CN111283286A - Assembling method of two radio frequency connectors and electronic product - Google Patents
Assembling method of two radio frequency connectors and electronic product Download PDFInfo
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- CN111283286A CN111283286A CN202010158075.8A CN202010158075A CN111283286A CN 111283286 A CN111283286 A CN 111283286A CN 202010158075 A CN202010158075 A CN 202010158075A CN 111283286 A CN111283286 A CN 111283286A
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- wire section
- welding
- microstrip line
- soldering tin
- radio frequency
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The invention discloses an assembly method of two radio frequency connectors and an electronic product. The first radio frequency joint assembling method comprises the steps of obtaining a section of soldering tin wire; placing the soldering tin wire section on the microstrip line; welding the soldering tin wire section of the electric soldering iron; obtaining an enamelled wire section or a metal wire section; and respectively spot-welding and bonding two ends of the enameled wire section or the metal wire section on the end part of the guide pin and the micro-strip wire, and bending the spot-welded and bonded enameled wire section or metal wire section. The second radio frequency joint assembling method comprises the steps of obtaining an enameled wire section or a metal wire section made of non-gold wire materials; two ends of the enameled wire section or the metal wire section are respectively bonded on the ends of the leading pins of the microstrip line and the radio frequency connector in a spot welding mode, and the enameled wire section or the metal wire section after the spot welding bonding is bent; obtaining a section of soldering tin wire section; placing the soldering tin wire section on the micro-strip wire after the enamelled wire section or the metal wire section is subjected to spot welding bonding at two ends; and the electric soldering iron is used for soldering the placed soldering tin wire section. The radio frequency connector in the electronic product is assembled by adopting the method.
Description
Technical Field
The invention relates to the field of electronic products, in particular to an assembly method of two radio frequency connectors and an electronic product.
Background
Some electronic products have a radio frequency connector and a microstrip line, and in the production process of the electronic products, a gap between the microstrip line and a pin (the microstrip line is generally located on a substrate) of the radio frequency connector is inevitably larger (larger than a standard gap) due to tolerance. In the process of assembling the corresponding radio frequency connector, the conventional solution is to scrap and rework, fold and fold the lead pins in the radio frequency terminal or directly stack the pins by using soldering tin. Scrapping and rework inevitably cause cost increase and possibly even cause delay of construction period; the connection failure between the microstrip line and the pin of the radio frequency connector is easily caused by stress deformation in a mode of bending the pin in the radio frequency terminal or directly stacking the pin by using soldering tin.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide two assembling methods of a radio frequency connector and an electronic product, so as to reduce the cost increase caused by adopting scrapping rework treatment when the gap between a microstrip line and a lead pin of the radio frequency connector is larger, and simultaneously improve the problem of easy connection failure caused by adopting a folded lead pin or directly stacking the microstrip line and the lead pin by using soldering tin when the gap is larger.
In order to achieve the purpose of the invention, the invention adopts the technical scheme that:
provided is a method for assembling a radio frequency connector, which includes:
acquiring a section of soldering tin wire section, wherein the volume of the soldering tin wire section is 1.5-2 times of the welding volume, and the welding volume is equal to the projection area of a guide pin of the radio frequency connector on the microstrip line multiplied by the distance between the guide pin and the microstrip line;
placing the soldering tin wire section on the microstrip line, wherein the placed soldering tin wire section is parallel to the guide pin and is contacted with the guide pin;
after the temperature of the electric soldering iron is stabilized at the preset temperature, the placed soldering tin wire section is welded for 0.5-1.2 seconds; before welding, the electric soldering iron and the soldering tin wire section are respectively positioned at two sides of the lead needle, the area of a welding spot on the micro-strip line after welding is 1-1.5 times of the projection area of the lead needle on the micro-strip line, the preset temperature is equal to the melting point + a of the soldering tin wire section, and a belongs to [28, 32 ];
cleaning the welding position to obtain an enamelled wire section or a metal wire section, wherein the outer diameters of the enamelled wire section and the metal wire section are 0.2-0.6 times of the diameter of the guide pin;
and respectively bonding two ends of the enameled wire section or the metal wire section on the end part of the guide pin and the microstrip line in a spot welding manner, wherein a bonding point between the enameled wire section or the metal wire section and the microstrip line is close to and does not contact with a welding point on the microstrip line, and the enameled wire section or the metal wire section after spot welding bonding is bent.
Further, in order to ensure the spot welding quality, the spot welding parameters in spot welding bonding are as follows: pressure 7-13 g, time 6 ms-10 ms, voltage 7-10V.
