CN104320910A - Circuit board welding structure - Google Patents
Circuit board welding structure Download PDFInfo
- Publication number
- CN104320910A CN104320910A CN201410641755.XA CN201410641755A CN104320910A CN 104320910 A CN104320910 A CN 104320910A CN 201410641755 A CN201410641755 A CN 201410641755A CN 104320910 A CN104320910 A CN 104320910A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- welding
- solder
- circuit
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a circuit board welding structure. Welding holes are formed in a circuit board, an insulating layer is arranged on the surface of the circuit board, the welding holes form welding spots after welding is carried out, and a solder bridge lap joint is formed on the insulating layer and between welding holes which need to be communicated. The circuit board welding structure has the advantages that solder bridges are formed between the welding spots needing to be communicated through soldering so that bridging connection can be formed between the welding spots, even when cold solder joints exist on the welding spots, circuits between the welding holes can still be closed through the solder bridges, influences caused by cold solder joints on closing of the circuits are avoided, the quality of the circuit board product is guaranteed, it is guaranteed that the circuit board product is in normal use, the structure for realizing the functions is simple, and influences cannot be caused on other performance of the circuit board.
Description
Technical field
The present invention relates to a kind of Welding Structure of circuit board.
Background technology
Welding circuit board causes defect, wherein has following two kinds of situations: 1, the solderability of circuit board apertures affects welding quality.Circuit board apertures solderability is bad, will produce rosin joint defect, affects the parameter of element in circuit, causes multi-layer sheet components and parts and interior layer line conducting instability, causes whole circuit function to lose efficacy.2, the weld defect of warpage generation.Circuit board and components and parts produce warpage in welding process, produce the defect such as rosin joint, short circuit due to stress deformation.
Rosin joint can cause circuit working abnormal, occurs in-and-out wild effect, and noise increases and do not have regularity, brings major hidden danger to the debugging of circuit, operation and maintenance.In addition, also some faulty soldered joint is within one period of long period that circuit is started working, and keeps in touch fair, is therefore not easy to find.But under the effect of the environmental conditions such as temperature, humidity and vibration, contact becomes not exclusively at leisure.The contact resistance of faulty soldered joint can cause local pyrexia, and local temperature raises impels again the solder joint situation of not exclusively contact to worsen further, finally even makes solder joint come off, the complete cisco unity malfunction of circuit.This process is one, two year sometimes.
Numeral shows according to statistics, in electronic system product fault, has half nearly to cause due to failure welding, but will find out from the electronic equipment of thousands of solder joints and cause the faulty soldered joint of fault, this is not a nothing the matter.So rosin joint is a large hidden danger of circuit reliability, must strictly avoid.When carrying out manual welding operation, especially to be noted.
Summary of the invention
Goal of the invention: for the problems referred to above, the object of this invention is to provide a kind of Welding Structure that rosin joint can be avoided to affect, and ensures the serviceability of circuit board.
Technical scheme: a kind of welding circuit board structure, circuit board has welding hole, the surface of circuit board is insulating barrier, forms solder joint after described welding hole welding, and forms weldering bridge overlap joint between the described welding hole of conducting to needing on described insulating barrier.
Layers of copper around described welding hole is coated with tin layers, plays the effect helping weldering.
Described weldering bridge shape is trapezoidal or U-shaped.
Beneficial effect: compared with prior art, advantage of the present invention formed weldering bridge again by soldering before needing the solder joint of conducting, being formed between butt welding point puts up a bridge connects, even if there is rosin joint at solder joint place, still by the circuit between weldering bridge conducting welding hole, the impact that rosin joint produces circuit turn-on can be avoided, ensure circuit board product quality and normally use, the structure realizing this function is simple, and can not have an impact to other performance of circuit board.
Accompanying drawing explanation
Fig. 1 is front view before welding circuit board;
Fig. 2 is front view after welding circuit board;
Fig. 3 is the A-A cutaway view of Fig. 2.
Embodiment
Below in conjunction with the drawings and specific embodiments, illustrate the present invention further, these embodiments should be understood only be not used in for illustration of the present invention and limit the scope of the invention, after having read the present invention, the amendment of those skilled in the art to the various equivalent form of value of the present invention has all fallen within the application's claims limited range.
As shown in Figure 1, circuit board has some welding holes 1, the layers of copper around welding hole 1 is coated with tin layers 5, when butt welding eyelet welding connects, this tin layers plays the effect helping weldering, and the surface of circuit board is insulating barrier 2.
As shown in accompanying drawing 2,3, when circuit board is welded, welding hole 1 is inserted in the end of wire, welding formation solder joint 3 is carried out to it, the interior layer line 6 conducting now in wire and wiring board.
Simultaneously between the solder joint needing conducting, side forms weldering bridge 4 by soldering on the insulating layer, thus overlaps between solder joint.The shape of weldering bridge can be show in Fig. 3 trapezoidal, also can be the shapes such as U-shaped.
Like this, between the solder joint needing conducting, be by the inside cord turning circuit in circuit board on the one hand, turning circuit can also be formed on the other hand by weldering bridge, even if when solder joint rosin joint, still by the circuit turn-on between weldering bridge guarantee solder joint, circuit board can be made by the impact of rosin joint.
