CN115041843A - Thin substrate laser drilling process and drilling jig - Google Patents
Thin substrate laser drilling process and drilling jig Download PDFInfo
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- CN115041843A CN115041843A CN202210766263.8A CN202210766263A CN115041843A CN 115041843 A CN115041843 A CN 115041843A CN 202210766263 A CN202210766263 A CN 202210766263A CN 115041843 A CN115041843 A CN 115041843A
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- 239000000758 substrate Substances 0.000 title claims abstract description 137
- 238000005553 drilling Methods 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000001179 sorption measurement Methods 0.000 claims description 34
- 238000004804 winding Methods 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims 1
- 230000035515 penetration Effects 0.000 abstract description 4
- 230000006835 compression Effects 0.000 abstract description 2
- 238000007906 compression Methods 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 description 10
- 239000002699 waste material Substances 0.000 description 7
- 230000007547 defect Effects 0.000 description 6
- 230000037303 wrinkles Effects 0.000 description 5
- 238000007599 discharging Methods 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
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- 230000008602 contraction Effects 0.000 description 2
- 229920002674 hyaluronan Polymers 0.000 description 2
- 229960003160 hyaluronic acid Drugs 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Abstract
The invention discloses a thin substrate laser drilling process and a drilling jig, which comprise the following steps: manufacturing an FR4 through hole jig and a carrier film, and attaching the carrier film to the upper surface of the FR4 through hole jig; providing a laser drilling machine, and installing the FR4 through hole jig after film pasting on a processing table top of the laser drilling machine; blanking, wherein the substrate is arranged on a unreeling shaft of the laser drilling machine in a roll material mode, and a guide film is attached to the substrate on a processing table surface to enable the substrate to be placed on the upper surface of the bearing film; and starting a laser processing program. According to the thin substrate laser drilling process and the drilling jig, provided by the invention, the compression damage generated in the operation process of the thin substrate is improved by utilizing the flexibility of the bearing film, the laser deflection problem caused by the depression of the thin substrate is improved by utilizing the support property of the bearing film, the problem of poor penetration of a laser through hole is thoroughly solved, the bearing film is directly attached to the FR4 through hole jig, the laser drilling process is simplified, the production cost is reduced, and the laser drilling quality is improved.
Description
Technical Field
The invention belongs to the technical field of circuit board processing, and particularly relates to a thin substrate laser drilling process and a drilling jig.
Background
With the continuous development of electronic information technology, consumer products are required to be thinner and thinner, the internal integrated circuits of the consumer products are developed towards lighter, thinner, shorter and smaller directions, the market demands for light, small and powerful integrated circuits continuously push the printed circuit board industry to develop towards thinner circuits and higher wiring density, wherein the processing technology of the micropore through holes of thin substrates (1/3OZ and 1/4OZ) is one of the bottlenecks of PCB development, and defects such as folds, board pressing points, through holes and the like are easily generated in the production of the ultrathin substrates.
The existing thin substrate drilling process has the following problems:
1. the laser is directly processed by using the avoiding tool, and the defects are that the waste discharge holes of the jig are dense, the jig is large in hollow, the hollow holes are irregular, the substrate at the dense holes is sunken after the table board of the equipment is adsorbed, pressure points and poor folds are easily generated, and the laser focuses to cause the through holes to be not penetrated during laser processing;
2. the substrate is attached with the support film laser, and the defects of the substrate are that the film pressing and peeling processes are increased, the manufacturing cost is increased, and wrinkles and poor pressing points are generated in the film pressing and peeling processes.
A general laser drilling apparatus satisfies a substrate roll processing with a stroke of about 6m, and at present, performs laser drilling on a substrate roll with a stroke of about 2m, and a general apparatus configuration does not satisfy the processing and manufacturing of the substrate roll.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a thin substrate laser drilling process and a drilling jig, wherein the soft performance of a bearing film is utilized to improve the pressure damage generated in the operation process of a thin substrate, the support performance of the bearing film is utilized to improve the laser deflection problem caused by the depression of the thin substrate, and the problem of poor penetration of a laser through hole is thoroughly solved.
