CN103722260A - Tin soldering micro-packaging process of dies - Google Patents
Tin soldering micro-packaging process of dies Download PDFInfo
- Publication number
- CN103722260A CN103722260A CN201310684582.5A CN201310684582A CN103722260A CN 103722260 A CN103722260 A CN 103722260A CN 201310684582 A CN201310684582 A CN 201310684582A CN 103722260 A CN103722260 A CN 103722260A
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- micropackaging
- die chip
- micro
- soldering
- printed board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
Abstract
The invention discloses a tin soldering micro-packaging process of dies. The process includes the steps of 1, regulating heating temperature of an electric soldering iron to 250 DEG C in order to place solder at a micro-packaged die chip fixation position reserved on a radio frequency printed board; 2, before the solder cools, placing a micro-packaged die chip to be fixed, on the micro-packaged die chip fixation position reserved on the radio frequency printed board with tweezers; 3, wiping the electric soldering iron with wet foam, holding the electric soldering iron against the micro-packaged die chip with one hand, holding the tweezers with the other hand to adjust the position of the micro-packaged die chip to make sure the head of the electric soldering iron contacts with the micro-packaged die chip for fewer than 5 seconds, and allowing for natural cooling after welding. The tin soldering micro-packaging process of dies has the advantages that the die chip can be reliably grounded and the problem that the chip easily skews to affect subsequent gold wire and printed board microstrip line quality when the thermal pasting technique is applied is solved.
Description
Technical field
The present invention relates to micropackaging pipe die chip welding procedure in frequency microwave product, be specifically related to a kind of soldering micropackaging tube core technique.
Background technology
In frequency microwave product design, usually use a large amount of micropackaging die chips, and adopt gold wire bonding technique that die chip and printed board microstrip line are electrically connected, before gold wire bonding, need chip to be fixed in reserved chip pad, to guarantee fixing reliability and the earthing effect of chip.
Existing die chip technique for fixing mainly contains following several mode:
Conducting resinl barbola work:
Conducting resinl drops in reserved chip pad center, the die chip back side is placed on conducting resinl, by warm table, it is heated, in heating process, epoxy resin cure is fixed on base center by die chip, but this technology mode is limited by the quality of conducting resinl, use conducting resinl in the life-span, anti-oxidant degree, heat conduction, contact resistance aspect all has some limitations, cannot guarantee the use of product high reliability, and at present domesticly aspect conducting resinl R&D and production, comparatively lagging behind, use external conducting resinl expensive, in product large-scale production, be also unfavorable for cost control.
Tin cream welding procedure:
Soldering paste is spread upon to the die chip back side, and place it on the base of the reserved tube core of printed board, by warm table mode, it is heated, make it be fixed on base center, but which is because the higher temperature of needs is carried out heating and melting to tin cream, in actual process, produce and be not easy the position of keyholed back plate die chip, after tin cream fusing, chip is easily crooked, cannot guarantee follow-up gold wire bonding processing quality.
Adopt traditional handicraft mode, during as conducting resinl and the fixing micropackaging tube core of tin cream technique, often need product printed board and box body to continue entirety heating, for preventing the situations such as the printed board distortion that continuous heating causes, the conducting resinl and the tin cream fusing point that adopt often can be too not high yet, and this has directly restricted product and adopt in subsequent technique the use of higher scolder.
Summary of the invention
The present invention solves the fixing middle problem that may occur in conducting resinl and tin cream of using of traditional micropackaging die chip, reduce the resistance of chip and base, improve the service life of product, guarantee follow-up gold wire bonding processing quality, and the cost that reduces micropackaging tube core technique for fixing, provides a kind of soldering micropackaging tube core technique.
The present invention is by the following technical solutions:
Soldering micropackaging tube core technique, comprises the following steps:
Step 1: electric iron heating-up temperature is adjusted to 250 degree, with placing scolder in its place, micropackaging die chip fixed position reserved in radio frequency printed board;
Step 2: before solder cools, use tweezers to treat that fixing micropackaging pipe die chip is positioned on micropackaging die chip fixed position reserved in radio frequency printed board.
