CN204632724U - Electronic device is stained with the device of silver - Google Patents
Electronic device is stained with the device of silver Download PDFInfo
- Publication number
- CN204632724U CN204632724U CN201520348399.2U CN201520348399U CN204632724U CN 204632724 U CN204632724 U CN 204632724U CN 201520348399 U CN201520348399 U CN 201520348399U CN 204632724 U CN204632724 U CN 204632724U
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- Prior art keywords
- silver
- electronic device
- machine
- plate
- stained
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Links
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 57
- 239000004332 silver Substances 0.000 title claims abstract description 57
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 56
- 230000017105 transposition Effects 0.000 claims abstract description 23
- 238000003825 pressing Methods 0.000 claims description 28
- 238000007598 dipping method Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 5
- 208000002109 Argyria Diseases 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to the device that a kind of electronic device is stained with silver, and it provides a kind of electronic device that makes to be the device that rake angle is stained with silver; Be mainly: be set as by guide plate, offset plate, transposition machine, push up oblique machine and formed, the electronic device being stained with silver waited by bearable a lot of of this guide plate, this transposition machine can by electronic device transposition to offset plate, this offset plate has elastic telescopic and electronic device firmly can be clamped position, the oblique machine in this top can by the electronic device pushing tow in offset plate in left, be tilted to the right angle, therefore, can be that left and right rake angle is stained with silver by electronic device.By above-mentioned device, can complete fast in a large number and be stained with silver and cut down finished cost, electronic device is that rake angle is stained with silver, more accurately controls to be stained with silver-colored scope, damage other device of electronic device periphery when can prevent from being stained with silver, and must silver-colored area is stained with more greatly and provide larger area to be welded in circuit board.
Description
Technical Field
The utility model relates to an electronic device is stained with device of silver, it provides one kind can let electronic device be stained with silver in a large number fast, and can be the device that the oblique angle is stained with silver, and reduce be stained with silver processing cost, be stained with when silver do not harm peripheral other devices, more accurate control be stained with silver scope, increase supply to weld in the welding area of circuit board.
Background
The conventional electronic device 1 (shown in fig. 3) with a special shape has to be processed with silver dipping. In the silver dipping processing method in the prior art, as shown in fig. 1, 2, 3 and 4, a positioning plate 3 of an electronic device 1 is coated with wax 4, the electronic device 1 is arranged on the wax 4 of the positioning plate 3 by a material discharger, the potential plate 3 is heated and melted with the wax 4, the electronic device 1 is positioned by the wax 4 after the wax 4 is cooled, the positioning plate 3 is input into a silver dipping machine to dip silver 5 at a horizontal angle, the positioning plate 3 is taken out after the silver dipping to melt the wax 4, and the electronic device 1 is separated to finish the silver dipping 5.
The silver dipping method has the following disadvantages:
(1) as shown in fig. 3, the silver 5 attached to the electronic device 1 in the prior art may stick to the peripheral devices of the electronic device 1 due to the upward extension of the silver paste, for example: the coil 2, causing damage to the insulation of the coil 2 and short-circuiting the coil 2.
(2) As shown in fig. 4, the silver 5 is attached to the electronic device 1 for soldering H to the circuit board 6. In the prior art, the silver 5 is adhered at a horizontal angle, so that the height of the silver should not be too high in order to prevent the silver from adhering to the peripheral devices (e.g., the coil 2) of the electronic device 1, i.e., the silver area is small, which is more inconvenient for the soldering H to the circuit board 6 and less firm for the soldering H with a small area.
