CN110729206B - Universal device for ball planting of ball grid array device - Google Patents
Universal device for ball planting of ball grid array device Download PDFInfo
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- CN110729206B CN110729206B CN201910946399.5A CN201910946399A CN110729206B CN 110729206 B CN110729206 B CN 110729206B CN 201910946399 A CN201910946399 A CN 201910946399A CN 110729206 B CN110729206 B CN 110729206B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
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Abstract
The invention discloses a universal ball planting device for a ball grid array device, and aims to provide a ball planting device which is high in practicability, flexible and convenient to operate and good in universality. The invention is realized by the following technical scheme: the ball planting pool of the ball planting table inner cavity frame is provided with a lifting support block for driving the ball grid array device substrate to synchronously ascend/descend, a main clamping slide block sliding along sliding grooves on two sides of the length of a frame opening, and an auxiliary clamping slide block sliding along a wide-edge suspension beam slide rail; the two main clamping sliding blocks move transversely and synchronously in the opposite direction or in the back direction through a transverse relative linkage mechanism of a transverse adjusting knob which is connected with the two main clamping sliding blocks, and the two auxiliary clamping sliding blocks also move longitudinally and synchronously in the opposite direction or in the back direction through a longitudinal relative linkage mechanism of a longitudinal adjusting knob which is connected with the two auxiliary clamping sliding blocks; the solder balls fall on the ball grid array device substrate pin bonding pads through the leakage holes of the solder ball leakage net, the number of the solder balls falling on the ball grid array device substrate pin bonding pads through the leakage net holes during ball planting is controlled, and the solder ball leakage installation of the ball grid array devices with different numbers of the solder balls is realized.
Description
Technical Field
The invention relates to the technical field of electronic packaging, in particular to a ball mounting device for a ball grid array packaging device.
Background
Ball grid array packaging (BGA for short) is provided with array solder balls at the bottom of a packaging body substrate and used as I/O ends of a circuit to be interconnected with a Printed Circuit Board (PCB), so that the mounting yield is improved, and the cost is potentially reduced; the BGA packaging device is provided with spherical contact acting pins on the bottom surface of a substrate in an array mode, and has short pins and small lead inductance and capacitance; the number of pins is large, and the ratio of the number of leading-out ends to the size of a device packaging body is high; the center distance of welding spots is large, the pins are firm, the coplanarity is good, and the assembly yield is high; the array solder ball has a large contact surface with the substrate, so that the signal transmission path is shortened, the lead inductance and resistance are reduced, the coplanarity of the I/O terminal is improved, and the loss caused by poor coplanarity in the assembly process is greatly reduced. The BGA has more I/O pins and larger pin pitch than QFP (quad flat package), and has the characteristics of good lead hardness and high self-alignment property. BGA packaging is an improvement from Pin Grid Array (PGA) packaging, which is a method of packaging by covering or partially covering the pins with a surface and grid arrangement. The solder balls are connected to the substrate printed pads through the packaged IC chip. The solder ball matrix arrangement strictly corresponds to the substrate printed pads, including dimensions, spacing, solder ball flatness, and the like. One disadvantage of BGA packages is that the solder balls cannot stretch as long pins and therefore they are not material rigid in material properties. All of the bonding devices may cause the solder joints between the solder balls of the BGA device and the PCB substrate to break when they are bent (thermal stress) or extended and vibrated (mechanical stress) due to the difference in thermal expansion coefficient between the PCB substrate and the BGA package. The main defect type is that the ball pitch of the solder balls exceeds the standard in the ball mounting process, and then the ball pitch of the BGA device exceeds the standard, so that the assembly and welding of the BGA device and the PCB are failed.
At present, BGA devices are widely adopted by a plurality of products, but in the application of a plurality of products with small batch, the following two problems are prominent in production: 1) the characteristics of various small-batch products lead to less quantity of purchased single BGA devices, the ball planting means only uses tweezers or templates to manually mount solder balls, the efficiency is low, the cost is high, the requirement on operators is extremely high, the overall level is on the repair level of the BGA elements, and the BGA devices have the defects of pin oxidation, partial solder ball loss and the like. 2) The design of the heated and warped welding pad of the printed board is inconsistent, and the BGA device has short circuit or insufficient welding defects caused by poor printing of soldering paste, insufficient welding temperature and the like. As the demand of BGA is increasing and the number of solder balls on the BGA device and the substrate is increasing and the pitch is decreasing with the development of packaging technology, the manual ball-mounting operation by the operator will not be sufficient. By adopting the processing mode of replacing the scrapped original device with a new device, on one hand, the production cost is greatly increased, on the other hand, if some BGA devices are not stored, the BGA devices need to be purchased again, and the purchase period of the BGA devices is generally longer, so that the production progress is seriously delayed.
3) The automatic BGA device ball-planting equipment is expensive and mainly used for BGA device manufacturers, electronic assembly manufacturers for assembling and assembling BGA devices basically cannot purchase the automatic ball-planting equipment due to the consideration of production cost, ball-planting means only adopt tweezers or a special ball-planting template for manual mounting, the ball-planting efficiency is low, the cost is high, the requirement on operators is extremely high, and the ball-planting yield is low.