Step 3: by electric soldering bit wet foam wiping, hold electric soldering bit near micropackaging die chip for one, another holds the position of tweezers adjustment micropackaging die chip, and the time that electric soldering bit is contacted with micropackaging die chip is no more than 5 seconds, has welded rear naturally cooling.
Use the instruments such as temperature control electric soldering iron, scolder is melted, in micropackaging die chip and radio frequency printed board, reserved micropackaging die chip fixed position forms complete, integrative-structure reliably the most at last, be with traditional micropackaging die chip technique for fixing difference, scolding tin micropackaging technique has only been used solder stick and temperature control electric soldering iron and in conjunction with manual welding mode, micropackaging die chip has been fixed on micropackaging die chip fixed position reserved in radio frequency printed board.
Further technical scheme is, the size of the area that in described step 1, scolder infiltrates in radio frequency printed board and micropackaging die chip matches.
Further technical scheme is, uses the diameter of scolding tin for 0.3mm is to 0.8mm in described step 3 in welding process.
Further technical scheme is, the diameter of described scolding tin is 0.3mm.
Further technical scheme is, described electric iron is temp regulatable electric iron.
Compared with prior art, the invention has the beneficial effects as follows:
1, because this technique does not adopt traditional die chip fixed form, whole printed board substrate is not heated, and in 5s, can suitably improve welding temperature and the material of die chip scolder weld interval, the hidden danger of high temperature solder stick is used in the welding of less subsequent handling;
2, adopt the micropackaging tube core of soldering technique welding, die site can obtain location, position accurately, and because solder stick oxidation resistance is better compared with conducting resinl, can significantly improve the service life of product;
3, adopt after the fixing tube core of soldering technique, when improving product service life, oxidation resistance, raising tube core earthing effect, less resistive, effectively reduce Product Process cost, overcome the serious dependence to conducting resinl especially import conducting resinl.
The specific embodiment
Below in conjunction with the present invention is further elaborated.
A kind of soldering micropackaging tube core technique, comprises the following steps:
Step 1: electric iron is (preferred, described electric iron is temp regulatable electric iron) heating-up temperature is adjusted to 250 degree, with placing scolder (preferred, the size of the area that described scolder infiltrates in radio frequency printed board and micropackaging die chip matches) in its place, micropackaging die chip fixed position reserved in radio frequency printed board;
Step 2: before solder cools, use tweezers to treat that fixing micropackaging pipe die chip is positioned on micropackaging die chip fixed position reserved in radio frequency printed board.
Step 3: by electric soldering bit wet foam wiping, hold electric soldering bit near micropackaging die chip for one, another holds the position of tweezers adjustment micropackaging die chip, the time that electric soldering bit is contacted with micropackaging die chip is no more than 5 seconds, weld the hand of holding welded piece in rear naturally cooling (using the diameter of scolding tin in described welding process for 0.3mm is to 0.8mm) welding process, need to wear gloves and anti-electrostatic wrist ring.。
According to one embodiment of present invention, the diameter of described scolding tin is 0.3mm.
" embodiment ", " another embodiment ", " embodiment " that spoken of in this manual, etc., refer to specific features, structure or the feature in conjunction with this embodiment, described and be included at least one embodiment that the application's generality describes.In description, multiple local appearance statement of the same race is not necessarily to refer to same embodiment.Furthermore, while describing a specific features, structure or feature in conjunction with arbitrary embodiment, what advocate is in conjunction with other embodiment, to realize this feature, structure or feature also to fall within the scope of the invention.
Although invention is described with reference to multiple explanatory embodiment of the present invention here, but, should be appreciated that, those skilled in the art can design a lot of other modification and embodiments, and these are revised and within embodiment will drop on the disclosed principle scope and spirit of the application.More particularly, in the scope of the open claim of the application, can carry out multiple modification and improvement to the building block of subject combination layout and/or layout.Except modification that building block and/or layout are carried out with improving, to those skilled in the art, other purposes will be also obvious.
Claims (5)
1. a soldering micropackaging tube core technique, is characterized in that comprising the following steps:
Step 1: electric iron heating-up temperature is adjusted to 250 degree, with placing scolder in its place, micropackaging die chip fixed position reserved in radio frequency printed board;
Step 2: before solder cools, use tweezers to treat that fixing micropackaging pipe die chip is positioned on micropackaging die chip fixed position reserved in radio frequency printed board.
