CN104191063A - Improved welding mold for welding semiconductor power module - Google Patents
Improved welding mold for welding semiconductor power module Download PDFInfo
- Publication number
- CN104191063A CN104191063A CN201410439434.1A CN201410439434A CN104191063A CN 104191063 A CN104191063 A CN 104191063A CN 201410439434 A CN201410439434 A CN 201410439434A CN 104191063 A CN104191063 A CN 104191063A
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- CN
- China
- Prior art keywords
- welding
- gap bridge
- spring
- pressing plate
- pressed
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/06—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for positioning the molten material, e.g. confining it to a desired area
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Die Bonding (AREA)
- Resistance Welding (AREA)
Abstract
The invention discloses an improved welding mold for welding a semiconductor power module and belongs to the field of tools and molds for manufacturing semiconductor power devices. The welding mold is obtained through improvement of an original welding mold, stand columns are vertically fixed to the two ends or the periphery of a lengthened welding mold base, the lower end of each stand column is sleeved with an upper backing ring, the upper end of each backing ring is sequentially sleeved with a lower pressing plate, a lower spring, an upper pressing plate and an upper spring, the other end of each upper pressing plate and the other end of each lower pressing plate press an electrode positioning plate and a chip positioning sheet respectively, and an adjusting nut is screwed onto the upper end of each stand column to adjust the pressure of the corresponding upper spring and the corresponding lower spring; each module electrode and each welding mold positioning stand column are sleeved with the electrode positioning plate, a gap bridge compression bar which can move up and down and is provided with a gap bridge compression spring is placed over each gap bridge, and each gap bridge compression bar is guided through a gap bridge compression bar guiding pipe. The welding mold is simple in structural design, practical, small in part number, low in cost increase, convenient to use, and capable of preventing deviation of the gap bridges when solder melts during welding, guaranteeing welding quality and improving the rate of finished products.
Description
Technical field
The invention belongs to the tool and mould scope of making semiconductor power device, particularly a kind of weldering mould of improved welding semi-conductor power module.A kind of mould that can be applicable to the automatic welding device of semi-conductor power module batch production specifically.
Background technology
Existing semiconductor power device weld mold as shown in Figure 1 mainly by weldering mould base 1, module copper soleplate 2, ceramics spacer 3, chip positioning sheet 4, weldering mould positioning vertical column 5 and electrode location-plate 6 form; During due to melts soldering tin, mobility is very large, and the floating gap bridge resting on chip is easy to slide and is partially welded, and is only suitable for small lot batch manufacture.While using automatic welding chain-conveyer furnace or box soldering furnace when batch production, because slight vibrations make to pass a bridge, be partially welded, cause in batch and scrap.
Summary of the invention
The object of the invention is to propose a kind of weldering mould of improved welding semi-conductor power module, it is characterized in that, on the basis of original weldering mould, improve, weldering mould base 1 two ends or the vertical fixing column 9 of periphery in lengthening, first put gasket ring 16 in the lower end of every root post 9, gasket ring 16 upper ends cover lower platens 10, lower spring 13 is being pressed lower platen 10, top board 11 is being pressed lower spring 13, and top board 11 is being pressed upper spring 12 above, and adjusting nut 17 is screwed in the upper end of every root post 9; Regulate the pressure of upper and lower spring; The other end of upper and lower pressing plate is being pressed respectively electrode location-plate 6 and chip positioning sheet 4; In electrode location-plate 6 middle parts of original weldering mould, over against 8 tops of passing a bridge, respectively there is the gap bridge depression bar 15 of a band gap bridge stage clip 14 movable up and down, and on electrode location-plate 6, weld gap bridge depression bar guide pipe 18; In when welding, with the gap bridge depression bar 15 of gap bridge stage clip 14, be pressed in and pass a bridge on 8, prevent the sideslip of passing a bridge when melts soldering tin, guaranteed welding quality, improved yield rate.
The vertical fixing column of described weldering mould base two ends or periphery must be to be arranged symmetrically with.
Described upper and lower pressing plate is rotatable on spring column, facilitates mould loading, unloading.
Beneficial effect of the present invention is this weldering mode structure simplicity of design, practicality, and number of parts and cost increase are seldom, easy to use, prevents the sideslip of passing a bridge when melts soldering tin, has guaranteed welding quality, has improved yield rate.
