CN202738277U

CN202738277U - SMT preprocessing device for POP package

Info

Publication number: CN202738277U
Application number: CN 201220463663
Authority: CN
Inventors: 梁锦贤
Original assignee: Individual
Current assignee: Individual
Priority date: 2012-09-12
Filing date: 2012-09-12
Publication date: 2013-02-13
Anticipated expiration: 2022-09-12

Abstract

The utility model discloses a SMT (surface mount technology) preprocessing device for POP (package-on-package) packages. The SMT preprocessing device comprises a printing machine, a SMT machine, a reflow, a steel mesh and a jig. The steel mesh is provided with one or more open pore array which is disposed in a printing area of the printing machine. The jig is provided with IC grooves which are in one-to-one correspondence with the open pore array, and the IC grooves are used to hold lower layer ICs of the POP packages. The IC grooves are provided with central vias. The IC grooves comprises first steps and second steps disposed on a lower part of an inner side of the first steps. The device uses an existing universal SMT production device, a special-purpose device with relatively high cost is not needed, and special-purpose production auxiliary materials with relatively high cost are not needed, thereby greatly reducing cost input. Through the device, upper layer ICs and lower layer ICs of the POP packages are made into an integrated one in advance and defects of a conventional POP package processing technology are overcome. The SMT preprocessing device greatly simplifies and mounting and welding difficulty of the POP packages, so that the device is simple and efficient, and greatly improves reliability of products.

Description

A kind of POP packaging SMT preprocessing device

Technical field

The utility model relates to the surface mounting technology field, relates in particular to a kind of POP packaging SMT preprocessing device.

Background technology

Mobile communication product is just turning to 3G (Third Generation) Moblie (3G) system, it provides more bandwidth (per second 1-2M bit), can transmit more data at wireless network, this not only requires the faster Digital Signal Processing time, also require the faster memory response time, therefore the reliability of packaging is had higher requirement, to this, many schemes have been designed in the industry, such as stacked package (POP).

The 22nd chapters and sections (Fine-pitch in the JSTD95 standard, Square Ball grid Array Package (FBGA) Package-on-Package (POP), in September, 2007, the B version) in, define the POP size and be 21 X 21mm to the maximum, pin-pitch 0.4mm, 0.5mm, 0.65mm and 0.80mm have higher requirement to production technology.At present, the upper and lower layer IC(chip of POP packaging) usually adopt the SMT(surface mounting technology) produce, namely utilize printing machine, chip mounter, these SMT equipment of reflow stove that upper and lower layer IC mounted, welds, its concrete grammar is: at first carry out the preparation that the POP packaging mounts, namely the POP special use is flown to reach and be contained on the corresponding chip mounter, and fly to reach pallet at POP and put into the special-purpose production auxiliary materials of POP (the special-purpose weld-aiding cream of POP or the special-purpose tin cream of POP), utilize the scraper that flies to reach that auxiliary material is struck off; After finishing above-mentioned preparation, SMT line body drops into PCB and carries out paste solder printing, the IC of lower floor that carries out the POP packaging at the PCB that finishes printing mounts, then recycling is equipped with chip mounter that the POP special use flies to reach and picks up the upper strata IC of POP packaging and upper strata IC is moved to the POP special use and fly to reach the pallet top, and be displaced downwardly to a certain height on the pallet according to the parameter of chip mounter setting, make the tin ball on the upper strata IC lower surface of POP packaging dip in auxiliary material, chip mounter is positioned over the upper strata IC that has dipped in auxiliary material the upper surface of the IC of lower floor more accurately, the tin ball of upper strata IC lower surface and the solder joint of the IC of lower floor upper surface are bondd mutually, at last the POP packaging of bonding is sent into the reflow stove, finish the welding of ashbury metal.

Yet, chip mounter upgrading or renewal, POP special use fly to reach, the special-purpose production auxiliary materials of POP all needs higher cost to drop into, and dip in the amount of auxiliary material and when mounting upper strata IC touch the IC of lower floor to cause displacement all be the difficult point of production process control, be easy to cause the common deficiency on the production technology, such as the pillow nest 1 among Fig. 1: the tin ball 21 of upper strata IC2 with become the figure of eight after the solder joint 31 of the IC3 of lower floor is finished welding, also have back taper 4: upper and lower layer solder joint in echelon, solder joint is unequal with the bonding area of upper and lower layer IC respectively, differs larger.Thereby affect the reliability of product, and the section of desirable solder joint 5 should be such as column, solder joint approaches with the bonding area of upper and lower layer IC respectively and equates very much, is very beneficial for the raising of product reliability.

The utility model content

For the deficiencies in the prior art, the purpose of this utility model is intended to provide a kind of simple and effective, POP packaging SMT preprocessing device with low cost, of fine qualities.

