CN106077880B - Soldering wires winding displacement tooling - Google Patents

Soldering wires winding displacement tooling Download PDF

Info

Publication number
CN106077880B
CN106077880B CN201610542559.6A CN201610542559A CN106077880B CN 106077880 B CN106077880 B CN 106077880B CN 201610542559 A CN201610542559 A CN 201610542559A CN 106077880 B CN106077880 B CN 106077880B
Authority
CN
China
Prior art keywords
wire
bottom plate
wire rod
tooling
winding displacement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610542559.6A
Other languages
Chinese (zh)
Other versions
CN106077880A (en
Inventor
李训红
汪雪婷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NANJING SHIHENG ELECTRONICS CO Ltd
Original Assignee
NANJING SHIHENG ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NANJING SHIHENG ELECTRONICS CO Ltd filed Critical NANJING SHIHENG ELECTRONICS CO Ltd
Priority to CN201610542559.6A priority Critical patent/CN106077880B/en
Publication of CN106077880A publication Critical patent/CN106077880A/en
Application granted granted Critical
Publication of CN106077880B publication Critical patent/CN106077880B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • B23K3/087Soldering or brazing jigs, fixtures or clamping means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices

Abstract

The invention discloses soldering wires winding displacement toolings and winding displacement technique, tooling includes bottom plate, high temperature gummed tape, paper tape and alignment tooling, bottom plate is strip structure, and width direction is equipped with several parallel wire casings, and the depth of each wire casing is to place both threads material as standard;It is aligned the both ends that tooling is set to the wire casing of bottom plate, high temperature gummed tape is bonded the wire rod after alignment, and the wire rod being bonded on high temperature gummed tape is transferred on paper tape etc. to be welded.Using the soldering wires winding displacement technique of above-mentioned tooling, including at least the wire casing technique of wire rod insertion bottom plate, alignment wire craft, transfer wire craft and interposer chip head technique.Soldering wires of the invention winding displacement tooling and winding displacement technique, it is easy to operate, not high to the post skill requirement of employee, and its efficiency is twice or more that traditional-handwork welds one by one, it reduces costs, shorten delivery date and promote quality, for the process after winding displacement, such as welding of whole frame, encapsulating, semi-automatic measuring are laid a good foundation.