(3) As shown in fig. 1, the electronic devices 1 are positioned in a row on the positioning plate 3, and then the electronic devices 1 on the positioning plate 3 are stained with silver, in other words, only one row of electronic devices 1 is stained with one silver staining procedure, and the number is small, so the processing completion amount at the same time is small, i.e. the processing cost is high.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems, the present invention aims to improve the disadvantages of the prior art and provide a device for silver staining of an electronic device, which comprises: the utility model discloses establish into and have baffle, offset plate, machine of shifting, top oblique machine. The guide plate is provided with a plurality of grooves which are fully distributed for placing a large number of electronic devices to be stained with silver, the rubber plate is provided with a plurality of containing holes which are fully distributed and is made of elastic rubber materials, the transposition machine is provided with a lower pressing plate and a bedplate, a plurality of ejector pins are fully distributed in the bedplate, and the oblique ejector is provided with a lower pressing plate and a plurality of ejector pin columns; the guide plate and the rubber plate are placed into a transposition machine, the ejector pins of the transposition machine can transpose all electronic devices of the guide plate into the rubber plate, the electronic devices can be stably positioned through the elasticity of the rubber plate, and then the rubber plate is placed into an inclined pushing machine, so that all the electronic devices can be inclined leftwards and rightwards, and therefore the electronic devices can be stained with silver at left inclined angles and right inclined angles.
In other words, the electronic device silver dipping apparatus comprises: the device comprises a guide plate, a rubber plate, a position changing machine and an inclined ejecting machine; the guide plate is provided with a plurality of grooves which are fully distributed, each groove is provided with a through hole, and each groove is used for bearing an electronic device to be stained with silver; the rubber plate is made of elastic rubber materials and is provided with a plurality of containing holes which are fully distributed, and each containing hole can limit an electronic device; the transposition machine is provided with a lower pressing plate and a bedplate, wherein the lower pressing plate of the transposition machine is connected with a pneumatic cylinder and can lift, the bedplate of the transposition machine is provided with a plurality of full through holes, ejector pins are arranged in the through holes, a guide plate is arranged on the bedplate of the transposition machine, a rubber plate is arranged on the guide plate, when the lower pressing plate of the transposition machine descends to press the rubber plate and the guide plate, and when the bedplate of the transposition machine descends, an electronic device can be pushed and transposed into a containing hole of the rubber plate from a groove of the guide plate through the ejector pins; the inclined pushing machine is provided with a lower pressing plate and a table plate, a rubber plate is placed on the table plate of the inclined pushing machine, the lower pressing plate of the inclined pushing machine is connected with a pneumatic cylinder and can lift, a plurality of fully-distributed inclined pushing columns are arranged at the bottom of the lower pressing plate of the inclined pushing machine, and when the lower pressing plate of the inclined pushing machine descends, the inclined pushing columns can push electronic devices in the rubber plate containing holes to form inclined angles, so that the electronic devices can be silver-stained in the inclined angles.
Preferably, the bottom of the bedplate of the shifting machine is provided with a spring support, and when a lower pressing plate of the shifting machine descends for pressing, the bedplate of the shifting machine can descend synchronously.
The beneficial effects of the utility model reside in that: through the utility model discloses can accomplish fast in a large number and be stained with silver, and reduce the processing cost, the silver that is stained with of oblique angle then can prevent to harm other peripheral devices, and provide great area welding in the circuit board.
Drawings
Fig. 1 is a schematic view of a prior art electronic device fixed during silver dipping.
Fig. 2 is a schematic view of a prior art electronic device showing horizontal silver dipping.
Fig. 3 is a schematic view of a prior art electronic device for completing silver wetting.
Fig. 4 is a schematic view of a prior art electronic device soldered to a circuit board.
Fig. 5 is a perspective view of the structure of the guide plate of the present invention.
Fig. 6 is a cross-sectional view of the electronic device placed on the guide plate.
Fig. 7 is a perspective view of the rubber plate structure of the present invention.
Fig. 8 is a cross-sectional view of the electronic device transposition rubber plate of the present invention.
Fig. 9 is a perspective view of the structure of the shifting machine of the present invention.
Fig. 10 is a perspective view of the structure of the tilting mechanism of the present invention.
Fig. 11 is the schematic diagram before the transposition machine of the utility model transposes the electronic device.
Fig. 12 is the transposition schematic diagram of the electronic device completed by the transposition machine of the present invention.
Fig. 13 is the schematic diagram of the oblique pushing machine of the present invention pushing the electronic device to an oblique angle left.
Fig. 14 is a schematic view of the electronic device of the present invention showing a left bevel being stained with silver.
Fig. 15 is a schematic diagram of the oblique pushing machine of the present invention pushing the electronic device at an oblique angle to the right.
