CN216087160U

CN216087160U - Air guide plate for PCB solder mask and resin hole plugging process

Info

Publication number: CN216087160U
Application number: CN202122237847.XU
Authority: CN
Inventors: 陈超; 谢小南
Original assignee: Jiuyang Sunshine Pcb Technology Co ltd
Current assignee: Jiuyang Sunshine Pcb Technology Co ltd
Priority date: 2021-09-15
Filing date: 2021-09-15
Publication date: 2022-03-18
Anticipated expiration: 2031-09-15

Abstract

The utility model discloses a gas guide plate for PCB solder mask and resin hole plugging procedures, which comprises: the air guide plate comprises an air guide plate body, wherein air guide holes of a blind hole structure are concavely arranged on one surface of the air guide plate body, the number of the air guide holes is multiple, the air guide holes are uniformly distributed on the surface of the air guide plate body, air holes of a through hole structure are formed in the hole bottoms of the air guide holes, and the aperture of each air hole is smaller than that of each air guide hole, so that one air guide hole can cover multiple plug holes in a PCB (printed circuit board), namely, air guide of the multiple plug holes in the PCB can be realized by drilling one air hole of the through hole structure in the air guide plate body, the number of drilled holes is reduced, the manufacturing efficiency of the air guide plate and the structural strength of the air guide plate are improved, the air guide effect is improved, the phenomena of plug hole depression, plug hole cracking, plug hole incomplete filling, plug hole garbage and the like are avoided, and the manufacturing cost of manual production and electricity utilization is also reduced.

Description

Air guide plate for PCB solder mask and resin hole plugging process

Technical Field

The utility model relates to the field of PCB production tools, in particular to a gas guide plate for PCB solder mask and resin hole plugging procedures.

Background

As more and more electronic products tend to be portable and multifunctional, the number of holes of the PCB is forced to be more and the density of the holes is forced to be relatively increased. In the prior art, in order to cause the phenomenon of poor hole plugging caused by oil sticking on the machine table surface during the solder mask hole plugging and resin hole plugging working section, an air guide plate is generally arranged. The conventional air guide plate is manufactured by drilling through air holes according to the original hole number, and the following defects occur in the manufacturing process: the more the number of holes, the longer the production time; the more the dense hole areas are, the more the dense hole areas are easy to drill, and the air guide plate is easy to scatter and damage, so that the filling degree of the plugged holes, the sunken plugged holes, the cracking and the like of the dense hole areas are influenced; the larger the pore diameter range is, the easier the air guide plate is drilled and broken to generate PP dust so as to generate hole plugging garbage.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a gas guide plate for a PCB solder mask and resin hole plugging process, which solves one or more technical problems in the prior art and at least provides a beneficial choice or creation condition.

The technical scheme adopted for solving the technical problems is as follows:

the utility model provides a gas guide plate for PCB solder mask and resin hole plugging procedures, which comprises: the air guide plate body is characterized in that a plurality of air guide holes with blind hole structures are concavely arranged on one surface of the air guide plate body, the number of the air guide holes is multiple, the air guide holes are uniformly distributed on the surface of the air guide plate body, air holes with through hole structures are formed in the hole bottoms of the air guide holes, and the hole diameters of the air holes are smaller than those of the air guide holes.

The utility model has the beneficial effects that: the aperture of air guide hole in this technique is greater than the aperture of bleeder vent, a air guide hole that can make can cover a plurality of consent on the PCB board like this, that is to say, the air guide to a plurality of consent on the PCB board can be realized to the bleeder vent of a perforating hole structure of drilling out on the air guide plate body, just so reduce the quantity of drilling, the efficiency of air guide plate manufacturing and the structural strength of air guide plate are improved, the effect of air guide is improved, avoid appearing the consent sunken, the consent fracture, the consent is not full, phenomenons such as consent rubbish, the manufacturing cost of production manual work and power consumption has also been reduced simultaneously.

As a further improvement of the technical scheme, the thickness of the air guide plate body is 2.4-2.6mm, and the depth of the air guide hole is 2.0-2.2 mm. This scheme is satisfying under the prerequisite of air guide for the air guide plate body has stronger structural strength.

As a further improvement of the technical scheme, the distance between the edge of the air hole and the inner edge of the air guide hole is more than or equal to 0.4 mm. Therefore, the uniformity of other air guide holes is better facilitated, and the structural strength of the air guide plate body is also improved.

As a further improvement of the technical scheme, the aperture of the air guide hole is 2.3-2.5mm, and the aperture of the air vent is 1.8-2.0 mm. The hole plugging hole diameter of the conventional resin and solder mask section is about 0.5mm, so that more than 4 plug holes can be covered by the air guide hole.

As a further improvement of the technical scheme, the air guide holes are arranged in an array. The arrangement is more orderly, and the coverage area of the air guide is larger.

As a further improvement of the technical scheme, the air guide holes and the air holes are concentrically arranged. Thus, the air guiding at the peripheral edge of the air guide hole is more uniform.

Drawings

The utility model is further described with reference to the accompanying drawings and examples;

FIG. 1 is a schematic structural diagram of an embodiment of an air guide plate for PCB solder mask and resin hole plugging processes provided by the present invention;

FIG. 2 is a top view of an embodiment of the air guide plate for PCB solder mask and resin via hole process provided by the present invention;

FIG. 3 is a sectional view A-A of FIG. 2;

fig. 4 is a partially enlarged view of a portion B in fig. 3.

