, and its efficiency is twice or more that traditional-handwork welds one by one.When because of welding, chip head is towards lower placement
Entire welding rod, the generation that fundamentally can reduce or reduce viscous tin product are also easy even if there is tin to be sticked on whole chip head
It was found that and checking.The efficiency and welding quality for improving chip and soldering wires, reduce costs, shorten delivery date and promotion
Quality has preferable use value.
What the embodiment of the present invention was announced is preferred embodiment, and however, it is not limited to this, the ordinary skill people of this field
Member, easily according to above-described embodiment, understands spirit of the invention, and make different amplification and variation, but as long as not departing from this
The spirit of invention, all within the scope of the present invention.
Claims (1)
1. soldering wires winding displacement tooling, it is characterised in that: including bottom plate (1), high temperature gummed tape (2), paper tape (3) and alignment tooling
(4), the bottom plate (1) is strip structure, and width direction is equipped with several parallel wire casings (11), each described wire casing
(11) depth is to place both threads material (5) as standard；Alignment tooling (4) is set to the both ends of the wire casing (11) of bottom plate (1),
The high temperature gummed tape (2) is bonded the wire rod (5) after alignment, and the wire rod (5) being bonded on high temperature gummed tape (2) is transferred to
Paper tape (3) is first-class to be welded；The upper end of the bottom plate (1) is additionally provided with fixed part (12), is additionally provided on the fixed part (12) solid
Determine structure or connecting hole (121)；It is additionally provided with bus cable device (6) above the bottom plate (1), the bus cable device (6) is by wire rod
(5) it smoothes out in the wire casing (11) on bottom plate (1)；The both threads material being vertically arranged under the overlay is placed in the wire casing (11), or
Place the both threads material of horizontal alignment arrangement；
In the specific manufacturing process of soldering wires winding displacement, including at least following processing step: the wire casing technique of wire rod insertion bottom plate,
It is aligned wire craft, transfer wire craft and interposer chip head technique,
The first step, wire rod are inserted into the wire casing technique of bottom plate, and each wire rod is smeared in corresponding wire casing, until each
A both threads material is placed in wire casing；
Second step is aligned wire craft, after the first step is completed, using alignment tooling by the head end and tail end of the wire rod in wire casing
It is aligned respectively；
Third step shifts wire craft, is bonded in above the wire casing of bottom plate with high temperature gummed tape, guarantees that wire rod is bonded in high-temp glue
After taking, high temperature gummed tape and wire rod are attached to together on the paper tape in chip head docking station；
Chip head is plugged into the end of wire rod by the 4th step, interposer chip head technique, forms wire rod item；
5th step prepares to weld, after the completion of the step 4, the chip head portion of wire rod item is placed on upward in aluminium frame,
After filling to aluminium frame, whole frame dipping scaling powder prepares welding；
After the completion of step 5, the chip head of whole wire material item is welded towards being down placed in entire tin pot for step 6
It connects；
In addition, winding displacement technique is suitble to the chip product that length of wires is 35-120mm to use, after the completion of step 4, walked
Before rapid five, bent angle technique is carried out to adjacent both threads material head, that is, uses bent angle tooling by two adjacent wire head bendings
As toed-in or toed-out type structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610542559.6A CN106077880B (en) | 2016-07-12 | 2016-07-12 | Soldering wires winding displacement tooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610542559.6A CN106077880B (en) | 2016-07-12 | 2016-07-12 | Soldering wires winding displacement tooling |
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| Publication Number | Publication Date |
|---|---|
| CN106077880A CN106077880A (en) | 2016-11-09 |
| CN106077880B true CN106077880B (en) | 2019-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610542559.6A Active CN106077880B (en) | 2016-07-12 | 2016-07-12 | Soldering wires winding displacement tooling |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108422059B (en) * | 2018-03-02 | 2020-11-06 | 河北中瓷电子科技股份有限公司 | Brazing die and brazing method for packaging shell |
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| CN205817033U (en) * | 2016-07-12 | 2016-12-21 | 南京时恒电子科技有限公司 | Soldering wires winding displacement frock |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH07201523A (en) * | 1993-12-28 | 1995-08-04 | Matsushita Electric Ind Co Ltd | High temperature thermistor temperature sensor |
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| CN101013675A (en) * | 2007-01-29 | 2007-08-08 | 南京时恒电子科技有限公司 | Method of spot welding for minitype sensor |
| CN103084689A (en) * | 2013-01-02 | 2013-05-08 | 青岛海润电子有限公司 | Sensor wire welding process in refrigerator foaming solidification status |
| CN103794299A (en) * | 2014-01-28 | 2014-05-14 | 南京时恒电子科技有限公司 | Semi-automatic wire arrangement device and wire arrangement method |
| CN203973124U (en) * | 2014-07-31 | 2014-12-03 | 国家电网公司 | Ground connection base wire bonds mould |
| CN204030237U (en) * | 2014-07-31 | 2014-12-17 | 江苏莫仕天安连接器有限公司 | A kind of cable assembly welding winding displacement tool |
| CN104501988A (en) * | 2014-12-16 | 2015-04-08 | 南京时恒电子科技有限公司 | Wide-temperature-region high-accuracy NTC (Negative Temperature Coefficient) temperature sensor and manufacturing method thereof |
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| CN106077880A (en) | 2016-11-09 |
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| CB03 | Change of inventor or designer information |
Inventor after: Li Xunhong Inventor after: Wang Xueting Inventor before: Li Xunhong |
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