Fig. 16 is a schematic view of the right bevel of the electronic device according to the present invention.
Fig. 17 is a schematic view illustrating the electronic device of the present invention completing the silver-dipping soldering on the circuit board.
Description of the main part symbols:
[ Prior Art ] A method for producing a semiconductor device
1 electronic device 5 silver
2 coil 6 circuit board
3 welding of positioning plate H
4 wax
[ utility model ] to solve the problems
10 guide plate 35 spring
11 groove 36, 44 pneumatic cylinder
12. 33 perforating 40 oblique pushing machine
20 rubber plate 42 top oblique column
21 accommodating hole 1 electronic device
30 transposer 2 coil
31. 41 lower press plate 5 silver
32. 43 bedplate 6 Circuit Board
And (3) welding a 34 thimble H.
Detailed Description
Referring to fig. 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, and 16, the electronic device of the present invention includes: the guide plate 10, the rubber plate 20, the transposer 30 and the inclined jacking machine 40; wherein,
the guide plate 10, as shown in fig. 5 and 6, is provided with a plurality of grooves 11 which are fully distributed, each groove 11 is provided with a through hole 12, and each groove 11 is used for holding the electronic device 1 to be stained with silver;
the rubber plate 20, as shown in fig. 7 and 8, is made of elastic rubber material, and has a plurality of accommodating holes 21 distributed therein, and each accommodating hole 21 can define the electronic device 1;
the transposer 30, as shown in fig. 9, 11, 12, has a lower pressing plate 31, a platen 32, the lower pressing plate 31 is connected with a pneumatic cylinder 36 for lifting, the bottom of the platen 32 has a spring 35 for supporting, the platen 32 has a plurality of through holes 33 fully distributed, each through hole 33 is provided with a thimble 34, in addition, a guide plate 10 is placed on the platen 32, a rubber plate 20 is placed on the guide plate 10, when the lower pressing plate 31 descends to press the rubber plate 20, the guide plate 10, and the platen 32 descends, the thimble 34 can push and transpose the electronic device 1 from the groove 11 of the guide plate 10 to the containing hole 21 of the rubber plate 20;
as shown in fig. 10, 13 and 15, the oblique pushing machine 40 includes a lower pressing plate 41 and a platen 43, wherein the platen 43 is disposed with the adhesive sheet 20, the lower pressing plate 41 is connected with a pneumatic cylinder 44 to be lifted, a plurality of oblique pushing posts 42 are disposed at the bottom of the lower pressing plate 41, and when the lower pressing plate 41 is lowered, the oblique pushing posts 42 can push the electronic device 1 in the hole 21 of the adhesive sheet 20 to form an oblique angle.
According to the above device, the utility model discloses an effect, efficiency do: referring to fig. 5, the electronic device 1 to be stained with silver is placed in the groove 11 of the guide plate 10 in cooperation with the vibrating discharger, the guide plate 10 is placed in the transposer 30, the rubber plate 20 (as shown in fig. 11) is placed on the guide plate 10, the lower pressing plate 31 of the transposer 30 is pressed down to insert the ejector pin 34 into the rubber plate 20, thereby pushing the electronic device 1 into the rubber plate 20 (as shown in fig. 12), thereby completing the transposition, the rubber plate 20 is placed in the inclinator 40, the inclined post 42 thereof can incline the electronic device 1 to the left (as shown in fig. 13), then the rubber plate 20 is fed into the silvering machine to be stained with a left inclined angle (as shown in fig. 14), then the rubber plate 20 is placed into the inclinator 40, thereby inclining the electronic device 1 to the right (as shown in fig. 15), then the rubber plate 20 is fed into the silvering machine to be stained with a right inclined angle (as shown in fig. 16), and the electronic device 1 is separated from the rubber plate 20, thus completing the silver dipping of the electronic device 1 in left and right oblique angles.
By the method, the following effects and advantages can be obtained:
(1) as shown in fig. 5, the guiding plate 10 and the glue plate 20 can hold a large number of electronic devices 1, in other words, one silver dipping operation can dip a large number of electronic devices 1 simultaneously, unlike the prior art that only one row of electronic devices 1 (shown in fig. 1) can be dipped, so that a larger number of silver dipping can be completed at the same time, i.e. the processing cost is reduced.