Furthermore, in order to facilitate the spot welding and bonding of the enameled wire section or the metal wire section, one end of the enameled wire section or the metal wire section is spot welded and bonded on the end part of the guide pin, and then the other end of the enameled wire section or the metal wire section is spot welded and bonded on the microstrip line.
Furthermore, in order to avoid damaging the quality of the electronic product in the cleaning process, the welding position is cleaned by brushing or inserting.
In a second aspect, the present disclosure provides another method for assembling a radio frequency connector, including:
obtaining an enamelled wire section or a metal wire section made of non-gold wire materials, wherein the outer diameters of the enamelled wire section and the metal wire section are 0.2-0.6 times of the diameter of the guide needle;
the two ends of the enameled wire section or the metal wire section are respectively bonded on the ends of the leading pins of the microstrip line and the radio frequency connector in a spot welding mode, the bonding point between the enameled wire section or the metal wire section and the microstrip line is located outside and close to the projection of the leading pin on the microstrip line, and the enameled wire section or the metal wire section after spot welding bonding is bent;
obtaining a section of soldering tin wire section, wherein the volume of the soldering tin wire section is 1.5-2 times of the welding volume, and the welding volume is equal to the projection area of the lead needle on the microstrip line multiplied by the distance between the lead needle and the microstrip line;
placing the soldering tin wire section on the micro-strip wire after spot welding and bonding of the two ends of the enameled wire section or the metal wire section, wherein the placed soldering tin wire section is parallel to the guide pin and is in contact with the guide pin;
after the temperature of the electric soldering iron is stabilized at the preset temperature, welding the placed soldering tin wire section for 0.5-1.2 seconds, wherein the preset temperature is the melting point + a of the soldering tin wire section, a belongs to [28, 32], and before welding, the electric soldering iron and the soldering tin wire section are respectively positioned at two sides of the guide pin;
after welding, the soldering tin covers the enameled wire section or the bonding point on the metal wire section, and when the metal wire section is adopted, the soldering tin covers the part of the metal wire section except the bonding point;
after welding, the area of a welding spot on the microstrip line is 1-1.5 times of the projection area of the guide pin on the microstrip line;
and cleaning the welding position.
Further, in order to ensure the spot welding quality, the spot welding parameters in spot welding bonding are as follows: pressure 7-13 g, time 6 ms-10 ms, voltage 7-10V.
Furthermore, in order to facilitate the spot welding and bonding of the enameled wire section or the metal wire section, one end of the enameled wire section or the metal wire section is spot welded and bonded on the end part of the guide pin, and then the other end of the enameled wire section or the metal wire section is spot welded and bonded on the microstrip line.
Furthermore, in order to avoid damaging the quality of the electronic product in the cleaning process, the welding position is cleaned by adopting ultrasonic waves or inserting and cleaning the welding position under a microscope.
The method for inserting and washing the welding position under the microscope comprises the step of clamping a cotton ball by using tweezers to dip a cleaning agent for multiple times of scrubbing.
In a third aspect, the present disclosure further provides an electronic product, which has a radio frequency connector and a microstrip line, where the radio frequency connector is assembled by using the assembly method of the radio frequency connector provided in the present disclosure.
The invention has the beneficial effects that:
by adopting the assembly method of the radio frequency connector provided by the invention, when the gap between the microstrip line and the guide pin of the radio frequency connector is larger, scrapping and reworking are not needed, and the cost is saved.
By adopting the method provided by the invention, even if the soldering tin is cracked by high-temperature thermal expansion, the enameled wire section or the metal wire section conducts the microstrip line and the guide pin, and the enameled wire section or the metal wire section after spot welding bonding is bent, so that the connection stress can be resisted, the connection failure between the microstrip line and the guide pin caused by the fact that the enameled wire section or the metal wire section is broken by pulling is avoided, and the stability of an electronic product adopting the assembly method of the radio frequency connector is improved.
Drawings
Fig. 1 is a partial cross-sectional view of an electronic product in an embodiment.
Wherein, 1, enamelling line segments; 2. leading a needle; 3. a housing; 4. soldering tin; 5. a substrate; 6. a microstrip line.
Detailed Description
The following detailed description of the present invention will be provided in conjunction with the accompanying drawings to facilitate the understanding of the present invention by those skilled in the art. It should be understood that the embodiments described below are only some embodiments of the invention, and not all embodiments. All other embodiments obtained by a person skilled in the art without any inventive step, without departing from the spirit and scope of the present invention as defined and defined by the appended claims, fall within the scope of protection of the present invention.