Step 3: by electric soldering bit wet foam wiping, hold electric soldering bit near micropackaging die chip for one, another holds the position of tweezers adjustment micropackaging die chip, and the time that electric soldering bit is contacted with micropackaging die chip is no more than 5 seconds, has welded rear naturally cooling.
2. soldering micropackaging tube core technique according to claim 1, is characterized in that: the size of the area that in described step 1, scolder infiltrates in radio frequency printed board and micropackaging die chip matches.
3. soldering micropackaging tube core technique according to claim 1, is characterized in that: in described step 3, in welding process, use the diameter of scolding tin for 0.3mm is to 0.8mm.
4. soldering micropackaging tube core technique according to claim 3, is characterized in that: the diameter of described scolding tin is 0.3mm.
5. soldering micropackaging tube core technique according to claim 1, is characterized in that: described electric iron is temp regulatable electric iron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310684582.5A CN103722260A (en) | 2013-12-12 | 2013-12-12 | Tin soldering micro-packaging process of dies |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310684582.5A CN103722260A (en) | 2013-12-12 | 2013-12-12 | Tin soldering micro-packaging process of dies |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103722260A true CN103722260A (en) | 2014-04-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201310684582.5A Pending CN103722260A (en) | 2013-12-12 | 2013-12-12 | Tin soldering micro-packaging process of dies |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270870A (en) * | 2016-08-31 | 2017-01-04 | 太仓市华盈电子材料有限公司 | A kind of Chip-R welding method |
| CN111283286A (en) * | 2020-03-09 | 2020-06-16 | 成都川美新技术股份有限公司 | Assembling method of two radio frequency connectors and electronic product |
| CN113795718A (en) * | 2019-05-10 | 2021-12-14 | 大金工业株式会社 | Heat exchanger, heat pump device, and method for manufacturing heat exchanger |
Citations (4)
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|---|---|---|---|---|
| JP2003288827A (en) * | 2002-03-27 | 2003-10-10 | Nec Schott Components Corp | Chip type temperature fuse and its mounting structure |
| JP2007044737A (en) * | 2005-08-11 | 2007-02-22 | Mitsubishi Electric Corp | Soldering iron device |
| CN101013675A (en) * | 2007-01-29 | 2007-08-08 | 南京时恒电子科技有限公司 | Method of spot welding for minitype sensor |
| CN103317203A (en) * | 2013-06-20 | 2013-09-25 | 成都九洲迪飞科技有限责任公司 | Welding technology for microwave substrate |
-
2013
- 2013-12-12 CN CN201310684582.5A patent/CN103722260A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003288827A (en) * | 2002-03-27 | 2003-10-10 | Nec Schott Components Corp | Chip type temperature fuse and its mounting structure |
| JP2007044737A (en) * | 2005-08-11 | 2007-02-22 | Mitsubishi Electric Corp | Soldering iron device |
| CN101013675A (en) * | 2007-01-29 | 2007-08-08 | 南京时恒电子科技有限公司 | Method of spot welding for minitype sensor |
| CN103317203A (en) * | 2013-06-20 | 2013-09-25 | 成都九洲迪飞科技有限责任公司 | Welding technology for microwave substrate |
Non-Patent Citations (2)
| Title |
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| 丁南菊: "表面贴装元件的手工焊接技巧", 《中国新技术新产品》, no. 18, 30 September 2011 (2011-09-30) * |
| 杜江淮: "电子手工焊接工艺及质量控制", 《安徽职业技术学院学报》, vol. 10, no. 03, 30 September 2011 (2011-09-30) * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270870A (en) * | 2016-08-31 | 2017-01-04 | 太仓市华盈电子材料有限公司 | A kind of Chip-R welding method |
| CN113795718A (en) * | 2019-05-10 | 2021-12-14 | 大金工业株式会社 | Heat exchanger, heat pump device, and method for manufacturing heat exchanger |
| CN111283286A (en) * | 2020-03-09 | 2020-06-16 | 成都川美新技术股份有限公司 | Assembling method of two radio frequency connectors and electronic product |
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Application publication date: 20140416 |