CN101013675A - Method of spot welding for minitype sensor - Google Patents
Method of spot welding for minitype sensor Download PDFInfo
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- CN101013675A CN101013675A CNA2007100198101A CN200710019810A CN101013675A CN 101013675 A CN101013675 A CN 101013675A CN A2007100198101 A CNA2007100198101 A CN A2007100198101A CN 200710019810 A CN200710019810 A CN 200710019810A CN 101013675 A CN101013675 A CN 101013675A
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- chip
- spot welding
- copper wire
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- thin copper
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/2076—Diameter ranges equal to or larger than 100 microns
Abstract
The invention relates to one micro sensor point welding process in electron part welding processing technique field, which comprises the following steps: distributing line on order; distribution chips; aid agent dipping and line terminal point welding not only solving the thin copper wire and micro chip difficulty accordingly and for position bar for batch production.
Description
Technical field
The present invention relates to a kind of welding technique, especially a kind of method of spot welding for minitype sensor belongs to electronic device welding technique field.
Background technology
One important procedure of Miniature Sensor manufacturing process is that sensor chip and two are drawn wire bonds together.In the past since lead for having necessarily flexible double finer wire, and the thickness of Miniature Sensor chip self is slightly larger than the spacing of double finer wire.Therefore, the welding technique of Cai Yonging is to pick up sensor chip with tweezers earlier for a long time, it is inserted between two finer wire leads temporarily fixes, and takes out behind the scolding tin of immersion fusing again, and cooling gets final product.
Yet, microminiaturized and improving constantly along with transducer to the sensor performance quality requirements, require to adopt diameter for the microsensor of thin enamel-cover copper wire below 0.2 millimeter for the chip size specification in 0.5 millimeter, lead, because the sensor chip tweezer is held difficulty, and thin copper wire is very soft, obviously can't adopt above immersed solder process.Have no alternative but to take the method for the manual meticulous spot welding of single-piece.Not only efficient is extremely low, and welding quality is difficult to control.
Summary of the invention
The technical problem to be solved in the present invention is: the difficult problem at above-mentioned microsensor welding proposes a kind of method of spot welding for minitype sensor that can significantly improve work efficiency and be convenient to guarantee welding quality.
In order to solve above technical problem, method of spot welding for minitype sensor of the present invention adopts following steps:
1), winding displacement according to the order of sequence---two one group basic according to the order of sequence perpendicular separation of thin copper wire of predetermined length arranged to be fixed on the positioning strip, and end to be welded exposes;
2), stand cloth chip---chip to be welded is spread out cloth on level and smooth heatproof backing plate;
3), auxiliary agent soaks into---and the scaling powder that will dissolve drips and is sprinkled upon on the backing plate, soaks into chip;
4), line end spot welding---help positioning strip, and, make its seam with the thin copper wire termination that the solder horn that dips in scolding tin pushes expose a chip to positioning strip.
Adopting above process not only to properly settle thin copper wire softness and microchip is difficult to tweezer and holds a difficult problem of bringing to welding, and because rationally by positioning strip, welding can be carried out in batches, and for the batch in each road, back cleans, batch is sealed the good condition of having created.Thereby improved work efficiency greatly.Compared with prior art, have significant substantive distinguishing features and outstanding progress.
Description of drawings
The present invention is further illustrated below in conjunction with accompanying drawing.
Fig. 1 is the schematic diagram of one embodiment of the invention.
Embodiment
Embodiment one
Present embodiment need be of a size of 0.65 * 0.65 * 0.4 micro temperature sensor and the enamelled wire thin copper wire of two diameters 0.15 welds together with a kind of.
Concrete process step following (referring to Fig. 1):
1), winding displacement according to the order of sequence---with two one group of the thin copper wire of predetermined length according to the order of sequence perpendicular separation be arranged on two parallel hardboard positioning strips 1, paste fixingly with adhesive sticker bar 2, end to be welded exposes;
2), stand cloth chip---chip 4 to be welded is evenly spread out cloth on level and smooth ceramic backing;
3), auxiliary agent soaks into---and the scaling powder that will dissolve evenly drips and is sprinkled upon on the backing plate, soaks into chip;
4), single-ended padding---help positioning strip on the other hand, another hand is pushed chip nearby one of to thin copper wire 3 terminations of exposing positioning strip with the thermostatic electric iron head that dips in scolding tin, some contact seam (spot welding); Scolding tin adopts lead-free soldering wire, and composition is Sn96.5 ± 5%, Ag3.0 ± 0.5%, Cu0.5 ± 0.1%, and the solder horn temperature is controlled at 270 ± 10 ℃, spot welding time＜1 second;
5), seam one by one---repeating step 4), with respectively organize on the positioning strip one of thin copper wire respectively with a chip seam;
6), spot welding end in addition---every group of thin copper wire one end respectively with a chip seam after, with pincet every group of thin copper wire other end contacted with corresponding chip, and contacts seam with electric iron point;
7), check separates---and after the assay was approved, throw off the adhesive sticker bar, the chip that is welded with two lead-in wires is separated from each other.
After adopting the method for spot welding for minitype sensor of present embodiment, solved simultaneously not only that thin copper wire is too pliable and tough can't to produce chucking power and chip is too small is difficult to the difficult problem that nickel is held, and can guarantee to finish required welding with basicly stable quality and higher efficient.
In addition to the implementation, the present invention can also have other execution modes.All employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop on the protection range of requirement of the present invention.
Claims (6)
1. method of spot welding for minitype sensor may further comprise the steps:
1), winding displacement according to the order of sequence---two one group basic according to the order of sequence perpendicular separation of thin copper wire of predetermined length arranged to be fixed on the positioning strip, and end to be welded exposes;
2), stand cloth chip---chip to be welded is spread out cloth on level and smooth heatproof backing plate;
3), auxiliary agent soaks into---and the scaling powder that will dissolve drips and is sprinkled upon on the backing plate, soaks into chip;
4), line end spot welding---help positioning strip, and, make its seam with the thin copper wire termination that the solder horn that dips in scolding tin pushes expose a chip to positioning strip.