In the BGA packaging technique, solder balls are placed on the pads of the BGA package substrate, which is called ball mounting. In the ball-planting device in the prior art, a four-corner adjustment positioning mode is adopted, although the positioning sizes in two directions can be adjusted simultaneously, the four-corner adjustment mode is only suitable for a square ball grid array device, for a rectangular device, only diagonal positioning can be adopted, the other two corners are suspended, the side length direction of the ball grid array device is not fixed, the device is likely to be placed unstably, and certain defects exist. Because the ball planting device adjusts the distance between the positioning surface of the supporting slide block and the solder ball leakage plate by adjusting 4 height adjusting screws for fixing the supporting slide block, the ball planting application of the ball grid array devices with different thicknesses is realized. The height of the four-corner supporting slide block is not uniform due to the fact that the 4 height adjusting screws are used for adjusting respectively, so that the ball grid array is not placed stably, and the distance between the device substrate surface and the solder ball leakage plate is not consistent.
Although the ball planting device in the prior art can realize the ball planting fixation of ball grid array devices with different specifications and models, the ball grid array devices with different specifications and models need to be manufactured with corresponding special solder ball leak boards, the production cost is high, the types of the special solder ball leak boards are multiple, and the manpower resources for storage and management are increased. Although the ball planting device is provided with the solder ball pouring groove, the recovery of the solder balls can be realized, the solder ball pouring groove is not provided with a baffle switch, when the ball planting device is shaken to carry out the missing installation of the solder balls, part of the solder balls are easy to overflow through the pouring groove, the waste of the solder balls is caused, and the excess is generated on the workbench.
Because the demand of the BGA is increasing, and with the development of packaging technology, the number of the solder balls on the BGA device and the substrate is increasing, and the pitch is decreasing, the ball mounting will not be qualified finally by the manual repair of the operator. Therefore, the development of a BGA repair ball-mounting universal device which has low cost, high efficiency and convenient use and meets the packaging requirements of different types of BGA is urgently needed in the market.
Disclosure of Invention
The invention aims to solve the technical problem of avoiding the defects of the prior art and provides a ball-planting general device for a ball grid array device, which has the advantages of simple structure, high production efficiency, good stability, convenient use, low cost and high ball-planting yield.
The technical scheme adopted by the invention for solving the problems in the prior art is as follows: a universal apparatus for ball-mounting ball grid array devices, comprising: a universal solder ball bushing 20 placed on the ball planting table 10, an elastic base 30 and a U-shaped slot 40 under the ball planting table 10. The method is characterized in that: the central part of a ball planting pool of an inner cavity frame of the ball planting table 10 is provided with a lifting support block 101 which drives a ball grid array device substrate 1 placed on the lifting support block to synchronously ascend/descend so as to realize the synchronous ascending/descending of the surface of the ball grid array device substrate 1 and a welding ball leakage net 202 in a universal welding ball leakage plate 20, the height distance of the lifting support block 101 is adjustable, an auxiliary clamping slide block 107 which is symmetrical with the lifting support block 101 and slides along a wide edge suspension beam slide rail, and a main clamping slide block 106 which is symmetrical about a middle suspension beam slide rail and slides along slide grooves at two sides of the; the two main clamping sliders 106 are transversely and synchronously moved towards or away from each other by taking the middle plate suspension beam slide rail lifting support block 101 as a central symmetrical axis through a transverse opposite linkage mechanism of a transverse adjusting knob 110 connected with the two main clamping sliders, and the two auxiliary clamping sliders 107 assembled on the middle suspension beam slide rail are longitudinally and synchronously moved towards or away from each other by taking the lifting support block 101 as a central symmetrical axis through a longitudinal opposite linkage mechanism of a longitudinal adjusting knob 111 connected with the two main clamping sliders. The built-in solder ball leakage net 202 of the universal solder ball leakage board 20 is provided with a leakage hole array which is classified according to the diameter, the welding distance and the odd-even arrangement of the solder balls and corresponds to the pin pad array of the ball grid array device substrate 1, the solder balls fall onto the pin pad of the ball grid array device substrate 1 through the leakage holes of the solder ball leakage net 202, and the solder balls are quickly leaked and installed on the corresponding pin pad of the ball grid array device substrate 1; four rectangular magnetic steel sheets 206 which are arranged on the front and the back of the ball-planting pool are arranged on the solder ball leakage net 202 in parallel to shield leakage holes which do not need to be provided with solder balls on the solder ball leakage net 202, and the number of the solder balls which fall onto the pin bonding pads of the ball grid array device substrate 1 through the leakage net holes during ball planting is controlled, so that the hole array provided with the solder balls on the leakage net corresponds to the pin bonding pad array of the ball grid array device substrate 1, and the ball-planting leakage boards of the same type BGA devices with different numbers of the solder balls are universal.
Compared with the prior art, the invention has the following beneficial effects.