The invention discloses a thin substrate laser drilling process, which comprises the following steps:
manufacturing an FR4 through hole jig and a carrier film, and attaching the carrier film to the upper surface of the FR4 through hole jig; the FR4 through hole jig is processed by mechanical drilling to obtain a plurality of first through holes and first vacuum adsorption holes, the carrier film is processed by laser to obtain a plurality of second through holes corresponding to the first through holes and second vacuum adsorption holes corresponding to the first vacuum adsorption holes, the diameter of each first through hole is larger than that of each second through hole, and the diameter of each first vacuum adsorption hole is larger than that of each second vacuum adsorption hole;
providing a laser drilling machine, and installing the FR4 through hole jig after film pasting on a processing table top of the laser drilling machine;
blanking, wherein the substrate is arranged on a unreeling shaft of the laser drilling machine in a roll material mode, and a guide film is attached to the substrate on a processing table surface to enable the substrate to be placed on the upper surface of the bearing film;
and starting a laser processing program.
Further, in the laser drilling process for the thin substrate, the step of manufacturing an FR4 through hole jig and a carrier film, and attaching the carrier film to the upper surface of the FR4 through hole jig is that the diameter of each first through hole is 0.5mm, and the hole distance between every two adjacent first through holes is 0.2mm-0.3 mm.
Further, in the laser drilling process for the thin substrate, the step of manufacturing the FR4 through hole jig and the carrier film, and attaching the carrier film to the upper surface of the FR4 through hole jig is carried out, wherein the thickness of the carrier film is 0.1mm-0.15 mm.
Further, the thin substrate laser drilling process includes the steps of blanking, mounting the substrate on an unwinding shaft of a laser drilling machine in a roll material mode, attaching and connecting the substrate with a guide film, placing the substrate on the upper surface of the carrier film in a threading mode, placing the substrate on the unwinding shaft in the roll material mode, placing the substrate on a processing table top in the threading mode, mounting a winding core with the rewound guide film on the winding shaft, placing the winding core on the processing table top in the threading mode, and attaching and connecting the guide film and the substrate through adhesive tapes so that the substrate is placed on the upper surface of the carrier film.
Further, in the laser drilling process for the thin substrate, the step of blanking is that the substrate is mounted on a unreeling shaft of the laser drilling machine in a roll material mode, a guide film is attached to the substrate, the substrate is placed on the upper surface of the carrier film in a threading mode, and the roll material stroke length of the substrate is 2 m.
The invention also discloses a thin substrate laser drilling jig which comprises an FR4 through hole jig and a bearing film attached to the upper surface of the FR4 through hole jig, wherein the FR4 through hole jig is provided with a plurality of first through holes and first vacuum adsorption holes, the bearing film is provided with a plurality of second through holes corresponding to the first through holes and second vacuum adsorption holes corresponding to the first vacuum adsorption holes, the diameter of each first through hole is larger than that of each second through hole, and the diameter of each first vacuum adsorption hole is larger than that of each second vacuum adsorption hole.
Further, according to the thin substrate laser drilling jig, the diameter of each first through hole is 0.5mm, and the hole distance between every two adjacent first through holes is 0.2mm-0.3 mm.
Furthermore, the thickness of the bearing film of the laser drilling jig for the thin substrate is 0.1mm-0.15 mm.
The technical scheme shows that the invention has the following beneficial effects:
1. according to the laser drilling process for the thin substrate, provided by the invention, the compression damage generated in the operation process of the thin substrate is improved by utilizing the flexibility of the bearing film, the laser deflection problem caused by the depression of the thin substrate is improved by utilizing the support property of the bearing film, and the problem of poor penetration of a laser through hole is thoroughly solved.
