CN106077880A - Soldering wires winding displacement frock and winding displacement technique - Google Patents
Soldering wires winding displacement frock and winding displacement technique Download PDFInfo
- Publication number
- CN106077880A CN106077880A CN201610542559.6A CN201610542559A CN106077880A CN 106077880 A CN106077880 A CN 106077880A CN 201610542559 A CN201610542559 A CN 201610542559A CN 106077880 A CN106077880 A CN 106077880A
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- wire
- winding displacement
- frock
- technique
- base plate
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Wire Processing (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The invention discloses soldering wires winding displacement frock and winding displacement technique, frock includes base plate, high temperature gummed tape, paper tape and alignment frock, base plate is strip structure, and its width is provided with some parallel wire casings, and the degree of depth of each wire casing is to place both threads material as standard；Alignment frock is located at the two ends of the wire casing of base plate, the wire rod after the bonding firmly alignment of high temperature gummed tape, and it is first-class to be welded that the wire rod being bonded on high temperature gummed tape is transferred to paper tape.Use the soldering wires winding displacement technique of above-mentioned frock, at least include that wire rod inserts the wire casing technique of base plate, alignment wire craft, transfer wire craft and interposer chip head technique.The soldering wires of the present invention winding displacement frock and winding displacement technique, simple to operate, the highest to the post skill set requirements of employee, and its efficiency is more than the twice that traditional-handwork welds one by one, reduce cost, shorten date of delivery and promote quality, lay a good foundation for the operation after winding displacement, the such as welding of whole frame, encapsulating, semi-automatic measuring.
Description
Technical field
The present invention relates to chip and soldering wires Technology field, particularly relate to soldering wires winding displacement frock and row
Wiring technology.
Background technology
Existing chip is complex with the welding procedure engineering of wire rod, and employee is difficult to grasp, and new employee's left-hand seat needs training
Instruction can be only achieved the prescription of new technology welding for 4-6 month, but efficiency but can only achieve the half of old employee.Additionally, core
Sheet head welds upward, and the head of chip, afterbody are particularly easy to produce viscous stannum phenomenon, because wire rod afterbody is by two root bark wire bondings
Rear discovery is glued stannum phenomenon and is difficult to check, quality hidden danger is bigger.
Summary of the invention
In order to overcome above-mentioned the deficiencies in the prior art, the invention provides soldering wires winding displacement frock and winding displacement technique,
Its object is to the time before shortening chip and soldering wires, ensure to be not likely to produce viscous stannum when chip and soldering wires simultaneously
Phenomenon, and ensure that it has preferable quality when welding.
The technical solution adopted in the present invention is: soldering wires winding displacement frock, including base plate, high temperature gummed tape, paper tape and
Alignment frock, base plate is strip structure, and its width is provided with some parallel wire casings, and the degree of depth of each wire casing is to put
Putting both threads material is standard；Alignment frock is located at the two ends of the wire casing of base plate, the wire rod after the bonding firmly alignment of high temperature gummed tape, and
The wire rod being bonded on high temperature gummed tape is transferred to paper tape first-class to be welded.
Further, the upper end of base plate is additionally provided with fixed part, and fixed part is additionally provided with fixed structure or connecting hole.
Further, base plate is also arranged above bus cable device, and bus cable device is by floating for the wire rod wire casing on base plate.
Further, the both threads material that in wire casing, placement is vertically arranged under the overlay, or place two of horizontal alignment arrangement
Wire rod.
Use the soldering wires winding displacement technique of above-mentioned frock, at least include following four processing step: wire rod inserts base plate
Wire casing technique, alignment wire craft, transfer wire craft and interposer chip head technique,
The first step, wire rod inserts the wire casing technique of base plate, and is smeared by each wire rod in the wire casing of correspondence, until each
A both threads material is placed in wire casing；
Second step, align wire craft, after the first step completes, uses alignment frock by the head end of the wire rod in wire casing and tail end
Align respectively；
3rd step, shifts wire craft, is bonded in above the wire casing of base plate with high temperature gummed tape, it is ensured that wire rod is all bonded in high-temp glue
After on band, high temperature gummed tape is attached to together with wire rod on the paper tape in chip head docking station；
4th step, interposer chip head technique, chip head is plugged into the end of wire rod, forms wire rod bar.