Description

Soldering wires winding displacement tooling
Technical field
The present invention relates to chips and soldering wires technology field, more particularly to soldering wires winding displacement tooling and row Wiring technology.
Background technique
The welding procedure engineering of existing chip and wire rod is complex, and employee is not easy to grasp, and the upper hand of new employee needs to train Instruction can be only achieved the quality requirement of new process welding for 4-6 months, but efficiency but can only achieve the half of old employee.In addition, core Sheet head is welded upward, and head, the tail portion of chip are particularly easy to generate viscous tin phenomenon, because wire rod tail portion is by two root skin wire bondings Find that viscous tin phenomenon is not easy to check afterwards, quality hidden danger is larger.
Summary of the invention
In order to overcome the above-mentioned deficiencies of the prior art, the present invention provides soldering wires winding displacement tooling and winding displacement technique, Its object is to shorten chip and the time before soldering wires, while guaranteeing to be not likely to produce viscous tin when chip and soldering wires Phenomenon, and guarantee that it has preferable quality in welding.
The technical scheme adopted by the invention is that: soldering wires winding displacement tooling, including bottom plate, high temperature gummed tape, paper tape and It is aligned tooling, bottom plate is strip structure, and width direction is equipped with several parallel wire casings, and the depth of each wire casing is to put Setting both threads material is standard;The both ends that tooling is set to the wire casing of bottom plate are aligned, high temperature gummed tape is bonded the wire rod after alignment, and The wire rod being bonded on high temperature gummed tape is transferred on paper tape etc. to be welded.
Further, the upper end of bottom plate is additionally provided with fixed part, and fixed structure or connecting hole are additionally provided on fixed part.
Further, bus cable device is additionally provided with above bottom plate, bus cable device smoothes out wire rod in the wire casing on bottom plate.
Further, the both threads material being vertically arranged under the overlay is placed in wire casing, or places two of horizontal alignment arrangement Wire rod.
Using the soldering wires winding displacement technique of above-mentioned tooling, include at least following four processing step: wire rod is inserted into bottom plate Wire casing technique, alignment wire craft, transfer wire craft and interposer chip head technique,
The first step, wire rod are inserted into the wire casing technique of bottom plate, and each wire rod is smeared in corresponding wire casing, until every A both threads material is placed in one wire casing;
Second step is aligned wire craft, after the first step is completed, using alignment tooling by the head end of the wire rod in wire casing and Tail end is aligned respectively;
Third step shifts wire craft, is bonded in above the wire casing of bottom plate with high temperature gummed tape, guarantees that wire rod is bonded in height After on warm adhesive tape, high temperature gummed tape and wire rod are attached to together on the paper tape in chip head docking station;
Chip head is plugged into the end of wire rod by the 4th step, interposer chip head technique, forms wire rod item.
Further, the 5th step prepares to weld, after the completion of the step 4, upward by the chip head portion of wire rod item It is placed in aluminium frame, after filling to aluminium frame, whole frame dipping scaling powder prepares welding.
Further, after the completion of step 5, the chip head of whole wire material item is welded towards the lower entire welding rod of placement It connects.
Further, after the completion of step 4, before carrying out step 5, bent angle work is carried out to adjacent both threads material head Two adjacent wire head bendings are become toed-in or toed-out type structure using bent angle tooling, to reach receipts by skill The intermediate distance of stringing material guarantees not falling out after chip insertion.
Further, after step 6 is completed, encapsulating and semi-automatic measuring are successively carried out to welding rod.
Further, winding displacement technique is suitble to the chip product that length of wires is 35-120mm to use.
Compared with prior art, the beneficial effects of the present invention are: soldering wires of the invention winding displacement tooling and winding displacement work Skill, it is easy to operate, it is not high to the post skill requirement of employee, it is easy to operate, and its efficiency is two that traditional-handwork welds one by one Times or more.When because of welding, entire welding rod is placed towards lower in chip head, fundamentally can reduce or reduce the generation of viscous tin product, Even if there is tin to be sticked on whole chip head, also it is easy discovery and checks.Improve chip and soldering wires efficiency and Welding quality reduces costs, shortens delivery date and promote quality, certainly for the process after winding displacement, such as welding of whole frame, encapsulating, half Dynamic measurement is laid a good foundation, and has preferable use value.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one embodiment of soldering wires winding displacement tooling;
Fig. 2 is the top view of the embodiment bottom plate 1 of Fig. 1;
Fig. 3 be Fig. 1 embodiment be transferred on paper tape 3 using high temperature gummed tape 2, and plug chip head equipment welding when Weld preparation state diagram;