The utility model adopts following technical scheme for achieving the above object:

A kind of POP packaging SMT preprocessing device comprises printing machine, chip mounter, reflow stove, steel mesh and smelting tool, wherein, is provided with one or more opening arrays that are positioned at the press printing scope on the steel mesh; Described smelting tool offers and opening array IC groove one to one, is used for the IC of lower floor of accommodating POP packaging, and the IC groove is provided with central through hole, and the IC groove comprises the first ladder and the second ladder that is positioned at the first ladder side-lower.

Wherein, described printing machine is provided with for the CCD alignment system that steel mesh and smelting tool is carried out exactitude position, corresponding, be provided with anchor point on the periphery of steel mesh, be provided with the lower anchor point that matches with upper anchor point on the periphery of described smelting tool, identify in process of production upper and lower anchor point by the CCD alignment system and come steel mesh and smelting tool are carried out exactitude position.

Wherein, described upper anchor point has two at least, is arranged at the place, diagonal angle of steel mesh, and described lower anchor point also has two at least, is arranged at the place, diagonal angle of smelting tool.

Wherein, the perforate of described opening array is circular or square.

Wherein, described central through hole is circular or square.

A kind of POP packaging SMT preprocessing device that the utility model is set forth, its beneficial effect is: this device adopts the general production equipment of present SMT, need not the higher special equipment of price, also need not the higher special-purpose production auxiliary materials of price during use, greatly reducing cost drops into, and in advance the upper and lower layer IC of POP packaging is processed into one by this device, effectively overcome the defective on the conventional P OP packaging processing technology, that greatly simplifies the POP packaging mounts, welds difficulty, thereby simple and effective, significantly improved the reliability of product.

Description of drawings

Fig. 1 adopts existing processing unit (plant) to process existing defective diagram;

Fig. 2 is the configuration diagram of steel mesh among the utility model embodiment;

Fig. 3 is the configuration diagram of smelting tool among the utility model embodiment;

Fig. 4 is that the partial structurtes of smelting tool among the utility model embodiment are amplified diagram;

Fig. 5 is among the utility model embodiment, and the IC of lower floor is placed in the view in the smelting tool IC groove;

Fig. 6 is among the utility model embodiment, and steel mesh is pressed together on the view on the smelting tool that is equipped with the IC of lower floor;

Fig. 7 is among the utility model embodiment, and chip mounter is mounted on view on the IC of lower floor with the upper strata IC of POP packaging;

Fig. 8 is among the utility model embodiment, and the upper and lower layer IC of POP packaging finishes the view of welding;

Fig. 9 is among the utility model embodiment, the POP packaging after upper and lower layer IC finishes welding, the view of finally from the IC groove, taking out.

Description of reference numerals:

1, pillow nest; 2, upper strata IC; 21, tin ball; 3, the IC of lower floor; 31, solder joint; 4, back taper; 5, desirable solder joint; 10, printing machine; 20, chip mounter; 30, reflow stove; 40, steel mesh; 41, opening array; 42, upper anchor point; 50, smelting tool; 51, IC groove; 511, central through hole; 512, the first ladder; 513, the second ladder; 52, lower anchor point; 60, upper strata IC; 70, the IC of lower floor; 71, body; 72, tin ball; 80, POP packaging.

Embodiment

Come the utility model is further described below in conjunction with accompanying drawing and specific embodiment.

Please refer to Fig. 2 to shown in Figure 9, it has demonstrated the concrete structure of the utility model preferred embodiment, a kind of POP packaging SMT preprocessing device, comprise printing machine 10, chip mounter 20, reflow stove 30, steel mesh 40 and smelting tool 50, wherein, such as Fig. 2, be provided with one or more opening arrays 41 that are positioned at printing machine 10 print range on the steel mesh 40, when opening array 41 only is one, it preferentially is arranged at the center of steel mesh 40, when a plurality of, opening array 41 is put the quantity that increases opening array 41 to radiation all around centered by steel mesh 40 centers, can enhance productivity to greatest extent like this, and the perforate of opening array 41 can be circle, square or other shape, if be circular, the aperture of perforate should be less than the diameter of the tin ball of upper strata IC60 lower surface.Such as Fig. 3, Fig. 4, described smelting tool 50 offers and opening array 41 IC groove 51 one to one, the IC70 of lower floor that is used for accommodating POP packaging 80, IC groove 51 is provided with central through hole 511, central through hole 511 can be circle, square or other shape, and during production, the vacuum pump of printing machine 10 is by these central through hole 511 vacuum suction layer IC70 that stay, thereby realize the location to the IC70 of lower floor, IC groove 51 comprises the first ladder 512 and the second ladder 513 that is positioned at the first ladder 512 side-lowers.

For ease of steel mesh 40 and smelting tool 50 are positioned, described printing machine 10 is provided with for the CCD alignment system that steel mesh 40 and smelting tool 50 is carried out exactitude position, corresponding, be provided with anchor point 42 on the periphery of steel mesh 40, be provided with the lower anchor point 52 that matches with upper anchor point 42 on the periphery of smelting tool 50, identify in process of production upper and lower anchor point by the CCD alignment system and come steel mesh 40 and smelting tool 50 are carried out exactitude position.Upper anchor point 42 will have two at least, be arranged at the place, diagonal angle of steel mesh 40, equally, lower anchor point 52 also will have two at least, is arranged at the place, diagonal angle of smelting tool 50, certainly, upper anchor point 42 is not limited to two with lower anchor point 52, also can be three, four or more, and upper anchor point 42 is the sign round dots that form high-contrast with steel mesh 40 true qualities, 52 of lower anchor points are the sign round dots that forms high-contrast with smelting tool 50 true qualities, and both all can be identified by the CCD alignment system.