Further, the 5th step, prepare welding, after described step 4 completes, by the chip head portion of wire rod bar upward
Being placed in aluminum frame, after treating that aluminum frame is filled, whole frame dipping scaling powder prepares welding.
Further, after step 5 completes, the chip head of whole wire material bar is welded towards the whole welding rod of lower placement
Connect.
Further, after step 4 completes, before carrying out step 5, adjacent both threads material head is carried out bent angle work
Skill, i.e. uses bent angle frock that two adjacent wire head bendings become interior eight words or toed-out type structure, thus reaches to receive
The intermediate distance of stringing material, it is ensured that chip does not falls out after inserting.
Further, after step 6 completes, welding rod is encapsulated and semi-automatic measuring successively.
Further, winding displacement technique is suitable for the chip product use that length of wires is 35-120mm.
Compared with prior art, the invention has the beneficial effects as follows: the soldering wires winding displacement frock of the present invention and winding displacement work
Skill, simple to operate, the highest to the post skill set requirements of employee, easy left-hand seat, and its efficiency be that traditional-handwork welds one by one two
More than Bei.During because of welding, chip head, towards the whole welding rod of lower placement, can fundamentally reduce or reduce the generation of viscous stannum product,
Even if there being stannum to be bonded on the chip head of whole piece, the most easily finding and checking.Improve chip and soldering wires efficiency and
Welding quality, reduces cost, shortening date of delivery and promotes quality, for the operation after winding displacement, such as the welding of whole frame, encapsulates, the most certainly
Dynamic measurement is laid a good foundation, and has preferable use value.
Accompanying drawing explanation
Fig. 1 is the structural representation of an embodiment of soldering wires winding displacement frock；
Fig. 2 is the top view of the embodiment base plate 1 of Fig. 1；
Fig. 3 is that the embodiment of Fig. 1 is using high temperature gummed tape 2 to be transferred on paper tape 3, and plugs weldering when chip head equipment welds
Connect SBR figure；
Fig. 4 be the embodiment of Fig. 2 A to the direction view of embodiment of single line of wire arrangement；
Fig. 5 be the embodiment of Fig. 2 A to the direction view of embodiment of double line of wire arrangement；
Fig. 6 is the bending structure schematic diagram using bent angle frock that two adjacent wire head bendings become interior eight words；
Fig. 7 is the chip structure schematic diagram obtained after the bending of Fig. 6；
Wherein: 1-base plate, 11-wire casing, 12-fixed part, 121-fixed structure or connecting hole；2-high temperature gummed tape, 3-paper tape, 4-
Alignment frock, 5-wire rod, 6-bus cable device, 7-chip head, 8-bent angle frock.
Detailed description of the invention
In order to deepen the understanding of the present invention, the present invention is further described with embodiment below in conjunction with the accompanying drawings, this enforcement
Example is only used for explaining the present invention, does not constitute protection scope of the present invention and limits.
As depicted in figs. 1 and 2, soldering wires winding displacement frock, including base plate 1, high temperature gummed tape 2, paper tape 3 and alignment frock
4, base plate 1 is strip structure, and its width is provided with some parallel wire casings 11, and the degree of depth of each wire casing 11 is to place
Both threads material 5 is standard；Alignment frock 4 is located at the two ends of the wire casing 11 of base plate 1, the wire rod after the bonding firmly alignment of high temperature gummed tape 2
5, and it is first-class to be welded that the wire rod 5 being bonded on high temperature gummed tape 2 is transferred to paper tape 3.
In the above-described embodiments, the upper end of base plate 1 is additionally provided with fixed part 12, fixed part 12 is additionally provided with fixed structure or
Connecting hole 121.Base plate 1 is also arranged above bus cable device 6, bus cable device 6 by floating for wire rod 5 wire casing 11 on base plate 1, as
Shown in Fig. 2, Fig. 4 and Fig. 5, the both threads material that in wire casing 11, placement is vertically arranged under the overlay, i.e. adapt to single Wiring technology, see Fig. 4,
Or place the both threads material of horizontal alignment arrangement, i.e. adapt to double Wiring technology, see Fig. 5.
