CN205096734U - Special tool board of radium -shine drilling of FPC - Google Patents
Special tool board of radium -shine drilling of FPC Download PDFInfo
- Publication number
- CN205096734U CN205096734U CN201520606548.0U CN201520606548U CN205096734U CN 205096734 U CN205096734 U CN 205096734U CN 201520606548 U CN201520606548 U CN 201520606548U CN 205096734 U CN205096734 U CN 205096734U
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- CN
- China
- Prior art keywords
- hole
- aperture
- fpc
- radium
- wiring board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a special tool board of radium -shine drilling of FPC, body including the tool board, the bits hole has been seted up on the body, expand and form the air vent that the aperture is greater than to fall bits hole aperture outside falling to considering to be worth doing the bottom in hole, a plurality of suction holes have still been seted up on the body, a lateral part of body has been offered two and has been drawn material skew affirmation hole, and be two distributions, the affirmation hole that is used for confirming the position of FPC circuit board is all offered to two bight positions of body, along drawing the flich to draw material skew registration hole to having offered two manual works on the body, and be two distributions, two sets of movable bed registration hole that are used for confirming the position of body on the movable bed are still offered to a lateral part of body, every movable bed registration hole of group all contains six registration hole that are two ranges. The utility model discloses can so that radium -shine when drilling produced waste material can be by falling to considering to be worth doing timely the getting rid of in hole, avoid the waste material to the influence of radium -shine drilling, can be fast, the radium -shine drilling processing procedure of efficient completion, improved the yield of operating efficiency and goods.
Description
Technical field
The utility model belongs to FCB wiring board manufacture field, relates to the tool used in a kind of wiring board processing procedure, is specifically related in a kind of FPC laser drilling, is positioned in table to carry the jig plate of goods.
Background technology
In existing FPC wiring board laser drilling processing procedure, direct being positioned in table by goods is holed usually.Owing to table not being arranged the hole of corresponding blanking, thus boring waste material cannot get rid of in time, cause can not radium bore large aperture (D >=0.5mm) through hole or blind hole.
Utility model content
For overcoming deficiency of the prior art, the utility model provides a kind of FPC laser drilling special jig plate, and the waste material being intended to make boring produce is got rid of in time, drills journey with the radium adapting to various aperture.
For realizing above-mentioned technical purpose, reach above-mentioned technique effect, the utility model is achieved through the following technical solutions:
The special jig plate of a kind of FPC laser drilling, be positioned in the table of the FPC laser drilling in wiring board processing procedure, for carrying goods to hole to it, comprise the body of jig plate, described body offers exfoliation hole, the distributing position in described exfoliation hole is corresponding with the position of opening on the FPC wiring board of required boring, the bottom in described exfoliation hole extends out and forms the passage that aperture is greater than aperture, described exfoliation hole, described body also offers some suction holes, one sidepiece of described body offers two and draws material skew to confirm hole, material skew is drawn to confirm that hole is two column distributions described in two, two angular positions of described body all offer the confirmation hole of the position for confirming FPC wiring board, described body manually draws material skew registration holes along drawing material direction to offer two, two described manually drawing expect that skew registration holes is two column distributions, one sidepiece of described body also offers two groups for confirming the table registration holes of the position of described body in table, often organize described table registration holes and all comprise six registration holes arranged in two row.
Further, the aperture in described exfoliation hole is greater than the perforate on the FPC wiring board of required boring.
Further, the aperture in described exfoliation hole 0.80mm larger than the aperture of the perforate on the FPC wiring board of required boring.
Further, the aperture of described passage is 5mm.
Further, the thickness of described body is 2mm, and the degree of depth of described passage is 0.5-1mm.
Further, the aperture of described suction hole is 1.0mm.
The beneficial effects of the utility model are as follows:
The utility model by offering exfoliation hole on its body, and the bottom in exfoliation hole is extended out formation passage, the waste material produced when laser drilling can be got rid of timely by exfoliation hole, avoid waste material on the impact of laser drilling, laser drilling processing procedure can be completed fast and efficiently, improve the yield of operating efficiency and goods.
Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to better understand technological means of the present utility model, and can be implemented according to the content of description, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present utility model.Detailed description of the invention of the present utility model is provided in detail by following examples and accompanying drawing thereof.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide further understanding of the present utility model, and form a application's part, schematic description and description of the present utility model, for explaining the utility model, is not formed improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 is top view of the present utility model;
Fig. 2 is the section enlarged diagram of exfoliation hole of the present utility model and passage.
Number in the figure illustrates: 1, body; 3, bottom surface; 2, end face; 4, exfoliation hole; 5, passage; 6, material skew registration holes is manually drawn; 7, table registration holes; 8, material skew is drawn to confirm hole; 9, suction hole; 10, hole is confirmed.
Detailed description of the invention
Below with reference to the accompanying drawings and in conjunction with the embodiments, describe the utility model in detail.
Shown in Fig. 1, Fig. 2, the special jig plate of a kind of FPC laser drilling, is positioned in the table of the FPC laser drilling in wiring board processing procedure, for carrying goods to hole to it.The special jig plate of this FPC laser drilling comprises the body 1 of jig plate, described body 1 is positioned in table, its ground 3 contacts with table, when carrying out laser drilling, FPC wiring board by described body 1 a sidepiece (following side as in Fig. 1) charging and on the end face 2 of body 1 as described in being positioned over.