2. The laser drilling process for the thin substrate simplifies the laser drilling process, reduces the production cost and improves the laser drilling quality.
In order to make the aforementioned and other objects, features and advantages of the invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of a thin substrate laser drilling process in an embodiment of the invention;
fig. 2 is a schematic structural diagram of a laser drilling jig for a thin substrate according to an embodiment of the present invention.
Reference numerals of the above figures: 1-FR4 through hole jig; 11-a first via; 12-a first vacuum adsorption hole; 2-a carrier film; 21-a second via; 22-a second vacuum adsorption hole; 3-a substrate; 31-substrate through hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, in the description of the present invention, the terms "first", "second", and the like are used for descriptive purposes only and for distinguishing similar objects, and no precedence between the two is considered as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
The present invention will be described in detail below with reference to the accompanying drawings and examples.
Example 1
As shown in fig. 1 to 2, the present embodiment provides a laser drilling process for a thin substrate, including the following steps:
manufacturing an FR4 through hole jig 1 and a carrier film 2, and attaching the carrier film 2 to the upper surface of the FR4 through hole jig 1; the FR4 through-hole jig 1 uses mechanical drilling to obtain a plurality of first through-holes 11 and first vacuum adsorption holes 12. The first through hole 11 can be used as a waste discharge hole for discharging and discharging waste after the substrate 3 is drilled. The substrate 3 is drilled by laser to obtain a substrate through hole 31, the diameter of the substrate through hole 31 is smaller than that of the second through hole 21, and the diameter of the substrate through hole 31 is the smallest. The carrier film 2 is subjected to laser processing to obtain a plurality of second through holes 21 corresponding to the first through holes 11 and a plurality of second vacuum adsorption holes 22 corresponding to the first vacuum adsorption holes 12, wherein the diameter of the first through holes 11 is larger than that of the second through holes 21, and the diameter of the first vacuum adsorption holes 12 is larger than that of the second vacuum adsorption holes 22;
providing a laser drilling machine, and mounting the FR4 through hole jig 1 subjected to film pasting on a processing table top of the laser drilling machine;
blanking, wherein the substrate 3 is arranged on a unreeling shaft of the laser drilling machine in a roll material mode, is attached and connected with the substrate by using a guide film (not shown in the figure), the substrate 3 is placed on the upper surface of the carrier film 2 according to a threading mode, the guide film is attached above the substrate 3, and the substrate 3 is placed on the upper surface of the carrier film 2;
and starting a laser processing program.
By the method, the bearing film 2 with the laser processing pattern is attached to the FR4 through hole jig 1, the waste discharge through holes of the existing jig in the background technology are dense, the jig is large in hollow and irregular in hollow holes, the substrate at the dense holes is sunken after the equipment table board is adsorbed, pressure points and poor wrinkles are easily generated, and the laser is focused to cause the through holes to be not penetrated during laser processing; in addition, the existing equipment can not directly reduce the aperture of the through hole of the jig; in the background art, a common laser drilling device meets the requirement of processing a substrate coil stock with a stroke of about 6m, and a support film is attached to the lower surface of a substrate aiming at the substrate coil stock with a longer stroke, so that the substrate is thicker as a whole, the deformation quantity of the substrate is reduced, if the substrate is not attached with the film, the expansion and contraction stability is poor, and the deformation is easy to occur, so that the substrate is attached with the support film, and the support film in the prior art is of a non-porous structure; in the method of adhering the support film to the lower surface of the substrate, the film pressing and peeling processes are increased, the manufacturing cost is increased, and the defects of wrinkles, poor pressure points and the like are caused by the film pressing and peeling. Therefore, according to the laser drilling process for the thin substrate provided by the embodiment of the invention, the flexibility of the carrier film 2 is utilized to improve the pressure damage generated in the operation process of the thin substrate, the aperture of the carrier film 2 is smaller than that of the FR4 through hole jig 1, the hollowing of the carrier film 2 is smaller than that of the FR4 through hole jig 1, the depression of the substrate 3 at a vacuum adsorption hole is reduced, the problem of laser deflection caused by the depression of the thin substrate is improved by utilizing the support property of the carrier film 2, the problem that the laser through hole is not poor in penetration is thoroughly solved, the carrier film 2 is directly attached to the FR4 through hole jig 1, the laser drilling process is simplified, the film pressing and stripping processes are omitted, the production cost is reduced, the poor images such as wrinkles and poor pressure points generated in the film pressing and stripping are reduced, and the quality of laser drilling is improved.