Accompanying drawing explanation
Fig. 1 is former weldering mode structure schematic diagram.
Fig. 2 is improved weldering mode structure schematic diagram.
The specific embodiment
The present invention proposes a kind of weldering mould of improved welding semi-conductor power module.Below in conjunction with accompanying drawing, be explained.
Figure 2 shows that improved weldering mode structure schematic diagram.At weldering mould base 1 two ends or the vertical vertical columns 9 of periphery that lengthen, this column must be to be arranged symmetrically with; Lower end at every root post 9 first puts gasket ring 16, gasket ring 16 upper end cover lower platens 10, and lower spring 13 is being pressed lower platen 10, and top board 11 is being pressed lower spring 13, and top board 11 is being pressed upper spring 12 above, and adjusting nut 17 is screwed in the upper end of every root post 9; Regulate the pressure of upper and lower spring; The other end of upper and lower pressing plate is being pressed respectively electrode location-plate 6 and chip positioning sheet 4, and on electrode location-plate 6, welds gap bridge depression bar guide pipe 18; Described upper and lower pressing plate is rotatable on column 9, facilitates mould loading, unloading.
Weldering mould base 1 middle part lengthening, the weldering mould positioning vertical column 5 of vertical fixing original weldering mould, module copper soleplate 2, ceramics spacer 3 are enclosed within on weldering mould positioning vertical column 5 successively, chip positioning sheet 4 is placed on ceramics spacer 3, module electrodes 7, gap bridge 8 are according to semi-conductor power module Standard, and module electrodes 7,8 relative positions of passing a bridge are fixed by chip positioning sheet 4; Electrode location-plate 6 entangles each module electrodes 7 and weldering mould positioning vertical column 5, over against 8 tops of passing a bridge, respectively place the gap bridge depression bar 15 of a band gap bridge stage clip 14 movable up and down, gap bridge depression bar 15 is by gap bridge depression bar guide pipe 18 guiding, when welding, gap bridge depression bar 15 with gap bridge stage clip 14 is pressed on gap bridge 8, prevent the sideslip of passing a bridge when melts soldering tin, guaranteed welding quality, improved yield rate.
Claims (3)
1. the weldering mould of an improved welding semi-conductor power module, it is characterized in that, on the basis of original weldering mould, improve, weldering mould base (1) two ends or the vertical fixing column (9) of periphery in lengthening, in the lower end of every root post (9), first put gasket ring (16), gasket ring (16) upper end cover lower platen (10), lower spring (13) is being pressed lower platen (10), top board (11) is being pressed lower spring (13), top board (11) is being pressed upper spring (12) above, and adjusting nut (17) is screwed in the upper end of every root post (9); Regulate the pressure of upper and lower spring; The other end of upper and lower pressing plate is being pressed respectively electrode location-plate (6) and chip positioning sheet (4); In electrode location-plate (6) middle part of original weldering mould, over against (8) top of passing a bridge, respectively there is the gap bridge depression bar (15) of a band gap bridge stage clip movable up and down (14), and at the upper welding of electrode location-plate (6) gap bridge depression bar guide pipe (18); When welding, it is upper that the gap bridge depression bar (15) of band gap bridge stage clip (14) is pressed in gap bridge (8), prevents the sideslip of passing a bridge when melts soldering tin, guaranteed welding quality, improved yield rate.
2. a kind of weldering mould of improved welding semi-conductor power module according to claim 1, is characterized in that, the vertical fixing column of described weldering mould base two ends or periphery must be to be arranged symmetrically with.