When adopting this device to carry out production and processing, its idiographic flow is: at first, the IC70 of lower floor of POP packaging 80 is put into the IC groove 51 (such as Fig. 5) of the correspondence that smelting tool 50 offers; Then, the steel mesh 40 that is provided with the opening array 41 corresponding with IC groove 51 printing machine 10 of packing into, add production auxiliary materials at the non-tapping of steel mesh 40; Then, the smelting tool 50 that installs POP packaging 80 IC70 of lower floor is sent into printing machine 10, after the contraposition through the CCD alignment system, steel mesh 40 is pressed together on the upper surface of smelting tool 50, and the opening array 41 of steel mesh 40 is positioned on the IC70 of lower floor of corresponding IC groove 51; Then, start printing machine 10, the scraper of printing machine 10 moves back and forth, and production auxiliary materials is scraped in the perforate of steel mesh 40, finishes the printing (such as Fig. 6) of the upper surface solder joint production auxiliary materials of the IC70 of lower floor; Follow again, smelting tool 50 is sent into chip mounter 20, chip mounter 20 picks up the upper strata IC60 of POP packaging 80 and it is positioned on the IC70 of lower floor accurately, it is bonding that the tin ball of upper strata IC60 lower surface and the IC70 of lower floor are printed with the upper surface solder joint of production auxiliary materials, finishes upper and lower layer IC and mount (such as Fig. 7); After this, the POP packaging 80 of finishing after mounting is sent into reflow stove 30, finish the upper and lower layer IC welding to POP packaging 80, (such as Fig. 8) makes it to be combined into one; At last, with the IC groove 51 interior taking-ups (such as Fig. 9) from smelting tool 50 of the POP packaging 80 that is welded as a whole.Be positioned over the IC groove 51 of smelting tool 50 when interior at the IC70 of lower floor with POP packaging 80, the body 71 of the IC70 of lower floor is by the first ladder 512 supportings of IC groove 51,72 in the tin ball of the IC70 of lower floor lower surface is positioned at the second ladder 513, that is: the length of IC groove 51, wide, high identical with the IC70 of lower floor, the height of the first ladder 512 equals body 71 height of the IC70 of lower floor, width is equal to or less than the IC70 of lower floor outermost tin ball 72 to the distance on body 71 limits, the height of the second ladder 513 is equal to or greater than the height of tin ball 72 on the IC70 of the lower floor lower surface, and width is less than body 71 width of the IC70 of lower floor.

Adopt this device, can use the general production auxiliary materials of present SMT and equipment, need not special-purpose production auxiliary materials, also need not again to buy special equipment, drop into thereby greatly reduce cost, and in advance the upper and lower layer IC of POP packaging 80 is processed into one by this device, effectively overcome the defective on conventional P OP packaging 80 processing technologys, that greatly simplifies POP packaging 80 mounts, welds difficulty, significantly improves the reliability of product.

The above, it only is the utility model preferred embodiment, be not that technical scope of the present utility model is imposed any restrictions, so every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any trickle modification, equivalent variations and modification that above embodiment does.

Claims

1. a POP packaging SMT preprocessing device is characterized in that, comprises printing machine, chip mounter, reflow stove, steel mesh and smelting tool, wherein, is provided with one or more opening arrays that are positioned at the press printing scope on the described steel mesh; Described smelting tool offers and opening array IC groove one to one, is used for the IC of lower floor of accommodating POP packaging, and the IC groove is provided with central through hole, and the IC groove comprises the first ladder and the second ladder that is positioned at the first ladder side-lower.

2. a kind of POP packaging SMT preprocessing device according to claim 1, it is characterized in that, described printing machine is provided with for the CCD alignment system that steel mesh and smelting tool is carried out exactitude position, corresponding, be provided with anchor point on the periphery of steel mesh, be provided with the lower anchor point that matches with upper anchor point on the periphery of described smelting tool, identify in process of production upper and lower anchor point by the CCD alignment system and come steel mesh and smelting tool are carried out exactitude position.

3. a kind of POP packaging SMT preprocessing device according to claim 2 is characterized in that described upper anchor point has two at least, is arranged at the place, diagonal angle of steel mesh, and described lower anchor point also has two at least, is arranged at the place, diagonal angle of smelting tool.

4. a kind of POP packaging SMT preprocessing device according to claim 1 is characterized in that, the perforate of described opening array is circular or square.

5. a kind of POP packaging SMT preprocessing device according to claim 1 is characterized in that, described central through hole is circular or square.