Claims (3)
1. a welding circuit board structure, circuit board has welding hole (1), the surface of circuit board is insulating barrier (2), it is characterized in that: after described welding hole (1) welding, form solder joint (3), and form weldering bridge (4) overlap joint to needing between the described welding hole (1) of conducting on described insulating barrier (2).
2. a kind of welding circuit board structure according to claim 1, is characterized in that: described welding hole (1) layers of copper is around coated with tin layers.
3. a kind of welding circuit board structure according to claim 1, is characterized in that: described weldering bridge (4) shape is trapezoidal or U-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410641755.XA CN104320910A (en) | 2014-11-13 | 2014-11-13 | Circuit board welding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410641755.XA CN104320910A (en) | 2014-11-13 | 2014-11-13 | Circuit board welding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104320910A true CN104320910A (en) | 2015-01-28 |
Family
ID=52376053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410641755.XA Pending CN104320910A (en) | 2014-11-13 | 2014-11-13 | Circuit board welding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104320910A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111283286A (en) * | 2020-03-09 | 2020-06-16 | 成都川美新技术股份有限公司 | Assembling method of two radio frequency connectors and electronic product |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201682689U (en) * | 2010-05-19 | 2010-12-22 | 曾强 | Circuit board |
| US20120295454A1 (en) * | 2010-02-01 | 2012-11-22 | Huawei Device Co., Ltd. | Printed circuit board assembly chip package component and soldering component |
| CN203279346U (en) * | 2013-05-17 | 2013-11-06 | 浙江东华电器股份有限公司 | False welding prevention single-sided circuit board |
| CN204157163U (en) * | 2014-11-13 | 2015-02-11 | 镇江市中协电气有限公司 | A kind of welding circuit board structure |
-
2014
- 2014-11-13 CN CN201410641755.XA patent/CN104320910A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120295454A1 (en) * | 2010-02-01 | 2012-11-22 | Huawei Device Co., Ltd. | Printed circuit board assembly chip package component and soldering component |
| CN201682689U (en) * | 2010-05-19 | 2010-12-22 | 曾强 | Circuit board |
| CN203279346U (en) * | 2013-05-17 | 2013-11-06 | 浙江东华电器股份有限公司 | False welding prevention single-sided circuit board |
| CN204157163U (en) * | 2014-11-13 | 2015-02-11 | 镇江市中协电气有限公司 | A kind of welding circuit board structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111283286A (en) * | 2020-03-09 | 2020-06-16 | 成都川美新技术股份有限公司 | Assembling method of two radio frequency connectors and electronic product |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8338715B2 (en) | PCB with soldering pad projections forming fillet solder joints and method of production thereof | |
| EP2555602A4 (en) | Multilayer wiring board and method for manufacturing multilayer wiring board | |
| JP4105148B2 (en) | Printed board | |
| JP4752367B2 (en) | Multilayer wiring board | |
| TW201343008A (en) | Printed circuit board structure | |
| CN204157163U (en) | A kind of welding circuit board structure | |
| JP4880360B2 (en) | Printed wiring board | |
| CN104320910A (en) | Circuit board welding structure | |
| CN108668435A (en) | A kind of circuit-board connecting structure | |
| TWI592071B (en) | Multilayer circuit board | |
| CN108282957A (en) | The production method and mobile terminal of a kind of printed circuit board, printed circuit board | |
| JP2008198814A (en) | Structure of mounting erected circuit board | |
| CN203596975U (en) | PCB with PIN connecting pin | |
| JP5908508B2 (en) | Printed board | |
| JP2012142226A (en) | Relay board for transmission connector | |
| CN203279346U (en) | False welding prevention single-sided circuit board | |
| JP2016163020A (en) | Board connection structure | |
| CN205793605U (en) | A kind of printed wiring board component | |
| CN100411498C (en) | Assembly of FPC and PCB | |
| JP2010087145A (en) | Electronic component mounting substrate | |
| JP2014165235A (en) | Circuit board and coupling structure | |
| TW201611675A (en) | Improved method for structure of circuit board | |
| CN102026477A (en) | Printed circuit board | |
| CN203896589U (en) | Electronic igniter and circuit board thereof | |
| JP2008103547A (en) | Solder paste applying method, and electronic circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 212000 Zhenjiang City, Jiangsu province Runzhou Industrial Park North of sericulture Applicant after: The Jiangsu automatically controlled Science and Technology Ltd. of triumphant moral Address before: 212000 Zhenjiang City, Jiangsu province Runzhou district on the west side of the bridge on the south side of the house with Intercity Railway Applicant before: Zhong Xie Electric Applicance Co., Ltd of Zhengjiang City |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: ZHENJIANG ZHONGXIE ELECTRIC CO., LTD. TO: JIANGSU KAIDE ELECTRONIC CONTROL TECHNOLOGY CO., LTD. |
|
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150128 |
|
| WD01 | Invention patent application deemed withdrawn after publication |