Fig. 4 be Fig. 2 embodiment A to wire arrangement single line embodiment direction view;
Fig. 5 be Fig. 2 embodiment A to wire arrangement double line embodiment direction view;
Fig. 6 is the bending structure schematic diagram that two adjacent wire head bendings are become to toed-in using bent angle tooling;
The chip structure schematic diagram obtained after the bending that Fig. 7 is Fig. 6;
Wherein: 1- bottom plate, 11- wire casing, 12- fixed part, 121- fixed structure or connecting hole;2- high temperature gummed tape, 3- paper Band, 4- are aligned tooling, 5- wire rod, 6- bus cable device, 7- chip head, 8- bent angle tooling.
Specific embodiment
In order to deepen the understanding of the present invention, present invention will be further explained below with reference to the attached drawings and examples, the implementation Example for explaining only the invention, does not constitute protection scope of the present invention and limits.
As depicted in figs. 1 and 2, soldering wires winding displacement tooling, including bottom plate 1, high temperature gummed tape 2, paper tape 3 and alignment tooling 4, bottom plate 1 is strip structure, and width direction is equipped with several parallel wire casings 11, and the depth of each wire casing 11 is to place Both threads material 5 is standard;The both ends that tooling 4 is set to the wire casing 11 of bottom plate 1 are aligned, high temperature gummed tape 2 is bonded the wire rod after alignment 5, and the wire rod 5 being bonded on high temperature gummed tape 2 is transferred on paper tape 3 etc. to be welded.
In the above-described embodiments, the upper end of bottom plate 1 is additionally provided with fixed part 12, be additionally provided on fixed part 12 fixed structure or Connecting hole 121.Bus cable device 6 is additionally provided with above bottom plate 1, bus cable device 6 smoothes out wire rod 5 in the wire casing 11 on bottom plate 1, such as Shown in Fig. 2, Fig. 4 and Fig. 5, the both threads material being vertically arranged under the overlay is placed in wire casing 11, that is, adapts to single Wiring technology, referring to fig. 4, Or place the both threads material of horizontal alignment arrangement, that is, double Wiring technology is adapted to, referring to Fig. 5.
Using the soldering wires winding displacement technique of above-mentioned tooling, include at least following four processing step: wire rod is inserted into bottom plate Wire casing technique, alignment wire craft, transfer wire craft and 7 technique of lock pin head,
The first step, wire rod are inserted into the wire casing technique of bottom plate, and each wire rod is smeared in corresponding wire casing, until every A both threads material is placed in one wire casing;
Second step is aligned wire craft, after the first step is completed, using alignment tooling by the head end of the wire rod in wire casing and Tail end is aligned respectively;
Third step shifts wire craft, is bonded in above the wire casing of bottom plate with high temperature gummed tape, guarantees that wire rod is bonded in height After on warm adhesive tape, high temperature gummed tape and wire rod are attached to together on the paper tape in chip head docking station;
Chip head is plugged into the end of wire rod by the 4th step, interposer chip head technique, forms wire rod item, shown in Figure 3.
Furthermore above-mentioned technique can also include the 5th step, prepare to weld, after the completion of the step 4, by the core of wire rod item Head head is placed on upward in aluminium frame, and after filling to aluminium frame, whole frame dipping scaling powder prepares welding.Step 5 is completed Afterwards, the chip head of whole wire material item is welded towards the lower entire welding rod of placement.As shown in fig. 6, after the completion of step 4, Before carrying out step 5, bent angle technique is carried out to adjacent both threads material head, that is, uses bent angle tooling 8 by two adjacent wire rods Head bending becomes toed-in or toed-out type structure, as shown in fig. 7, guaranteeing core to reach the intermediate distance of tightening wire rod It does not fall out after piece insertion.After step 6 is completed, encapsulating and semi-automatic measuring are successively carried out to welding rod.
Finally, winding displacement technique is suitble to when the chip product welding that length of wires is 35-120mm or uses when assembly, line The wire rod that material specification is No. 26-32 has better using effect.
Soldering wires of the invention winding displacement tooling and winding displacement technique, it is easy to operate, not to the post skill requirement of employee Height is easy to operate, and its efficiency is twice or more that traditional-handwork welds one by one.When because of welding, chip head is towards lower placement Entire welding rod, the generation that fundamentally can reduce or reduce viscous tin product are also easy even if there is tin to be sticked on whole chip head It was found that and checking.The efficiency and welding quality for improving chip and soldering wires, reduce costs, shorten delivery date and promotion Quality has preferable use value.
What the embodiment of the present invention was announced is preferred embodiment, and however, it is not limited to this, the ordinary skill people of this field Member, easily according to above-described embodiment, understands spirit of the invention, and make different amplification and variation, but as long as not departing from this The spirit of invention, all within the scope of the present invention.