Specifically, in this embodiment, in the step of "manufacturing an FR4 through-hole jig 1 and a carrier film 2, and attaching the carrier film 2 to the upper surface of the FR4 through-hole jig 1", the diameter of each first through-hole 11 is 0.5mm, and the hole pitch between adjacent first through-holes 11 is 0.2mm to 0.3 mm.
Specifically, in this embodiment, the FR4 through-hole jig 1 and the carrier film 2 are manufactured, and the carrier film 2 is attached to the upper surface of the FR4 through-hole jig 1, wherein the thickness of the carrier film 2 is 0.1mm to 0.15 mm.
Specifically, in this embodiment, the step "blanking", the substrate 3 is mounted on an unwinding shaft of the laser drilling machine in a roll form, a guide film is used to attach and connect the substrate, the substrate 3 is placed on the upper surface of the carrier film 2 in a threading manner ", the substrate 3 is placed on the unwinding shaft in a roll form, the substrate is placed on a processing table top in a threading manner, a winding core with the rewound guide film is mounted on the winding shaft, the substrate is placed on the processing table top in a threading manner, and the guide film is attached and connected to the substrate by an adhesive tape, so that the substrate 3 is placed on the upper surface of the carrier film 2.
Specifically, in this embodiment, the step "blanking", in which the substrate is mounted on the unreeling shaft of the laser drilling machine in a roll form, is attached to the substrate by using a guide film, and the substrate 3 is placed on the upper surface of the carrier film 2 in a threading manner ", where the roll stroke length of the substrate 3 is 2 m.
Preparing an FR4 through hole jig 1 required by laser processing, providing an RTR (room temperature resistor) orbotech UV (ultraviolet) laser drilling machine to perform laser drilling on a substrate 3 (a HA (hyaluronic acid) copper substrate) with 12 mu mCu, 12 mu mPI, 12 mu mCu/9 mu mCu, 12 mu mPI and 9 mu mCu), installing the FR4 through hole jig 1 attached with a bearing film 2 on a processing table board of the laser drilling machine, arranging the substrate 3 on a unreeling shaft of the laser drilling machine in a coil form, and arranging the substrate on the processing table board according to a threading mode; the winding core of the rewound guide film is installed on a winding shaft and is arranged on a processing table top in a threading mode, the guide film is connected with the base plate in an adhesive tape attaching mode, the processing size and the number are set according to a laser processing program of a laser drilling machine, laser drilling of the base plate is completed, and then the base plate is inspected by using a microscope.
Example 2
As shown in fig. 2, the embodiment provides a thin substrate laser drilling jig, including FR4 through-hole jig 1 and a carrier film 2 attached to the upper surface of FR4 through-hole jig 1, FR4 through-hole jig 1 is provided with a plurality of first through-holes 11 and first vacuum adsorption holes 12, carrier film 2 is provided with a plurality of second through-holes 21 corresponding to first through-holes 11 and second vacuum adsorption holes 22 corresponding to first vacuum adsorption holes 12, the diameter of first through-holes 11 is greater than the diameter of second through-holes 21, and the diameter of first vacuum adsorption holes 12 is greater than the diameter of second vacuum adsorption holes 22. The first through hole 11 can be used as a waste discharge hole for discharging and discharging waste after the substrate is drilled. The substrate 3 is drilled by laser to obtain a substrate through hole 31, the diameter of the substrate through hole 31 is smaller than that of the second through hole 21, and the diameter of the substrate through hole 31 is the smallest.