Described body 1 offers exfoliation hole 4, the distributing position in described exfoliation hole 4 is corresponding with the position of opening on the FPC wiring board of required boring, the bottom in described exfoliation hole 4 extends out and forms aperture and is greater than in the passage 5(accompanying drawing 1 in aperture, described exfoliation hole 4 and only illustrates that several exfoliation holes and passage are example, can adopt corresponding setting in reality according to the difference of goods).The aperture in described exfoliation hole 4 is greater than the perforate on the FPC wiring board of required boring, the aperture 0.80mm larger than the aperture of the perforate on the FPC wiring board of required boring in such as described exfoliation hole 4.And the aperture of described passage is 5mm.By the section of described body 1, the thickness h 1 of described body 1 is 2mm, and the degree of depth h2 of described passage 5 is 0.5-1mm, and described exfoliation hole 4 and described passage 5 form a stair-stepping through hole.If the close together between adjacent described exfoliation hole 4, then the described passage 5 of its correspondence can connect as one.Described body 1 also offering some apertures is 1.0mm suction hole 9.Described passage 5 is connected with getter device, when laser drilling produces waste material, the waste material sucking-off falling into described exfoliation hole 4 can be got rid of in time.
One sidepiece (i.e. feed side) of described body 1 offer two draw material skew to confirm described in 8, two, hole, to draw material skew to confirm hole 8 is in two column distributions.When charging, material skew can be drawn to confirm whether hole 8 offsets with the relative position determination charging of product edges by this.Two angular positions of described body 1 all offer the confirmation hole 10 of the position for confirming FPC wiring board, described body 1 manually draws material skew registration holes 6 along drawing material direction to offer two, two described material skew registration holes 6 of manually drawing are in two column distributions, one sidepiece of described body 1 also offers two groups for confirming the table registration holes 7 of the described position of body 1 in table, often organizes described table registration holes 7 and all comprises six registration holes arranged in two row.
The special jig plate of this FPC laser drilling can be discharged radium timely and be bored the waste material produced, and double-sided laser hole can be made to share a slice jig plate, the synchronous radium of the through hole or blind hole that can adapt to various aperture bores, both can avoid, because radium bores the waste material of generation to the harmful effect of goods, can also reaching and saving jig plate expense and exempt the object changing jig plate operation.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (1)
1. the special jig plate of FPC laser drilling, be positioned in the table of the FPC laser drilling in wiring board processing procedure, for carrying goods to hole to it, comprise the body (1) of jig plate, described body (1) offers exfoliation hole (4), the distributing position of described exfoliation hole (4) is corresponding with the position of opening on the FPC wiring board of required boring, the bottom of described exfoliation hole (4) extends out and forms the passage (5) that aperture is greater than described exfoliation hole (4) aperture, described body (1) also offers some suction holes (9), one sidepiece of described body (1) offers two and draws material skew to confirm hole (8), hole (8) is in two column distributions to draw material skew to confirm described in two, two angular positions of described body (1) all offer the confirmation hole (10) of the position for confirming FPC wiring board, described body (1) is upper manually draws material skew registration holes (6) along drawing material direction to offer two, two described material skew registration holes (6) that manually draw are in two column distributions, one sidepiece of described body (1) also offers two groups for confirming the table registration holes (7) of described body (1) position in table, often organize described table registration holes (7) and all comprise six registration holes arranged in two row, the aperture of described exfoliation hole (4) is greater than the perforate on the FPC wiring board of required boring, the aperture of described passage is 5mm, the thickness of described body (1) is 2mm, and the degree of depth of described passage (5) is 0.5-1mm, it is characterized in that: the aperture 0.80mm larger than the aperture of the perforate on the FPC wiring board of required boring of described exfoliation hole (4), the aperture of described suction hole (9) is 1.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520606548.0U CN205096734U (en) | 2015-08-13 | 2015-08-13 | Special tool board of radium -shine drilling of FPC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520606548.0U CN205096734U (en) | 2015-08-13 | 2015-08-13 | Special tool board of radium -shine drilling of FPC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205096734U true CN205096734U (en) | 2016-03-23 |
Family
ID=55512544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520606548.0U Expired - Fee Related CN205096734U (en) | 2015-08-13 | 2015-08-13 | Special tool board of radium -shine drilling of FPC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205096734U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110125561A (en) * | 2019-05-09 | 2019-08-16 | 景旺电子科技(龙川)有限公司 | A kind of method of General purpose jig RTR laser drilling |
| CN111024020A (en) * | 2019-12-18 | 2020-04-17 | 无锡深南电路有限公司 | Method for measuring thickness of measuring tool plate and circuit board metal layer |
| CN115041843A (en) * | 2022-07-01 | 2022-09-13 | 福莱盈电子股份有限公司 | Thin substrate laser drilling process and drilling jig |
-
2015
- 2015-08-13 CN CN201520606548.0U patent/CN205096734U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110125561A (en) * | 2019-05-09 | 2019-08-16 | 景旺电子科技(龙川)有限公司 | A kind of method of General purpose jig RTR laser drilling |
| CN111024020A (en) * | 2019-12-18 | 2020-04-17 | 无锡深南电路有限公司 | Method for measuring thickness of measuring tool plate and circuit board metal layer |
| CN115041843A (en) * | 2022-07-01 | 2022-09-13 | 福莱盈电子股份有限公司 | Thin substrate laser drilling process and drilling jig |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160323 Termination date: 20200813 |