2. according to the described method of spot welding for minitype sensor of claim 1, it is characterized in that: described step 4), be divided into following work step and finish:
Single-ended padding---help on the other hand positioning strip, another hand closes with some Contact welding that the solder horn that dips in scolding tin will chip nearby pushes to expose the thin copper wire termination of positioning strip to;
Seam one by one---repeat above work step, with respectively organize on the positioning strip one of thin copper wire respectively with a chip seam;
Spot welding is end in addition---every group of thin copper wire one end respectively with a chip seam after, with pincet every group of thin copper wire other end contacted with corresponding chip, and contacts seam with flatiron point.
3. according to the described method of spot welding for minitype sensor of claim 2, it is characterized in that: in the described step 1) be, with two one group of the thin copper wire of predetermined length according to the order of sequence perpendicular separation be arranged on two hardboard positioning strips, paste fixingly with the adhesive sticker bar, end to be welded exposes.
4. according to the described method of spot welding for minitype sensor of claim 3, it is characterized in that: described each step also comprises after finishing:
Check separates---and after the assay was approved, throw off the adhesive sticker bar, the chip that is welded with two lead-in wires is separated from each other.
5. according to the described method of spot welding for minitype sensor of claim 4, it is characterized in that: described scolding tin adopts lead-free soldering wire, and composition is Sn96.5 ± 5%, Ag3.0 ± 0.5%, Cu0.5 ± 0.1%.
6. according to the described method of spot welding for minitype sensor of claim 5, it is characterized in that: described solder horn temperature is controlled at 270 ± 10 ℃, and the spot welding time was less than 1 second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100198101A CN100435306C (en) | 2007-01-29 | 2007-01-29 | Method of spot welding for minitype sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100198101A CN100435306C (en) | 2007-01-29 | 2007-01-29 | Method of spot welding for minitype sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101013675A true CN101013675A (en) | 2007-08-08 |
| CN100435306C CN100435306C (en) | 2008-11-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100198101A Expired - Fee Related CN100435306C (en) | 2007-01-29 | 2007-01-29 | Method of spot welding for minitype sensor |
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| Country | Link |
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| CN (1) | CN100435306C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103398884A (en) * | 2013-07-30 | 2013-11-20 | 江苏法尔胜材料分析测试有限公司 | Hot embedding method for gold-phase sample preparation of thin steel wires |
| CN103722260A (en) * | 2013-12-12 | 2014-04-16 | 成都赛英科技有限公司 | Tin soldering micro-packaging process of dies |
| CN103794299A (en) * | 2014-01-28 | 2014-05-14 | 南京时恒电子科技有限公司 | Semi-automatic wire arrangement device and wire arrangement method |
| CN106077880A (en) * | 2016-07-12 | 2016-11-09 | 南京时恒电子科技有限公司 | Soldering wires winding displacement frock and winding displacement technique |
| CN108357985A (en) * | 2018-01-26 | 2018-08-03 | 贵州钢绳股份有限公司 | A kind of positioning paper and its application in steel bead wire winding |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5139972A (en) * | 1991-02-28 | 1992-08-18 | General Electric Company | Batch assembly of high density hermetic packages for power semiconductor chips |
| CN1338349A (en) * | 2001-09-26 | 2002-03-06 | 长春海拉车灯有限公司 | Hot plate welding method with automatic multi-point regulation |
| CH696615A5 (en) * | 2003-09-22 | 2007-08-15 | Esec Trading Sa | A method for adjustment of the bonding head of a die bonder. |
| JP2006250648A (en) * | 2005-03-09 | 2006-09-21 | Yamaha Corp | Manufacturing method of physical quantity sensor and bonding device |
-
2007
- 2007-01-29 CN CNB2007100198101A patent/CN100435306C/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103398884A (en) * | 2013-07-30 | 2013-11-20 | 江苏法尔胜材料分析测试有限公司 | Hot embedding method for gold-phase sample preparation of thin steel wires |
| CN103722260A (en) * | 2013-12-12 | 2014-04-16 | 成都赛英科技有限公司 | Tin soldering micro-packaging process of dies |
| CN103794299A (en) * | 2014-01-28 | 2014-05-14 | 南京时恒电子科技有限公司 | Semi-automatic wire arrangement device and wire arrangement method |
| CN103794299B (en) * | 2014-01-28 | 2016-02-10 | 南京时恒电子科技有限公司 | A kind of semi-automatic bus cable device and wire arranging method |
| CN106077880A (en) * | 2016-07-12 | 2016-11-09 | 南京时恒电子科技有限公司 | Soldering wires winding displacement frock and winding displacement technique |
| CN106077880B (en) * | 2016-07-12 | 2019-06-25 | 南京时恒电子科技有限公司 | Soldering wires winding displacement tooling |
| CN108357985A (en) * | 2018-01-26 | 2018-08-03 | 贵州钢绳股份有限公司 | A kind of positioning paper and its application in steel bead wire winding |
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| Publication number | Publication date |
|---|---|
| CN100435306C (en) | 2008-11-19 |
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Address after: 211121, Nanjing Road, Jiangning District, Jiangsu 18, Jinyang Road Patentee after: Nanjing Shiheng Electronics Co., Ltd. Address before: 211101 Shuanglong road 179-1, Jiangning District, Jiangsu, Nanjing Patentee before: Nanjing Shiheng Electronics Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081119 Termination date: 20190129 |
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| CF01 | Termination of patent right due to non-payment of annual fee |