3. a kind of weldering mould of improved welding semi-conductor power module according to claim 1, is characterized in that, described upper and lower pressing plate is rotatable on spring column, facilitates mould loading, unloading.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410439434.1A CN104191063B (en) | 2014-09-01 | 2014-09-01 | A kind of weldering mould of welding semi-conductor power module of improvement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410439434.1A CN104191063B (en) | 2014-09-01 | 2014-09-01 | A kind of weldering mould of welding semi-conductor power module of improvement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104191063A true CN104191063A (en) | 2014-12-10 |
| CN104191063B CN104191063B (en) | 2016-04-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410439434.1A Active CN104191063B (en) | 2014-09-01 | 2014-09-01 | A kind of weldering mould of welding semi-conductor power module of improvement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104191063B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107871798A (en) * | 2017-12-12 | 2018-04-03 | 博硕皓泽自动化设备无锡有限公司 | A kind of auxiliary pressure device of photovoltaic plate weld |
| CN109926676A (en) * | 2019-04-28 | 2019-06-25 | 中国电子科技集团公司第三十八研究所 | The welder and welding method of SMP connector |
| CN110605452A (en) * | 2018-09-30 | 2019-12-24 | 中航光电科技股份有限公司 | Radio frequency contact piece reflow soldering frock |
| CN110640256A (en) * | 2019-11-05 | 2020-01-03 | 北京北广科技股份有限公司 | Automatic adjust welding frock |
| CN110756940A (en) * | 2019-10-29 | 2020-02-07 | 深圳基本半导体有限公司 | Power module electrode welding tool fixture and welding method |
| CN111958079A (en) * | 2020-07-30 | 2020-11-20 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Welding method of curved surface microstrip antenna |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202377641U (en) * | 2011-12-30 | 2012-08-15 | 成都芯通科技股份有限公司 | Device for welding radio-frequency power amplification module |
| CN202622205U (en) * | 2012-03-30 | 2012-12-26 | 高密星合电子有限公司 | Diode lead chip compacting device |
| CN102922195A (en) * | 2012-10-23 | 2013-02-13 | 京信通信系统（中国）有限公司 | Sheeting fixture |
| CN103567683A (en) * | 2012-07-18 | 2014-02-12 | 西安永电电气有限责任公司 | Positioning tool for chip welding |
| CN203992730U (en) * | 2014-09-01 | 2014-12-10 | 徐州汉通电子科技有限公司 | For welding the weldering mould of semi-conductor power module |
-
2014
- 2014-09-01 CN CN201410439434.1A patent/CN104191063B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202377641U (en) * | 2011-12-30 | 2012-08-15 | 成都芯通科技股份有限公司 | Device for welding radio-frequency power amplification module |
| CN202622205U (en) * | 2012-03-30 | 2012-12-26 | 高密星合电子有限公司 | Diode lead chip compacting device |
| CN103567683A (en) * | 2012-07-18 | 2014-02-12 | 西安永电电气有限责任公司 | Positioning tool for chip welding |
| CN102922195A (en) * | 2012-10-23 | 2013-02-13 | 京信通信系统（中国）有限公司 | Sheeting fixture |
| CN203992730U (en) * | 2014-09-01 | 2014-12-10 | 徐州汉通电子科技有限公司 | For welding the weldering mould of semi-conductor power module |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107871798A (en) * | 2017-12-12 | 2018-04-03 | 博硕皓泽自动化设备无锡有限公司 | A kind of auxiliary pressure device of photovoltaic plate weld |
| CN110605452A (en) * | 2018-09-30 | 2019-12-24 | 中航光电科技股份有限公司 | Radio frequency contact piece reflow soldering frock |
| CN110605452B (en) * | 2018-09-30 | 2021-09-03 | 中航光电科技股份有限公司 | Radio frequency contact piece reflow soldering frock |
| CN109926676A (en) * | 2019-04-28 | 2019-06-25 | 中国电子科技集团公司第三十八研究所 | The welder and welding method of SMP connector |
| CN109926676B (en) * | 2019-04-28 | 2022-06-03 | 中国电子科技集团公司第三十八研究所 | Welding device and welding method for SMP connector |
| CN110756940A (en) * | 2019-10-29 | 2020-02-07 | 深圳基本半导体有限公司 | Power module electrode welding tool fixture and welding method |
| CN110756940B (en) * | 2019-10-29 | 2022-01-18 | 深圳基本半导体有限公司 | Power module electrode welding tool fixture and welding method |
| CN110640256A (en) * | 2019-11-05 | 2020-01-03 | 北京北广科技股份有限公司 | Automatic adjust welding frock |
| CN111958079A (en) * | 2020-07-30 | 2020-11-20 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Welding method of curved surface microstrip antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104191063B (en) | 2016-04-27 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An improved die for welding semiconductor power module Effective date of registration: 20210105 Granted publication date: 20160427 Pledgee: Xuzhou Productivity Promotion Center Pledgor: XUZHOU HANTONG ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980000027 |
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