Claims (1)

1. soldering wires winding displacement tooling, it is characterised in that: including bottom plate (1), high temperature gummed tape (2), paper tape (3) and alignment tooling (4), the bottom plate (1) is strip structure, and width direction is equipped with several parallel wire casings (11), each described wire casing (11) depth is to place both threads material (5) as standard;Alignment tooling (4) is set to the both ends of the wire casing (11) of bottom plate (1), The high temperature gummed tape (2) is bonded the wire rod (5) after alignment, and the wire rod (5) being bonded on high temperature gummed tape (2) is transferred to Paper tape (3) is first-class to be welded;The upper end of the bottom plate (1) is additionally provided with fixed part (12), is additionally provided on the fixed part (12) solid Determine structure or connecting hole (121);It is additionally provided with bus cable device (6) above the bottom plate (1), the bus cable device (6) is by wire rod (5) it smoothes out in the wire casing (11) on bottom plate (1);The both threads material being vertically arranged under the overlay is placed in the wire casing (11), or Place the both threads material of horizontal alignment arrangement;
In the specific manufacturing process of soldering wires winding displacement, including at least following processing step: the wire casing technique of wire rod insertion bottom plate, It is aligned wire craft, transfer wire craft and interposer chip head technique,
The first step, wire rod are inserted into the wire casing technique of bottom plate, and each wire rod is smeared in corresponding wire casing, until each A both threads material is placed in wire casing;
Second step is aligned wire craft, after the first step is completed, using alignment tooling by the head end and tail end of the wire rod in wire casing It is aligned respectively;
Third step shifts wire craft, is bonded in above the wire casing of bottom plate with high temperature gummed tape, guarantees that wire rod is bonded in high-temp glue After taking, high temperature gummed tape and wire rod are attached to together on the paper tape in chip head docking station;
Chip head is plugged into the end of wire rod by the 4th step, interposer chip head technique, forms wire rod item;
5th step prepares to weld, after the completion of the step 4, the chip head portion of wire rod item is placed on upward in aluminium frame, After filling to aluminium frame, whole frame dipping scaling powder prepares welding;
After the completion of step 5, the chip head of whole wire material item is welded towards being down placed in entire tin pot for step 6 It connects;
In addition, winding displacement technique is suitble to the chip product that length of wires is 35-120mm to use, after the completion of step 4, walked Before rapid five, bent angle technique is carried out to adjacent both threads material head, that is, uses bent angle tooling by two adjacent wire head bendings As toed-in or toed-out type structure.
CN201610542559.6A 2016-07-12 2016-07-12 Soldering wires winding displacement tooling Active CN106077880B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610542559.6A CN106077880B (en) 2016-07-12 2016-07-12 Soldering wires winding displacement tooling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610542559.6A CN106077880B (en) 2016-07-12 2016-07-12 Soldering wires winding displacement tooling

Publications (2)

Publication Number Publication Date
CN106077880A CN106077880A (en) 2016-11-09
CN106077880B true CN106077880B (en) 2019-06-25

Family

ID=57219786

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610542559.6A Active CN106077880B (en) 2016-07-12 2016-07-12 Soldering wires winding displacement tooling

Country Status (1)

Country Link
CN (1) CN106077880B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108422059B (en) * 2018-03-02 2020-11-06 河北中瓷电子科技股份有限公司 Brazing die and brazing method for packaging shell

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101013675A (en) * 2007-01-29 2007-08-08 南京时恒电子科技有限公司 Method of spot welding for minitype sensor
CN103084689A (en) * 2013-01-02 2013-05-08 青岛海润电子有限公司 Sensor wire welding process in refrigerator foaming solidification status
CN103794299A (en) * 2014-01-28 2014-05-14 南京时恒电子科技有限公司 Semi-automatic wire arrangement device and wire arrangement method
CN203973124U (en) * 2014-07-31 2014-12-03 国家电网公司 Ground connection base wire bonds mould
CN204030237U (en) * 2014-07-31 2014-12-17 江苏莫仕天安连接器有限公司 A kind of cable assembly welding winding displacement tool
CN104501988A (en) * 2014-12-16 2015-04-08 南京时恒电子科技有限公司 Wide-temperature-region high-accuracy NTC (Negative Temperature Coefficient) temperature sensor and manufacturing method thereof
CN204700403U (en) * 2015-05-19 2015-10-14 东莞市品耀自动化设备有限公司 A kind of two-wire bus cable device of T8 lamp bar bonding equipment
CN205057341U (en) * 2015-10-13 2016-03-02 东莞宝特电业有限公司 Welding is with wiring compacting machine
CN205817033U (en) * 2016-07-12 2016-12-21 南京时恒电子科技有限公司 Soldering wires winding displacement frock