Use the soldering wires winding displacement technique of above-mentioned frock, at least include following four processing step: wire rod inserts base plate
Wire casing technique, alignment wire craft, transfer wire craft and lock pin head 7 technique,
The first step, wire rod inserts the wire casing technique of base plate, and is smeared by each wire rod in the wire casing of correspondence, until each
A both threads material is placed in wire casing；
Second step, align wire craft, after the first step completes, uses alignment frock by the head end of the wire rod in wire casing and tail end
Align respectively；
3rd step, shifts wire craft, is bonded in above the wire casing of base plate with high temperature gummed tape, it is ensured that wire rod is all bonded in high-temp glue
After on band, high temperature gummed tape is attached to together with wire rod on the paper tape in chip head docking station；
4th step, interposer chip head technique, chip head is plugged into the end of wire rod, forms wire rod bar, shown in Figure 3.
The most above-mentioned technique can also include, the 5th step, prepares welding, after described step 4 completes, by the core of wire rod bar
Head head is placed in aluminum frame upward, and after treating that aluminum frame is filled, whole frame dipping scaling powder prepares welding.Step 5 completes
After, the chip head of whole wire material bar is welded towards the whole welding rod of lower placement.As shown in Figure 6, after step 4 completes,
Before carrying out step 5, adjacent both threads material head is carried out bent angle technique, i.e. use bent angle frock 8 by two adjacent lines
Material head bending becomes interior eight words or toed-out type structure, as it is shown in fig. 7, thus reach to tighten up the intermediate distance of wire rod, it is ensured that
Chip does not falls out after inserting.After step 6 completes, welding rod is encapsulated and semi-automatic measuring successively.
Finally, winding displacement technique is suitable for when the chip product that length of wires is 35-120mm welds or the time of assembling uses, line
Material specification is that the wire rod of No. 26-32 has more preferable using effect.
The soldering wires of the present invention winding displacement frock and winding displacement technique, simple to operate, to the post skill set requirements of employee not
Height, easy left-hand seat, and its efficiency are more than the twices that traditional-handwork welds one by one.During because of welding, chip head is towards lower placement
Whole welding rod, can fundamentally reduce or reduce the generation of viscous stannum product, even if there being stannum to be bonded on the chip head of whole piece, the most easily
Find and check.Improve chip and the efficiency of soldering wires and welding quality, reduce cost, shorten date of delivery and lifting
Quality, has preferable use value.
What embodiments of the invention were announced is preferred embodiment, but is not limited thereto, the ordinary skill people of this area
Member, easily according to above-described embodiment, understands the spirit of the present invention, and makes different amplifications and change, but as long as without departing from this
The spirit of invention, the most within the scope of the present invention.
Claims (10)
1. soldering wires winding displacement frock, it is characterised in that: include base plate (1), high temperature gummed tape (2), paper tape (3) and alignment frock
(4), described base plate (1) is strip structure, and its width is provided with some parallel wire casings (11), each described wire casing
(11) the degree of depth is to place both threads material (5) as standard；Described alignment frock (4) is located at the two ends of the wire casing (11) of base plate (1),
Wire rod (5) after the bonding firmly alignment of described high temperature gummed tape (2), and the wire rod (5) being bonded on high temperature gummed tape (2) is transferred to
Paper tape (3) is first-class to be welded.
Soldering wires winding displacement frock the most according to claim 1, it is characterised in that: the upper end of described base plate (1) also sets
There is fixed part (12), described fixed part (12) is additionally provided with fixed structure or connecting hole (121).
Soldering wires winding displacement frock the most according to claim 2, it is characterised in that: described base plate (1) is also arranged above
Bus cable device (6), described bus cable device (6) is by floating for wire rod (5) wire casing (11) on base plate (1).
Soldering wires winding displacement frock the most according to claim 3, it is characterised in that: place vertical in described wire casing (11)
The both threads material being arranged under the overlay, or place the both threads material of horizontal alignment arrangement.