The production efficiency is high. The invention adopts a ball planting table and a general solder ball leakage plate covering the ball planting table, a ball planting leakage net on the general solder ball leakage plate is provided with a maximum number of hole arrays corresponding to the solder ball spacing, the solder ball diameter and the odd-even arrangement of solder balls of a ball grid array device in the ball planting table, the position of a solder ball shielding plate is adjusted to ensure that a solder ball leakage mesh array corresponds to a pin pad array of a ball grid array device substrate 1 to be planted, and the solder balls fall onto the pin pad of the ball grid array device substrate 1 through the leakage holes of the general solder ball planting leakage plate. Meanwhile, four clamping slide blocks for clamping and positioning ball grid array devices are arranged on four sides of the inner cavity of the ball planting table, and the main clamping slide blocks positioned on the opposite sides are connected with a transverse adjusting knob arranged on a bidirectional transverse moving screw rod to drive the two clamping slide blocks to synchronously move outwards towards the wide side of the ball planting table or synchronously move inwards towards the center of the ball planting table; equally, be located the vertical adjust knob that is equipped with on the two-way vertical screw rod that moves of supplementary centre gripping slider connection of another opposite side, drive two centre gripping sliders move towards in step the long limit department of planting the ball platform moves outward or moves towards in step the center department of planting the ball platform moves inwards, device simple structure, convenient operation can realize that different appearance size ball grid array devices plant the ball to general solder ball bushing design has avoided different BGA devices to plant the ball and need make the current situation of special solder ball bushing, has realized that the same type BGA device of solder ball quantity is different plants the ball bushing and is general, has improved production efficiency. The elastic base and the removable U-shaped clamping grooves are designed, the U-shaped clamping grooves are removed when the solder balls are neglected to be installed, the hard springs of the elastic base are convenient for the ball grid array ball-planting general device to shake, the solder balls are rapidly neglected to be installed, and the ball-planting efficiency is improved.
The stability is good. The invention utilizes the lifting supporting block with adjustable height arranged at the center of the inner cavity of the ball planting table to support the central part of the ball grid array device substrate 1 to be planted with balls, so that the device is stably placed; the lifting support block with the sliding inclined plane is connected with the spring seat through a screw component, two springs are arranged on the inner surface of the ball planting table in a butt joint mode in a containing hole in the spring seat, and the two springs are symmetrical to the center line of the lifting support block and keep the stability of the lifting support block when the wedge-shaped block structure moves; one pair of the four clamping slide blocks has larger size, the other pair has smaller size, and the four clamping slide blocks can be suitable for clamping and positioning the four sides of the ball grid array devices with various shapes and sizes, and have good stability and high ball planting yield. The U-shaped clamping groove is designed in a drawing mode, and only when the solder balls are subjected to neglected loading operation, the U-shaped clamping groove is drawn out from the elastic base, so that the hard spring of the elastic base is convenient for the ball planting table to shake to realize the quick neglected loading of the solder balls onto the pin bonding pads of the corresponding ball grid array device substrate 1, and the requirement that the ball planting table needs to be stable in a non-solder ball neglected loading operation time period can be met. The two bidirectional screw rods are utilized to drive the main clamping slide block and the auxiliary clamping slide block to synchronously adjust the four clamping slide blocks, so that the center of the ball grid array device is conveniently and quickly clamped and positioned during ball planting operation; the screw rod drives the wedge-shaped structural part to move left and right, when the wedge-shaped structural part moves to the left, the inclined wedge surface of the wedge-shaped structural part slides on the inclined surface of the lifting supporting block to push the lifting supporting block to move upwards, and meanwhile, the spring is compressed; when the screw rod drives the wedge-shaped structural member to move rightwards, the wedge-shaped structural member does not support the lifting supporting block through the wedge-shaped sliding surface any more, and the lifting supporting block does descending movement under the action of the spring; the ascending/descending movement of the lifting support block finally realizes the synchronous ascending/descending of the ball grid array device placed on the upper surface of the lifting support block, realizes the adjustable distance between the ball grid array device substrate 1 and a welding ball leakage net in the universal welding ball leakage board, enables the ball grid array device to be placed stably during ball planting operation, is convenient to adjust the height, and solves the problems that the height of four lifting support blocks is easily inconsistent and the ball grid array device is placed unstably because four height adjusting screws are needed to adjust the heights of the four lifting support blocks in the prior art. The clamping device with the main clamping sliding block and the auxiliary clamping sliding block on the opposite side is adopted, stable clamping of devices with rectangular and square shapes can be realized, and the problems that in the prior art, the rectangular devices can only be clamped diagonally, the other two corners are suspended, and the ball grid array devices are not placed stably are solved.
Low cost and convenient use. The invention is classified according to the diameter of the solder balls, the spacing of the solder balls and the arrangement odd-even of the solder balls of various ball grid array devices, and a universal solder ball leakage net is manufactured according to the maximum quantity of the solder balls of the ball grid array devices; four rectangular magnetic steel sheets are respectively positioned on the front and the back of the solder ball leakage net to shield meshes which do not need to be subjected to solder ball leakage, so that a hole array on the leakage net, in which the solder balls are not required to be subjected to leakage, corresponds to a pin pad array of the ball grid array device substrate 1, the overlapped part of the front rectangular magnetic steel sheet and the back rectangular magnetic steel sheet on the solder ball leakage net and the part, in which the back rectangular magnetic steel sheet of the solder ball leakage net is not overlapped with the front rectangular magnetic steel sheet, are respectively adsorbed and fixed by circular magnet blocks, and the rectangular magnetic steel sheets are prevented from shifting; the general solder ball leakage net and the design mode of shielding unnecessary solder ball leakage holes by the rectangular magnetic steel sheet change the current situation that each BGA device needs to be manufactured with a special solder ball leakage net before, realize the common ball-planting leakage net of the same type BGA devices with different solder ball quantities, reduce the loss of production resources, energy and manpower resources and reduce the production cost; the solder ball pouring groove is provided with the spring switch, so that the solder ball is prevented from overflowing when the ball planting device is shaken in the ball planting operation, and the problems of overflow waste and generation of redundant materials of the solder ball in the prior art are solved. The handle which is convenient for the bushing to take and place is arranged on the universal solder ball bushing frame, so that the universal solder ball bushing is convenient to take and place, and the solder ball leakage net is stably separated from the ball grid array device, and the problems that the universal solder ball bushing is difficult to take and place and the solder ball leakage net is easily separated from the ball grid array device in the prior art are solved.
The universality is strong. The center of the inner cavity of the ball planting table is provided with a lifting supporting block with adjustable height, the central part of a ball grid array device substrate 1 for supporting balls to be planted is controlled to move left and right through a screw rod, the lifting supporting block is driven to ascend/descend, so that ball grid array devices placed on the lifting supporting block synchronously ascend/descend, and the distance between the surface of the ball grid array device substrate 1 and a welding ball leakage net in the universal welding ball leakage plate is adjustable; meanwhile, four clamping slide blocks for clamping and positioning the ball grid array device are arranged on four sides of the inner cavity of the ball planting table, and the two bidirectional screws drive the four clamping slide blocks to synchronously move (simultaneously move inwards or outwards), so that the clamping and positioning sizes can be conveniently adjusted according to the shape size of the ball grid array device, and thus the ball planting universal device for the ball grid array device can be used for planting balls of rectangular and square ball grid array devices with different shape sizes and thicknesses, and has strong universality; the universal solder ball leakage net is provided with the maximum number of leakage hole arrays corresponding to the solder ball pitch and the solder ball diameter of the ball grid array device in the ball planting platform, and the leakage holes which are not required to be leaked and loaded with solder balls on the solder ball leakage net are shielded by adjusting the positions of the four rectangular magnetic steel sheets positioned on the front and the back of the solder ball leakage net, so that the leakage hole arrays which are leaked and loaded with solder balls on the solder ball leakage net correspond to the pin pad arrays of the ball grid array device substrate to be planted, and the universal ball planting leakage boards of the same type BGA devices with different solder ball numbers are universal.
The ball planting yield is high. The design of buckle locking, the general solder ball bushing that quick locking counterpoint was accomplished prevents that the general solder ball bushing from shifting and arousing the solder ball skew when ball planting operation rocks the ball planting device, has solved prior art and has rocked and lead to solder ball neglected loading skew problem when ball planting device easily. The handle is arranged on the universal solder ball leakage plate frame, so that stable separation of a solder ball leakage net and a ball grid array device is facilitated, the problem that the solder ball is easy to shift due to separation of the solder ball leakage net and the ball grid array device is solved, and the ball planting yield is high.
The invention is suitable for ball mounting of ball grid array devices of various specifications and models. The ball mounting structure can be used for repairing and mounting the ball in BGA assembly, and can also be used for mounting the ball in small-batch BGA production packaging.
Drawings
FIG. 1 is a schematic diagram of an axonometric projection structure of a ball grid array device ball mounting universal apparatus of the present invention;
FIG. 2 is a schematic rear axial view of the structure of FIG. 1;
FIG. 3 is a schematic axial view of the table (10) of FIG. 1;
FIG. 4 is a schematic three-dimensional structure of the universal ball grid array (20) of FIG. 1;
FIG. 5 is a top view of FIG. 4;
FIG. 6 is a sectional view taken along line A-A of FIG. 5;
FIG. 7 is a sectional view taken along line B-B of FIG. 5;
FIG. 8 is a cross-sectional view taken along line C-C of FIG. 5;
FIG. 9 is a schematic axial view of the elastomeric mount (30) of FIG. 1;
in the figure: 1. the ball grid array device comprises a ball grid array device substrate, 10 a ball planting table, 101 a lifting support block, 102 a wedge-shaped structural member, 103 screws, 104 height adjusting knobs, 105 springs, 106 main clamping sliders, 107 auxiliary clamping sliders, 108 bidirectional transverse moving screws, 109 bidirectional longitudinal moving screws, 110 transverse adjusting knobs, 111 longitudinal adjusting knobs, 112 positioning pins, 113 locking buckles, 114 spring seats, 20 universal solder ball leakage plates, 201 clamping frames, 202 solder ball leakage nets, 203 handles, 204 solder ball pouring grooves, 205 baffle switches, 206 rectangular magnetic steel sheets, 207 circular magnet blocks, 208 positioning holes, 30 elastic bases, 301 mounting holes, 302 hard springs, 303 placement bases, 304 screw fastening holes, 305 square through holes and 40U-shaped clamping grooves.
Detailed Description
The following detailed description of the preferred embodiments of the invention refers to the accompanying drawings.
Referring to fig. 1-9, in a preferred embodiment described below, a general apparatus for ball-mounting a ball grid array device includes: install the general solder ball bushing 20 of planting the table 10 top, be located the elastic base 30 and the U-shaped draw-in groove of planting the table 10 below, its characterized in that: the central part of a ball planting pool of an inner cavity frame of the ball planting table 10 is provided with a lifting support block 101 which drives a ball grid array device substrate 1 placed on the ball planting pool to synchronously ascend/descend and has adjustable height distance, an auxiliary clamping slide block 107 which is symmetrical with the lifting support block 101 and slides along a wide-edge suspension beam slide rail, and a main clamping slide block 106 which is symmetrical about a middle suspension beam slide rail and slides along slide grooves at two sides of the length of an inner cavity frame opening; the two main clamping sliders 106 are transversely and synchronously moved towards or away from each other by taking the lifting support block 101 on the middle suspension beam slide rail as a central symmetrical axis through a transverse relative linkage mechanism of a transverse adjusting knob 110 connected with the two main clamping sliders 106, and are longitudinally and synchronously moved towards or away from each other by taking the lifting support block 101 as a central symmetrical axis through a longitudinal relative linkage mechanism of a longitudinal adjusting knob 111 connected with the two auxiliary clamping sliders 107 on the middle suspension beam slide rail; the built-in solder ball leakage net 202 of the universal solder ball leakage plate 20 is provided with a plurality of solder ball leakage nets which are arranged and classified according to the diameter of the solder balls, the welding distance and the odd-even arrangement of the solder balls, and the leakage hole array corresponding to the ball grid array device substrate 1 pin pad array, the solder balls fall onto the ball grid array device substrate 1 pin pad through the leakage holes of the solder ball leakage net 202, the solder balls are quickly leaked and mounted on the corresponding ball grid array device substrate 1 pin pad, four rectangular magnetic steel plates 206 which are arranged in parallel on the front and back sides of the ball-planting pool grid are arranged on the solder ball grid 202 to shield the leakage holes which are not needed to be provided with solder balls on the solder ball grid 202, the number of solder balls which fall on the pin bonding pads of the substrate 1 of the ball grid array device through the leakage holes during ball planting is controlled, the hole array of the solder balls neglected to be arranged on the leakage net corresponds to the pin pad array of the ball grid array device substrate 1, so that the ball planting leakage board of the BGA devices of the same type with different numbers of the solder balls is universal; aligning the positioning hole 208 on the universal solder ball bushing 20 with the positioning pin 112 on the ball planting table 10, and installing the universal solder ball bushing 20 on the ball planting table 10, so that the bottom surface of the clamping frame 201 of the universal solder ball bushing 20 is in surface contact with the front surface of the ball planting table 10, and locking and fastening the installed universal solder ball bushing 20 and the ball planting table 10 by using a locking fastener on the diagonal of the side surface of the ball planting table 10; solder balls are poured into the solder ball leakage net 202 of the universal solder ball leakage plate 20, the U-shaped clamping groove 40 on the elastic base 30 is drawn out, the ball planting table 10 is slightly shaken, so that the solder balls quickly fall onto each pin pad of the ball grid array device substrate 1 through the solder ball leakage net holes, and the quick leakage installation of the solder balls is realized; inserting the U-shaped clamping groove into the elastic base, opening the locking buckle 113, holding the upper handle 203 of the universal solder ball bushing frame with two hands, stably and quickly taking down the universal solder ball bushing from the ball planting table, and then taking down the ball grid array device with the planted balls for thermosetting.
Refer to fig. 2 and 3. Four clamping slide blocks for clamping and positioning the ball grid array device substrate 1 at four sides are arranged in a ball planting pool in an inner cavity at the upper end of the ball planting table 10, wherein a transverse main clamping slide block 106 for clamping the ball grid array device substrate 1 placed on a supporting block 101 along the longitudinal direction passes through a bidirectional traversing screw rod 108 connected below, a transverse adjusting knob 110 is arranged on the bidirectional traversing screw rod 108, and the transverse adjusting knob 110 is rotated to drive the two main clamping slide blocks 106 to synchronously and oppositely clamp towards the wide side direction of the ball grid array device substrate 1; similarly, two longitudinal auxiliary clamping sliders 107 perpendicular to the wide side of the ball grid array device substrate 1 are connected with a two-way longitudinal movement screw 109, and the two auxiliary clamping sliders 107 are driven by a longitudinal adjusting knob 111 connected with one end of the two-way longitudinal movement screw 109 to synchronously perform opposite clamping movement towards the long side direction of the ball grid array device 1, so that the ball grid array device substrate 1 with a rectangular or square shape can be stably clamped. Of the grip sliders, the main grip slider 106 is larger in size than the auxiliary grip slider 107. The fixed clamping of the ball grid array device substrates 1 with different overall dimensions and thicknesses can be realized by adjusting the height of the lifting supporting block 101 at the center of the ball planting pool in the inner cavity of the ball planting table 10 and adjusting the clamping size of the main/auxiliary clamping slide block 106/107 in the inner cavity.
Referring to fig. 1, a supporting elastic base 30 and a U-shaped clamping groove 40 are arranged below the ball planting table 10 shown in fig. 8, the U-shaped clamping groove 40 is drawn out, a hard spring 302 on the elastic base 30 is convenient for the ball planting table to swing, so that solder balls are quickly and neglected to be installed on a basic 1-pin pad of the ball grid array device, when the solder balls are not neglected to be installed, the U-shaped clamping groove 40 is inserted into two sides of the spring of the elastic base to prevent the ball planting table from swinging, and the stability of the ball planting table is.
Referring to fig. 1, the locking buckle 113 for locking and fixing the substrate 1 of the ball grid array device is arranged on the outer side plate of the wide diagonal of the ball-mounting table 10, so as to prevent the universal solder ball grid plate 20 from shifting to cause solder ball offset during ball-mounting operation, and solve the problem of the prior art that the solder ball mounting device is easy to cause solder ball mounting offset during shaking.
See fig. 4. The universal solder ball leakage board 20 consists of a ball planting pool surrounded by a clamping frame 201, a solder ball leakage net 202 positioned in the ball planting pool and a solder ball pouring groove 204 arranged on one corner edge of the ball planting pool, wherein a baffle switch 205 is arranged on the solder ball pouring groove 204, when the ball planting table is shaken to carry out solder ball leakage assembly operation, the baffle is closed, and after the solder ball leakage assembly is finished, when the solder ball needs to be poured, the baffle is opened; four rectangular magnetic steel sheets 206 are arranged on four sides of the vertical solder ball leakage net 202, wherein two rectangular magnetic steel sheets are positioned on the front side of the solder ball leakage net 202, and the other two rectangular magnetic steel sheets are positioned on the back side of the solder ball leakage net 202 to shield leakage holes which do not need to be subjected to solder ball leakage on the solder ball leakage net 202, so that a hole array which is subjected to solder ball leakage on the leakage net corresponds to a pin pad array of the ball grid array device substrate 1; the overlapped part of the front rectangular magnetic steel sheet 206 and the back rectangular magnetic steel sheet 206 of the solder ball leakage net 202 and the part of the back rectangular magnetic steel sheet 206 of the solder ball leakage net 202 which is not overlapped with the front rectangular magnetic steel sheet 206 are adsorbed and fixed by a circular magnet block 207 to prevent the rectangular magnetic steel sheets from shifting; the design mode of shielding the unnecessary solder ball leakage holes by the rectangular magnetic steel sheet realizes the universal use of the same type BGA device ball-planting leakage boards with different solder ball quantities, and changes the current situation that each BGA device needs to be provided with a special solder ball leakage net. The two opposite sides of the clamping frame 201 are provided with vertically upward handles 203, which is convenient for the picking and placing operation of the universal solder ball leakage board 20, realizes the stable separation of the solder ball leakage net 202 and the ball grid array device, and solves the problems that the universal solder ball leakage board is not easy to pick and place and the solder ball leakage net is easy to cause the displacement of the solder balls when being separated from the ball grid array device in the prior art.
Referring to fig. 6, 7, 8. The lifting support block 101 with the sliding inclined plane is connected with a spring seat 114 through a screw component, two springs 105 are arranged in accommodating holes on the spring seat 114 and are opposite to the inner surface of the table tennis table 10, and the two springs 105 are symmetrical to the central line of the lifting support block 101 and keep the stability of the lifting support block 101 when the wedge block structure 102 moves. A screw 103 with a height adjusting knob 104 at one end drives the wedge-shaped structural member 102 to move left and right through threads, when the wedge-shaped structural member 102 moves leftwards, the inclined wedge surface slides along the inclined surface of the lifting support block 101 to push the lifting support block 101 to ascend, and meanwhile, a spring is compressed; when the height adjusting knob 104 drives the screw 103 to drive the wedge-shaped structural part 102 to move rightwards, the wedge-shaped structural part 102 no longer supports the lifting support block 101 through the wedge-shaped sliding surface, and the lifting support block descends under the action of the spring 105; the ascending/descending of the lifting supporting block 101 drives the ball grid array device placed on the upper surface to ascend/descend synchronously, so that the distance between the ball grid array device substrate 1 and the welding ball leakage net in the universal welding ball leakage plate 20 is adjustable, and the ball grid array device ball planting universal device can be used for ball planting of ball grid array devices with different thicknesses, and the universality is realized.
Although embodiments of the present invention have been shown and described with respect to the above-described embodiments, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made herein without departing from the spirit and scope of the invention, and these improvements and modifications should be considered within the scope of the invention.
Claims (9)
1. A universal apparatus for ball-mounting ball grid array devices, comprising: place general solder ball bushing (20) on planting ball platform (10), be located elastic base (30) and U-shaped draw-in groove (40) of planting ball platform (10) below, its characterized in that: the center part of a ball planting pool of an inner cavity frame of the ball planting table (10) is provided with a lifting support block (101) which drives a ball grid array device substrate (1) placed on the ball planting pool to synchronously ascend/descend and has adjustable height distance, an auxiliary clamping slide block (107) which is symmetrical with the lifting support block (101) and slides along a wide-edge suspension beam slide rail, and a main clamping slide block (106) which is symmetrical about a middle suspension beam slide rail and slides along slide grooves at two sides of the length of an inner cavity frame opening; the two main clamping sliding blocks (106) are transversely and synchronously moved in the opposite direction or in the opposite direction by a transverse opposite linkage mechanism of a transverse adjusting knob (110) connected with the lower parts of the two main clamping sliding blocks, and the middle suspension beam sliding rail lifting supporting block (101) is taken as a central symmetrical shaft; two auxiliary clamping sliders (107) assembled on the middle suspension beam slide rail move longitudinally and synchronously in opposite directions or back directions by taking the lifting support block (101) as a central symmetry axis through a longitudinal opposite linkage mechanism of a longitudinal adjusting knob (111) connected with the auxiliary clamping sliders; a leakage hole array which is classified according to the diameter of solder balls, the welding distance and the odd-even arrangement of the solder balls and corresponds to a pin pad array of a ball grid array device substrate (1) is arranged on a built-in solder ball leakage net (202) of the universal solder ball leakage plate (20); rectangular magnetic steel sheets (206) are arranged on two sides of the solder ball leakage net (202), and circular magnet blocks (207) which are fixed in an adsorption mode are distributed at two ends of the solder ball leakage net (202) and the rectangular magnetic steel sheets (206); four rectangular magnetic steel sheets (206) on the front and back surfaces of the solder ball leakage net (202) respectively shield meshes which do not need to be subjected to solder ball leakage on the solder ball leakage net (202), solder balls fall onto a pin pad of the ball grid array device substrate (1) through the leakage holes of the solder ball leakage net (202), rapid leakage installation of the solder balls is realized, the hole array subjected to solder ball leakage on the solder ball leakage net (202) corresponds to the pin pad array of the ball grid array device substrate (1), and the universal ball-planting leakage board of the same type BGA device with different solder ball quantities is realized.
2. The universal apparatus for ball grid array device ball mounting of claim 1 wherein: in the clamping slide block, the size of the main clamping slide block (106) is larger than that of the auxiliary clamping slide block (107), and the fixed clamping of the ball grid array device substrates (1) with different overall dimensions and thicknesses can be realized by adjusting the height of the lifting supporting block (101) at the center of the ball planting pool in the inner cavity of the ball planting table (10) and adjusting the clamping size of the main/auxiliary clamping slide block (106/107) in the inner cavity.
3. The universal apparatus for ball grid array device ball mounting of claim 1 wherein: the bottom surface of a clamping frame (201) of the universal solder ball leakage plate (20) is in surface contact with the front surface of the ball planting table (10), and the mounted universal solder ball leakage plate (20) is locked and fixed by using locking buckles at the opposite angles of the side surface of the ball planting table (10); pouring a proper amount of solder balls into the solder ball leakage net (202), drawing out the U-shaped clamping groove (40) on the elastic base (30), and shaking the ball planting table (10) through a hard spring welded on the elastic base to enable the solder balls to quickly fall onto each pin pad of the ball grid array device substrate (1) through the solder ball leakage net holes so as to realize quick leakage installation of the solder balls; inserting the U-shaped clamping groove into the elastic base, opening the locking buckle (113), holding the upper handle (203) of the universal solder ball bushing frame by hand, taking down the universal solder ball bushing, and taking down the ball grid array device with the implanted balls for thermosetting.
4. The universal apparatus for ball grid array device ball mounting of claim 1 wherein: four clamping slide blocks for clamping and positioning the ball grid array device substrate (1) at four sides are arranged in a ball planting pool in an inner cavity at the upper end of the ball planting table (10), wherein two transverse main clamping slide blocks (106) are connected with a bidirectional traversing screw rod (108), and two main clamping slide blocks (106) are driven to synchronously and oppositely clamp towards the wide side direction of the ball grid array device substrate (1) synchronously through a transverse adjusting knob (110) connected with one end of the bidirectional traversing screw rod (108).
5. The universal apparatus for ball grid array device ball mounting of claim 1 wherein: the two longitudinal auxiliary clamping sliders (107) are connected with the two-way longitudinal moving screw (109), and the two auxiliary clamping sliders (107) are driven by a longitudinal adjusting knob (111) connected with one end of the two-way longitudinal moving screw (109) to synchronously perform opposite clamping movement towards the long side direction of the ball grid array device substrate (1).
6. The universal apparatus for ball grid array device ball mounting of claim 1 wherein: the height of a central lifting supporting block (101) of a ball planting pool in an inner cavity of the ball planting table (10) and the clamping size of a main/auxiliary clamping sliding block (106/107) in the inner cavity are adjusted, so that the fixed clamping of the ball grid array device substrates (1) with different external dimensions and thicknesses is realized.
7. The universal apparatus for ball grid array device ball mounting of claim 1 wherein: plant ball platform (10) below and be equipped with the U-shaped draw-in groove (40) of bracketing elastic base (30) and neglected loading solder ball, take U-shaped draw-in groove (40) out for stereoplasm spring (302) on elastic base (30) are convenient for plant the ball platform and are rocked when planting the ball operation, realize that the solder ball is neglected to be adorned on ball grid array device base plate (1) pin pad fast, when non-neglected loading solder ball operation, U-shaped draw-in groove (40) insert elastic base spring both sides and prevent that the ball platform of planting from rocking, ensure the ball platform of planting is steady.
8. The universal apparatus for ball grid array device ball mounting of claim 1 wherein: the universal solder ball leakage board (20) is composed of a ball planting pool surrounded by a clamping frame (201), a solder ball leakage net (202) located in the ball planting pool and a solder ball pouring groove (204) arranged on one corner edge of the ball planting pool, a baffle switch (205) is arranged on the solder ball pouring groove (204), when the ball planting table is shaken to perform solder ball neglected loading operation, the baffle is closed, and after the solder ball neglected loading is completed, the baffle is opened when the solder ball is poured.
9. The universal apparatus for ball grid array device ball mounting of claim 1 wherein: the lifting supporting block (101) with the sliding inclined plane is connected with a spring seat (114) through a screw component, two springs (105) are arranged in accommodating holes in the spring seat (114) and are symmetrical to the central line of the lifting supporting block (101) to abut against the inner surface of the ball planting table (10); a screw rod (103) of the ball planting table (10) with a height adjusting knob at one end drives the wedge-shaped structural member (102) to move left and right through threads, and when the wedge-shaped structural member (102) moves leftwards, an inclined wedge surface slides along an inclined surface of the lifting supporting block (101) to push the lifting supporting block (101) to ascend and compress a spring (105); when the height adjusting knob (104) drives the screw (103) to drive the wedge-shaped structural part (102) to move rightwards, the wedge-shaped structural part (102) does not support the lifting of the lifting supporting block (101) through a wedge-shaped sliding surface any more, and the lifting supporting block (101) descends under the action of the spring (105); the ascending/descending of the lifting supporting block (101) realizes the synchronous ascending/descending of the ball grid array device placed on the upper surface of the lifting supporting block, and realizes the adjustable distance between the ball grid array device substrate (1) and the welding ball leakage net in the universal welding ball leakage plate (20).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910946399.5A CN110729206B (en) | 2019-10-05 | 2019-10-05 | Universal device for ball planting of ball grid array device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910946399.5A CN110729206B (en) | 2019-10-05 | 2019-10-05 | Universal device for ball planting of ball grid array device |
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| CN110729206A CN110729206A (en) | 2020-01-24 |
| CN110729206B true CN110729206B (en) | 2021-06-11 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113411739B (en) * | 2021-07-29 | 2022-09-16 | 浙江欧赛电子有限公司 | Automatic assembling system for T iron of loudspeaker |
| CN115497858B (en) * | 2022-11-17 | 2023-03-24 | 深圳市立可自动化设备有限公司 | Ball planting machine guide plate |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1312735C (en) * | 2003-08-14 | 2007-04-25 | 宏达国际电子股份有限公司 | Ball-planting device for making several tin balls stick to chip |
| CN201323709Y (en) * | 2008-12-16 | 2009-10-07 | 深圳市实益达科技股份有限公司 | Ball mounting clamp |
| KR101044164B1 (en) * | 2009-09-02 | 2011-06-27 | 황기천 | Solder ball adhering device |
| CN202076240U (en) * | 2011-06-10 | 2011-12-14 | 王国华 | Tin-ball planting device for integrated circuit |
| KR200473125Y1 (en) * | 2013-01-10 | 2014-06-19 | 임채열 | Reballing apparatus |
| KR101563969B1 (en) * | 2013-11-13 | 2015-10-28 | 배관수 | Solder ball Reballing device for BGA Type Sub-Strate |
| CN205184131U (en) * | 2015-12-07 | 2016-04-27 | 深圳创维数字技术有限公司 | BGA plants football shirt and puts |
| CN108878316A (en) * | 2018-06-05 | 2018-11-23 | 北方电子研究院安徽有限公司 | A kind of easy BGA ball-planting device |
| CN208819834U (en) * | 2018-08-28 | 2019-05-03 | 深圳市信鸿泰锡业有限公司 | A kind of tin sweat(ing) cut-in type ball-planting device |
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