Detailed Description

Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, if words such as "a plurality" are described, the meaning is one or more, the meaning of a plurality is two or more, more than, less than, more than, etc. are understood as excluding the present number, and more than, less than, etc. are understood as including the present number.

In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.

Referring to fig. 1 to 4, the following embodiments are made for an air guide plate used in a PCB solder mask and resin via hole process of the present invention: the method comprises the following steps: the air guide plate comprises an air guide plate body 100, wherein a blind hole structure air guide hole 110 is concavely arranged on one surface of the air guide plate body 100, the number of the air guide holes 110 is multiple, the air guide holes 110 are uniformly distributed on the surface of the air guide plate body 100, the air guide holes 110 are arranged in an array manner in the embodiment, the arrangement is more orderly, and the air guide coverage area is larger; in other embodiments, the air holes 110 may be spaced in other manners, and may be determined according to different PCB boards.

The bottom of the air guide hole 110 is provided with an air hole 120 with a through hole structure, wherein the aperture of the air hole 120 is smaller than that of the air guide hole 110, so that one air guide hole 110 can cover a plurality of plug holes on the PCB, that is, the air guide hole 120 with one through hole structure is drilled on the air guide plate body 100, so that air guide for the plurality of plug holes on the PCB can be realized, the number of drilled holes is reduced, the manufacturing efficiency of the air guide plate and the structural strength of the air guide plate are improved, the air guide effect is improved, the phenomena of plug hole depression, plug hole cracking, plug hole insufficiency, plug hole garbage and the like are avoided, and the manufacturing cost of production labor and electricity is reduced.

The conventional air guide holes are designed to be larger than the hole plugging hole diameter, or the adhesive air guide plate is easy to generate, and the air guide holes with the different hole diameters are drilled according to the hole plugging hole diameter, so that the dense hole area is easy to drill, and the hole plugging fullness is influenced, therefore, the air guide holes 110 of the embodiment are designed not to drill, and the air guide holes 120 are drilled, and during manufacturing, the air guide holes 110 are drilled after the air guide holes 120 are drilled.

Further, the thickness of the air guide plate body 100 is 2.4-2.6mm, the depth of the air guide hole 110 is 2.0-2.2mm, the thickness of the air guide plate body 100 in this embodiment is 2.5mm, and the depth of the air guide hole 110 is 2.1mm, so that the air guide plate body 100 has strong structural strength on the premise of meeting air guidance.

And the aperture of the air guide hole 110 is 2.3-2.5mm, and the aperture of the air hole 120 is 1.8-2.0 mm. The aperture of the air guide hole 110 of the embodiment is 2.4mm, the aperture of the air vent 120 is 2.0mm, and the conventional method is to drill all the plug holes, so the required time is equivalent to the time for drilling one plate, and the embodiment drills the air guide hole 110 with the aperture of 2.4mm, that is, if the plug hole aperture is 0.25mm in the coverage range of the air guide hole 110 with the aperture of 2.4mm, the speed can be increased by 8 times.

The distance between the edge of the air hole 120 and the inner edge of the air guide hole 110 is more than or equal to 0.4 mm. Therefore, the uniformity of other air guide holes 110 is facilitated, the structural strength of the air guide plate body 100 is improved, and the air guide holes 110 and the air holes 120 are concentrically arranged, so that air guide at the peripheral edges of the air guide holes 110 is more uniform.

Such as according to the conventional orifice size accounting of 0.25mm, the production can simultaneously increase the speed of manufacturing the gas guide plate by 6-8 times.

While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that the present invention is not limited to the details of the embodiments shown and described, but is capable of numerous equivalents and substitutions without departing from the spirit of the utility model as set forth in the claims appended hereto.

Claims

1. The utility model provides a lead aerofoil that is used for PCB to hinder to weld and resin consent process which characterized in that: it includes: air guide plate body (100) the concave air guide hole (110) that are equipped with the blind hole structure in a surface of air guide plate body (100), the quantity of air guide hole (110) is a plurality of, and is a plurality of air guide hole (110) equipartition is on the surface of air guide plate body (100), the hole bottom of air guide hole (110) is provided with bleeder vent (120) of perforating hole structure, the aperture of bleeder vent (120) is less than the aperture of air guide hole (110).

2. The air guide plate for PCB solder mask and resin hole plugging process as claimed in claim 1, wherein: the thickness of the air guide plate body (100) is 2.4-2.6mm, and the depth of the air guide hole (110) is 2.0-2.2 mm.

3. The air guide plate for PCB solder mask and resin hole plugging process as claimed in claim 2, wherein: the aperture of the air guide hole (110) is 2.3-2.5mm, and the aperture of the air hole (120) is 1.8-2.0 mm.

4. The air guide plate for PCB solder mask and resin hole plugging process as claimed in claim 1, wherein: the air guide holes (110) are arranged in an array.

5. The air guide plate for PCB solder mask and resin hole plugging process as claimed in claim 1, wherein: the distance between the edge of the air hole (120) and the inner edge of the air guide hole (110) is more than or equal to 0.4 mm.

6. The air guide plate for PCB solder mask and resin hole plugging process as claimed in claim 5, wherein: the air guide holes (110) and the air holes (120) are concentrically arranged.