By means of the structure, the carrier film 2 is attached to the upper surface of the FR4 through-hole jig 1, the aperture of the carrier film 2 is smaller than that of the FR4 through-hole jig 1, the substrate 3 is placed on the carrier film 2, and after laser drilling, the diameter of the substrate through-hole 31 is the smallest. The existing jig has dense waste discharge through holes, large hollowed holes and irregular hollowed holes, the substrate at the dense holes is sunken after the table board of the equipment is adsorbed, pressure points and poor folds are easy to generate, and laser is focused during laser processing to cause the through holes to be not penetrated; in addition, the existing equipment can not directly reduce the aperture of the through hole of the jig; in the background art, a common laser drilling device meets the requirement of processing a substrate coil stock with a stroke of about 6m, and a support film is attached to the lower surface of a substrate aiming at the substrate coil stock with a longer stroke, so that the substrate is thicker as a whole, the deformation quantity of the substrate is reduced, if the substrate is not attached with the film, the expansion and contraction stability is poor, and the deformation is easy to occur, so that the substrate is attached with the support film, and the support film in the prior art is of a non-porous structure; in the method of adhering the support film to the lower surface of the substrate, the film pressing and peeling processes are increased, the manufacturing cost is increased, and the defects of wrinkles, poor pressure points and the like are caused by the film pressing and peeling. Therefore, in the embodiment of the application, a laser drilling jig for a thin substrate is used for performing laser drilling on a substrate coil stock with a stroke of about 2m, if a film is pasted on the lower surface of the substrate, the production cost is increased, so that a bearing film does not need to be pasted on a substrate material to ensure the deformation of the substrate, in addition, the existing equipment manufacturing structure has difference, the diameter of a jig hole cannot be directly reduced, therefore, the bearing film 2 is pasted on the upper surface of the FR4 through hole jig 1, the flexibility and the support of the jig surface are improved, the aperture of the bearing film 2 is smaller than that of the FR4 through hole jig 1, the hollow of the bearing film 2 is smaller than that of the FR4 through hole jig 1, the depression of the substrate 3 at the vacuum adsorption hole is reduced, and the problem of laser deflection caused by the depression of the thin substrate is improved by the support of the bearing film 2.
Specifically, in this embodiment, the diameter of the first through hole 11 is 0.5mm, and the hole pitch between adjacent first through holes 11 is 0.2mm to 0.3 mm.
Specifically, in this embodiment, the thickness of the carrier film 2 is 0.1mm to 0.15 mm.
The principle and the implementation mode of the invention are explained by applying specific embodiments in the invention, and the description of the embodiments is only used for helping to understand the technical scheme and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (8)
1. A thin substrate laser drilling process is characterized by comprising the following steps:
manufacturing an FR4 through hole jig and a carrier film, and attaching the carrier film to the upper surface of the FR4 through hole jig; the FR4 through hole jig is processed by mechanical drilling to obtain a plurality of first through holes and first vacuum adsorption holes, the carrier film is processed by laser to obtain a plurality of second through holes corresponding to the first through holes and second vacuum adsorption holes corresponding to the first vacuum adsorption holes, the diameter of each first through hole is larger than that of each second through hole, and the diameter of each first vacuum adsorption hole is larger than that of each second vacuum adsorption hole;
providing a laser drilling machine, and installing the FR4 through hole jig after film pasting on a processing table top of the laser drilling machine;
blanking, wherein the substrate is arranged on a unreeling shaft of the laser drilling machine in a roll material mode, is attached and connected with the substrate by using a guide film, and is placed on the upper surface of the carrier film in a threading mode;
and starting a laser processing program.