5. the soldering wires winding displacement technique described in claim 1-4 any one, it is characterised in that: at least include following four work
Skill step: wire rod inserts the wire casing technique of base plate, alignment wire craft, transfer wire craft and interposer chip head technique,
The first step, wire rod inserts the wire casing technique of base plate, and is smeared by each wire rod in the wire casing of correspondence, until each
A both threads material is placed in wire casing；
Second step, align wire craft, after the first step completes, uses alignment frock by the head end of the wire rod in wire casing and tail end
Align respectively；
3rd step, shifts wire craft, is bonded in above the wire casing of base plate with high temperature gummed tape, it is ensured that wire rod is all bonded in high-temp glue
After on band, high temperature gummed tape is attached to together with wire rod on the paper tape in chip head docking station；
4th step, interposer chip head technique, chip head is plugged into the end of wire rod, forms wire rod bar.
Soldering wires winding displacement technique the most according to claim 5, it is characterised in that: the 5th step, prepare welding, described step
After four complete, the chip head portion of wire rod bar is placed in aluminum frame upward, after treating that aluminum frame is filled, whole frame dipping scaling powder
Prepare welding.
Soldering wires winding displacement technique the most according to claim 6, it is characterised in that: step 6, after step 5 completes, by whole
The chip head of wire material bar welds towards lower placement whole stannum pot.
Soldering wires winding displacement technique the most according to claim 7, it is characterised in that: described winding displacement technique is suitable for length of wires
Chip product for 35-120mm uses.
Soldering wires winding displacement technique the most according to claim 6, it is characterised in that: after step 4 completes, carrying out step
Before five, adjacent both threads material head is carried out bent angle technique, i.e. use bent angle frock to be bent into by two adjacent wire heads
For interior eight words or toed-out type structure.
Soldering wires winding displacement technique the most according to claim 7, it is characterised in that: after step 6 completes, welding rod is depended on
Secondary carrying out is encapsulated and semi-automatic measuring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610542559.6A CN106077880B (en) | 2016-07-12 | 2016-07-12 | Soldering wires winding displacement tooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610542559.6A CN106077880B (en) | 2016-07-12 | 2016-07-12 | Soldering wires winding displacement tooling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106077880A true CN106077880A (en) | 2016-11-09 |
| CN106077880B CN106077880B (en) | 2019-06-25 |
Family
ID=57219786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610542559.6A Active CN106077880B (en) | 2016-07-12 | 2016-07-12 | Soldering wires winding displacement tooling |
Country Status (1)
| Country | Link |
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| CN (1) | CN106077880B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108422059A (en) * | 2018-03-02 | 2018-08-21 | 河北中瓷电子科技有限公司 | A kind of package casing soldering mold and method for welding |
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| JPH07201523A (en) * | 1993-12-28 | 1995-08-04 | Matsushita Electric Ind Co Ltd | High temperature thermistor temperature sensor |
| CN101013675A (en) * | 2007-01-29 | 2007-08-08 | 南京时恒电子科技有限公司 | Method of spot welding for minitype sensor |
| CN103084689A (en) * | 2013-01-02 | 2013-05-08 | 青岛海润电子有限公司 | Sensor wire welding process in refrigerator foaming solidification status |
| CN103794299A (en) * | 2014-01-28 | 2014-05-14 | 南京时恒电子科技有限公司 | Semi-automatic wire arrangement device and wire arrangement method |
| CN203973124U (en) * | 2014-07-31 | 2014-12-03 | 国家电网公司 | Ground connection base wire bonds mould |
| CN204030237U (en) * | 2014-07-31 | 2014-12-17 | 江苏莫仕天安连接器有限公司 | A kind of cable assembly welding winding displacement tool |
| CN104501988A (en) * | 2014-12-16 | 2015-04-08 | 南京时恒电子科技有限公司 | Wide-temperature-region high-accuracy NTC (Negative Temperature Coefficient) temperature sensor and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108422059A (en) * | 2018-03-02 | 2018-08-21 | 河北中瓷电子科技有限公司 | A kind of package casing soldering mold and method for welding |
| CN108422059B (en) * | 2018-03-02 | 2020-11-06 | 河北中瓷电子科技股份有限公司 | Brazing die and brazing method for packaging shell |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106077880B (en) | 2019-06-25 |
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Inventor after: Li Xunhong Inventor after: Wang Xueting Inventor before: Li Xunhong |
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