(2) As shown in fig. 17, the electronic device 1 is dipped with silver 5 at a left oblique angle and a right oblique angle, in other words, the electronic device 1 is not contacted with silver near the peripheral device (coil 2), so that the problem of damaging the peripheral device by the silver is avoided.
(3) As shown in fig. 17, the electronic device 1 is dipped with silver 5 at the left and right oblique angles, so that a larger area of silver can be obtained, and thus, a larger area is provided for soldering H to the circuit board 6, so that a more stable soldering effect can be obtained.
(4) Since it is not necessary to fix the electronic component 1 with "wax" as in the prior art, heating of "heating wax" is not necessary, and there is no fear that the electronic component 1 is damaged by heating.
To sum up, the device for silver staining of electronic device of the present invention has practical industrial value, and is an unprecedented creation, which really accords with the gist of new patent, and solicits to grant patents.
Claims (2)
1. An electronic device is stained with silver device which characterized in that: the electronic device silver dipping device comprises: the device comprises a guide plate, a rubber plate, a position changing machine and an inclined ejecting machine; wherein,
the guide plate is provided with a plurality of grooves which are fully distributed, each groove is provided with a through hole, and each groove is used for bearing an electronic device to be stained with silver;
the rubber plate is made of elastic rubber materials and is provided with a plurality of containing holes which are fully distributed, and each containing hole can limit an electronic device;
the transposition machine is provided with a lower pressing plate and a bedplate, wherein the lower pressing plate of the transposition machine is connected with a pneumatic cylinder and can lift, the bedplate of the transposition machine is provided with a plurality of full through holes, ejector pins are arranged in the through holes, a guide plate is arranged on the bedplate of the transposition machine, a rubber plate is arranged on the guide plate, when the lower pressing plate of the transposition machine descends to press the rubber plate and the guide plate, and when the bedplate of the transposition machine descends, an electronic device can be pushed and transposed into a containing hole of the rubber plate from a groove of the guide plate through the ejector pins;
the inclined pushing machine is provided with a lower pressing plate and a table plate, a rubber plate is placed on the table plate of the inclined pushing machine, the lower pressing plate of the inclined pushing machine is connected with a pneumatic cylinder and can lift, a plurality of fully-distributed inclined pushing columns are arranged at the bottom of the lower pressing plate of the inclined pushing machine, and when the lower pressing plate of the inclined pushing machine descends, the inclined pushing columns can push electronic devices in the rubber plate containing holes to form inclined angles, so that the electronic devices can be silver-stained in the inclined angles.
2. The electronic device silver staining apparatus of claim 1, wherein: the bottom of the bedplate of the position changing machine is provided with a spring support, and when a lower pressing plate of the position changing machine descends for pressing, the bedplate of the position changing machine can descend synchronously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520348399.2U CN204632724U (en) | 2015-05-27 | 2015-05-27 | Electronic device is stained with the device of silver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520348399.2U CN204632724U (en) | 2015-05-27 | 2015-05-27 | Electronic device is stained with the device of silver |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204632724U true CN204632724U (en) | 2015-09-09 |
Family
ID=54051724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520348399.2U Active CN204632724U (en) | 2015-05-27 | 2015-05-27 | Electronic device is stained with the device of silver |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204632724U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109731743A (en) * | 2018-12-27 | 2019-05-10 | 肇庆力行智能制造有限公司 | Silver-colored fully-automatic production system is stained at a kind of surface mount elements both ends |
-
2015
- 2015-05-27 CN CN201520348399.2U patent/CN204632724U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109731743A (en) * | 2018-12-27 | 2019-05-10 | 肇庆力行智能制造有限公司 | Silver-colored fully-automatic production system is stained at a kind of surface mount elements both ends |
| CN109731743B (en) * | 2018-12-27 | 2021-02-19 | 肇庆力行智能制造有限公司 | Full-automatic production system for silver staining at two ends of surface mounted device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |