CN215966024U - Device for shaping SOP (self-aligned package) and QFP (quad Flat Package) package pins - Google Patents
Device for shaping SOP (self-aligned package) and QFP (quad Flat Package) package pins Download PDFInfo
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- CN215966024U CN215966024U CN202122077600.6U CN202122077600U CN215966024U CN 215966024 U CN215966024 U CN 215966024U CN 202122077600 U CN202122077600 U CN 202122077600U CN 215966024 U CN215966024 U CN 215966024U
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Abstract
The utility model relates to a device for shaping SOP and QFP packaging pins, which comprises a bottom plate, an XYZ three-axis motion platform, a shaping comb fixing seat, a shaping comb, a device loading seat, a pressing assembly, an inspection assembly and a support, wherein the XYZ three-axis motion platform is provided with a base plate and a base plate; the shaping comb fixing seat is installed on an XYZ three-axis motion platform, the shaping comb is inserted into the shaping comb fixing seat and then fixed by a first screw knob, the device loading seat is vertically fixed on the bottom plate, the pressing assembly comprises a cylindrical vertical rod, a connecting plate and a second screw knob, the vertical rod is vertically fixed on the bottom plate, and the connecting plate is sleeved on the vertical rod; the inspection assembly comprises guide rails, a sliding block and a laser level bar, the support is vertically fixed on the bottom plate, the two guide rails are respectively fixed on the bottom plate and the support, the guide rails are located between the shaping comb fixing seat and the device loading seat, the sliding block is sleeved on the guide rails, and the laser level bar is fixed on the sliding block. The utility model has small volume, simple operation, wide application range and high working efficiency and can simultaneously ensure the clearance and the coplanarity of the pins.
Description
Technical Field
The utility model relates to integrated circuit pin shaping, in particular to a device for shaping SOP and QFP package pins.
Background
The QFP package is a gull wing (L) type with pins led out from four sides of the package, the SOP package is a gull wing (L) type with pins led out from two sides of the package, and during the component screening and detecting process, the pins of the component are deformed due to clamping dislocation of a tool, dropping of the component or extrusion collision. Along with the development of integrated circuits, the integration level is higher and higher, pins are more and more, the distance is smaller and smaller, the pins cannot adjust the pin gap to be consistent with the coplanarity after being deformed by manual correction, and the phenomena of failure such as insufficient soldering, series connection and the like often occur during automatic soldering on a circuit board. In the prior art, full-automatic shaping equipment from a Singapore FP-50 is used for shaping SOP/QFP packaging pins, the equipment not only needs to manually preprocess and adjust pin gaps of samples, but also needs to carry out parameter setting and adjustment on each surface of the pins, the debugging workload is large, whether dense pins meet the gap of a shaping comb or not when full-automatic shaping is carried out on the equipment cannot be guaranteed, and damage to devices and the shaping comb is often caused in practice. Because the length of each device pin is inconsistent with the rigidity of the material, the pin can not be ensured to restore the original point after being integrally deformed, usually, the pin can be integrally deviated to a certain direction, the adjustment of the parameter needs to be continuously adjusted, repeated shaping is carried out to observe and verify, and the pin is easily broken due to the bending stress fatigue of the pin. In addition, the deformation of the pins caused by statistical screening, transportation, packaging and the like in work is usually only a few occasionally, the deformation amount is one-side or two-side deformation, the debugging time is too long under the condition of small quantity and excessive device types, and the use of FP-50 full-automatic shaping equipment consumes manpower and time extremely and is not beneficial to one-line production.
Aiming at the defects in the prior art, the utility model provides the device for shaping the pins of the SOP and QFP packages, which has the advantages of small volume, simple operation, wide application range and high working efficiency, and can simultaneously ensure the pin clearance and the coplanarity.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a device for shaping pins of SOP and QFP packages, which has small volume, simple operation, wide application range and high working efficiency and can simultaneously ensure the pin clearance and coplanarity.
In order to achieve the purpose, the utility model adopts the following technical scheme: a device for shaping SOP and QFP packaging pins comprises a bottom plate and an XYZ three-axis motion platform fixed on the bottom plate, and is characterized by further comprising a shaping comb fixing seat, a shaping comb, a device loading seat, a pressing assembly, an inspection assembly and a support; the shaping comb fixing seat is installed on the XYZ three-axis motion platform and comprises a long strip-shaped observation port, a first threaded through hole and a first screw knob, a cylindrical through hole corresponding to the first threaded through hole is formed in the shaping comb, and the shaping comb is inserted into the shaping comb fixing seat and then fixed with the first threaded through hole and the cylindrical through hole through the first screw knob in a matched mode; the device loading seat is vertically fixed on the bottom plate, the compressing assembly comprises a cylindrical vertical rod, a connecting plate and a second screw knob, the vertical rod is vertically fixed on the bottom plate, the connecting plate is sleeved on the vertical rod, and a second threaded through hole matched with the second screw knob is formed in the connecting plate; the inspection assembly comprises guide rails, a sliding block and a laser level bar, the support is vertically fixed on the bottom plate, the two guide rails are respectively fixed on the bottom plate and the support, the guide rails are located between the shaping comb fixing seat and the device loading seat, the sliding block is sleeved on the guide rails, and the laser level bar is fixed on the sliding block.
Furthermore, comb tooth gaps of the shaping comb correspond to packaging pins of the shaped object one by one.
Furthermore, limiting bulges are arranged on the periphery of the top surface of the device loading seat.
Further, the cylindrical vertical rod is adjacent to the device loading seat and far away from the shaping comb fixing seat.
The working process of the utility model is as follows:
1. preparation work: selecting a corresponding device loading base and a shaping comb according to the device packaging size and the pin pitch; embedding the shaping comb into a shaping comb fixing seat, and rotating a first screw knob to fix the shaping comb; placing the shaped object on a device loading seat, and rotating a second screw knob to fix the shaped object; and observing the positions of the pins from the elongated observation port, and simultaneously adjusting X, Y the shaft platform to adjust the shaping comb to the tail ends of the pins, so that all the pins are correspondingly inserted into the comb tooth gaps of the shaping comb.
2. Adjusting the pin clearance: the laser leveling instrument which is horizontally arranged is opened, the slide block is pushed to adjust the position of a laser line, an undeformed positioning pin is selected, the laser leveling instrument is adjusted to enable the laser line to be coincided with the positioning pin, the X-axis platform is adjusted, the shaping comb drives the pin to move left and right, the whole body is consistent and slightly deformed, and finally the X-axis platform is adjusted to enable the laser line to be coincided with the positioning pin.
3. Adjusting coplanarity of pins: selecting an undeformed pin plane on one side, adjusting a laser level bar vertically arranged to keep a laser line and a device pin plane on the same line, adjusting a Z-axis platform, driving the pins to move up and down by the front end plane of a shaping comb base to wholly and uniformly deform slightly, and finally adjusting the Z-axis platform to enable the laser line and the plane of the shaped pins to be completely superposed.
According to the utility model, the shaping comb corresponding to the packaging pin of the shaped object is selected, and a laser line is shot out as a reference plane through the horizontal laser level ruler and the vertical laser level ruler by virtue of the XYZ three-axis motion platform, so that the pin clearance and coplanarity can be simultaneously ensured, and the working efficiency is effectively improved.
The utility model has small volume, simple operation and wide application range.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the shaping comb of the present invention inserted into the shaping comb holder;
FIG. 3 is a schematic structural view of a fixing base (without a first screw knob) of the shaping comb of the present invention;
FIG. 4 is a schematic view of a shaping comb of the present invention;
FIG. 5 is a schematic view of the device carrier and hold-down assembly of the present invention;
FIG. 6 is a schematic view of a connection plate structure of the present invention;
FIG. 7 is a schematic view of the inspection assembly of the present invention.
In the figure, 1-base plate; 2-XYZ three-axis motion platform; 3-a shaping comb fixing seat; 3.1-strip-shaped observation port; 3.2-first threaded through hole; 3.3-first screw knob; 4-shaping comb; 4.1-cylindrical through hole; 5-a device loading base; 6-a pressing component; 6.1-cylindrical vertical rod; 6.2-connecting plate; 6.2.1-a second threaded through hole; 6.3-second screw knob; 7-inspecting the component; 7.1-guide rail; 7.2-sliding block; 7.3-laser level bar; 8-bracket.
Detailed Description
The utility model is further described below with reference to the following figures and examples, which should not be construed as limiting the utility model.
The device for shaping the SOP and QFP package pins comprises a base plate 1, an XYZ three-axis motion platform 2 fixed on the base plate 1, a shaping comb fixing seat 3, a shaping comb 4, a device loading seat 5, a pressing assembly 6, an inspection assembly 7 and a support 8, wherein the shaping comb fixing seat is fixedly arranged on the base plate; the shaping comb fixing seat 3 is installed on the XYZ three-axis motion platform 2, the shaping comb fixing seat 3 comprises a strip-shaped observation port 3.1, a first threaded through hole 3.2 and a first screw knob 3.3, a cylindrical through hole 4.1 corresponding to the first threaded through hole 3.2 is formed in the shaping comb 4, and the shaping comb 4 is inserted into the shaping comb fixing seat 3 and then fixed with the first threaded through hole 3.2 and the cylindrical through hole 4.1 through the first screw knob 3.3 in a matched mode; the device loading seat 5 is vertically fixed on the bottom plate 1, the compressing assembly 6 comprises a cylindrical vertical rod 6.1, a connecting plate 6.2 and a second screw knob 6.3, the vertical rod 6.1 is vertically fixed on the bottom plate 1, the connecting plate 6.2 is sleeved on the vertical rod 6.1, and a second threaded through hole 6.2.1 matched with the second screw knob 6.3 is formed in the connecting plate 6.2; the inspection assembly 7 comprises guide rails 7.1, a sliding block 7.2 and a laser horizontal ruler 7.3, the support 8 is vertically fixed on the bottom plate 1, the two guide rails 7.1 are respectively fixed on the bottom plate 1 and the support 8, the guide rails 7.1 are positioned between the shaping comb fixing seat 3 and the device loading seat 5, the sliding block 7.2 is sleeved on the guide rails 7.1, and the laser horizontal ruler 7.3 is fixed on the sliding block 7.2.
The preferred embodiments are: in the above scheme, the comb tooth gaps of the shaping comb 4 correspond to the package pins of the object to be shaped one by one.
The preferred embodiments are: in the above scheme, the periphery of the top surface of the device loading seat 5 is provided with a limiting bulge.
The preferred embodiments are: in the above solution, the cylindrical vertical rod 6.1 is adjacent to the device-loading base 5 and away from the shaping comb-holding base 3.
Those not described in detail in this specification are prior art to the knowledge of those skilled in the art.
Claims (5)
1. A device for shaping SOP and QFP package pins comprises a base plate (1) and an XYZ three-axis motion platform (2) fixed on the base plate (1), and is characterized in that: the device is characterized by also comprising a shaping comb fixing seat (3), a shaping comb (4), a device loading seat (5), a pressing assembly (6), an inspection assembly (7) and a support (8); the shaping comb fixing seat (3) is installed on the XYZ three-axis motion platform (2), the shaping comb fixing seat (3) comprises a long strip-shaped observation port (3.1), a first threaded through hole (3.2) and a first screw knob (3.3), a cylindrical through hole (4.1) corresponding to the first threaded through hole (3.2) is formed in the shaping comb (4), and the shaping comb (4) is inserted into the shaping comb fixing seat (3) and then is fixed with the first threaded through hole (3.2) and the cylindrical through hole (4.1) through the first screw knob (3.3) in a matched mode; the device loading seat (5) is vertically fixed on the bottom plate (1), the pressing assembly (6) comprises a cylindrical vertical rod (6.1), a connecting plate (6.2) and a second screw knob (6.3), the vertical rod (6.1) is vertically fixed on the bottom plate (1), the connecting plate (6.2) is sleeved on the vertical rod (6.1), and a second threaded through hole (6.2.1) matched with the second screw knob (6.3) is formed in the connecting plate (6.2); the inspection assembly (7) comprises guide rails (7.1), a sliding block (7.2) and a laser horizontal ruler (7.3), the support (8) is vertically fixed on the bottom plate (1), the two guide rails (7.1) are respectively fixed on the bottom plate (1) and the support (8), the guide rails (7.1) are located between the shaping comb fixing seat (3) and the device loading seat (5), the sliding block (7.2) is sleeved on the guide rails (7.1), and the laser horizontal ruler (7.3) is fixed on the sliding block (7.2).
2. The apparatus of claim 1 for SOP and QFP package pin shaping, wherein: and comb tooth gaps of the shaping comb (4) correspond to the packaging pins of the shaped object one by one.
3. The apparatus for SOP and QFP package pin shaping of claim 1 or 2, wherein: and limiting bulges are arranged on the periphery of the top surface of the device loading seat (5).
4. The apparatus for SOP and QFP package pin shaping of claim 1 or 2, wherein: the cylindrical upright rod (6.1) is adjacent to the device loading seat (5) and is far away from the shaping comb fixing seat (3).
5. The apparatus of claim 3 for SOP and QFP package pin shaping, wherein: the cylindrical upright rod (6.1) is adjacent to the device loading seat (5) and is far away from the shaping comb fixing seat (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122077600.6U CN215966024U (en) | 2021-08-31 | 2021-08-31 | Device for shaping SOP (self-aligned package) and QFP (quad Flat Package) package pins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122077600.6U CN215966024U (en) | 2021-08-31 | 2021-08-31 | Device for shaping SOP (self-aligned package) and QFP (quad Flat Package) package pins |
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| Publication Number | Publication Date |
|---|---|
| CN215966024U true CN215966024U (en) | 2022-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122077600.6U Active CN215966024U (en) | 2021-08-31 | 2021-08-31 | Device for shaping SOP (self-aligned package) and QFP (quad Flat Package) package pins |
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| CN (1) | CN215966024U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114871353A (en) * | 2022-05-24 | 2022-08-09 | 南京睿芯峰电子科技有限公司 | Shaping structure and method for packaging outer lead |
| CN117706432A (en) * | 2024-02-02 | 2024-03-15 | 合肥中航天成电子科技有限公司 | Pin detection equipment for SOP packaging element |
-
2021
- 2021-08-31 CN CN202122077600.6U patent/CN215966024U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114871353A (en) * | 2022-05-24 | 2022-08-09 | 南京睿芯峰电子科技有限公司 | Shaping structure and method for packaging outer lead |
| CN114871353B (en) * | 2022-05-24 | 2024-05-03 | 南京睿芯峰电子科技有限公司 | Shaping structure and method for packaging outer leads |
| CN117706432A (en) * | 2024-02-02 | 2024-03-15 | 合肥中航天成电子科技有限公司 | Pin detection equipment for SOP packaging element |
| CN117706432B (en) * | 2024-02-02 | 2024-04-30 | 合肥中航天成电子科技有限公司 | Pin detection equipment for SOP packaging element |
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