The scheme provides an assembly method of a radio frequency connector, which comprises the following steps:
acquiring a section of soldering tin wire section, wherein the volume of the soldering tin wire section is 1.5-2 times of the welding volume, and the welding volume is equal to the projection area of a lead needle 2 of the radio frequency connector on a microstrip line 6 multiplied by the distance between the lead needle 2 and the microstrip line 6;
placing the soldering tin wire section on the microstrip line 6, wherein the placed soldering tin wire section is parallel to the guide pin 2 and is contacted with the guide pin 2 (because the diameter of the common soldering tin 4 wire is larger than the distance between the guide pin 2 and the microstrip line 6, the top of the soldering tin wire section can be contacted with the thimble certainly after the soldering tin wire section is placed in parallel);
after the temperature of the electric soldering iron is stabilized at the preset temperature, the placed soldering tin wire section is welded for 0.5-1.2 seconds; before welding, the electric soldering iron and the soldering tin wire section are respectively positioned at two sides of the lead needle 2 (namely the lower cutter side of the electric soldering iron and the soldering tin wire section are respectively positioned at two sides of the lead needle 2), the area of a welding spot on the microstrip line 6 after welding is 1-1.5 times of the projection area of the lead needle 2 on the microstrip line 6, and the preset temperature is equal to the melting point of the soldering tin wire section + a, and a belongs to [28, 32 ];
cleaning the welding position to obtain an enamelled wire section 1 or a metal wire section, wherein the outer diameters of the enamelled wire section 1 and the metal wire section are 0.2-0.6 times of the diameter of the guide pin 2;
and respectively carrying out spot welding and bonding on the end part of the lead needle 2 and the microstrip line 6 at two ends of the enameled wire section 1 or the metal wire section, wherein a bonding point between the enameled wire section 1 or the metal wire section and the microstrip line 6 is close to and does not contact with a welding point on the microstrip line 6 (at the moment, the bonding point between the enameled wire section 1 or the metal wire section and the microstrip line 6 is positioned on the end surface side of the end part of the lead needle 2), and the enameled wire section 1 or the metal wire section after spot welding and bonding is bent.
By adopting the method for welding the placed soldering tin wire sections, the stability of soldering tin and welding is ensured, and the influence on the performance of the electronic product caused by overlarge volume of a welding spot is avoided. By adopting the spot welding and bonding method for the enameled wire section 1 or the metal wire section, the stability of spot welding is ensured, and the influence on the performance of the electronic product caused by overlong enameled wire section 1 or the metal wire section is avoided.
In implementation, as shown in fig. 1, an enameled wire segment 1 is adopted in the scheme, a microstrip line 6 is located on a substrate 5, and the substrate 5 is located in a housing 3. Wherein, the spot welding parameters in the spot welding bonding are as follows: the pressure is 7-13 g (the spot welding bonding deformation parts of the enameled wire section 1 and the metal wire section are easy to break due to overlarge pressure, and poor contact is caused due to overlong pressure), the time is 6-10 ms (the spot welding strength is influenced due to overlong time, the end part of the enameled wire section 1 or the metal wire section is fragile and cannot bear stress due to overlong time), and the voltage is 7-10V (the spot welding strength is insufficient due to overlong voltage, and the overwelding condition is caused due to overhigh voltage).
In the spot welding bonding of the enameled wire section 1 or the metal wire section, one end of the enameled wire section 1 or the metal wire section is spot welded and bonded on the end part of the guide pin 2, and then the other end of the enameled wire section is spot welded and bonded on the microstrip line 6.
Wherein, the mode of cleaning the welding position is brushing or inserting cleaning.
In a second aspect, the present disclosure provides another method for assembling a radio frequency connector, including:
obtaining an enamelled wire section 1 or a metal wire section made of non-gold wire materials, wherein the outer diameters of the enamelled wire section 1 and the metal wire section are 0.2-0.6 times of the diameter of the guide needle 2;
the two ends of an enameled wire section 1 or a metal wire section are respectively bonded on the ends of a micro-strip line 6 and a guide pin 2 of a radio frequency connector in a spot welding mode, a bonding point between the enameled wire section 1 or the metal wire section and the micro-strip line 6 is located outside and close to the projection of the guide pin 2 on the micro-strip line 6, and the enameled wire section 1 or the metal wire section after spot welding bonding is bent;
obtaining a section of soldering tin wire section, wherein the volume of the soldering tin wire section is 1.5-2 times of the welding volume, and the welding volume is equal to the projection area of the lead needle 2 on the microstrip line 6 multiplied by the distance between the lead needle 2 and the microstrip line 6;
placing a soldering tin wire section on the microstrip line 6 after spot welding and bonding of the enameled wire section 1 or two ends of the metal wire section, wherein the placed soldering tin wire section is parallel to the guide pin 2 and is in contact with the guide pin 2;
after the temperature of the electric soldering iron is stabilized at the preset temperature, welding the placed soldering tin wire section for 0.5-1.2 seconds, wherein the preset temperature is the melting point + a of the soldering tin wire section, a belongs to [28, 32], and before welding, the electric soldering iron and the soldering tin wire section are respectively positioned at two sides of the guide pin 2;
after welding, the soldering tin 4 covers the enamelled wire section 1 or the bonding point on the metal wire section, when the metal wire section is adopted, the soldering tin 4 covers the part of the metal wire section except the bonding point (the outer surface of the enamelled wire section 1 is provided with an insulating layer, so that tin can not be melted, and a gap is formed between the enamelled wire section 1 at the middle section and the soldering tin 4, while the metal wire section which is not made of gold wire can be melted, so that the soldering tin 4 can completely cover the part of the metal wire section except the bonding point due to the tension effect, thereby avoiding the damage of the electronic product performance caused by the oxidation of the metal wire section);
after welding, the area of a welding spot on the microstrip line 6 is 1-1.5 times of the projection area of the lead needle 2 on the microstrip line 6;
and cleaning the welding position.
The reason for adopting the metal wire made of non-gold wire material in the scheme is as follows: if a gold wire is adopted, after spot welding bonding, the tin wire section is melted at high temperature, and the AUSN4 intermetallic compound is generated by the soldering tin 4 and the gold to cause the phenomenon of gold brittleness, so that the performance of the electronic product is seriously influenced. The metal wire can be made of copper wire, copper-plated silver wire, aluminum wire or alloy wire and the like.
During implementation, spot welding parameters in spot welding bonding in the scheme are as follows: the pressure is 7-13 g (the spot welding bonding deformation parts of the enameled wire section 1 and the metal wire section are easy to break due to overlarge pressure, and poor contact is caused due to overlong pressure), the time is 6-10 ms (the spot welding strength is influenced due to overlong time, the end part of the enameled wire section 1 or the metal wire section is fragile and cannot bear stress due to overlong time), and the voltage is 7-10V (the spot welding strength is insufficient due to overlong voltage, and the overwelding condition is caused due to overhigh voltage).
In the spot welding bonding of the enameled wire section 1 or the metal wire section, one end of the enameled wire section 1 or the metal wire section is spot welded and bonded on the end part of the guide pin 2, and then the other end of the enameled wire section is spot welded and bonded on the microstrip line 6.
The mode of cleaning the welding position is to clean the welding position by ultrasonic wave or insert-clean the welding position under a microscope. The method for inserting and washing the welding position under the microscope comprises the step of clamping a cotton ball by using tweezers to dip a cleaning agent for multiple times of scrubbing.
In a third aspect, the present disclosure further provides an electronic product, which has a radio frequency connector and a microstrip line 6, where the radio frequency connector is assembled by using the assembly method of the radio frequency connector provided in the present disclosure.
Claims (10)
1. A method of assembling a radio frequency connector, comprising:
obtaining a soldering tin wire section, wherein the volume of the soldering tin wire section is 1.5-2 times of the welding volume, and the welding volume is equal to the projection area of a lead needle (2) of the radio frequency connector on a microstrip line (6) multiplied by the distance between the lead needle (2) and the microstrip line (6);
placing the soldering tin wire section on the microstrip line (6), wherein the placed soldering tin wire section is parallel to the guide pin (2) and is in contact with the guide pin (2);
after the temperature of the electric soldering iron is stabilized at the preset temperature, the placed soldering tin wire section is welded for 0.5-1.2 seconds; before welding, the electric soldering iron and the soldering tin wire section are respectively positioned at two sides of the lead needle (2), the area of a welding spot on the microstrip line (6) after welding is 1-1.5 times of the projection area of the lead needle (2) on the microstrip line (6), the preset temperature is equal to the melting point of the soldering tin wire section + a, and a belongs to [28, 32 ];
cleaning a welding part, and then obtaining an enamelled wire section (1) or a metal wire section, wherein the outer diameters of the enamelled wire section (1) and the metal wire section are 0.2-0.6 times of the diameter of the guide pin (2);
and respectively carrying out spot welding and bonding on the two ends of the enameled wire section (1) or the metal wire section on the end part of the guide pin (2) and the microstrip line (6), wherein a bonding point between the enameled wire section (1) or the metal wire section and the microstrip line (6) is close to and does not contact with a welding spot on the microstrip line (6), and the enameled wire section (1) or the metal wire section after spot welding and bonding is bent.
2. The method for assembling a radio frequency connector according to claim 1, wherein the spot welding parameters in the spot welding bonding are as follows: pressure 7-13 g, time 6 ms-10 ms, voltage 7-10V.
3. The method for assembling a radio frequency connector according to claim 1, wherein one end of the enameled wire segment (1) or the wire segment is spot-welded to the end of the lead pin (2), and then the other end thereof is spot-welded to the microstrip line (6).
4. The method for assembling a radio frequency connector according to any one of claims 1 to 3, wherein the welding site is cleaned by brushing or brushing.
5. A method of assembling a radio frequency connector, comprising:
obtaining an enamelled wire section (1) or a metal wire section made of non-gold wire materials, wherein the outer diameters of the enamelled wire section (1) and the metal wire section are 0.2-0.6 times of the diameter of the guide needle (2);
the two ends of the enameled wire section (1) or the metal wire section are respectively bonded on the ends of the microstrip line (6) and the guide pin (2) of the radio frequency connector in a spot welding mode, the bonding point between the enameled wire section (1) or the metal wire section and the microstrip line (6) is located outside the projection of the guide pin (2) on the microstrip line (6) and close to the projection, and the enameled wire section (1) or the metal wire section after spot welding bonding is bent;
obtaining a soldering tin wire section, wherein the volume of the soldering tin wire section is 1.5-2 times of the welding volume, and the welding volume is equal to the projection area of the lead needle (2) on the microstrip line (6) multiplied by the distance between the lead needle (2) and the microstrip line (6);
placing the soldering tin wire section on the microstrip line (6) which is subjected to spot welding bonding at two ends of the enameled wire section (1) or the metal wire section, wherein the placed soldering tin wire section is parallel to the guide pin (2) and is in contact with the guide pin (2);
after the temperature of the electric soldering iron is stabilized at a preset temperature, welding the placed soldering tin wire section for 0.5-1.2 seconds, wherein the preset temperature is the melting point + a of the soldering tin wire section, and a belongs to [28, 32], and before welding, the electric soldering iron and the soldering tin wire section are respectively positioned at two sides of the guide pin (2);
after welding, the soldering tin (4) covers the enameled wire section (1) or the bonding point on the metal wire section, and when the metal wire section is adopted, the soldering tin (4) covers the part of the metal wire section except the bonding point;
the area of a welding spot on the microstrip line (6) after the welding is finished is 1-1.5 times of the projection area of the lead needle (2) on the microstrip line (6);
and cleaning the welding position.
6. The method for assembling a radio frequency connector according to claim 5, wherein the spot welding parameters in the spot welding bonding are as follows: pressure 7-13 g, time 6 ms-10 ms, voltage 7-10V.
7. A method for assembling a radio frequency connector according to claim 5, wherein one end of the enameled wire segment (1) or the wire segment is spot-welded to the end of the lead pin (2), and then the other end is spot-welded to the microstrip line (6).
8. The method for assembling a radio frequency connector according to any one of claims 5 to 7, wherein the welding site is cleaned by ultrasonically cleaning the welding site or by inserting and cleaning the welding site under a microscope.
9. The method of assembling an rf connector of claim 8, wherein the step of inserting and washing the weld under a microscope is performed by holding a cotton ball with tweezers and dipping the cotton ball in a cleaning solution for multiple scrubbing.
10. Electronic product having a radio frequency connection and a microstrip line (6), characterized in that the radio frequency connection is assembled using the method of assembling a radio frequency connection according to any of claims 1-9.
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| CN202010158075.8A CN111283286A (en) | 2020-03-09 | 2020-03-09 | Assembling method of two radio frequency connectors and electronic product |
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| CN202010158075.8A CN111283286A (en) | 2020-03-09 | 2020-03-09 | Assembling method of two radio frequency connectors and electronic product |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114083169A (en) * | 2021-12-13 | 2022-02-25 | 上海无线电设备研究所 | Flexible connection process method and tool for converting radio frequency coaxial to microstrip |
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