2. The laser drilling process for the thin substrate as claimed in claim 1, wherein the step of fabricating an FR4 through hole jig and a carrier film, and attaching the carrier film to the upper surface of the FR4 through hole jig comprises the steps of making the first through holes with a diameter of 0.5mm and making the hole spacing between adjacent first through holes with a distance of 0.2mm to 0.3 mm.
3. The laser drilling process for the thin substrate as claimed in claim 1, wherein the step of fabricating the FR4 through hole jig and the carrier film, and attaching the carrier film to the upper surface of the FR4 through hole jig is carried out, wherein the thickness of the carrier film is 0.1mm-0.15 mm.
4. The laser drilling process of the thin substrate as claimed in claim 1, wherein the step of blanking comprises mounting the substrate in a roll form on an unwinding shaft of the laser drilling machine, attaching the substrate to a substrate using a guide film, placing the substrate on the upper surface of the carrier film in a threading manner, placing the substrate in a roll form on the unwinding shaft, placing the substrate on a processing table in a threading manner, mounting a winding core with the rewound guide film on a winding shaft, placing the winding core on the processing table in a threading manner, and attaching the guide film to the substrate by tape so that the substrate is placed on the upper surface of the carrier film.
5. The laser drilling process for thin substrates according to claim 1, wherein the step of blanking, mounting the substrate in a roll form on a pay-off reel of the laser drilling machine, attaching the substrate to a guide film, and placing the substrate in a threading manner on the upper surface of the carrier film, wherein the roll stroke length of the substrate is 2 m.
6. The utility model provides a thin base plate laser drilling tool, its characterized in that is in including FR4 through-hole tool and laminating the carrier film of FR4 through-hole tool upper surface, be equipped with a plurality of first through-holes and first vacuum adsorption hole on the FR4 through-hole tool, be equipped with on the carrier film a plurality of with the second through-hole that first through-hole corresponds, with the second vacuum adsorption hole that first vacuum adsorption hole corresponds, the diameter of first through-hole is greater than the diameter of second through-hole, the diameter of first vacuum adsorption hole is greater than the diameter of second vacuum adsorption hole.
7. The laser drilling jig for thin substrates as claimed in claim 6, wherein the diameter of the first through holes is 0.5mm, and the hole pitch between adjacent first through holes is 0.2mm to 0.3 mm.
8. The laser drilling jig for thin substrates as claimed in claim 6, wherein the thickness of the carrier film is 0.1mm-0.15 mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210766263.8A CN115041843A (en) | 2022-07-01 | 2022-07-01 | Thin substrate laser drilling process and drilling jig |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210766263.8A CN115041843A (en) | 2022-07-01 | 2022-07-01 | Thin substrate laser drilling process and drilling jig |
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| CN115041843A true CN115041843A (en) | 2022-09-13 |
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| CN103737184A (en) * | 2013-12-25 | 2014-04-23 | 广州兴森快捷电路科技有限公司 | Device and fixture for performing laser machining on through hole and fixture installation method |
| CN205096734U (en) * | 2015-08-13 | 2016-03-23 | 苏州东恩电子科技有限公司 | Special tool board of radium -shine drilling of FPC |
| CN106216855A (en) * | 2016-08-30 | 2016-12-14 | 武汉华工激光工程有限责任公司 | The laser boring method of IMD forming plastic cement and laser drilling device |
| CN209334954U (en) * | 2018-11-02 | 2019-09-03 | 深圳市新宇腾跃电子有限公司 | A kind of radium-shine holes drilled through jig |
| CN209767941U (en) * | 2019-02-28 | 2019-12-10 | 同扬光电（江苏）有限公司 | Radium-shine drilling tool board of circuit board |
| CN215468792U (en) * | 2020-12-31 | 2022-01-11 | 深圳市吉祥云科技有限公司 | Laser cutting machine's flat tool of inhaling and laser cutting machine |
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