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07201523A (en) * 1993-12-28 1995-08-04 Matsushita Electric Ind Co Ltd High temperature thermistor temperature sensor

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101013675A (en) * 2007-01-29 2007-08-08 南京时恒电子科技有限公司 Method of spot welding for minitype sensor
CN103084689A (en) * 2013-01-02 2013-05-08 青岛海润电子有限公司 Sensor wire welding process in refrigerator foaming solidification status
CN103794299A (en) * 2014-01-28 2014-05-14 南京时恒电子科技有限公司 Semi-automatic wire arrangement device and wire arrangement method
CN203973124U (en) * 2014-07-31 2014-12-03 国家电网公司 Ground connection base wire bonds mould
CN204030237U (en) * 2014-07-31 2014-12-17 江苏莫仕天安连接器有限公司 A kind of cable assembly welding winding displacement tool
CN104501988A (en) * 2014-12-16 2015-04-08 南京时恒电子科技有限公司 Wide-temperature-region high-accuracy NTC (Negative Temperature Coefficient) temperature sensor and manufacturing method thereof
CN204700403U (en) * 2015-05-19 2015-10-14 东莞市品耀自动化设备有限公司 A kind of two-wire bus cable device of T8 lamp bar bonding equipment
CN205057341U (en) * 2015-10-13 2016-03-02 东莞宝特电业有限公司 Welding is with wiring compacting machine
CN205817033U (en) * 2016-07-12 2016-12-21 南京时恒电子科技有限公司 Soldering wires winding displacement frock

Also Published As

Publication number Publication date
CN106077880A (en) 2016-11-09

Similar Documents

Publication Publication Date Title
CN205817033U (en) Soldering wires winding displacement frock
CN106077880B (en) Soldering wires winding displacement tooling
CN207057316U (en) A kind of bending hoop examines mould
CN205968708U (en) Detachable protection network mounting tool
CN206043908U (en) Combined cabinet
CN205293152U (en) Packing box suitable for automatic joint sealing operation
CN206356420U (en) Metal plate bending fixture
CN204558206U (en) A kind of electronic component assembling box
CN207040005U (en) A kind of industrial gauge outfit attachment means
CN206602012U (en) The I-shaped inducer of embedded coiling
CN206564237U (en) Test solar components welding of battery film pulling force tensile test mould
CN206181572U (en) Circuit board gum lamination jig
CN206153409U (en) Side riveting tool of cell -phone shell
CN205992386U (en) A kind of lamp plate for LED display and the attachment structure of driving plate
CN205587860U (en) Close bars weld roll coil of strip overall arrangement device and stringer
CN207398807U (en) A kind of signal cable connector of charged core locating plate
CN216373006U (en) Pipe shell lead forming tool
CN205864431U (en) A kind of CATV ray machine
CN207339111U (en) Detachable combination secondary winding displacement Wire bender
CN206296554U (en) Motor of camera welding fixture
CN204695904U (en) A kind of insulation frame for inverter inductor
CN208449777U (en) Automatic dispensing machine
CN206471226U (en) A kind of double winding magnet ring coiling positioning tool
CN208922800U (en) A kind of vertical Surface Mounting Technology component structure
CN207076621U (en) A kind of Corner Link mounting table of point gum machine

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CB03 Change of inventor or designer information
CB03 Change of inventor or designer information

Inventor after: Li Xunhong

Inventor after: Wang Xueting

Inventor before: Li Xunhong

GR01 Patent grant
GR01 Patent grant